CN114335079B - Curved surface directional ultrasonic device - Google Patents
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Abstract
The invention discloses a curved surface directional ultrasonic device which comprises a first conductive structure, a second conductive structure and an intermediate microstructure, wherein the first conductive structure comprises a bending-resistant layer and a first conductive layer arranged on one surface of the bending-resistant layer, the second conductive structure comprises a substrate opposite to the bending-resistant layer and a second conductive layer arranged on one surface of the substrate close to the first conductive layer, and the intermediate microstructure is arranged between the first conductive layer and the second conductive layer and is used for providing an air gap required by vibration of the bending-resistant layer. The invention combines the electrostatic ultrasonic transducer with the curved surface screen, so that the display has multiple functions of screen directional sounding, curved surface display and the like.
Description
Technical Field
The invention relates to the technical field of screen directional sounding, in particular to a curved surface directional ultrasonic device.
Background
With the development of display technology, consumers are more inclined to favor a display device which can realize sound and picture integration and perfectly integrate a display picture and a playing sound, not only in the requirements of picture quality and definition, but also in the output effect of sound gradually.
The existing sound and picture unification of a display device is realized through a screen sounding technology, and the principle is that a vibrating original is utilized to push a screen to vibrate to make a sound. For example: the resonance type screen sounding scheme is that a device with vibration characteristics is attached to the lower part of a screen or the middle frame of the whole machine, and the device vibrates when in work, so that the screen is finally driven to vibrate and sound; also for example: the device mainly comprises two parts, one part is directly attached to a screen, the other part is fixed on a middle frame, and when the device works, the two parts can generate interactive attraction or repulsion force, so that the screen is pushed to vibrate and sound, and compared with a resonance type screen sound generation scheme, the conversion efficiency is improved.
With the development of OLED display technology, curved panels are increasingly used. Curved screens find application in these areas, ranging from small-sized field phones, displays to liquid crystal televisions. Compared with the mainstream flat screen display device, the curved surface display adopting the OLED technology has smaller thickness and lower power consumption. For large-size curved televisions, the pictures are provided with a deeper layer due to the better surrounding type impression, so that the user is provided with a deeper viewing experience, and the television has a certain stereoscopic vision effect.
That is, the current market demand for curved screens is becoming more and more clear. Therefore, how to make the directional ultrasound screen curved is a problem that needs to be solved at present.
The invention comprises the following steps:
the invention aims to provide a curved surface directional ultrasonic device with a curved screen.
In order to achieve the above object, the present invention provides a curved surface directional ultrasound device, comprising:
the first conductive structure comprises a bending-resistant layer and a first conductive layer arranged on one surface of the bending-resistant layer;
the second conductive structure comprises a substrate and a second conductive layer, wherein the substrate is arranged opposite to the bending-resistant layer, and the second conductive layer is arranged on one surface of the substrate, which is close to the first conductive layer;
and the middle microstructure is arranged between the first conductive layer and the second conductive layer and is used for providing an air gap required by vibration of the bending-resistant layer.
In a preferred embodiment, the bending-resistant layer comprises a bending-resistant base layer and a protective layer, wherein the protective layer is respectively arranged on the upper surface and the lower surface of the bending-resistant base layer, and the first conductive layer is arranged on the protective layer of one layer; or, one surface of the bending-resistant substrate layer is provided with the protective layer, and the other surface of the bending-resistant substrate layer is provided with the first conductive layer.
In a preferred embodiment, the bending-resistant substrate layer is ultra-thin glass UTG with a thickness of 15 um-30 um or polyimide CPI film, and the protective layer is thermoplastic polyurethane elastomer rubber TPU with a thickness of 15 um-20 um.
In a preferred embodiment, the protective layer is adhered or coated on the bending-resistant substrate layer.
In a preferred embodiment, the device further comprises an insulating layer disposed between the first conductive layer and the second conductive layer, the intermediate microstructure being disposed on the insulating layer or on the first conductive layer.
In a preferred embodiment, the device further comprises a first edge trace and a second edge trace, the first edge trace is disposed on the first conductive layer and along an outer edge of the first conductive layer, and the second edge trace is disposed on the insulating layer and along an outer edge of the insulating layer or on the second conductive layer and along an outer edge of the second conductive layer.
In a preferred embodiment, an optical compensation layer is further arranged between the bending-resistant layer and the first conductive layer.
In a preferred embodiment, the first conductive structure further includes a first edge trace, an insulating layer and a second edge trace, the first edge trace is disposed on the first conductive layer and along an outer edge of the first conductive layer, the insulating layer is disposed on the first conductive layer and covers the first edge trace, the second edge trace is disposed on the insulating layer and along an outer edge of the first conductive layer, the intermediate microstructure is disposed on the insulating layer, and the first conductive structure is in frame fit with the second conductive layer of the second conductive structure through the second edge trace.
In a preferred embodiment, the first conductive structure further includes a first edge trace disposed on the first conductive layer and disposed along an outer edge of the first conductive layer, the second conductive structure further includes a second edge trace disposed on the second conductive layer and disposed along an outer edge of the second conductive layer, and an insulating layer disposed on the second conductive layer and covering the second edge trace.
In a preferred embodiment, the first conductive structure further includes a first edge trace and a protective layer, the first edge trace is disposed on the first conductive layer and along an outer edge of the first conductive layer, the protective layer is disposed on the first conductive layer and covers the first edge trace, the intermediate microstructure is disposed on the protective layer, and the first conductive structure and the second conductive layer of the second conductive structure are in frame fit.
Compared with the prior art, the invention has the following beneficial effects: the invention combines the electrostatic ultrasonic transducer with the curved screen, and forms various alternative schemes, so that the display has various functions such as screen directional sounding, curved surface display and the like, realizes screen audio frequency orientation, listens to privacy, avoids interference to surrounding personnel, realizes the curved surface function, has better effect on the stereoscopic impression of the picture display of the curved screen compared with the straight screen, and expands the application range of the curved screen.
Description of the drawings:
FIG. 1 is a schematic diagram of the overall structure of a directional ultrasonic touch device of the present invention;
FIG. 2 is a schematic diagram of the overall structure of an embodiment of the present invention;
FIG. 3 is a schematic diagram of the overall structure of the optical compensation layer of FIG. 3 according to the present invention;
FIG. 4 is a schematic structural diagram of embodiment 1 of the present invention;
FIG. 5 is a schematic structural diagram of embodiment 2 of the present invention;
fig. 6 is a schematic structural diagram of embodiment 3 of the present invention.
The reference numerals are:
1/1a/1b/1c, a first conductive structure, 11/11a/11b/11c, a bend resistant layer, 111/111a/111b/111c, a bend resistant base layer, 112, a protective layer, 112a/112b/112c, a first protective layer, 113a/113b/113c, a second protective layer, 12/12a/12b/12c, a first conductive layer, 13, an optical compensation layer, 2/2a/2b/2c, a second conductive structure, 21/21a/21b/21c, a substrate, 22/22a/22b/22c, a second conductive layer, 3/3a/3b/3c, an intermediate microstructure, 4/4a/4b/4c, a first edge trace, 5/5a/5b, an insulating layer, 6/6a/6b/6c, a second edge trace.
The specific embodiment is as follows:
the following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
As shown in fig. 1 to 3, the curved surface directional ultrasound device disclosed by the invention comprises a first conductive structure 1, a second conductive structure 2 and an intermediate microstructure 3, wherein the first conductive structure 1 and the second conductive structure 2 are combined to form an electrostatic ultrasound transducer, and the intermediate microstructure 3 is arranged between the first conductive structure 1 and the second conductive structure 2 and is used for providing an air gap required by vibration of the first conductive structure 1. The electrostatic ultrasonic transducer sends out ultrasonic signals modulated by the audio signals, audible sound is demodulated by air, and directional sound production of the device is realized. Preferably, both the first conductive structure 1 and the second conductive structure 2 may be bent into a curved shape, thereby realizing the curveability of the device.
Specifically, in implementation, the first conductive structure 1 is mainly used for vibrating and sounding in response to application of an electrical signal, and as shown in fig. 1, the first conductive structure specifically includes a bending-resistant layer 11 and a first conductive layer 12, where the first conductive layer 12 is disposed on one surface of the bending-resistant layer 11. In one embodiment, as shown in fig. 2, the bending-resistant layer 11 specifically includes a bending-resistant substrate layer 111 and two protective layers 112, where the bending-resistant substrate layer 111 may preferably be made of an ultrathin flexible glass UTG or a transparent polyimide CPI film, and the thickness of the ultrathin flexible glass is preferably 15 um-30 um, and the bending angle is preferably 1-2 °, and the smaller the bending angle, the larger the bending degree of the ultrathin flexible glass is. The thickness of the transparent polyimide CPI film is also preferably 15um to 30um. The two protective layers 112 are respectively disposed on the upper and lower opposite surfaces of the bending-resistant substrate layer 111, and specifically may be formed on the bending-resistant substrate layer 111 by a lamination process or a coating process. If a coating process is used, the thickness of the protective layer may be 15um to 20um, preferably 15um. The thickness of the protective layer 112 formed by the lamination process is slightly thicker than that formed by the coating process, because the adhesive layer for lamination is increased. In this embodiment, the first conductive layer 12 is disposed on one of the protective layers 112 (e.g., the protective layer 112 disposed on the lower surface of the bending-resistant substrate layer 111). In other embodiments, the bending-resistant layer 11 may also specifically include a bending-resistant substrate layer 111 and a protective layer 112, where the description of the bending-resistant substrate layer 111 may refer to the description in the foregoing embodiments, and is not repeated herein. The protective layer 112 is disposed on one of the surfaces of the bending-resistant substrate layer 111, for example, on the upper surface of the bending-resistant substrate layer 111, and the first conductive layer 12 is disposed on the lower surface of the bending-resistant substrate layer 111. In practice, the first conductive layer 12 may be Indium Tin Oxide (ITO) or nano-silver, preferably nano-silver having higher flexibility than indium tin oxide. The protective layer 112 may be a thermoplastic polyurethane elastomer rubber TPU, preferably having a Young's modulus of 300MPa to 1GPa.
Preferably, as shown in fig. 3, an optical compensation layer 13 may also be provided between the bending resistant layer 11 and the first conductive layer 12.
Specifically, the second conductive structure 2 includes a substrate 21 and a second conductive layer 22, where the second conductive layer 22 is disposed on a surface of the substrate 21 near the first conductive layer 12, and the second conductive layer 22 may also be made of Indium Tin Oxide (ITO), and the sheet resistance is preferably below 40Ω.
The invention discloses a curved surface directional ultrasonic device, which also comprises a first edge wire 4, an insulating layer 5 and a second edge wire 6, wherein the first edge wire 4 is arranged on a first conductive layer 12 and is arranged along the outer edge of the first conductive layer 12 and is mainly used for leading out the first conductive layer 12. The first edge routing 4 can be realized by adopting conductive silver paste, conductive carbon paste, conductive adhesive copper foil or conductive tape and the like. The insulating layer 5 is disposed between the first conductive layer 12 and the second conductive layer 22, and mainly plays a role of insulation. In practice, the insulating layer 5 may be disposed on the first conductive layer 12 and cover the first edge trace 4, or the insulating layer 5 may be disposed on the second conductive layer 22. The thickness of the insulating layer 5 is preferably 1um-15um, more preferably below 3 um. The insulating layer 5 may be formed by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
The second edge trace 6 is disposed between the insulating layer 5 and the second conductive layer 22, and is mainly used for guiding out the second conductive layer 22. In one embodiment, the second edge trace 6 is disposed on the insulating layer 5 and along an outer edge of the insulating layer 5. In another embodiment, the second edge trace 6 is directly disposed on the second conductive layer 22 and disposed along an outer edge of the second conductive layer 22. In implementation, the second edge trace 6 may be one or a combination of two or more of double-sided conductive adhesive material, double-sided conductive copper foil, double-sided conductive woven fabric conductive adhesive, double-sided conductive non-woven fabric conductive adhesive or conductive silver paste.
The intermediate microstructure 3 is arranged between the first conductive structure 1 and the second conductive structure 2, and the thickness (i.e. the height) of the intermediate microstructure 3 is preferably between 3um and 80 um. It can also be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes. In practice, the intermediate microstructure 3 may be provided in particular on the insulating layer 5 or in particular on the first conductive layer 12.
The following describes the specific structure of the curved directional ultrasound device of the present invention in several specific embodiments.
Example 1
As shown in fig. 4, the curved surface directional ultrasound device disclosed in embodiment 1 of the present invention includes a first conductive structure 1a, a second conductive structure 2a and an intermediate microstructure 3a, where the first conductive structure 1a specifically includes a bending-resistant layer 11a, a first conductive layer 12a, a first edge trace 4a, an insulating layer 5a and a second edge trace 6a, the bending-resistant layer 11a specifically includes a bending-resistant base layer 111a, a first protective layer 112a and a second protective layer 113a, the bending-resistant base layer 111a is used as a base material of the first conductive structure 1a, and an ultrathin flexible glass UTG or a transparent polyimide CPI film material may be preferably used, the thickness of the ultrathin flexible glass is preferably 15 um-30 um, and the bending angle is preferably 1-2 °. The thickness of the transparent polyimide CPI film is also preferably 15um to 30um.
The first protective layer 112a and the second protective layer 113a are respectively disposed on two opposite surfaces of the bending-resistant substrate layer 111a, and specifically may be formed on the bending-resistant substrate layer by a lamination process or a coating process. If a coating process is used, the thickness of the protective layer may be 15um to 20um, preferably 15um. And the first protective layer 112a and the second protective layer 113a may employ thermoplastic polyurethane elastomer rubber TPU, whose young's modulus is preferably 300MPa to 1GPa.
The first conductive layer 12a is disposed on the second protective layer 113a, and when the first conductive layer 12a is implemented, indium Tin Oxide (ITO) or nano silver is used, preferably nano silver having higher flexibility than indium tin oxide.
The first edge trace 4a is disposed on the first conductive layer 12a and along an outer edge of the first conductive layer 12a, and is mainly used for guiding out the first conductive layer 12 a. In this embodiment 1, the first edge trace 4a may be implemented by conductive silver paste, conductive carbon paste, conductive adhesive copper foil, or conductive tape.
The insulating layer 5a is disposed on the first conductive layer 112a and covers the first edge trace 4a, and in this embodiment 1, the thickness of the insulating layer 5a is preferably 1um to 15um, more preferably less than 3 um. The insulating layer 5a may be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
The second edge trace 6a is disposed on the insulating layer 5a and along an outer edge of the insulating layer 5a, for guiding out the second conductive layer 22. In this embodiment 1, the second edge trace 6a may be one or a combination of two or more of double-sided conductive adhesive material, double-sided conductive copper foil, double-sided conductive woven fabric conductive adhesive, double-sided conductive non-woven fabric conductive adhesive or conductive silver paste.
The intermediate microstructure 3a is also disposed on the insulating layer 5a, specifically in other regions of the insulating layer 5a except for the region where the second edge trace 6a is disposed. In this embodiment 1, the thickness (i.e., height) of the intermediate microstructure 3a is preferably between 3um and 80 um. It can also be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
In embodiment 1, the second conductive structure 2a specifically includes a substrate 21a and a second conductive layer 22a, where the substrate 21a is made of a transparent material, such as but not limited to bendable glass. The second conductive layer 22a is disposed on one surface of the substrate 21 a. In practice, the second conductive layer 22a may be made of Indium Tin Oxide (ITO) or nano silver, and preferably nano silver having higher flexibility than indium tin oxide. The process is coating or sputtering, and the lower the sheet resistance, the better, preferably 40 Ω or less and consistent with the sheet resistance of the first conductive layer 112 a.
In this embodiment 1, the surface treatment of the second conductive structure 2a is not required, the first conductive structure 1a is designed integrally, and the first conductive structure 1a and the second conductive structure 2a are directly bonded, specifically, in this embodiment, the insulating layer 5a of the first conductive structure 1a is frame-bonded with the second conductive layer 22a of the second conductive structure 2a through the second edge trace 6 a. Before the first conductive structure 1a and the second conductive structure 2a are attached, the first conductive structure 1a and the second conductive structure 2a are kept in a plane state, and when the first conductive structure and the second conductive structure are attached, a curved surface attaching device is used for attaching, and the curvature is determined according to actual requirements.
Example 2
As shown in fig. 5, the curved surface directional ultrasound device disclosed in embodiment 2 of the present invention includes a first conductive structure 1b, a second conductive structure 2b and an intermediate microstructure 3b, where the first conductive structure 1b specifically includes a bending-resistant layer 11b, an optical compensation layer 13, a first conductive layer 12b and a first edge trace 4b, where the bending-resistant layer 11b specifically includes a bending-resistant base layer 111b, a first protection layer 112b and a second protection layer 113b, the bending-resistant base layer 111b is used as a base material of the first conductive structure 1b, and an ultrathin flexible glass UTG or a transparent polyimide CPI film material may be preferably used, the thickness of the ultrathin flexible glass is preferably 15 um-30 um, and the bending angle is preferably 1-2 °. The thickness of the transparent polyimide CPI film is also preferably 15um to 30um.
The first protective layer 112b and the second protective layer 113b are respectively disposed on two opposite surfaces of the bending-resistant substrate layer 111b, and specifically may be formed on the bending-resistant substrate layer by a lamination process or a coating process. If a coating process is used, the thickness of the protective layer may be 15um to 20um, preferably 15um. And the first protective layer 112b and the second protective layer 113b may employ thermoplastic polyurethane elastomer rubber TPU, whose young's modulus is preferably 300MPa to 1GPa.
The optical compensation layer 13 is provided on the second protective layer 113b, and in embodiment 1, the optical compensation layer 13 may be provided between the second protective layer 113b and the first conductive layer 12 b. The first conductive layer 12b is disposed on the optical compensation layer 13, and when the first conductive layer 12b is implemented, indium Tin Oxide (ITO) or nano silver is used, preferably nano silver having higher flexibility than indium tin oxide.
The first edge trace 4b is disposed on the first conductive layer 12b and along an outer edge of the first conductive layer 12b, and is mainly used for guiding out the first conductive layer 12 b. In embodiment 2, the first edge trace 4b may be implemented by conductive silver paste, conductive carbon paste, conductive adhesive copper foil, conductive tape, or the like.
The intermediate microstructure 3b is disposed on the first conductive layer 12b, and specifically disposed in other areas of the first conductive layer 12b except for the area where the first edge trace 4b is disposed. In this embodiment 2, the thickness (i.e., height) of the intermediate microstructure 3b is preferably between 3um and 80 um. It can also be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
In embodiment 2, the second conductive structure 2b specifically includes a substrate 21b, a second conductive layer 22b, a second edge trace 6b and an insulating layer 5b, where the substrate 21b is made of a transparent material, such as but not limited to bendable glass. The second conductive layer 22b is disposed on one surface of the substrate 21 b. In practice, the second conductive layer 22b may be made of Indium Tin Oxide (ITO) or nano silver, preferably nano silver having higher flexibility than indium tin oxide. The process is coating or sputtering, and the lower the sheet resistance, the better, preferably 40 Ω or less and consistent with the sheet resistance of the first conductive layer 12 b.
The second edge trace 6b is disposed on the second conductive layer 22b and along an outer edge of the second conductive layer 22b, for guiding out the second conductive layer 22 b. In embodiment 2, the second edge trace 6b may be one or a combination of two or more of double-sided conductive adhesive material, double-sided conductive copper foil, double-sided conductive woven fabric conductive adhesive, double-sided conductive non-woven fabric conductive adhesive or conductive silver paste.
The insulating layer 5b is disposed on the second conductive layer 22b and covers the second edge trace 6b, and in this embodiment 2, the thickness of the insulating layer 5b is preferably 1um to 15um, more preferably less than 3 um. The insulating layer 5b may be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
In this embodiment 2, unlike in embodiment 1, the second edge trace 6b and the insulating layer 5b are provided on the substrate, so in this embodiment, when the first conductive structure 1b and the second conductive structure 2b are bonded, specifically, the first conductive layer 12b of the first conductive structure 1b is frame-bonded with the insulating layer 5b of the second conductive structure 2b through the first edge trace 4 b. Before the first conductive structure 1b and the second conductive structure 2b are attached, the first conductive structure 1b and the second conductive structure 2b are kept in a plane state, and when the first conductive structure and the second conductive structure are attached, a curved surface attaching device is used for attaching, and the curvature is determined according to actual requirements.
Example 3
As shown in fig. 6, the curved surface directional ultrasound device disclosed in embodiment 3 of the present invention includes a first conductive structure 1c, a second conductive structure 2c and an intermediate microstructure 3c, where the first conductive structure 1c specifically includes a bending-resistant layer 11c, a first conductive layer 12c, a first edge routing 4c, a second protective layer 113c and a second edge routing 6c, the bending-resistant layer 11c specifically includes a bending-resistant base layer 111c and a first protective layer 112c, the bending-resistant base layer 111c is used as a base material of the first conductive structure 1c, and an ultrathin flexible glass UTG or a transparent polyimide CPI film may be preferably used, the thickness of the ultrathin flexible glass is preferably 15 um-30 um, and the bending angle is preferably 1-2 °. The thickness of the transparent polyimide CPI film is also preferably 15um to 30um.
The first protection layer 112c is disposed on the upper surface of the bending-resistant substrate layer 111c, and may be formed on the bending-resistant substrate layer 111c by a lamination process or a coating process. If a coating process is used, the thickness of the protective layer may be 15um to 20um, preferably 15um. And the first protective layer 112c may be a thermoplastic polyurethane elastomer rubber TPU, preferably having a young's modulus of 300MPa to 1GPa.
The first conductive layer 12c is disposed on the lower surface of the bending-resistant substrate layer 111c, and when the first conductive layer 12c is implemented, indium Tin Oxide (ITO) or nano silver is used, preferably nano silver having higher flexibility than indium tin oxide.
The first edge trace 4c is disposed on the first conductive layer 12c and along an outer edge of the first conductive layer 12c, and is mainly used for guiding out the first conductive layer 12 c. In this embodiment 3, the first edge trace 4c may be implemented by conductive silver paste, conductive carbon paste, conductive adhesive copper foil, conductive tape, or the like.
The second passivation layer 113c is disposed on the first conductive layer 12c and covers the first edge trace 4c, and in embodiment 3, the second passivation layer 113c may be formed on the first conductive layer 12c by a bonding process or a coating process. If a coating process is used, the thickness of the protective layer may be 15um to 20um, preferably 15um. And the second protective layer 113c may be a thermoplastic polyurethane elastomer rubber TPU, preferably having a young's modulus of 300MPa to 1GPa. In this embodiment, the second protective layer 113c serves as both a protective layer and an insulating layer, i.e., serves both as a protection and an electrical insulation.
In embodiment 3, the second edge trace 6c is disposed on the second protection layer 113c and along the outer edge of the second protection layer 113c, for guiding out the second conductive layer 22 c. In this embodiment 3, the second edge trace 6c may be one or a combination of two or more of double-sided conductive adhesive material, double-sided conductive copper foil, double-sided conductive woven fabric conductive adhesive, double-sided conductive non-woven fabric conductive adhesive or conductive silver paste.
The intermediate microstructure 3c is also disposed on the second protection layer 113c, specifically disposed in other areas of the second protection layer 113c except the area where the second edge trace 6c is disposed. In this embodiment 3, the thickness (i.e., height) of the intermediate microstructure 3c is preferably between 3um and 80 um. It can also be realized by various processes, mainly a main market process route such as a Silk printing process, an exposure developing process, a transfer printing process, a SPIN coating process, a Silk Coater process or an FCS (FieldBus Contorl Syestem, field bus control system) coating process, a UV (ultraviolet) printing process, a 3D jet printing process, a character jet printing process, a CVD (chemical vapor deposition) process, a pvd (Physical Vapor Deposition) process, and other derivative routes.
In embodiment 3, the second conductive structure 2c also includes a substrate 21c and a second conductive layer 22c, and the substrate 21c is made of transparent material, such as but not limited to bendable glass. The second conductive layer 22c is disposed on one surface of the substrate 21 c. In practice, the second conductive layer 22c may be made of Indium Tin Oxide (ITO) or nano silver, preferably nano silver having higher flexibility than indium tin oxide. The process is coating or sputtering, and the lower the sheet resistance, the better, preferably 40 Ω or less and consistent with the sheet resistance of the first conductive layer 12 c.
In other alternative embodiments, the second edge trace 6c may be disposed on the second conductive structure 2c, such as, in particular, on an outer edge of the second conductive layer 12 c. The intermediate microstructure 3c can also be arranged on the second conductive structure 2c, such as in particular on other areas of the second conductive layer 12c than the outer edge area.
This embodiment 3 is different from embodiment 1 in that the first conductive layer 12c is directly provided on the bending-resistant base layer 111c, the second protective layer 113c is provided on the first conductive layer 12c, and the second edge trace 6c and the intermediate microstructure 3c are provided on the second protective layer 113 c. In addition, as in embodiment 1, the second conductive structure 2c does not need to be subjected to surface treatment, the first conductive structure 1c is designed integrally, the first conductive structure 1c and the second conductive structure 2c are directly bonded, and specifically, in this embodiment, the second protective layer 113c of the first conductive structure 1c is frame-bonded with the second conductive layer 22c of the second conductive structure 2c through the second edge wire 6 c. Before the first conductive structure 1c and the second conductive structure 2c are attached, the first conductive structure 1c and the second conductive structure 2c are kept in a plane state, and when the first conductive structure and the second conductive structure are attached, a curved surface attaching device is used for attaching, and the curvature is determined according to actual requirements.
The invention has the advantages that the electrostatic ultrasonic transducer is combined with the curved screen, and various alternative schemes are formed, so that the display has various functions of screen directional sounding, display, touch control and the like, the screen audio frequency orientation is realized, the privacy is listened, the interference to peripheral personnel is avoided, the curved function is realized, and compared with the straight screen, the effect on the three-dimensional effect of the picture display of the curved screen is better, and the application range of the curved screen is expanded.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. A curved directional ultrasound device, comprising:
the first conductive structure comprises a bending-resistant layer and a first conductive layer arranged on one side of the bending-resistant layer, and the first conductive structure is used for vibrating and sounding in response to the application of an electric signal;
the second conductive structure comprises a substrate and a second conductive layer, wherein the substrate is arranged opposite to the bending-resistant layer, and the second conductive layer is arranged on one surface of the substrate, which is close to the first conductive layer; the first conductive structure and the second conductive structure are combined to form an electrostatic ultrasonic transducer;
and the middle microstructure is arranged between the first conductive layer and the second conductive layer and is used for providing an air gap required by vibration of the bending-resistant layer.
2. The curved surface directional ultrasound device according to claim 1, wherein the bending-resistant layer comprises a bending-resistant base layer and a protective layer, the protective layers are respectively arranged on the upper surface and the lower surface of the bending-resistant base layer, and the first conductive layer is arranged on one of the protective layers; or, one surface of the bending-resistant substrate layer is provided with the protective layer, and the other surface of the bending-resistant substrate layer is provided with the first conductive layer.
3. The curved surface directional ultrasound device of claim 2, wherein the bending-resistant substrate layer is ultra-thin glass UTG with a thickness of 15-30 um or polyimide CPI film, and the protective layer is thermoplastic polyurethane elastomer rubber TPU with a thickness of 15-20 um.
4. The curved directional ultrasound device of claim 2, wherein the protective layer is adhered to or coated on the bend-resistant substrate layer.
5. The curved directional ultrasound device of claim 1, further comprising an insulating layer disposed between the first conductive layer and the second conductive layer, wherein the intermediate microstructure is disposed on the insulating layer or on the first conductive layer.
6. The curved directional ultrasound device of claim 5, further comprising a first edge trace disposed on the first conductive layer and along an outer edge of the first conductive layer and a second edge trace disposed on the insulating layer and along an outer edge of the insulating layer or on the second conductive layer and along an outer edge of the second conductive layer.
7. The curved directional ultrasound device of claim 1, wherein an optical compensation layer is further disposed between the bend-resistant layer and the first conductive layer.
8. The curved directional ultrasound device of any of claims 1-3, wherein the first conductive structure further comprises a first edge trace, an insulating layer, and a second edge trace, the first edge trace is disposed on and along an outer edge of the first conductive layer, the insulating layer is disposed on and covers the first edge trace, the second edge trace is disposed on and along an outer edge of the first conductive layer, the intermediate microstructure is disposed on the insulating layer, and the first conductive structure is frame-bonded to the second conductive layer of the second conductive structure via the second edge trace.
9. A curved directional ultrasound device as recited in any of claims 1-3, wherein said first conductive structure further comprises a first edge trace disposed on said first conductive layer and along an outer edge of said first conductive layer, said second conductive structure further comprises a second edge trace disposed on said second conductive layer and along an outer edge of said second conductive layer, and an insulating layer disposed on said second conductive layer and covering said second edge trace.
10. The curved surface directional ultrasound device of any of claims 1-3, wherein the first conductive structure further comprises a first edge trace and a protective layer, the first edge trace is disposed on the first conductive layer and along an outer edge of the first conductive layer, the protective layer is disposed on the first conductive layer and covers the first edge trace, the intermediate microstructure is disposed on the protective layer, and the first conductive structure is in frame-fit with the second conductive layer of the second conductive structure.
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| CN115036348B (en) * | 2022-04-28 | 2023-12-29 | 苏州清听声学科技有限公司 | Directional display device and electronic device |
| CN115220595B (en) * | 2022-05-25 | 2023-11-17 | 苏州清听声学科技有限公司 | Preparation process of touch sounding display unit |
| CN115243168A (en) * | 2022-05-25 | 2022-10-25 | 苏州清听声学科技有限公司 | Preparation process of touch sounding display unit |
| CN115243171B (en) * | 2022-08-03 | 2023-11-21 | 苏州清听声学科技有限公司 | Efficient double-channel directional sounding ultrasonic screen and manufacturing process thereof |
| CN115942219B (en) * | 2022-10-17 | 2023-12-08 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
| CN115802249B (en) * | 2022-10-17 | 2023-12-29 | 苏州清听声学科技有限公司 | Foldable directional display device and preparation process |
| CN115567835B (en) * | 2022-10-17 | 2024-02-02 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
| CN115550818B (en) * | 2022-10-17 | 2023-12-08 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
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