CN114371069A - Welding strength testing device and welding strength testing method - Google Patents
Welding strength testing device and welding strength testing method Download PDFInfo
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- CN114371069A CN114371069A CN202111545364.4A CN202111545364A CN114371069A CN 114371069 A CN114371069 A CN 114371069A CN 202111545364 A CN202111545364 A CN 202111545364A CN 114371069 A CN114371069 A CN 114371069A
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- 238000012360 testing method Methods 0.000 title claims abstract description 145
- 238000003466 welding Methods 0.000 title claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000007789 sealing Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 238000005192 partition Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 8
- 238000010998 test method Methods 0.000 claims 2
- 239000011324 bead Substances 0.000 description 23
- 238000005476 soldering Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
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- 239000000463 material Substances 0.000 description 2
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- 238000005086 pumping Methods 0.000 description 2
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- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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Abstract
The application belongs to the technical field of welding strength testing, and particularly relates to welding strength testing equipment and a welding strength testing method, wherein the welding strength testing equipment is used for testing the welding strength between an electronic component and a substrate; the substrate is provided with a mounting surface, and the electronic component is welded on the mounting surface; the welding strength test equipment comprises a vacuum cover and a vacuum generating device; the air inlet of the vacuum generating device is communicated with the vacuum cavity; the vacuum cover comprises a vacuum cavity with an opening, the vacuum cover is covered on the substrate, the electronic component is located in the vacuum cavity, and the mounting surface seals the opening of the vacuum cavity. The welding strength testing equipment tests the welding strength between the electronic component and the substrate by using the negative pressure in the vacuum cavity, has simple and easy testing scheme, has no requirement on the distance between the electronic components, has high testing efficiency, and is more suitable for the electronic equipment with small distance or micro distance.
Description
Technical Field
The application belongs to the technical field of welding strength testing, and particularly relates to welding strength testing equipment and a welding strength testing method.
Background
With the development of science and technology, the PCB is applied to various electronic products, and the PCB is usually provided with electronic components to realize different functions, and soldering materials such as soldering paste are usually used to connect the pads of the electronic components with the pads of the PCB, so as to realize electric conduction. The connection strength between the electronic component and the PCB (Printed Circuit Board) directly affects the reliability of the electrical connection, and the lower soldering strength may cause problems such as insufficient soldering, resulting in a problem of dead halt in the use process of the electronic component. Therefore, in the production process, the welding strength between the electronic component and the PCB needs to be tested so as to avoid the reliability problems of dead halt and the like caused by electric connection failure due to insufficient welding strength in the subsequent use process.
At present, a thrustor is usually adopted for measurement, but in the actual measurement process, the thrustor can only test one electronic component at a time, and along with the increase of the density of the electronic components on a PCB, the efficiency of the test using the thrustor is low, which is not enough to meet the production requirement.
Disclosure of Invention
The application aims to provide welding strength testing equipment and a welding strength testing method, and aims to solve the technical problem that in the prior art, a thrustmeter is adopted to test the welding strength between a PCB and an electronic component, and the welding strength is low in efficiency.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: a welding strength test device is used for testing the welding strength between an electronic component and a substrate; the substrate is provided with a mounting surface, and the electronic component is welded on the mounting surface;
the welding strength testing equipment comprises a vacuum cover and a vacuum generating device; the air inlet of the vacuum generating device is communicated with the vacuum cavity; the vacuum cover comprises a vacuum cavity with an opening, the vacuum cover is covered on the substrate, the electronic component is located in the vacuum cavity, and the mounting surface is used for sealing the opening of the vacuum cavity.
Optionally, the vacuum cover includes a bottom plate and a ring side plate, the ring side plate is connected to the bottom plate, and surrounds the vacuum chamber.
Optionally, the welding strength testing device further comprises a sealing member, which is arranged at a joint of an end of the ring side plate facing away from the bottom plate and the mounting surface and is used for sealing the vacuum cavity.
Optionally, the vacuum generating device further comprises a first vacuum tube and a first vacuum pump, and the first vacuum pump is communicated with the vacuum cavity through the first vacuum tube and is used for vacuumizing the vacuum cavity.
Optionally, a partition plate is arranged in the vacuum cover, the vacuum cavity is divided into a plurality of test cavities by the partition plate, the electronic components are distributed in the test cavities, and the test cavities are communicated with the air inlet of the vacuum generating device.
Optionally, the vacuum generating device includes a main vacuum tube, a second vacuum pump and a plurality of sub vacuum tubes, an air inlet of the second vacuum pump is communicated with the main vacuum tube, one end of each sub vacuum tube is communicated with the main vacuum tube, and the other end of each sub vacuum tube is communicated with each test cavity.
Optionally, the vacuum generating device includes a plurality of third vacuum pumps and a plurality of second vacuum pipes, and each of the third vacuum pumps is in one-to-one correspondence with each of the test chambers through each of the second vacuum pipes, and is configured to evacuate each of the vacuum chambers.
Optionally, the welding strength testing equipment further comprises a recycling module, and the recycling module is connected with the vacuum generating device and is used for recycling the electronic component separated from the substrate.
Optionally, the welding strength testing apparatus further includes a packaging module, and the packaging module is connected to the vacuum generating device and is used for packaging the electronic component detached from the substrate on the substrate.
One or more technical solutions in the welding strength testing apparatus provided by the present application have at least one of the following technical effects: when the welding strength testing equipment is used, the vacuum cover is arranged on the installation surface of the substrate, wherein the electronic component is installed on the installation surface, the installation surface seals the opening of the vacuum cover, at the moment, the vacuum cavity is in a closed state, then the vacuum generating device is started, the vacuum generating device vacuumizes the vacuum cavity to enable the vacuum cavity to be in negative pressure, if the soldering paste between the electronic component and the substrate has defects which affect the welding strength, such as air holes or cracks, the electronic component is separated from the substrate under the action of the negative pressure, the negative pressure value corresponds to the welding strength, and different negative pressure values are set to correspond to different welding strengths, so that the welding strength of the electronic component and the substrate in the electronic equipment is tested; and in actual test process, can establish the vacuum cover on the monoblock base plate to realize the welding strength test between electronic components and the base plate on the monoblock base plate, this compares with adopting the electronic components test of a thrustor, and detection efficiency obtains effectively promoting. In addition, the welding strength test equipment provided by the application tests the welding strength between the electronic component and the substrate by using the negative pressure in the vacuum cavity, the test scheme is simple and easy to implement, has no requirement on the distance between the electronic components, has high test efficiency, and is more suitable for electronic equipment with small distance or micro distance.
Another technical scheme adopted by the application is as follows: a welding strength testing method adopts the welding strength testing equipment, and comprises the following steps:
providing a vacuum hood and a vacuum generating device communicated with the vacuum hood;
arranging the vacuum cover on the electronic component on the substrate, wherein the substrate seals the opening of the vacuum cover;
and starting a vacuum generating device, and vacuumizing a vacuum cavity in the vacuum cover to form negative pressure in the vacuum cavity.
In the welding strength testing method, the welding strength between the electronic component and the substrate is tested by utilizing the negative pressure in the vacuum cavity, the testing scheme is simple and easy to implement, the space between the electronic component is not required, the testing efficiency is high, and the method is more suitable for electronic equipment with small space or micro space; in addition, in the actual test process, the vacuum cover can be covered on the whole substrate, so that the welding strength test between the electronic component and the substrate on the whole substrate is realized, and compared with the test of one electronic component by adopting a thrustmeter, the detection efficiency is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a welding strength test of an LED lighting device provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a welding strength testing apparatus according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a welding strength testing apparatus provided in the second embodiment of the present application for testing welding strength.
Fig. 4 is a schematic structural diagram of a welding strength testing device provided in the third embodiment of the present application for testing welding strength.
Wherein, in the figures, the respective reference numerals:
01-LED light-emitting equipment 011-PCB 012-soldering paste
013-LED lamp bead 02-thrustor
11-electronic component 12-substrate 121-mounting surface
13-solder paste 21-vacuum hood 22-vacuum generator
23-sealing member 24-sealing gasket 211-vacuum cavity
212-bottom plate 213-annular side plate 214-baffle plate
215-test chamber 221-first vacuum tube 222-first vacuum pump
223 vacuum branch pipe of total vacuum pipe 224 second vacuum pump 225
226-third vacuum pump 227-second vacuum line.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
As shown in fig. 2 to 4, in an embodiment of the present application, a soldering strength testing apparatus is provided for testing a soldering strength between an electronic component and a substrate; the substrate is provided with a mounting surface, and the electronic component is welded on the mounting surface; the electronic components can be LED lamp beads, resistors, capacitors, inductors, potentiometers, electronic tubes, radiators, electromechanical elements, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, photoelectric devices, sensors and the like, and are not limited one by one; in addition, in the embodiment of the application, an LED light emitting device in a display is taken as an example for description, that is, the electronic component is an LED lamp bead, and the substrate is a PCB board or a glass substrate.
In the related art, the LED lamp bead may be an LED component (commonly known as a DIP Package (also called Dual In-line Package), an SMD Package (abbreviated as Surface Mounted Devices, for short) or an unpackaged LED chip, which is packaged by using a soldering material such as solder paste, and the like, and is not listed here.
Referring to fig. 1, a thrustometer is commonly used in the industry to test the welding strength between an LED lamp bead and a PCB board, and the basic principle is as shown in fig. 1. The LED light-emitting device 01 comprises a PCB board 011 and LED lamp beads 013, wherein the LED lamp beads 013 are electrically connected with the PCB board 011 through solder paste 012. The method for testing the welding strength by the aid of the thrustometer 02 is characterized in that the thrustometer 02 acts on the side face of the LED lamp bead 013, acting force is applied to the LED lamp bead 013, the corresponding acting force when the LED lamp bead 013 is separated from the PCB board 011 is tested, and the acting force is used as the welding strength between the LED lamp bead 013 and the PCB board 011. According to the method, the welding strength is represented by using the shearing stress, the testing principle is simple, but with the continuous reduction of the pixel distance in an LED light-emitting device 01 such as an LED display product, the distance between LED lamp beads 013 is continuously reduced, the size of a thrust arm of a thrustmeter 02 needs to be correspondingly reduced, meanwhile, the moving space becomes smaller, and the design difficulty of the thrustmeter 02 is increased; in addition, only one LED lamp bead 013 can be tested by using the thrustmeter 02 at a time, and along with the increase of the density of the LED lamp beads 013 in the LED light-emitting device 01, the efficiency of testing by using the thrustmeter 02 is not enough to meet the production requirement. In addition, the push arm of the thrustor 02 is in point contact with the side surface of the LED lamp bead 013, and the LED lamp bead 013 is unevenly stressed everywhere, so that the welding strength cannot be accurately represented.
With reference to fig. 1 and 2, to solve the problem, the present application provides a novel method for testing the welding strength between an LED lamp bead 013 and a PCB 011, in which a vacuum cavity 211 is used to test the welding strength by using a negative pressure principle, the testing scheme is simple and easy to implement, no requirement is imposed on the distance between the LED lamp beads 013, the testing efficiency is high, and the method is more suitable for LED lighting devices 01 with small or fine distances, and in addition, in the testing scheme of the vacuum cavity 211, the stress on each part of the LED lamp bead 013 is uniform, and the testing on the welding strength is more accurate. The application also provides welding strength testing equipment using the testing scheme.
The embodiment of the application provides following welding strength test equipment, and the concrete structure is as follows:
example one
In the present embodiment, as shown in fig. 2, a soldering strength testing apparatus is provided for testing the soldering strength between the electronic component 11 and the substrate 12; the substrate 12 has a mounting surface 121, and the electronic component 11 is soldered to the mounting surface 121; the welding strength test device comprises a vacuum cover 21 and a vacuum generating device 22; the air inlet of the vacuum generating device 22 is communicated with the vacuum cavity 211; the vacuum cover 21 includes a vacuum chamber 211 having an opening, the vacuum cover 21 is covered on the substrate 12, the electronic component 11 is located in the vacuum chamber 211, and the mounting surface 121 seals the opening of the vacuum chamber 211.
Specifically, when the welding strength testing device provided in the embodiment of the present application is used, the vacuum cover 21 is first disposed on the mounting surface 121 of the substrate 12 on which the electronic component 11 is mounted, and at the same time, the mounting surface 121 seals the opening of the vacuum cover 21, at this time, the vacuum chamber 211 is in a closed state, the vacuum generating device 22 is then started, the vacuum generating device 22 evacuates the vacuum chamber 211 to make the vacuum chamber 211 have a negative pressure, if there are defects that affect the welding strength, such as air holes or cracks, in the solder paste 13 between the electronic component 11 and the substrate 12, the electronic component 11 is separated from the substrate 12 under the action of the negative pressure, the negative pressure value corresponds to the welding strength, and different negative pressure values are set to correspond to different welding strengths, so as to test the welding strength of the electronic component 11 and the substrate 12 in the electronic device; in the actual testing process, the vacuum cover 21 can be covered on the whole substrate 12, so that the welding strength test between the electronic component 11 and the substrate 12 on the whole substrate 12 is realized, and compared with the test of one electronic component 11 by adopting a thrustor, the detection efficiency is effectively improved.
The welding strength test equipment provided by the embodiment of the application uses the negative pressure in the vacuum cavity 211 to test the welding strength between the electronic component 11 and the substrate 12, the test scheme is simple and easy to implement, the distance between the electronic component 11 is not required, the test efficiency is high, and the equipment is more suitable for electronic equipment with small distance or micro distance.
In a specific embodiment, the electronic device may be an LED lighting device, the electronic component 11 is an LED lamp bead, and the substrate 12 is a PCB; in the detection process of actual LED lamp beads, the LED lamp beads on the PCB can be detected in a partition mode, the LED lamp beads on the whole PCB can be detected simultaneously, the specific detection area can be designed according to the size of the vacuum cover 21, and limitation is not required.
In this embodiment, as shown in fig. 2, the vacuum cover 21 includes a bottom plate 212 and a ring side plate 213, wherein the ring side plate 213 is connected to the bottom plate 212 and surrounds the bottom plate 212 to form a vacuum chamber 211. The vacuum cavity 211 with an opening at one end is formed by surrounding the ring side plate 213 and the bottom plate 212, so that when in test use, only the end part of the ring side plate 213 back to the bottom plate 212 is required to be placed on the substrate 12, the opening of the vacuum cavity 211 is sealed, the operation is simple, and the vacuum cover 21 is simple in structure and convenient to manufacture.
In a specific embodiment, the ring-shaped side plate 213 may have a circular ring shape, a square ring shape, an elliptical ring shape, or the like, and a specific shape thereof may be designed according to an arrangement manner of the electronic components 11 on the substrate 12, which is not limited herein.
In the present embodiment, as shown in fig. 2, the welding strength testing apparatus further includes a sealing member 23, and the sealing member 23 is disposed at a connection between an end of the ring side plate 213 facing away from the bottom plate 212 and the mounting surface 121, and is used for sealing the vacuum chamber 211. The sealing piece 23 seals the joint of the annular side plate 213 and the mounting surface 121, so that the vacuum cavity 211 is in a sealed state, the vacuum pumping effect in the vacuum cavity 211 is better, and the accuracy of the test result is higher.
In a specific embodiment, the sealing member 23 is a sealing ring, the sealing ring surrounds the electronic component 11 to be tested, the vacuum cover 21 covers the electronic component 11 to be tested, and the sealing ring is clamped between the end of the ring side plate 213 facing away from the bottom plate 212 and the mounting surface 121, so as to seal the vacuum cavity 211.
In this embodiment, as shown in fig. 2, vacuum generator 22 further includes a first vacuum tube 221 and a first vacuum pump 222, and first vacuum pump 222 is connected to vacuum chamber 211 through first vacuum tube 221 and is configured to evacuate vacuum chamber 211. The vacuum cavity 211 is communicated with the first vacuum pump 222 through the first vacuum pipe 221, after the first vacuum pump 222 is started, air in the vacuum cavity 211 is pumped out, negative pressure is formed in the vacuum cavity 211, and therefore the welding strength test between the electronic component 11 and the substrate 12 is achieved.
In this embodiment, the first vacuum tube 221 is provided with a vacuum gauge head (not shown) and a vacuum valve (not shown), and the vacuum gauge head can display the vacuum degree in the vacuum cavity 211 in real time, so that a tester can adjust test parameters at any time, and test failure and damage to the electronic component 11 and the substrate 12 are avoided; the vacuum valve can block vacuum pumping in time to prevent damage.
In this embodiment, the soldering strength testing apparatus further includes a recycling module (not shown) connected to the vacuum generator 22 for recycling the electronic component 11 separated from the substrate 12. After the negative pressure is formed in the vacuum chamber 211, the electronic component 11 is separated from the substrate 12 under the action of the negative pressure for the defects such as air holes or cracks existing in the solder paste 13 between the electronic component 11 and the substrate 12 and affecting the welding strength, and the recovery module can recover the electronic component 11 which is separated from the substrate 12 due to insufficient welding strength, thereby providing conditions for the subsequent repair of the electronic component 11.
In this embodiment, the soldering strength testing apparatus further includes a packaging module (not shown), which is connected to the vacuum generating device 22 and is used for packaging the electronic component 11 detached from the substrate 12 on the substrate 12. After the negative pressure is formed in the vacuum cavity 211, for the defects that the soldering strength is affected by air holes or cracks and the like in the soldering paste 13 between the electronic component 11 and the substrate 12, the electronic component 11 is separated from the substrate 12 under the action of the negative pressure, and the electronic component 11 which is separated from the substrate 12 due to insufficient soldering strength can be soldered and packaged on the substrate 12 again by the packaging module, so that the electronic component 11 can be repaired in time.
Example two
As shown in fig. 3, the difference between the present embodiment and the first embodiment is: the vacuum cover 21 is internally provided with a partition plate 214, the vacuum cavity 211 is divided into a plurality of test cavities 215 by the partition plate 214, the electronic components 11 are distributed in the test cavities 215, and the test cavities 215 are communicated with the air inlet of the vacuum generating device 22. The vacuum chamber 211 is divided into a plurality of test chambers 215 by the partition plate 214, so that the plurality of test chambers 215 respectively test the electronic components 11 in different areas, and different welding strength distributions in different test areas can be obtained, thereby facilitating adjustment of the manufacturing process.
In a specific embodiment, the partition 214 may be in a grid or grid shape, so as to divide the vacuum chamber 211 into a plurality of test chambers 215, wherein the number of the test chambers 215 may be two, three, four or more, and the specific number thereof is set according to actual needs, and is not limited herein.
In the embodiment shown in fig. 3, the gasket 24 is sandwiched between the end of the partition 214 facing away from the bottom surface of the vacuum chamber 211 and the mounting surface 121. The partition plate 214 and the mounting surface 121 are sealed through the sealing gasket 24, so that external air is prevented from entering the test cavity 215 from a gap between the partition plate 214 and the mounting surface 121, the test cavity 215 is guaranteed to have a good vacuumizing effect, and the test accuracy is further guaranteed.
In a specific embodiment, the sealing gasket 24 can be connected with the sealing ring to form a whole, so that in use, the sealing gasket is only laid on the substrate 12 and then the vacuum cover 21 is covered, and the detection operation is convenient and quick.
In this embodiment, the test cavities 215 may have the same shape and size, or may have different shapes and sizes, and may be specifically designed according to actual needs, and are not limited herein.
In an embodiment, as shown in fig. 3, the vacuum generating device 22 includes a main vacuum tube 223, a second vacuum pump 224 and a plurality of sub vacuum tubes 225, an air inlet of the second vacuum pump 224 is communicated with the main vacuum tube 223, one end of each sub vacuum tube 225 is communicated with the main vacuum tube 223, and the other end of each sub vacuum tube 225 is communicated with each test cavity 215. The second vacuum pump 224 evacuates each test chamber 215 through the main vacuum pipe 223 and each sub vacuum pipe 225, and negative pressure is formed in each test chamber 215, thereby realizing the soldering strength test of the electronic component 11 in each test chamber 215.
The rest of this embodiment is the same as the first embodiment, and the unexplained features in this embodiment are explained by the first embodiment, which is not described herein again.
EXAMPLE III
As shown in fig. 4, the present embodiment is different from the second embodiment in that: the vacuum generating device 22 includes a plurality of third vacuum pumps 226 and a plurality of second vacuum pipes 227, and each third vacuum pump 226 is respectively communicated with each test chamber 215 through each second vacuum pipe 227 in a one-to-one correspondence manner and is used for vacuumizing the corresponding test chamber 215. Each test cavity 215 communicates with each third vacuum pump 226 one-to-one, so adjust different third vacuum pumps 226 to different states, make have different negative pressure values in different test cavities 215 to this realizes different negative pressures in different test cavities 215, applys different welding strength test conditions to different regions, and then realizes setting up different welding strength critical values to different regions and carry out the subregion test.
The rest of this embodiment is the same as the embodiment, and the unexplained features in this embodiment are explained by the embodiment two, which is not described again here.
Example four
The embodiment provides a welding strength testing method, which comprises the following steps of:
s10: providing a vacuum cover 21 and a vacuum generating device 22 communicated with the vacuum cover 21;
s20: arranging a vacuum cover 21 on the electronic component 11 on the substrate 12, wherein the substrate 12 seals the opening of the vacuum cover 21;
s30: the vacuum generating device 22 is activated to evacuate the vacuum chamber 211 in the vacuum cover 21, thereby forming a negative pressure in the vacuum chamber 211.
In the welding strength testing method of the embodiment of the application, the negative pressure in the vacuum cavity 211 is used for testing the welding strength between the electronic component 11 and the substrate 12, the testing scheme is simple and easy to implement, the distance between the electronic components 11 is not required, the testing efficiency is high, and the method is more suitable for electronic equipment with small distance or micro distance; in addition, in the actual testing process, the vacuum cover 21 can be covered on the whole substrate 12, so that the welding strength test between the electronic component 11 and the substrate 12 on the whole substrate 12 can be realized, and compared with the test of one electronic component 11 by adopting a thrustmeter, the detection efficiency is effectively improved.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (10)
1. A welding strength test device is used for testing the welding strength between an electronic component and a substrate; the substrate is provided with a mounting surface, and the electronic component is welded on the mounting surface;
the method is characterized in that: the welding strength testing equipment comprises a vacuum cover and a vacuum generating device; the air inlet of the vacuum generating device is communicated with the vacuum cavity; the vacuum hood comprises a vacuum cavity with an opening; the vacuum cover covers the substrate, the electronic component is located in the vacuum cavity, and the mounting surface is used for sealing an opening of the vacuum cavity.
2. The welding strength test apparatus according to claim 1, wherein: the vacuum cover comprises a bottom plate and a ring side plate, wherein the ring side plate is connected with the bottom plate, is arranged around the bottom plate and forms the vacuum cavity.
3. The welding strength test apparatus according to claim 2, wherein: the welding strength testing equipment further comprises a sealing element, wherein the sealing element is arranged at the connecting position of the end part of the ring side plate, which is opposite to the bottom plate, and the mounting surface and is used for sealing the vacuum cavity.
4. The welding strength test apparatus according to any one of claims 1 to 3, characterized in that: the vacuum generating device further comprises a first vacuum tube and a first vacuum pump, and the first vacuum pump is communicated with the vacuum cavity through the first vacuum tube and is used for vacuumizing the vacuum cavity.
5. The welding strength test apparatus according to any one of claims 1 to 3, characterized in that: the vacuum chamber is divided into a plurality of test chambers by the partition board, the electronic components are distributed in the test chambers, and the test chambers are communicated with the air inlet of the vacuum generating device.
6. The welding strength test apparatus according to claim 5, wherein: the vacuum generating device comprises a main vacuum tube, a second vacuum tube and a plurality of branch vacuum tubes, wherein an air inlet of the second vacuum tube is communicated with the main vacuum tube, one end of each branch vacuum tube is communicated with the main vacuum tube, and the other end of each branch vacuum tube is communicated with each test cavity respectively.
7. The welding strength test apparatus according to claim 5, wherein: the vacuum generating device comprises a plurality of third vacuum pumps and a plurality of second vacuum pipes, and each third vacuum pump is communicated with each test cavity in a one-to-one correspondence mode through each second vacuum pipe and is used for vacuumizing each vacuum cavity.
8. The welding strength test apparatus according to any one of claims 1 to 3, characterized in that: the welding strength testing equipment further comprises a recycling module, wherein the recycling module is connected with the vacuum generating device and used for recycling the electronic components separated from the substrate.
9. The welding strength test apparatus according to any one of claims 1 to 3, characterized in that: the welding strength testing equipment further comprises a packaging module, wherein the packaging module is connected with the vacuum generating device and is used for packaging the electronic component separated from the substrate on the substrate.
10. A welding strength test method is characterized in that: the welding strength test apparatus according to any one of claims 1 to 9 is used, and the welding strength test method includes the steps of:
providing a vacuum hood and a vacuum generating device communicated with the vacuum hood;
arranging the vacuum cover on the electronic component on the substrate, wherein the substrate seals the opening of the vacuum cover;
and starting a vacuum generating device, and vacuumizing a vacuum cavity in the vacuum cover so as to form negative pressure in the vacuum cavity.
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| CN202111545364.4A CN114371069A (en) | 2021-12-16 | 2021-12-16 | Welding strength testing device and welding strength testing method |
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| CN202111545364.4A CN114371069A (en) | 2021-12-16 | 2021-12-16 | Welding strength testing device and welding strength testing method |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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