CN114371497A - Radiation imaging detector and manufacturing method thereof - Google Patents
Radiation imaging detector and manufacturing method thereof Download PDFInfo
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- G—PHYSICS
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
- G01T1/2914—Measurement of spatial distribution of radiation
- G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
- G01T1/2928—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2012—Measuring radiation intensity with scintillation detectors using stimulable phosphors, e.g. stimulable phosphor sheets
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
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Abstract
The invention provides a radiation imaging detector and a manufacturing method thereof, wherein the radiation imaging detector comprises a sensor, a scintillator, an optical fiber composite structure and an additional sensor, the optical fiber composite structure comprises a plurality of optical fibers, the sensor, the scintillator, the optical fiber composite structure and the additional sensor are sequentially stacked, incident rays generate fluorescence through the scintillator, the fluorescence on one side of the sensor is directly transmitted to the sensor, and the fluorescence on one side of the additional sensor is transmitted to the additional sensor through fiber cores of all the optical fibers in the optical fiber composite structure by utilizing a waveguide effect. Compared with the traditional detector, the invention doubles the absorption value of fluorescence by a single sensor or a metal-plated reflecting film, greatly improves the photosensitive efficiency of the detector, further improves the detection efficiency of the detector and effectively reduces the radiation dose.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of radiation imaging, in particular to a radiation imaging detector and a manufacturing method thereof.
[ background of the invention ]
Radiation imaging, a technique for observing the interior of an object with rays. The technology can obtain the information such as the internal structure and the density of the object under the condition of not damaging the object, and is widely applied to the fields of medical health, national economy, scientific research and the like at present. Radiation imaging is divided into conventional radiation imaging and digital radiation imaging. With the advent of the digital age, digital radiation imaging has gradually replaced traditional radiation imaging with technical defects, that is, sensors such as photosensitive films or fluorescent screens used in traditional radiation imaging are replaced by "array detectors" composed of a large number of discrete detector elements. Each detector element of the array detector can respectively measure the radiation intensity of the position and finally give a corresponding digital signal. The detector elements of the one-dimensional array detector are arranged in a line, and the output signals of the detector elements reflect the distribution of the radiation intensity along the line. The detector elements of the two-dimensional array detector are orderly arranged in a region with a certain area, and the output signals of the detector elements reflect the distribution of the radiation intensity in the region. The radiation intensity distribution image given by the array detector is digital, can be stored, transmitted and processed by fully applying the modern computer technology, and greatly improves the application value of the obtained radiation image. In particular, the detection efficiency, response time and size scale of the array detector are incomparable with those of sensors such as an induction film, so that a plurality of detection tasks which cannot be performed by the traditional radiation imaging can be performed, in other words, the occurrence and development of digital radiation imaging enable the radiation imaging to enter a brand new era.
The traditional digital radiation imaging detector (taking an X-ray detector as an example) comprises a base material, a scintillator and a sensor (a photoelectric detection device), wherein the scintillator absorbs X-rays and then emits fluorescence, the sensor is generally arranged on one side of fluorescence diffusion, the structural design can not enable the sensor to receive all the fluorescence emitted by the scintillator, even if the fluorescence is reflected by a plated metal film on the other side of the fluorescence diffusion, the sensor arranged on the one side of the fluorescence diffusion can not absorb all the fluorescence, and the photosensitive efficiency of the sensor is lower. It is worth noting that the fluorescence emitted from the scintillator surface is uniformly emitted in all directions in space, has no specific orientation, belongs to lambertian distribution, and the fluorescence emission of the isotropic spatial distribution is not beneficial to the collection of the fluorescence, thereby reducing the detection efficiency. Meanwhile, in the existing X-ray detector, the sensor often has a certain spatial distance from the scintillator, which means that only the fluorescence in a specific solid angle can reach the sensor, and the fluorescence that does not enter the sensor is wasted, thereby greatly limiting the improvement of the detection efficiency. In addition, the fluorescence that finally reaches the sensor is inevitably reduced in signal intensity and sharpness compared to the fluorescence generated by the scintillator due to spatial diffusion, thereby reducing the overall spatial resolution, signal-to-noise ratio, and sensitivity of the detector.
Therefore, there is a need for an improved structure of the above-mentioned digital radiation imaging detector.
[ summary of the invention ]
The technical problem to be solved by the invention is as follows: the radiation imaging detector and the manufacturing method thereof are provided, and the problem that the existing detector is low in detection efficiency is solved.
In order to solve the technical problems, the invention adopts the technical scheme that:
a first aspect of embodiments of the present invention provides a radiation imaging detector, including: the optical fiber composite structure comprises a plurality of optical fibers, and the sensor, the scintillator, the optical fiber composite structure and the additional sensor are sequentially stacked;
incident rays generate fluorescence through the scintillator, the fluorescence on one side of the sensor is directly transmitted to the sensor, and the fluorescence on one side of the additional sensor is transmitted to the additional sensor through fiber cores of all optical fibers in the optical fiber composite structure by utilizing a waveguide effect.
In some embodiments, the scintillator, the optical fiber composite structure and the additional sensor are bonded together by a coupling agent, wherein the coupling agent is at least one of silicone oil, silicone grease and silica gel.
In some embodiments, a plurality of optical fibers in the optical fiber composite structure integrate a three-dimensional array, any optical fiber in the optical fiber composite structure comprises a fiber core and a cladding, and the refractive index of the fiber core is larger than that of the cladding;
the fiber core and the cladding of any optical fiber in the optical fiber composite structure are at least one of transparent glass or flexible plastic;
the diameter of the fiber core of any optical fiber in the optical fiber composite structure is 1/100-1/10 of the pixel spacing of the sensor;
the thickness of the cladding of any optical fiber in the optical fiber composite structure is 1/10-1/5 of the diameter of the core.
In some embodiments, the fiber optic composite structure is a fiber optic faceplate having a length, width, and height of 430mm, and Y, respectively, wherein Y is 0.5mm ≦ 2 mm.
In some implementations, the sensor and the additional sensor are at least one of a CMOS sensor or a photodiode sensor.
In some embodiments, the scintillator comprises europium gadolinium oxysulfide, thallium cesium iodide, and all-inorganic perovskite nanocrystals CsPbX3Wherein, X is any one of Cl, Br and I.
In some embodiments, the sensor and the additional sensor are electrically connected on both sides with mutually independent data reading circuit boards, which are arranged parallel to the direction of the incident radiation.
A second aspect of the embodiments of the present invention provides a manufacturing method, applied to the radiation imaging detector according to the first aspect of the embodiments of the present invention, including:
growing a scintillator on the sensor;
attaching an optical fiber composite structure to the scintillator by using a coupling agent;
an additional sensor is bonded to the fiber composite structure using a coupling agent.
In some embodiments, the attaching the fiber composite structure to the scintillator with a coupling agent further comprises:
polishing the optical fiber composite structure;
coarsening the polished optical fiber composite structure by any one of gas etching, laser etching and mechanical processing;
utilizing the couplant, laminating the optical fiber composite structure to the scintillator includes: and adhering the coarsened optical fiber composite structure to the scintillator by using a coupling agent.
In some embodiments, said attaching an additional sensor to said fiber optic composite structure using a coupling agent comprises: and after the additional sensor is turned over and rotates 90 degrees anticlockwise, the additional sensor is attached to the coarsened optical fiber composite structure by using a coupling agent.
From the above description, compared with the prior art, the invention has the following beneficial effects:
the fluorescence that incident ray produced through the scintillator not only can transmit to the sensor, can also take place the total reflection in the fibre core of each optic fibre in optic fibre composite construction, finally arrive the additional sensor that is located the sensor offside nondestructively and fidelity, single sensor or metal-plated reflective film increase one time to the absorption value of fluorescence in the traditional detector, increase the photosensitive efficiency of detector by a wide margin, and then promote the detection efficiency of detector, effectively reduce radiation dose. The optical fiber composite structure clamped between the scintillator and the additional sensor is highly collimated to fluorescence and low in ray absorption, so that signal loss is reduced, and high resolution of the detector is guaranteed. In addition, the optical fiber composite structure increases the space distance between the sensor and the additional sensor, thereby reducing the mutual electronic interference caused by the too close distance between the sensor and the additional sensor, and further avoiding the noise and the streak artifact caused by the mutual electronic interference.
[ description of the drawings ]
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is to be understood that the drawings in the following description are of some, but not all, embodiments of the invention. For a person skilled in the art, other figures can also be obtained from the provided figures without inventive effort.
Fig. 1 is a schematic structural diagram of a radiation imaging detector provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram of another embodiment of a radiation imaging detector;
FIG. 3 is a schematic structural diagram of a radiation imaging detection system based on a fiber composite structure according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart of a manufacturing method according to an embodiment of the present invention;
fig. 5 is another schematic flow chart of the manufacturing method according to the embodiment of the invention.
[ detailed description ] embodiments
For purposes of promoting a clear understanding of the objects, aspects and advantages of the invention, reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements throughout. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
Referring to fig. 1, fig. 1 is a schematic structural diagram of a radiation imaging detector according to an embodiment of the present invention.
As shown in fig. 1, a radiation imaging detector according to a first embodiment of the present invention includes a sensor 1, a scintillator 2, an optical fiber composite structure 3, and an additional sensor 4, where the optical fiber composite structure 3 includes a plurality of optical fibers (not shown), the sensor 1, the scintillator 2, the optical fiber composite structure 3, and the additional sensor 4 are sequentially stacked, when a high-energy ray a (e.g., an X-ray) is incident on the radiation imaging detector, the incident ray a generates a fluorescence B through the scintillator 2, the fluorescence B on one side of the sensor 1 is directly transmitted to the sensor 1, and the fluorescence B on one side of the additional sensor 4 is transmitted to the additional sensor 4 through fiber cores of the optical fibers in the optical fiber composite structure 3 by using a waveguide effect. It can be understood that when the sensor 1 and the additional sensor 4 are arranged, it is necessary to ensure that the two ends of the sensor 1 and the additional sensor 4 do not translate relatively, so as to realize the "pixel-to-pixel" alignment of the sensor 1 and the additional sensor 4.
In some embodiments, in order to avoid the absorption and scattering of the high-energy ray a by the fiber composite structure 3 before reaching the scintillator 2, the incidence direction of the high-energy ray a may be selected to be incident from the side of the sensor 1, rather than from the side of the additional sensor 4 as shown in fig. 1.
It should be noted that the sensor 1 and the additional sensor 4 each include a photosensitive cell array and an auxiliary circuit, where the photosensitive cell array is responsible for completing the conversion task of the photoelectric signal, and the auxiliary circuit realizes the functions of generating the driving signal, processing and outputting the photoelectric signal, and the like.
In the radiation imaging detector provided by the embodiment, the incident ray A can be transmitted to the sensor 1 through the fluorescence B generated by the scintillator 2, and can be totally reflected in the fiber core of each optical fiber in the optical fiber composite structure 3, and finally reaches the additional sensor 4 positioned at the opposite side of the sensor 1 without damage and fidelity, so that the absorption value of the fluorescence is doubled compared with that of a single sensor or a metal-plated reflecting film in the traditional detector, the photosensitive efficiency of the detector is greatly improved, the detection efficiency of the detector is further improved, and the radiation dose is effectively reduced. The optical fiber composite structure 3 clamped between the scintillator 2 and the additional sensor 4 is highly collimated to the fluorescence B and has low absorption to the ray A, thereby reducing the loss of signals and ensuring the high resolution of the detector. In addition, the optical fiber composite structure 3 increases the spatial distance between the sensor 1 and the additional sensor 4, thereby reducing the mutual electronic interference caused by the too close distance between the sensor 1 and the additional sensor 4, and further avoiding the noise and streak artifacts generated by the mutual electronic interference.
Example 2
Referring to fig. 2, fig. 2 is another schematic structural diagram of a radiation imaging detector according to an embodiment of the invention.
In comparison with the radiation imaging detector provided in the first embodiment of the present invention, the substrate 5 and the data reading circuit board 6 are added in the second embodiment of the present invention.
As shown in fig. 2, the radiation imaging detector provided in this embodiment further includes a substrate 5, and the substrate 5 is disposed on a side of the sensor 1 away from the scintillator 2. It should be noted that the substrate 5 is glass (e.g., impact resistant alkali free glass), while in some embodiments the substrate 5 is a flexible plastic (e.g., a high molecular weight organic plastic polyimide).
In this embodiment, the optical fiber composite structure 3 has a flat interface, an incident space and an exit space, light emission has a large emission solid angle in the flat interface, the incident space and the exit space of the optical fiber composite structure 3, and in order to eliminate the refractive index difference between the scintillator 2, the optical fiber composite structure 3 and the additional sensor 4, the scintillator 2, the optical fiber composite structure 3 and the additional sensor 4 are bonded by a coupling agent, where the coupling agent is at least one of silicone oil, silicone grease and silicone gel. It can be understood that when the refractive indexes of the coupling agent, the fiber cores of the optical fibers in the optical fiber composite structure 3 and the scintillator 2 are close, the coupling agent is uniformly coated, and no air bubbles exist among the scintillator 2, the optical fiber composite structure 3 and the additional sensor 4, the output efficiency of the fluorescence B from the scintillator 2 to the additional sensor 4 can be greatly improved. It should also be noted that the coupling agent is OCA (optical Clear adhesive) optical cement, and the refractive index of OCA is 1.49.
In this embodiment, a plurality of optical fibers in the optical fiber composite structure 3 are integrated into a three-dimensional array, and any optical fiber in the optical fiber composite structure 3 has the following characteristics:
firstly, any optical fiber in the optical fiber composite structure 3 comprises a fiber core and a cladding, the diameter of the fiber core is 10 μm, the thickness of the cladding is 2 μm, and the refractive index of the fiber core is greater than the refractive index of the cladding (the refractive index is sequentially reduced from the inside to the outside of the optical fiber composite structure 3), in other words, the fiber core of any optical fiber in the optical fiber composite structure 3 has high refractive index and the cladding has low refractive index, and each optical fiber in the optical fiber composite structure 3 does not have mutual crosstalk of optical signals due to the shielding effect of the cladding with low refractive index, thereby improving the signal-to-noise ratio, solving the traditional problem that the crosstalk of optical signals cannot be completely eliminated in the process of transmitting fluorescence B to the additional sensor 4, and it should be noted that the fluorescence B which does not reach the additional sensor 4 can be reflected once or repeatedly by the cladding of each optical fiber in the optical fiber composite structure 3 and finally enter the fiber core of each optical fiber in the optical fiber composite structure 3, to exit to the additional sensor 4;
secondly, the fiber core and the cladding of any optical fiber in the optical fiber composite structure 3 are at least one of transparent glass (such as high-refractive-index metal-doped glass or low-refractive-index glass, wherein the refractive index of the high-refractive-index metal-doped glass is 1.8, and the refractive index of the low-refractive-index glass is 1.5) or flexible plastic (such as high-refractive-index PMMA flexible plastic or low-refractive-index PMMA ultraviolet curing glue, wherein the refractive index of the high-refractive-index PMMA flexible plastic is 1.8, and the refractive index of the low-refractive-index PMMA ultraviolet curing glue is 1.4);
thirdly, the diameter of the fiber core of any optical fiber in the optical fiber composite structure 3 is 1/100-1/10 of the pixel interval of the sensor 1, so that for the sensor 1 and the optical fiber composite structure 3, complicated optical registration can be omitted, and the assembly difficulty of the optical fiber composite structure 3 is greatly reduced;
fourthly, the thickness of the cladding of any optical fiber in the optical fiber composite structure 3 is 1/10-1/5 of the diameter of the core.
In some embodiments, the optical fiber composite structure 3 is an optical fiber panel, and the length, width and height of the optical fiber panel are 430mm, 430mm and Y, respectively, wherein Y is greater than or equal to 0.5mm and less than or equal to 2mm, for example, when Y is 1mm, the transmittance of the optical fiber composite structure 3 to the fluorescence B emitted by the scintillator 2 and having a visible light wavelength of about 550 nm is greater than 75%. In other embodiments, the length, width, and height of the optical fiber panel can be flexibly adjusted according to practical application conditions, for example, if the thickness of the optical fiber panel is properly increased, that is, the thickness of the optical fiber composite structure 3 is properly increased, it is simply considered that the spatial distance between the sensor 1 and the additional sensor 4 can be increased due to the increased thickness of the optical fiber composite structure 3, and further electronic mutual interference between the sensor 1 and the additional sensor 4 due to too close distance can be further reduced, and due to the non-destructive fidelity constraint of the fiber cores of the optical fibers in the optical fiber composite structure 3 on the fluorescence B, although the thickness of the optical fiber composite structure 3 is increased, diffusion and weakening of the fluorescence B caused by lengthening of the propagation path of the fluorescence B do not occur, thereby ensuring the spatial resolution of the detector.
In the embodiment, the sensor 1 and the additional sensor 4 are at least one of a CMOS (Complementary Metal Oxide Semiconductor) sensor or a photodiode sensor (e.g., an amorphous silicon photodiode), and the pixel pitch is 140 μm. It will be appreciated that the role of the sensor 1 and the additional sensor 4 is to convert and output the received fluorescence B into an electrical signal.
In the present embodiment, the scintillator 2 includes at least one of europium gadolinium oxysulfide, thallium cesium iodide, and all-inorganic perovskite nanocrystals CsPbX3, where X is any one of Cl, Br, and I. In some embodiments, the scintillator 2 may be doped with other scintillator ceramic materials.
In addition, in order to double the speed of reading the data of the sensor 1 and the additional sensor 4, the data reading circuit boards 6 which are independent from each other are electrically connected to both sides of the sensor 1 and the additional sensor 4 in the embodiment, and the data reading circuit boards 6 are arranged in parallel to the direction of the incident ray a, so that the interference of the high-energy ray a radiation and the ionizing radiation to the data reading circuit boards 6 during long-time operation can be reduced.
As can be seen from the above description of the present embodiment, the substrate 5, the sensor 1, the scintillator 2, the optical fiber composite structure 3, and the additional sensor 4 in the present embodiment may all be made of flexible materials, so that the detector provided in the present embodiment satisfies the flexible design, and has unusual performance in terms of cost saving and anti-collision.
It should be noted that, for a CT detection system including a plurality of detectors (the plurality of detectors are arranged in an array or a matrix in a housing), each detector generates heat seriously during operation, and the CT detection system itself is sensitive to temperature, and if the temperature is too high, the operating performance of the photoelectric sensor is affected, and further the detection accuracy of the CT detection system is affected, so that the detection result is inaccurate. Considering some high-energy rays emitted from the ray source in a conical shape like X rays, the CT detection system needs to be in a section of arc shape in order to ensure that the distance from each detector to the light source center of the ray source is equal, which provides a very strict requirement on the geometric structure precision of each detector and an image chain.
Finally, experimental data comparing the relative values of photon responses (i.e., sensitivities) of the detector provided in this example with those of the conventional detector are given, as shown in the following table. In the experiment, the thicknesses of the scintillators of the detector provided by the embodiment and the traditional detector are both 400 μm, the test condition is that the ray source is filtered by adding 0.2mm of Cu, the source-image distance (the distance between the ray source and the surface of the detector) is 1.25 m, kV is fixed to be 70, and mAs is increased in sequence.
As can be seen from the above table, the sensitivity of the detector provided by the present embodiment can be up to 1.95 times that of the conventional detector.
Example 3
Referring to fig. 3, fig. 3 is a schematic structural diagram of a radiation imaging detection system based on an optical fiber composite structure according to an embodiment of the present invention.
As shown in fig. 3, a third embodiment of the present invention provides a radiation imaging detection system based on an optical fiber composite structure, applying the radiation imaging detector provided in the first embodiment and/or the second embodiment of the present invention, including a radiation source 100, a filter 200, an upper photosensitive layer 300, a lower photosensitive layer 400, a high voltage generation module 500, a control module 600, a data acquisition module 700, an image processing module 800 and an image display module 900, wherein the upper photosensitive layer 300 and the lower photosensitive layer 400 jointly represent the radiation imaging detector provided in the first embodiment and/or the second embodiment of the present invention, in other words, the upper photosensitive layer 300 and the lower photosensitive layer 400 correspond to the additional sensor 4 and the sensor 1, respectively, and if the upper photosensitive layer 300 corresponds to the additional sensor 4, the lower photosensitive layer 400 corresponds to the sensor 1; if the upper photosensitive layer 300 corresponds to the sensor 1, the lower photosensitive layer 400 corresponds to the additional sensor 4. In practical application, the radiation source 100 emits high-energy radiation a through the filter 200, the high-energy radiation a vertically enters from top to bottom and penetrates through the human body C to reach the detector (the whole body formed by the upper photosensitive layer 300 and the lower photosensitive layer 400), the upper photosensitive layer 300 and the lower photosensitive layer 400 simultaneously convert independently-collected fluorescent signals into electric signals and transmit the electric signals to the data acquisition module 700 through the control module 600, an upper image and a lower image are formed, the image processing module 800 corrects, preprocesses, registers and fuses the upper image and the lower image formed by the data acquisition module 700, a two-in-one fused image is further obtained, and finally the two-in-one fused image is displayed by the image display module 900.
Specifically, the image processing module 800 performs registration on the upper and lower images formed by the data acquisition module 700, which means that the sensor 1 and the additional sensor 4 cannot completely perform one-to-one correspondence between pixels after being attached, so that image registration is required to be performed in an image domain, where the registration includes translation, amplification and rotation of the images. In practical operation, the upper photosensitive layer 300 and the lower photosensitive layer 400 can simultaneously image a high-resolution line-to-line card or a phantom in advance, and then match the upper and lower images to a single-pixel level through registration, such registration only needs to be done once, and after registration transformation is obtained, the registration transformation can be directly applied to the next acquired image. The image processing module 800 blends the upper and lower images formed by the data acquisition module 700, which means that the two images independently obtained from the upper photosensitive layer 300 and the lower photosensitive layer 400 can be combined into an image with high resolution and high signal-to-noise ratio by linear combination. The weight coefficient of the linear combination can be determined by maximizing the signal-to-noise ratio in the selected region of interest through a least square method, and compared with the image acquired by a traditional detector, the fused image has a higher signal-to-noise ratio and can ensure high resolution under the condition of low radiation dose. In addition, the steps of the image processing module 800 performing correction and preprocessing on the upper and lower images formed by the data acquisition module 700 are the same as those of the conventional detector, and are not repeated here.
Example 4
Referring to fig. 4, fig. 4 is a schematic flow chart of a manufacturing method according to an embodiment of the invention.
As shown in fig. 4, a fourth embodiment of the present invention provides a manufacturing method, which is applied to the radiation imaging detector provided in the first embodiment and/or the second embodiment of the present invention, and includes the following steps S11 to S13.
S11, growing a scintillator on the sensor;
s12, adhering the optical fiber composite structure to the scintillator by using a coupling agent;
here, the optical fiber composite structure is manufactured by a hot-press drawing method. It can be understood that before attaching the optical fiber composite structure to the scintillator, the surface of the optical fiber composite structure needs to be cleaned to reduce the influence of particles. It should be noted that the fiber composite structure is vacuum gapless attached to the scintillator by the couplant. It should also be noted that, when the optical fiber composite structure is attached to the scintillator, the optical fiber composite structure needs to be in a normal temperature state, and the pressure is less than or equal to 1.2 atmospheric pressures and is kept for 3 min.
S13, attaching the additional sensor to the optical fiber composite structure by using a coupling agent;
it will be appreciated that prior to attaching the additional sensor to the optical fiber composite structure, the optical fiber composite structure and the additional sensor surface need to be cleaned to reduce the particulate impact. It should be noted that the additional sensor is vacuum-gapless fitted to the fiber composite structure by the coupling agent. It should be noted that the additional sensor needs to be in a normal temperature state when being attached to the optical fiber composite structure, and the pressure is less than or equal to 1.2 atmospheric pressures and kept for 3 min.
In some embodiments, the additional sensor is directly grown on the surface of the optical fiber composite structure and is bonded with the scintillator as a whole (here, the scintillator is directly grown on the sensor), so that one-step bonding process can be eliminated, the bonding cost can be reduced, and the bonding yield can be improved.
As can be seen from the above description in this embodiment, the manufacturing method has the advantages of simple process, high yield, strong reusability, flexible processing, and low manufacturing cost, does not require specific manufacturing equipment, and is convenient for large-scale commercial production.
Example 5
Referring to fig. 5, fig. 5 is another schematic flow chart of the manufacturing method according to the embodiment of the invention.
Compared with the manufacturing method provided by the fourth embodiment of the invention, the fifth embodiment of the invention has a different step flow.
As shown in fig. 5, the manufacturing method provided by the present embodiment includes the following steps S21 to S25.
S21, growing a scintillator on the sensor;
s22, polishing the optical fiber composite structure;
s23, roughening the polished optical fiber composite structure through any one of gas etching, laser etching and machining;
s24, attaching the coarsened optical fiber composite structure to a scintillator by using a coupling agent;
s25, turning the additional sensor and rotating the additional sensor counterclockwise by 90 degrees, and adhering the additional sensor to the coarsened optical fiber composite structure by using a coupling agent;
here, in order to make the data reading circuit boards electrically connected with the sensor and the additional sensor not overlap each other in space and avoid causing local overheating, the orientation of the additional sensor and the orientation of the sensor need to be perpendicular to each other at 90 degrees, that is, before the additional sensor is attached to the coarsened optical fiber composite structure, the additional sensor is turned over and rotated 90 degrees counterclockwise, and then the additional sensor is attached to the coarsened optical fiber composite structure by using a coupling agent, so that the additional sensor and the sensor are attached to each other in a pixel-pixel alignment manner.
It should be noted that, in the summary of the present invention, each embodiment is described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. For the method class embodiment, since it is similar to the product class embodiment, the description is simple, and the relevant points can be referred to the partial description of the product class embodiment.
It is further noted that, in the present disclosure, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined in this disclosure may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A radiation imaging detector, comprising: the optical fiber composite structure comprises a plurality of optical fibers, and the sensor, the scintillator, the optical fiber composite structure and the additional sensor are sequentially stacked;
incident rays generate fluorescence through the scintillator, the fluorescence on one side of the sensor is directly transmitted to the sensor, and the fluorescence on one side of the additional sensor is transmitted to the additional sensor through fiber cores of all optical fibers in the optical fiber composite structure by utilizing a waveguide effect.
2. The radiation imaging detector defined in claim 1, wherein the scintillator, the fiber composite structure and the additional sensor are bonded together by a coupling agent, the coupling agent being at least one of silicone oil, silicone grease and silicone gel.
3. The radiation imaging detector of claim 1, wherein a plurality of optical fibers in the optical fiber composite structure are integrated into a three-dimensional array, and any optical fiber in the optical fiber composite structure comprises a core and a cladding, and the refractive index of the core is greater than that of the cladding;
the fiber core and the cladding of any optical fiber in the optical fiber composite structure are at least one of transparent glass or flexible plastic;
the diameter of the fiber core of any optical fiber in the optical fiber composite structure is 1/100-1/10 of the pixel spacing of the sensor;
the thickness of the cladding of any optical fiber in the optical fiber composite structure is 1/10-1/5 of the diameter of the core.
4. The radiation imaging detector defined in claim 1, wherein the fiber composite structure is a fiber optic faceplate having a length, width and height of 430mm, 430mm and Y, respectively, wherein Y is 0.5mm ≦ 2 mm.
5. The radiation imaging detector of claim 1, wherein said sensor and additional sensor are at least one of a CMOS sensor or a photodiode sensor.
6. The radiation imaging detector defined in claim 1, wherein the scintillator comprises europium gadolinium oxysulfide, thallium cesium iodide, and all-inorganic perovskite nanocrystals CsPbX3Wherein, X is any one of Cl, Br and I.
7. The radiation imaging detector defined in claim 1, wherein the sensor and the additional sensor are electrically connected on both sides to separate data reading circuit boards, the data reading circuit boards being arranged parallel to the direction of the incident radiation.
8. A method of manufacture for use in a radiation imaging detector according to any of claims 1 to 7, comprising:
growing a scintillator on the sensor;
attaching an optical fiber composite structure to the scintillator by using a coupling agent;
an additional sensor is bonded to the fiber composite structure using a coupling agent.
9. The method of claim 8, wherein the applying the fiber composite structure to the scintillator with the coupling agent further comprises:
polishing the optical fiber composite structure;
coarsening the polished optical fiber composite structure by any one of gas etching, laser etching and mechanical processing;
utilizing the couplant, laminating the optical fiber composite structure to the scintillator includes: and adhering the coarsened optical fiber composite structure to the scintillator by using a coupling agent.
10. The method of claim 9, wherein said adhering an additional sensor to said fiber optic composite structure with a coupling agent comprises: and after the additional sensor is turned over and rotates 90 degrees anticlockwise, the additional sensor is attached to the coarsened optical fiber composite structure by using a coupling agent.
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