CN114368117A - Latent glue feeding mechanism of die - Google Patents
Latent glue feeding mechanism of die Download PDFInfo
- Publication number
- CN114368117A CN114368117A CN202011102595.3A CN202011102595A CN114368117A CN 114368117 A CN114368117 A CN 114368117A CN 202011102595 A CN202011102595 A CN 202011102595A CN 114368117 A CN114368117 A CN 114368117A
- Authority
- CN
- China
- Prior art keywords
- runner
- glue feeding
- latent
- feeding mechanism
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 70
- 238000000465 moulding Methods 0.000 claims description 12
- 239000000155 melt Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a latent glue feeding mechanism of a die, which comprises an upper fixing plate, a female die plate, a male die plate and a lower fixing plate, wherein the latent glue feeding mechanism of the die comprises: the female die core is arranged on the female die plate; the male die core is arranged on the male die plate; the glue inlet branch piece channel is arranged on one side of the male die core and is connected with the glue inlet forming cavity of the product; the sliding block is arranged on the male die core; the first flow channel is vertically arranged inside the sliding block; the second flow channel is arranged at the head part of the sliding block and is obliquely connected with the rubber branch piece inlet channel, and the first flow channel and the second flow channel are mutually connected and form an oblique included angle; the runner thimble is arranged in the core insert, and by using the latent glue feeding mechanism of the die, the problems that a stub bar is easy to be blocked between the core insert and a slide block and the die is damaged are solved, the maintenance cost of the die is reduced, the product quality is improved, and the production efficiency of the die is improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a glue feeding structure of a mold, in particular to a latent glue feeding mechanism of the mold.
[ background of the invention ]
In the prior art, a glue feeding mechanism of a mold is arranged to complete a glue feeding molding operation of a product, as shown in fig. 1 and 2, fig. 1 is a schematic diagram of a glue feeding mechanism of the mold in a mold closing state in the prior art, fig. 2 is a schematic diagram of a glue feeding mechanism of the mold in an mold opening state in the prior art, the mold includes an upper fixing plate 11, a female mold plate 12, a male mold plate 13 and a lower fixing plate 14, the glue feeding mechanism 100 of the mold adopts a slide block 130 to perform latent glue feeding, that is, a vertical runner 131 is arranged inside the slide block 130, and a glue feeding branch piece channel 121 and an inclined runner 122 are arranged on a male mold core 120, the vertical runner 131 connects the inclined runner 122 and the glue feeding branch piece channel 121, and the glue feeding branch piece channel 121 connects a molding cavity of the product, so that a glue feeding molten liquid firstly flows into the inclined runner 122 on the male mold core 120 through the vertical runner 131 inside the slide block 130, then flows into the branch rubber inlet channel 121, then flows into the molding cavity of the product from the branch rubber inlet channel 121, and finally, the operation of rubber inlet molding of the product is carried out. The runner ejector pin is arranged on the mold core, when the mold is in a mold opening state, the vertical runner 121 is pulled out of the slide block 130, then the slide block 130 is withdrawn, and then the runner ejector pin performs product ejection operation, however, the processing mode enables the stub bar to be easily clamped between the mold core and the slide block, and the mold is closed when the stub bar is not taken out, so that the mold is directly crushed, the product quality is reduced, the maintenance cost of the mold is increased, and the production efficiency of the mold is reduced.
In view of the above, there is a need to develop a latent adhesive feeding mechanism for a mold, so as to solve the problems that a stub bar generated in the current processing manner is easily jammed between a mold core and a slide block, the mold is damaged, the product quality is reduced, the maintenance cost of the mold is increased, and the production efficiency of the mold is reduced.
[ summary of the invention ]
Therefore, an object of the present invention is to provide a latent adhesive feeding mechanism for a mold, so as to solve the problems that a stub bar generated in the current processing manner is easily jammed between a mold core and a slide block, the mold is damaged, the product quality is reduced, the maintenance cost of the mold is increased, and the production efficiency of the mold is reduced.
In order to achieve the above object, the present invention provides a latent glue feeding mechanism for a mold, the mold comprising an upper fixing plate, a female mold plate, a male mold plate and a lower fixing plate, the latent glue feeding mechanism for the mold comprising:
the female die core is arranged on the female die plate;
the male die core is arranged on the male die plate;
the glue inlet branch piece channel is arranged on one side of the core insert and is connected with a glue inlet forming cavity of a product;
the sliding block is arranged on the male die core;
the first flow channel is vertically arranged inside the sliding block;
the second flow channel is arranged at the head of the sliding block, the second flow channel is obliquely connected with the rubber inlet branch piece channel, and the first flow channel and the second flow channel are mutually connected and form an oblique included angle;
and the flow passage thimble is arranged in the core insert.
Optionally, the first runner is a vertical runner, and the second runner is a latent runner.
Optionally, the melt in the latent runner directly enters the glue inlet branch piece channel from the head of the sliding block, and then enters the glue inlet forming cavity of the product from the glue inlet branch piece channel to perform glue inlet forming on the product.
Optionally, the included angle of inclination is between 30 and 60 degrees.
Optionally, when the latent glue feeding mechanism of the mold is in a mold opening state, the first runner and the second runner directly retreat backward along with the slider, after the slider retreats for a certain distance, the runner positioning ejector pin corresponds to the first runner, and the runner ejector pin directly ejects the first runner.
Compared with the prior art, the latent glue feeding mechanism of the die firstly arranges the vertical runner and the latent runner on the sliding block, the vertical runner and the latent runner are connected to form an inclined included angle, secondly, the melt liquid in the latent runner directly enters the glue feeding branch piece channel from the head part of the sliding block, then flows into the glue feeding forming cavity from the glue feeding branch piece channel to carry out forming operation, then, when the latent glue feeding mechanism of the die is in a die opening state, the vertical runner and the latent runner directly retreat backwards along with the sliding block, after the latent glue feeding mechanism retreats for a certain distance, the runner positioning thimble corresponds to the position of the vertical runner, the runner thimble directly ejects the vertical runner out, the die is directly prevented from being blocked and damaged by the runner, by utilizing the latent glue feeding mechanism of the die, the problems that the stub bar is easily blocked between the die core and the sliding block and the die is damaged are solved, and the die maintenance cost is reduced, the product quality and the production efficiency of the die are also improved.
[ description of the drawings ]
Fig. 1 is a schematic diagram of a prior art mold with a glue feeding mechanism in a mold clamping state.
Fig. 2 is a schematic diagram of a glue feeding mechanism of a prior art mold in a mold opening state.
Fig. 3 is a schematic view of the latent glue feeding mechanism of the mold of the present invention in a mold clamping state.
Fig. 4 is a schematic view of the latent glue feeding mechanism of the mold of the invention in the mold opening state.
Fig. 5 is a partial schematic view of the latent glue feeding mechanism of the mold of the invention in the mold opening state.
[ detailed description ] embodiments
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to a preferred embodiment of the present invention and the accompanying drawings.
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, fig. 1 is a schematic view of a mold clamping state of a mold according to the prior art, fig. 2 is a schematic view of a mold opening state of a mold according to the prior art, fig. 3 is a schematic view of a mold clamping state of a latent glue feeding mechanism of a mold according to the present invention, fig. 4 is a schematic view of a mold opening state of a latent glue feeding mechanism of a mold according to the present invention, and fig. 5 is a partial schematic view of a mold opening state of a latent glue feeding mechanism of a mold according to the present invention.
In order to achieve the above object, the present invention provides a latent glue feeding mechanism 200 for a mold, the mold comprising an upper fixing plate 21, a female mold plate 22, a male mold plate 23 and a lower fixing plate 24, the latent glue feeding mechanism 200 for the mold comprising:
the cavity insert 210 is arranged on the cavity plate 22, the cavity plate 22 fixes the cavity insert 210, and the cavity insert 210 is used for glue feeding and forming of a product;
the core insert 220 is arranged on the core plate 23, the core plate 23 fixes the core insert 220, and the core insert 220 is used for fixing the sliding block 230;
the rubber inlet branch piece channel 221 is arranged on one side of the core insert 220, the rubber inlet branch piece channel 221 is connected with a rubber inlet molding cavity of a product, and the rubber inlet branch piece channel 221 is used for enabling molten liquid to flow into the molding cavity of the product to perform rubber inlet molding operation of the product;
a slide 230, wherein the slide 230 is disposed on the core insert 220;
a first flow channel 231, wherein the first flow channel 231 is vertically disposed inside the slider 230, and the first flow channel 231 is used for vertically inputting melt;
the second runner 232 is arranged at the head of the slider 230, the second runner 232 is obliquely connected with the rubber inlet branch piece channel 221, the first runner 231 and the second runner 232 are connected with each other and form an oblique included angle, the second runner 232 is used for enabling melt to directly flow into the rubber inlet branch piece channel 221 for rubber inlet forming, and the first runner 231 and the second runner 232 are connected with each other and form an oblique included angle, so that the melt can be shunted and buffered to enter a forming cavity of a product for operation;
a flow channel thimble 240, the flow channel thimble 240 is disposed in the core 23, and the flow channel thimble 240 is configured to eject the first flow channel 231.
The first flow channel 231 is a vertical flow channel, and the second flow channel 232 is a latent flow channel.
The melt in the latent runner directly enters the glue inlet branch piece channel 221 from the head of the sliding block 230, and then enters the glue inlet molding cavity of the product from the glue inlet branch piece channel 221 to perform glue inlet molding of the product.
Wherein the included angle of inclination is between 30 and 60 degrees.
When the latent glue feeding mechanism 200 of the mold is in a mold opening state, the first flow channel 231 and the second flow channel 232 directly retreat backward along with the slider 230, and after the slider 230 retreats for a certain distance, the flow channel positioning pin 240 corresponds to the first flow channel 231, and the flow channel pin 240 directly pushes out the first flow channel 231.
Compared with the prior art, the latent glue feeding mechanism 100 of the mold of the invention firstly arranges the vertical runner and the latent runner on the slide block 230, the vertical runner and the latent runner are integrally connected with each other and form an inclined included angle, wherein the vertical runner and the latent runner have the functions of shunting and buffering molten liquid, secondly, the molten liquid in the latent runner directly enters the glue inlet branch piece channel 221 from the head part of the slide block 230, then enters the glue inlet molding cavity of a product from the glue inlet branch piece channel 221, then, when the latent glue feeding mechanism 200 of the mold is in a mold opening state, the vertical runner and the latent runner directly retreat backwards along with the slide block 230, after the molten liquid retreats for a certain distance, the runner thimble 240 directly ejects the vertical runner, thereby directly avoiding the runner from being blocked and crushing the mold, and utilizing the latent glue feeding mechanism 200 of the mold of the invention, not only solving the problems that a material head is easy to be blocked between a mold core and the slide block 230 and the mold is damaged, the maintenance cost of the die is reduced, the product quality is improved, and the production efficiency of the die is improved.
It should be noted that the present invention is not limited to the above embodiments, and any simple modification, equivalent change and modification made to the above embodiments by those skilled in the art based on the technical solution of the present invention fall within the protection scope of the present invention.
Claims (5)
1. The utility model provides a glue feeding mechanism hides of mould, this mould includes upper fixed plate, female template, public template and bottom plate, its characterized in that, glue feeding mechanism hides of mould includes:
the female die core is arranged on the female die plate;
the male die core is arranged on the male die plate;
the glue inlet branch piece channel is arranged on one side of the core insert and is connected with a glue inlet forming cavity of a product;
the sliding block is arranged on the male die core;
the first flow channel is vertically arranged inside the sliding block;
the second flow channel is arranged at the head of the sliding block, the second flow channel is obliquely connected with the rubber inlet branch piece channel, and the first flow channel and the second flow channel are mutually connected and form an oblique included angle;
and the flow passage thimble is arranged in the core insert.
2. The latent glue feeding mechanism of a mold according to claim 1, wherein the first runner is a vertical runner, and the second runner is a latent runner.
3. The latent glue feeding mechanism of a mold according to claim 2, wherein the melt in the latent runner directly enters the glue feeding branch piece channel from the head of the slide block, and then enters the glue feeding molding cavity of the product from the glue feeding branch piece channel to perform glue feeding molding of the product.
4. The latent glue feeding mechanism of a mold according to claim 1, wherein the angle of said inclined included angle is between 30 and 60 degrees.
5. The latent glue feeding mechanism of a mold according to claim 1, wherein when the latent glue feeding mechanism of a mold is in an open state, the first runner and the second runner are directly withdrawn backwards along with the slide block, after the slide block is withdrawn for a certain distance, the runner positioning pin corresponds to the first runner, and the runner pin directly pushes out the first runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011102595.3A CN114368117A (en) | 2020-10-15 | 2020-10-15 | Latent glue feeding mechanism of die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011102595.3A CN114368117A (en) | 2020-10-15 | 2020-10-15 | Latent glue feeding mechanism of die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114368117A true CN114368117A (en) | 2022-04-19 |
Family
ID=81138994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011102595.3A Pending CN114368117A (en) | 2020-10-15 | 2020-10-15 | Latent glue feeding mechanism of die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114368117A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106466906A (en) * | 2015-08-21 | 2017-03-01 | 汉达精密电子(昆山)有限公司 | Hide into plastic structure in slide block |
| CN107303716A (en) * | 2016-04-22 | 2017-10-31 | 汉达精密电子(昆山)有限公司 | Enter plastic structure in sliding block |
| CN207841953U (en) * | 2017-11-29 | 2018-09-11 | 四川长虹模塑科技有限公司 | Injection mold is hidden into plastic structure |
| CN108943602A (en) * | 2017-05-26 | 2018-12-07 | 汉达精密电子(昆山)有限公司 | It is hidden in sliding block into plastic structure |
-
2020
- 2020-10-15 CN CN202011102595.3A patent/CN114368117A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106466906A (en) * | 2015-08-21 | 2017-03-01 | 汉达精密电子(昆山)有限公司 | Hide into plastic structure in slide block |
| CN107303716A (en) * | 2016-04-22 | 2017-10-31 | 汉达精密电子(昆山)有限公司 | Enter plastic structure in sliding block |
| CN108943602A (en) * | 2017-05-26 | 2018-12-07 | 汉达精密电子(昆山)有限公司 | It is hidden in sliding block into plastic structure |
| CN207841953U (en) * | 2017-11-29 | 2018-09-11 | 四川长虹模塑科技有限公司 | Injection mold is hidden into plastic structure |
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