CN114299825A - Display module and electronic equipment - Google Patents

Display module and electronic equipment Download PDF

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Publication number
CN114299825A
CN114299825A CN202111670190.4A CN202111670190A CN114299825A CN 114299825 A CN114299825 A CN 114299825A CN 202111670190 A CN202111670190 A CN 202111670190A CN 114299825 A CN114299825 A CN 114299825A
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China
Prior art keywords
display module
transparent
transparent bonding
adhesive
screen body
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CN202111670190.4A
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Chinese (zh)
Inventor
薛建雄
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Bazhou Yungu Electronic Technology Co ltd
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Bazhou Yungu Electronic Technology Co ltd
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Priority to CN202111670190.4A priority Critical patent/CN114299825A/en
Publication of CN114299825A publication Critical patent/CN114299825A/en
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Abstract

The application provides a display module and electronic equipment, relates to the technical field of display equipment, and is used for solving the technical problem that the anti-falling capability of a frame area of the display module is poor; the bonding layer comprises a first transparent bonding part and a second transparent bonding part, the orthographic projection of the first transparent bonding part on the screen body covers the display area, and the orthographic projection of the second transparent bonding part on the screen body covers the frame area; the thickness of the second transparent bonding part is larger than that of the first transparent bonding part. The application is used for improving the anti-falling capacity of the frame area of the display module.

Description

Display module and electronic equipment
Technical Field
The application relates to the technical field of display, in particular to a display module and electronic equipment.
Background
AMOLED (Active Matrix/Organic Light Emitting Diode) is an Active Matrix Organic Light Emitting Diode panel, has the characteristics of fast response speed, high contrast, wide viewing angle, and the like, and has been widely used in recent years. With the rapid development of AMOLED display, consumers are increasingly pursuing the ultra-thinness and narrow frame of AMOLED display modules. In the related art, the AMOLED display module includes a screen body and a package cover plate packaged on the screen body. However, the AMOLED display module in the related art has poor drop resistance.
Disclosure of Invention
In view of the above problem, the embodiment of the application provides a display module assembly and electronic equipment, and this display module assembly can improve the anti ability of falling of display module assembly satisfying under the condition of big screen account for ratio and narrow frame to reduce the display module assembly when falling the damaged problem in the frame district of the screen body.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
in a first aspect, an embodiment of the present application provides a display module, which has a display area and a frame area surrounding the display area, wherein the display module includes a screen body, an adhesive layer, and a package cover plate, which are sequentially stacked, the adhesive layer is used for adhering the screen body and the package cover plate, and the adhesive layer includes a semi-solid adhesive; the bonding layer comprises a first transparent bonding part and a second transparent bonding part, the orthographic projection of the first transparent bonding part on the screen body covers the display area, and the orthographic projection of the second transparent bonding part on the screen body covers the frame area; wherein the thickness of the second transparent bonding part is greater than that of the first transparent bonding part.
As an optional implementation manner, the first transparent bonding portion and the second transparent bonding portion are an integral piece, and the second transparent bonding portion is surrounded around the first transparent bonding portion.
As an optional implementation manner, an adhesive overflow groove is arranged between the first transparent bonding part and the second transparent bonding part.
As an alternative embodiment, the width of the glue overflow groove is 20-30 μm.
As an optional implementation manner, the groove depth of the glue overflow groove is less than or equal to the thickness of the first transparent bonding part.
In an alternative embodiment, the first transparent adhesive part has a thickness of 125 to 150 μm.
In an alternative embodiment, the second transparent adhesive part has a thickness of 300 to 500 μm.
As an alternative embodiment, the adhesive layer is a transparent optical glue.
As an optional implementation manner, one side of the screen body facing the package cover plate is provided with a polarizer, an integrated circuit layer and a supporting protection layer covering the side wall of the integrated circuit layer close to the frame region, and tops of the polarizer and the supporting protection layer are flush and respectively abutted against the adhesive layer.
Compared with the prior art, the display module that this application embodiment provided has following advantage at least:
the display module assembly that the embodiment of this application provided is including the screen body that stacks gradually the setting, adhesive linkage and encapsulation apron, the adhesive linkage includes half solid-state glue, the adhesive linkage includes first transparent bonding portion and the transparent bonding portion of second, wherein, the display area is filled to first transparent bonding portion, the frame district is filled to the transparent bonding portion of second, because first transparent bonding portion and the transparent bonding portion of second are half solid-state glue, therefore, can be better satisfy the coating demand of the narrow frame of display module assembly, so that the projection of the transparent bonding portion of second on the screen body covers the frame district, and the thickness of the transparent bonding portion of second is greater than the thickness of first transparent bonding portion, thus, the space of filling the frame district that the transparent bonding portion of second can be abundant, in order to avoid the display module assembly to screen the frame district damage when falling, thereby the anti-falling ability of display module assembly has been improved.
In a second aspect, an embodiment of the present application provides an electronic device, including the display module provided in the first aspect.
The electronic equipment provided by the embodiment of the application has the same beneficial effects as the display module, and is not repeated herein.
In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems that can be solved by the display module and the electronic device provided by the embodiments of the present application, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic top view of a display module according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view illustrating another structure of a display module according to an embodiment of the present disclosure.
Reference numerals:
100-a display module;
110-screen body;
120-a package cover plate;
130-an adhesive layer;
131-a first transparent adhesive part;
132-a second transparent adhesive portion;
133-glue overflow groove;
140-a polarizing plate;
150-integrated circuit layer;
160-supporting protective layer.
Detailed Description
In the correlation technique, the main reason that the anti-falling capability of display module is poor lies in: the display module comprises a screen body and an encapsulation cover plate encapsulated on the screen body, the screen body comprises a display panel and a polarizing plate arranged on one side of the display panel facing the encapsulation cover plate, wherein the display panel comprises a luminous display area and a frame area arranged at the edge of the luminous display area, the display module further comprises a flexible circuit board which is connected with the frame area of the luminous layer and is folded to the back of the luminous layer, in order not to affect the electrical performance of the flexible circuit board, the frame region of the light-emitting layer is usually in a suspended state, in order to avoid the damage of the frame area when the screen body falls, liquid silicone adhesive is usually filled between the frame area of the light-emitting layer and the package cover plate, therefore, the liquid silicone adhesive can fill the area between the frame area of the light-emitting layer and the packaging cover plate, the frame area of the screen body can be supported and protected after the silicone adhesive is cured, and the anti-falling capacity of the screen body in the frame area can be improved.
However, as the frame of the screen body becomes narrower and narrower, since the silicone adhesive is coated on the frame of the screen body in a liquid state, when the frame of the screen body becomes narrower and narrower, it becomes more and more difficult to coat the liquid silicone adhesive on the frame of the screen body, and the filling requirement of the silicone adhesive between the screen body and the cover plate cannot be met, so that the anti-falling capability of the screen body is poor.
In order to solve the above problems, embodiments of the present application provide a display module, which includes a panel, an adhesive layer, and a package cover plate, wherein the panel, the adhesive layer, and the package cover plate are sequentially stacked, the adhesive layer includes a semi-solid adhesive, the adhesive layer includes a first transparent adhesive portion and a second transparent adhesive portion, wherein the first transparent bonding part fills the display area, the second transparent bonding part fills the frame area, and the first transparent bonding part and the second transparent bonding part are both semi-solid glue, therefore, the coating requirement of the narrow frame of the display module can be better met, so that the orthographic projection of the second transparent bonding part on the screen body covers the frame area, and the thickness of the second transparent bonding part is larger than that of the first transparent bonding part, so that the second transparent bonding part can fully fill the gap of the frame area, the frame area of the screen body is prevented from being damaged when the display module falls, and therefore the falling resistance of the display module is improved.
In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example one
Fig. 1 is a schematic top view of a display module according to an embodiment of the present disclosure; fig. 2 is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure.
Referring to fig. 1, a display module 100 provided in the embodiment of the present application includes a display area and a frame area surrounding the display area.
It will be appreciated that the display area is used to provide a display image to the user, while the border area is a non-display area. In fig. 1, the AA area may be a display area of the display module 100, and the B area is a frame area of the display module 100, wherein the frame area is surrounded around the display area.
Referring to fig. 2, the display module 100 provided in this embodiment of the present application includes a screen body 110 and a package cover plate 120 sequentially stacked, where it can be understood that the screen body 110 includes a display panel and a polarizing plate 140 disposed on one side of the display panel facing the package cover plate 120, the display panel may include a light emitting device layer, one surface of the polarizing plate 140 is attached to an upper surface of the light emitting device layer, the other surface of the polarizing plate 140 is attached to the package cover plate 120, the display panel has a light emitting display area and a frame area, the package cover plate 120 has a see-through area, and a display image in the light emitting display area presents a display image to a user through the see-through area.
The display module 100 further includes an integrated circuit layer 150, the integrated circuit layer 150 includes a flexible circuit board, the flexible circuit board is connected to the frame region of the display panel and is turned over to the back of the display panel, in order not to affect the electrical performance of the flexible circuit board, a support protection layer 160 is usually disposed on the sidewall of the flexible circuit board, especially on the sidewall close to the frame region, so as to protect the sidewall of the flexible circuit board, and the support protection layer 160 may be a non-UV type optical adhesive to protect the flexible circuit board.
The supporting protection layer 160 may be disposed on the surface of the display panel, besides the side wall of the flexible circuit board, so as to protect the metal traces on the surface of the display panel.
In addition, the supporting protection layer 160 may have a thickness such that the top of the supporting protection layer 160 is flush with the top of the polarizer 140 to support and protect the panel 110.
In this application, an adhesive layer 130 is further disposed between the screen body 110 and the package cover plate 120, and the bonding between the screen body 110 and the package cover plate 120 is achieved through the adhesive layer 130.
Optionally, the adhesive layer 130 includes a semi-solid adhesive, so that the first transparent adhesive portion 131 and the second transparent adhesive portion 132 are both semi-solid adhesives.
The adhesive layer 130 includes a first transparent adhesive portion 131 and a second transparent adhesive portion 132, the first transparent adhesive portion 131 is used for attaching the display area of the screen body 110 to the cover plate 120, and the second transparent adhesive portion 132 is used for attaching the frame area of the screen body 110 to the cover plate 120.
In this application, semi-solid state material is chooseed for use to the transparent portion of bonding 132 of second, can understand, through chooseing semi-solid state material for use to the transparent portion of bonding 132 of second, like this, it is narrower when the frame district, when the area that leads to the frame district to treat the coating is less, the coating demand in frame district also can be satisfied to the transparent portion of bonding 132 of semi-solid state to when avoiding influencing flexible circuit board's electrical property, can improve the anti ability of falling in the frame district of the screen body 110.
The second transparent adhesive portion 132 and the first transparent adhesive portion 131 may be made of the same material or different materials.
For example, the second transparent adhesive part 132 and the first transparent adhesive part 131 may both be semi-solid optically clear adhesive.
In the following embodiments, the first transparent adhesive portion 131 and the second transparent adhesive portion 132 are both semi-solid transparent optical adhesives.
As shown in fig. 2, in order to improve the reliability of the bonding between the frame region of the panel 110 and the package cover 120, in the embodiment of the present invention, the thickness of the second transparent adhesive portion 132 is greater than that of the first transparent adhesive portion 131, so that the second adhesive portion can repeatedly fill the gap between the frame region of the panel 110 and the package cover 120.
By segmenting the adhesive layer 130 into different thicknesses, the problem of insufficient filling of different areas between the screen body 110 and the package cover plate 120 is solved, so that the reliability of the attachment between the screen body 110 and the package cover plate 120 is improved.
The first transparent bonding part 131 and the second transparent bonding part 132 are made of semi-solid optical transparent adhesive, so that the curing process can be reduced, on one hand, the packaging period between the screen body 110 and the packaging cover plate 120 can be shortened, and the cost can be reduced; on the other hand, bonding defects due to depressions or the like formed when the adhesive layer 130 is cured can be reduced, and the reliability of the package between the panel 110 and the package cover 120 can be improved.
In specific implementation, the semi-solid adhesive layer 130 is firstly attached to the screen body 110, and when the encapsulation cover plate 120 is attached to the screen body 110, the semi-solid adhesive layer 130 is attached after being torn off from the release film on the side facing the encapsulation cover plate 120, so that the problem that the adhesive layer 130 is not filled enough on the screen body 110 can be solved, and the attachment reliability between the screen body 110 and the encapsulation cover plate 120 can be improved.
In the above scheme, the bonding layer 130 for attaching the screen body 110 and the package cover plate 120 is set to be semi-solid, and the first transparent bonding part 131 in the bonding layer 130 is used for attaching the screen body 110 between the display area and the package cover plate 120, and the second transparent bonding part 132 is used for attaching the frame area of the screen body 110 and the package cover plate 120, so that the coating requirement of the narrow frame of the display module 100 can be better met, in addition, the thickness of the second transparent bonding part 132 is greater than that of the first transparent bonding part 131, so that the second transparent bonding part 132 can fully fill the gap of the frame area, so that the frame area of the screen body 110 is prevented from being damaged when the display module 100 falls, so that the anti-falling capability of the display module 100 is improved, and the safety and reliability of the display module 100 can be improved.
As an alternative embodiment, the first transparent adhesive part 131 and the second transparent adhesive part 132 are a single piece, and the second transparent adhesive part 132 is disposed around the first transparent adhesive part 131.
Illustratively, the first transparent adhesive part 131 and the second transparent adhesive part 132 may be semi-solid transparent optical glue. Firstly, selecting a substrate with a corresponding thickness according to the corresponding attaching thickness of the display area between the screen body 110 and the packaging cover plate 120, correspondingly cutting the substrate of the semi-solid transparent optical adhesive according to the sizes of the display area and the frame area, and then attaching the corresponding semi-solid transparent optical adhesive to the position corresponding to the frame area on the cut substrate according to the actual attaching thickness between the frame area and the packaging cover plate 120 after cutting, so as to form an adhesive layer 130 with different thicknesses, thereby meeting different attaching gaps of the display area and the frame area.
The first transparent adhesive part 131 and the second transparent adhesive part 132 manufactured by the above process are integrated, so that the processing process and the bonding process of the adhesive layer 130 can be reduced during bonding, thereby reducing the cost.
In addition, when the screen body 110 and the package cover plate 120 are bonded together, in order to improve the bonding reliability between the screen body 110 and the package cover plate 120, a hot pressing device is required to apply appropriate pressure and temperature to the package cover plate 120, and the semi-solid adhesive layer 130 has certain fluidity at a certain temperature and pressure, so that glue overflow is formed all around, and the display effect of the display module 100 is not affected by the formation of a protrusion between the screen body 110 and the package cover plate 120 due to the glue overflow.
Fig. 3 is a schematic cross-sectional view illustrating another structure of a display module according to an embodiment of the present disclosure. Referring to fig. 3, in the embodiment of the present disclosure, an overflow groove 133 may be disposed between the first transparent bonding portion 131 and the second transparent bonding portion 132, so that the overflow generated by the bonding layer 130 is filled in the overflow groove 133.
It can be understood that the glue overflow groove 133 can be an annular glue overflow groove 133, and the annular glue overflow groove 133 is disposed between the first transparent bonding portion 131 and the second transparent bonding portion 132, so that when the first transparent bonding portion 131 and the second transparent bonding portion 132 flow in a high-temperature and high-pressure environment, the glue overflow of the first transparent bonding portion 131 flows into the glue overflow groove 133, the glue overflow of one side of the second transparent bonding portion 132 close to the glue overflow groove 133 flows into the glue overflow groove 133, and the glue overflow of one side of the second transparent bonding portion 132 close to the frame edge can further fill the edge of the frame of the screen body 110, so as to improve the anti-falling capability of the frame area of the screen body 110, and avoid the frame area from being damaged when falling.
The cross-sectional shape of the flash groove 133 may be rectangular, trapezoidal, semicircular, or semi-elliptical, as long as it can accommodate flash of the first transparent bonding portion 131 and the second transparent bonding portion 132, and the embodiment of the present application is not particularly limited.
In addition, the specific width of the glue overflow groove 133 may be determined according to actual conditions as long as the glue overflow can be completely accommodated.
Illustratively, the cross-sectional shape of the glue overflow groove 133 is rectangular, wherein the width of the rectangular glue overflow groove 133 may be 20 μm to 30 μm, for example, the width of the rectangular glue overflow groove 133 may be 20 μm, 21 μm, 22 μm, 23 μm, 23.5 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, and the like.
The width of the glue overflow groove 133 refers to a distance between the first transparent adhesive portion 131 and the second transparent adhesive portion 132 along a horizontal direction, wherein the horizontal direction is perpendicular to the thickness direction of the display module 100.
Optionally, the groove depth of the glue overflow groove 133 may be smaller than the thickness of the first transparent bonding portion 131, and certainly, the groove depth of the glue overflow groove 133 may also be equal to the thickness of the first transparent bonding portion 131, which is not limited in this embodiment.
Illustratively, when the groove depth of the glue overflow groove 133 is equal to the thickness of the first transparent bonding portion 131, and the bonding layer 130 is not yet attached to the panel body 110, the release film on the bonding layer 130 forms the first transparent bonding portion 131 and the second transparent bonding portion 132 into a single piece, and when the bonding layer 130 is attached to the panel body 110, the release film is removed, the glue overflow groove 133 between the first transparent bonding portion 131 and the second transparent bonding portion 132 completely separates the first transparent bonding portion 131 from the second transparent bonding portion 132, so that the first transparent bonding portion 131 and the second transparent bonding portion 132 form two completely independent portions, so that when the encapsulation cover plate 120 is attached to the panel body 110, the glue overflow is filled into the glue overflow groove 133, and the influence of the glue overflow between the panel body 110 and the encapsulation cover plate 120 on the display effect of the display module 100 due to the formation of a protrusion is avoided.
It is understood that the specific thickness of the first transparent adhesive portion 131 may be determined according to the overall thickness of the display module 100, and for example, the thickness of the first transparent adhesive portion 131 may be 125 μm to 150 μm, for example, the thickness of the first transparent adhesive portion 131 may be 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, and the like.
The specific thickness of the second transparent adhesive portion 132 may also be determined according to the overall thickness of the display module 100, for example, the thickness of the second transparent adhesive portion 132 may be 300 μm to 500 μm, and for example, the thickness of the second transparent adhesive portion 132 may be 300 μm, 350 μm, 380 μm, 400 μm, 450 μm, 500 μm, and the like.
To sum up, the display module assembly that this application embodiment provided is including the screen body that stacks gradually the setting, adhesive linkage and encapsulation apron, the adhesive linkage includes semi-solid glue, the adhesive linkage includes first transparent bonding portion and the transparent bonding portion of second, wherein, the display area is filled to first transparent bonding portion, the frame district is filled to the transparent bonding portion of second, because first transparent bonding portion and the transparent bonding portion of second are semi-solid, therefore, can be better satisfy the coating demand of the narrow frame of display module assembly, so that the projection of the transparent bonding portion of second on the screen body covers the frame district, and the thickness of the transparent bonding portion of second is greater than the thickness of first transparent bonding portion, thus, the space of the filling frame district that the transparent bonding portion of second can be abundant, in order to avoid the display module assembly frame district damage of the screen body when falling, thereby the anti-falling ability of display module assembly has been improved.
Example two
An embodiment of the present application provides an electronic device, which includes the display module in the first embodiment.
The structure and the working principle of the display module are described in detail in the first embodiment, and are not described in detail herein.
It can be understood that the electronic device provided in the embodiment of the present application may be a mobile phone, a tablet computer, or the like.
The electronic equipment provided by the embodiment of the application comprises a display module, wherein the display module comprises a screen body, an adhesive layer and a packaging cover plate which are sequentially stacked, the adhesive layer comprises semi-solid glue, the adhesive layer comprises a first transparent adhesive part and a second transparent adhesive part, wherein the first transparent bonding part fills the display area, the second transparent bonding part fills the frame area, and the first transparent bonding part and the second transparent bonding part are both solid, therefore, the coating requirement of the narrow frame of the display module can be better met, so that the projection of the second transparent bonding part on the screen body covers the frame area, and the thickness of the second transparent bonding part is larger than that of the first transparent bonding part, so that the second transparent bonding part can fully fill the gap of the frame area, the frame area of the screen body is prevented from being damaged when the display module falls, and therefore the falling resistance of the display module is improved.
The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
In the description of the present application, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
The terms "first," "second," and "third" (if any) in the description and claims of this application and the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A display module is provided with a display area and a frame area surrounding the display area, and is characterized by comprising a screen body, an adhesive layer and a packaging cover plate which are sequentially stacked, wherein the adhesive layer is used for bonding the screen body and the packaging cover plate and comprises semi-solid glue;
the bonding layer comprises a first transparent bonding part and a second transparent bonding part, the orthographic projection of the first transparent bonding part on the screen body covers the display area, and the orthographic projection of the second transparent bonding part on the screen body covers the frame area; wherein the thickness of the second transparent bonding part is greater than that of the first transparent bonding part.
2. The display module of claim 1, wherein the first transparent bonding portion and the second transparent bonding portion are a single piece, and the second transparent bonding portion is disposed around the first transparent bonding portion.
3. The display module according to claim 1 or 2, wherein an adhesive overflow groove is formed between the first transparent bonding portion and the second transparent bonding portion.
4. The display module according to claim 3, wherein the width of the glue overflow groove is 20-30 μm.
5. The display module according to claim 3, wherein the groove depth of the glue overflow groove is less than or equal to the thickness of the first transparent bonding part.
6. The display module of claim 1, wherein the first transparent adhesive portion has a thickness of 125 μm to 150 μm.
7. The display module according to claim 1, wherein the second transparent adhesive portion has a thickness of 300 μm to 500 μm.
8. The display module of claim 1, wherein the adhesive layer is a transparent optical adhesive.
9. The display module according to claim 1, wherein a side of the panel body facing the package cover plate has a polarizer, an integrated circuit layer, and a support protection layer covering a sidewall of the integrated circuit layer near the frame region, and tops of the polarizer and the support protection layer are flush and respectively abutted against the adhesive layer.
10. An electronic device, comprising the display module according to any one of claims 1 to 9.
CN202111670190.4A 2021-12-30 2021-12-30 Display module and electronic equipment Pending CN114299825A (en)

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