CN114356058A - Internal cavity structure of electronic equipment - Google Patents
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- CN114356058A CN114356058A CN202111681348.8A CN202111681348A CN114356058A CN 114356058 A CN114356058 A CN 114356058A CN 202111681348 A CN202111681348 A CN 202111681348A CN 114356058 A CN114356058 A CN 114356058A
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- 239000011248 coating agent Substances 0.000 claims abstract description 40
- 238000000576 coating method Methods 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims description 44
- 239000011247 coating layer Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
According to the internal cavity structure of the electronic device disclosed by the embodiment of the disclosure, the first coating covers the first area of the inner wall of the cavity, the second coating covers the second area of the inner wall of the cavity, and the emissivity of the first coating is higher than that of the second coating, so that the transmission rate of heat to the first area can be increased, and the transmission rate of heat to the second area can be reduced. Therefore, although the second area is closer to the heat source, the temperatures of the second area and the first area can be closer, and accordingly, the temperature of the second area can be prevented from being too high.
Description
Technical Field
The utility model relates to a mechanical cavity heat dissipation technical field especially relates to an inside cavity structures of electronic equipment.
Background
With the development of scientific technology, people use electronic equipment more and more, and for terminal electronic products, such as intelligent sound boxes, learning machines and the like, because of the product form and the internal structure, the temperature of certain positions on the surface of a shell is generally higher, so that the use experience of users can be influenced.
Disclosure of Invention
This disclosure is provided to introduce concepts in a simplified form that are further described below in the detailed description. This disclosure is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
The embodiment of the disclosure provides an internal cavity structure of an electronic device, which can avoid the overhigh temperature of a certain area in the cavity under the condition of not changing the cavity structure.
In a first aspect, an embodiment of the present disclosure provides an internal cavity structure of an electronic device, where a first region of an inner wall of a cavity covers a first coating, and a second region of the inner wall of the cavity covers a second coating; the emissivity of said first coating layer is higher than the emissivity of said second coating layer; the cavity is used for placing a heat source, the distance between the first area and the heat source is a first distance, the distance between the second area and the heat source is a second distance, and the first distance is larger than the second distance.
In some optional embodiments, a heat dissipation plate is disposed inside the cavity; the heat dissipation plate is disposed between the first region and the heat source.
In some optional embodiments, the first plate surface of the heat dissipation plate is covered with a third coating layer, and the first plate surface of the heat dissipation plate is disposed opposite to the first region.
In some alternative embodiments, the area of the first region is not less than the area of the coverage area of the third coating layer.
In some alternative embodiments, the area of the heat dissipation plate is not smaller than the area of the heat source.
In some optional embodiments, the second plate surface of the heat dissipation plate is disposed opposite to the heat source, and a distance between the heat source and the first position of the second plate surface is smaller than a preset distance, wherein the first plate surface of the heat dissipation plate corresponds to the second plate surface of the heat dissipation plate.
In some alternative embodiments, the heat dissipation plate is in contact with the heat source.
In some alternative embodiments, the area of the first region is not smaller than the area of the second region.
In some optional embodiments, the first surface of the heat source is disposed opposite to the second region, and an area of the second region is smaller than or equal to an area of the first surface of the heat source.
In some alternative embodiments, the emissivity of the third coating is higher than the emissivity of the second coating.
In some alternative embodiments, the third coating layer and the first coating layer are made of the same material.
According to the internal cavity structure of the electronic device, the first coating covers the first area of the inner wall of the cavity, the second coating covers the second area of the inner wall of the cavity, and the radiation rate of the first coating is higher than that of the second coating, so that the transmission rate of heat to the first area can be increased, and the transmission rate of heat to the second area can be reduced. Therefore, although the second area is closer to the heat source, the temperatures of the second area and the first area can be closer, and accordingly, the temperature of the second area can be prevented from being too high.
Drawings
The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.
Fig. 1 is a schematic structural view of one embodiment of an internal cavity structure of an electronic device according to the present disclosure;
fig. 2 is a schematic structural diagram of another embodiment of an internal cavity structure of an electronic device according to the present disclosure.
Summary of reference numerals:
10-a cavity; 110 — a first region; 120-a second region; 130-a heat source; 131-a first side of a heat source; 140-a heat sink; 141-a first plate surface of the heat sink; 142-the second plate surface of the heat spreader plate.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.
It should be understood that the various steps recited in the method embodiments of the present disclosure may be performed in a different order, and/or performed in parallel. Moreover, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present disclosure is not limited in this respect.
The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.
It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.
It is noted that references to "a", "an", and "the" modifications in this disclosure are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that "one or more" may be used unless the context clearly dictates otherwise.
In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the disclosed products are conventionally placed in use, and are only for convenience in describing and simplifying the present disclosure, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present disclosure.
In the description of the present disclosure, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.
Referring to fig. 1, a schematic structural diagram of an internal cavity structure of an electronic device according to an embodiment of the present disclosure is shown. In fig. 1, the area indicated by the dashed box at the first area 110 can be understood as the coverage area of the first coating, and the area indicated by the dashed box at the second area 120 can be understood as the coverage area of the second coating; it should be noted that the first region 110 and the second region 120 have no thickness, and the positions of the first region 110 and the second region 120 are only indicated by dashed boxes.
As can be seen from fig. 1, the interior of the chamber 10 may be used for placing a heat source 130 and may be covered with a first coating in a first region 110 of the inner wall of the chamber and a second coating in a second region 120 of the inner wall of the chamber; and the emissivity of the first coating may be higher than the emissivity of the second coating.
Here, the first region 110 is spaced apart from the heat source 130 by a first distance, and the second region 120 is spaced apart from the heat source 130 by a second distance, and the first distance may be greater than the second distance.
By way of example, the heat source 130 may be understood as a device or apparatus that may generate heat. For example, the heat source may be a circuit board (e.g., a CPU motherboard).
As an example, since the heat source is placed inside the chamber 10, the heat transfer efficiency is high in the region closer to the heat source 130, and the heat transfer efficiency is low in the region farther from the heat source 130. And the temperature of the area close to the heat source is higher than that of the area far away from the heat source, so that the surface temperature of the cavity can be greatly different. For example, the temperature is lower in the region where the surface of the chamber is farther from the heat source, and the temperature is higher in the region where the surface of the chamber is closer to the heat source.
As an example, a first region 110 of the inner wall of the chamber 10 may be covered with a first coating layer, and a second region 120 of the inner wall of the chamber 10 is covered with a second coating layer, and since the emissivity of the first coating layer is higher than that of the second coating layer, the efficiency of heat transfer to the first region 110 may be increased, and the efficiency of heat transfer to the second region 120 may be decreased; in this way, more heat may be transferred to the first region 110, and the amount of heat transferred to the second region 120 may be reduced accordingly. In this way, although the first region 110 is far from the heat source, it can absorb more heat, and accordingly, after the first region 110 absorbs more heat, the heat absorbed by the second region 120 is correspondingly reduced, so as to avoid the over-high temperature of the second region 120 of the chamber.
As an example, both the first coating and the second coating may be carbon nanomaterials, with the only carbon nanomaterials of the first coating having a higher emissivity.
As an example, there are many ways of covering the inner wall of the cavity 10 with a layer of coating, which are not described herein for brevity of the description, and only need to be selected reasonably according to the actual situation, for example, the first coating may be covered on the first area 110 by spraying, and correspondingly, the second coating may be covered on the second area 120 by spraying.
It can be seen that, in the embodiment of the present application, by covering the first coating layer on the first region of the inner wall of the cavity and covering the second coating layer on the second region of the inner wall of the cavity, the emissivity of the first coating layer is higher than that of the second coating layer, so that the rate of heat transfer to the first region can be increased, and the rate of heat transfer to the second region can be decreased. Therefore, although the second area is closer to the heat source, the temperatures of the second area and the first area can be closer, and accordingly, the temperature of the second area can be prevented from being too high.
In some embodiments, with continued reference to fig. 2, fig. 2 is another schematic chamber of the present disclosure, where the area indicated by the dashed box at the first region 110 can be understood as the coverage area of the first coating, and the area indicated by the dashed box at the second region 120 can be understood as the coverage area of the second coating; it should be noted that the first region 110 and the second region 120 have no thickness, and the positions of the first region 110 and the second region 120 are only indicated by dashed boxes.
As can be seen from fig. 2, a heat dissipation plate 140 may be disposed inside the cavity 10, and the heat dissipation plate 140 may be disposed between the first region 110 and the heat source 130.
As an example, after the heat dissipation plate is disposed between the first region 110 and the heat source 130, the heat of the heat source can be more rapidly transmitted, and thus, the temperature of the heat source can be prevented from being too high.
For example, the material of the heat sink 140 may be set according to actual conditions, and the material of the heat sink 140 is not limited herein, and for example, the material of the heat sink 140 may be an aluminum alloy.
In some embodiments, the first plate surface 141 of the heat dissipation plate 140 is covered with the third coating layer, and the first plate surface 141 of the heat dissipation plate is disposed opposite to the first region 110.
For example, the third coating layer covers the first plate surface 141 of the heat dissipation plate 140, so that the efficiency of heat absorption by the first plate surface 141 of the heat dissipation plate can be improved, and more heat can be diffused toward the first plate surface 141 of the heat dissipation plate. In this way, not only the heat dissipation plate 140 can absorb more heat and increase the heat absorption efficiency of the heat dissipation plate 140, but also the first area 110 can improve the heat absorption efficiency because the first plate surface 141 is opposite to the first area 110.
In some embodiments, the area of the first region 110 may be no less than the area of the coverage area of the third coating.
As an example, the area of the first region 110 is not smaller than the area of the coverage area of the third coating layer, so that the rate of heat diffusion from the vicinity of the first plate surface 141 of the heat dissipation plate to the first region 110 can be increased, and the heat absorption efficiency of the first region 110 can also be increased.
In some embodiments, the area of the heat dissipation plate 140 may be not smaller than the area of the heat source.
As an example, the size of the heat dissipation plate 140 is not smaller than that of the heat source, so that the heat of the heat source 130 can be rapidly transmitted through the heat dissipation plate 140, and thus, the temperature of the heat source 130 can be prevented from being too high.
In some embodiments, the heat dissipation plate 140 is disposed opposite to the heat source 130, and a maximum distance between the heat source 130 and the heat dissipation plate 140 is less than a preset distance.
As an example, the second plate 142 of the heat dissipation plate 140 is disposed opposite to the heat source 130, and a maximum distance between the heat source 130 and the first position of the second plate 142 is less than a preset distance.
Here, the first plate surface 141 of the heat sink 140 corresponds to the second plate surface 142 of the heat sink 140.
As an example, the maximum distance between the heat source 130 and the first position of the second plate surface 142 is smaller than the preset distance, so that the heat of the heat source 130 can be more efficiently transmitted to the heat dissipation plate 140, and the heat can be transferred out by the heat dissipation plate 140. That is, in this way, the heat source 130 can transmit heat to the heat dissipation plate 140 relatively quickly, and thus, the heat source 130 is prevented from being excessively hot.
As an example, the heat dissipation plate 140 may be in direct contact with the heat source 130, which may further increase the heat transfer efficiency.
As can be seen from fig. 2, the heat dissipation plate 140 and the heat source 130 can be abutted against each other, and the black rectangular frame can be understood as the heat source; for example, the heat source may be a CPU board, and in this case, the black rectangular frame may be understood as a component mounted on the CPU board.
In some embodiments, the area of the first region may be not smaller than the area of the second region.
As an example, the area of the first region is not smaller than the area of the second region, so that the efficiency of the first region for absorbing heat can be improved, and the efficiency of the second region for absorbing heat can be effectively reduced. In this way, the temperature of the first region can be made approximately the same as the temperature of the second region.
As an example, the area of the first region and the area of the second region may be defined according to actual conditions, for example, the area of the first region and the area of the second region may be determined according to a first distance between the first region and the heat source and a second distance between the second region and the heat source.
Continuing with fig. 2, the first side 131 of the heat source 130 is disposed opposite the second region 120, and the area of the second region 120 is less than or equal to the area of the first side 131 of the heat source.
As an example, since the emissivity of the second coating covered by the second region 120 is low, the second region 120 may be sized slightly smaller, so that it may be avoided that other regions of the cavity (e.g., the first region 110) are too hot due to the second region 120 being too large, such that most of the heat is transferred to other regions.
In some embodiments, the emissivity of the third coating may be higher than the emissivity of the second coating.
As an example, the emissivity of the third coating layer is higher than that of the second coating layer, so that the heat of the heat source can be more diffused to the first plate surface of the heat dissipation plate, and the heat dissipation plate can well transfer the heat out.
In some embodiments, the third coating and the first coating are the same material.
As an example, the third coating and the first coating are made of the same material, so that the spraying time can be saved, and the cavity can be sprayed by only using two materials.
In the related art, structural modification is usually required to be performed on the internal cavity structure of the electronic device, so that heat dissipation can be performed on the internal cavity structure of the electronic device, for example, the internal cavity structure of the electronic device can be perforated, and a fan is additionally installed to dissipate heat of a heat source inside the cavity. According to the heat transfer device, the first coating covers the first area of the inner wall of the cavity, the second coating covers the second area of the inner wall of the cavity, and the emissivity of the first coating is higher than that of the second coating, so that the heat transfer speed to the first area can be increased, and the heat transfer speed to the second area can be reduced. Therefore, although the second area is closer to the heat source, the temperatures of the second area and the first area can be closer, and accordingly, the temperature of the second area can be prevented from being too high. In addition, the mode of the application does not need to change the result of the cavity, so that the manufacturing cost of the cavity can be saved.
The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the disclosure herein is not limited to the particular combination of features described above, but also encompasses other embodiments in which any combination of the features described above or their equivalents does not depart from the spirit of the disclosure. For example, the above features and (but not limited to) the features disclosed in this disclosure having similar functions are replaced with each other to form the technical solution.
Further, while operations are depicted in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are included in the above discussion, these should not be construed as limitations on the scope of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination.
Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.
Claims (11)
1. An internal cavity structure of electronic equipment is characterized in that,
a first area of the inner wall of the cavity is covered with a first coating, and a second area of the inner wall of the cavity is covered with a second coating;
the emissivity of the first coating layer is higher than the emissivity of the second coating layer;
the cavity is used for placing a heat source, the distance between the first area and the heat source is a first distance, the distance between the second area and the heat source is a second distance, and the first distance is larger than the second distance.
2. The internal cavity structure of electronic equipment according to claim 1, wherein a heat dissipation plate is disposed inside the cavity;
the heat dissipation plate is disposed between the first region and the heat source.
3. The internal cavity structure of electronic device according to claim 2, wherein a third coating layer is coated on the first plate surface of the heat dissipation plate, and the first plate surface of the heat dissipation plate is disposed opposite to the first region.
4. The internal cavity structure of electronic device according to claim 3, wherein the area of the first region is not smaller than the area of the coverage area of the third coating layer.
5. The chamber of claim 2, wherein the heat dissipation plate has an area not smaller than that of the heat source.
6. The internal cavity structure of electronic device according to claim 2, wherein the second plate surface of the heat dissipation plate is disposed opposite to the heat source, and a distance between the heat source and the first position of the second plate surface is smaller than a predetermined distance; the first plate surface of the heat dissipation plate corresponds to the second plate surface of the heat dissipation plate.
7. The internal cavity structure of electronic device according to claim 2, wherein the heat dissipation plate is in contact with the heat source.
8. The internal cavity structure of electronic device according to claim 1, wherein the area of the first region is not smaller than the area of the second region.
9. The internal cavity structure of electronic device as claimed in claim 1, wherein the first surface of the heat source is opposite to the second region, and the area of the second region is smaller than or equal to the area of the first surface of the heat source.
10. The internal cavity structure of an electronic device according to claim 3, wherein the emissivity of the third coating layer is higher than the emissivity of the second coating layer.
11. The internal cavity structure of electronic device as claimed in claim 3, wherein the third coating layer and the first coating layer are made of the same material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111681348.8A CN114356058A (en) | 2021-12-31 | 2021-12-31 | Internal cavity structure of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111681348.8A CN114356058A (en) | 2021-12-31 | 2021-12-31 | Internal cavity structure of electronic equipment |
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| JP2010062521A (en) * | 2008-08-08 | 2010-03-18 | Kobe Steel Ltd | Heat radiating structure |
| US20160106010A1 (en) * | 2013-06-17 | 2016-04-14 | Hitachi Automotive Systems, Ltd. | Box-type vehicle-mounted control device |
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