CN114286513B - Asymmetric prestress eliminating type LED backboard and manufacturing method thereof - Google Patents
Asymmetric prestress eliminating type LED backboard and manufacturing method thereof Download PDFInfo
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- CN114286513B CN114286513B CN202111447042.6A CN202111447042A CN114286513B CN 114286513 B CN114286513 B CN 114286513B CN 202111447042 A CN202111447042 A CN 202111447042A CN 114286513 B CN114286513 B CN 114286513B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 claims abstract description 36
- 238000013461 design Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 25
- 239000002344 surface layer Substances 0.000 claims description 20
- 230000014759 maintenance of location Effects 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 10
- 230000035882 stress Effects 0.000 description 13
- 239000000047 product Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 244000141359 Malus pumila Species 0.000 description 1
- 235000021016 apples Nutrition 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The invention provides an asymmetric prestress eliminating type LED backboard and a manufacturing method thereof, wherein the LED backboard is manufactured by adopting an asymmetric stacking design, and the reverse stress of bending stress which is inevitably generated in the SMT mounting process due to large difference of copper left on two sides is prestored in the PCB production stage, so that the phenomenon that the LED backboard is slightly bent towards a lamp surface after the completion of the LED backboard is solved. And the copper layer covered by the grounding area on the driving surface is of a grid structure, grid lines are inclined to the length direction of the packaging backboard, more internal stress can be further reserved on the lamp surface through asymmetric design, so that the stress of bending towards the driving surface in the process of mounting the driving surface IC is counteracted, the warping deformation problem of the flip LED backboard in an SMT link can be solved, and the mounting efficiency and yield of the wafer are improved.
Description
Technical Field
The invention belongs to the field of manufacturing of LED back plates, and particularly relates to an asymmetric prestress eliminating type LED back plate and a manufacturing method thereof.
Background
Compared with discrete device small-pitch LEDs of traditional SMT surface mount lamp beads, the MINI LED direct display product based on the RGB flip chip has higher luminous efficiency, the chip and the circuit are integrally protected by packaging glue, the service life is longer, the display effect is better, and the product is popularized very fast in the last two years. Such as apples, BOEs, samsung, all have related products on the market.
The link of transferring a large amount of flip chips with extremely small size to a flip back plate PCB is a great difficulty in the manufacturing process of the product, the number of the PCB back plates used for the flip LEDs is 4-10 layers of multi-layer circuit boards, the driving surface circuit of the PCB is limited by circuit design, decoupling and grounding are required to be considered, and copper with large area is designed, so that the copper retention rate is generally over 70%; the lamp surface only keeps the die bonding pad and a small number of lines in single trend, and the copper retention rate is only below 20% and is uniformly distributed in a chip mode. The asymmetric copper-remaining device is impacted by high temperature of about 250 ℃ in the PCB mounting driving element process, double-sided thermal stress deformation cannot be counteracted, so that the PCB is bent towards a driving surface with more copper-remaining and large stress, the serious bending rate reaches more than 2%, and the precise transfer and mounting of a lamp surface wafer are seriously affected. Therefore, at present, the PCB can deform and warp to different degrees after the driving element is attached, so that the high-precision attaching of the lamp face wafer is difficult, and the production efficiency, the attaching yield and the display effect of the final product are affected.
Disclosure of Invention
The invention aims to solve the technical problem that the PCB can deform and bend to different degrees after the driving element is attached in the process of transferring a large amount of flip chips with extremely small sizes to the flip-chip backboard PCB in the existing manufacturing process of the LED backboard.
The invention is realized in such a way that an asymmetric prestress eliminating type LED backboard comprises a lamp surface for welding an LED, a driving surface for welding a driving device and a packaging backboard positioned between the lamp surface and the driving surface, wherein the packaging backboard comprises a plurality of inner circuit layers; the lamp surface is connected with the packaging backboard through a first surface bonding sheet, and the driving surface is connected with the packaging backboard through a second surface bonding sheet; the thickness of the first surface layer bonding sheet is larger than that of the second surface layer bonding sheet; the copper layer covered on the lamp surface is of a solid structure; the copper layer covered by the grounding area on the driving surface is of a first grid structure, and grid lines of the first grid structure are inclined to the length direction of the packaging backboard; the copper retention rate on the lamp face is greater than the copper retention rate on the driving face.
Further, a first process edge covered with copper is arranged at the edge of the lamp surface, a second process edge covered with copper is arranged at the edge of the driving surface, and a copper layer covered on the first process edge is of a solid structure; and the copper layer covered on the second process side is of a second grid structure, and grid lines of the second grid structure are inclined to the length direction of the packaging backboard.
Further, a first process edge coated with copper is arranged at the edge of the lamp surface, a second process edge coated with copper is arranged at the edge of the driving surface, and the width of the first process edge is larger than that of the second process edge.
Further, the width range of the first process side and the second process side is 3-10 MM.
Further, the first surface layer bonding sheet and the second surface layer bonding sheet are prepregs, and the length direction of the glass fibers in the first surface layer bonding sheet and the second surface layer bonding sheet is parallel or perpendicular to the length direction of the packaging backboard.
Further, the first surface layer bonding sheet is a prepreg, and the second surface layer bonding sheet is copper-clad resin without glass fiber.
Further, the length direction of the network wires of the first grid structure and the second grid structure is inclined by 45 degrees relative to the length direction of the package backboard.
Further, the ratio of copper retention rates of the lamp surface and the driving surface is 100:65.
further, the widths of the grid lines in the first grid structure and the second grid structure are 0.2 MM-1 MM, and the gaps between the grid lines are 0.2 MM-1 MM.
The invention also provides a manufacturing method of the asymmetric prestress eliminating type LED backboard, which comprises the following steps:
s1, according to the target warping degree of the packaging backboard after SMT, asymmetrically designing wiring on a lamp surface and a driving surface; wherein, the copper retention rate on the lamp surface is larger than the copper retention rate on the driving surface; the copper layer covered on the lamp surface is of a solid structure; the copper layer covered by the grounding area on the driving surface is of a first grid structure, and grid lines of the first grid structure are inclined to the edge of the packaging backboard;
s2, preparing a packaging backboard;
s3, bonding a first surface bonding sheet on the front surface of the packaging backboard according to the wiring design in the step S1, manufacturing a bonding pad of a lamp surface and a circuit trace on the first surface bonding sheet, bonding a second surface bonding sheet on the back surface of the packaging backboard, and manufacturing a grid structure of a driving surface and the circuit trace on the second surface bonding sheet; wherein the thickness of the first surface layer bonding sheet is greater than the thickness of the second surface layer bonding sheet;
s4, after the product is manufactured, a reflow test is carried out by simulating parameters of the mounting drive IC, the warping degree of the plate is measured, the influence is evaluated, and meanwhile, the flatness of the LED backboard after SMT is adjusted by changing the grid line width of the first grid structure and the thickness of the second surface bonding sheet on the driving surface.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the LED backboard is manufactured by adopting an asymmetric stacking design, and the reverse stress of bending stress which is necessarily generated in the SMT mounting process due to large difference of copper remained on two sides is prestored in the PCB production stage, so that the phenomenon that the LED backboard is slightly bent towards the lamp surface possibly generated after the completion of the LED backboard is solved, the LED backboard can be leveled according to the actual use requirement, the prestored stress generated by the asymmetric design is not influenced by the leveling, and the bending stress towards the lamp surface generated by SMT processing at the rear end of the product can be partially or completely counteracted. The driving surface is provided with grid lines inclined to the length direction of the packaging backboard, more internal stress can be reserved on the lamp surface through asymmetric design, so that the bending stress of the driving surface in the process of mounting the driving surface IC is counteracted, the bending deformation problem of the flip LED backboard in an SMT link can be improved, and the mounting efficiency and the yield of the wafer are improved.
Drawings
Fig. 1 is a schematic structural diagram of an asymmetric prestress relieving LED back plate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the driving surface of the LED back plate shown in FIG. 1;
FIG. 3 is a schematic view of an arrangement of a process side of a lamp face of the LED back-plate of FIG. 1;
fig. 4 is a schematic layout of the process side of the driving face of the LED back plate shown in fig. 1.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the two parts. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1, an asymmetric prestress-eliminating type LED back plate provided by the present invention includes a lamp surface 1 for soldering an LED, a driving surface 2 for soldering a driving device, and a package back plate 3 located between the lamp surface 1 and the driving surface 2, wherein the package back plate 3 includes a plurality of inner circuit layers.
The lamp surface 1 is connected with the packaging backboard 3 through a first surface bonding sheet 4, the driving surface 2 is connected with the packaging backboard 3 through a second surface bonding sheet 5, and the thickness of the first surface bonding sheet 4 is larger than that of the second surface bonding sheet 5. In this embodiment, the first surface layer bonding sheet 4 and the second surface layer bonding sheet 5 are prepregs, and the length direction of the glass fibers in the first surface layer bonding sheet 4 and the second surface layer bonding sheet 5 is parallel or perpendicular to the length direction of the package back plate 3. Alternatively, the first surface layer bonding sheet 4 is a prepreg, and the second surface layer bonding sheet 5 is a copper-clad resin without glass fiber.
The copper layer covered on the lamp surface 1 is of a solid structure; the copper layer covered by the grounding area on the driving surface 2 is of a first grid structure (shown in fig. 2), and grid lines of the first grid structure are inclined to the length direction of the packaging backboard; preferably, the length direction of the network wires is inclined at 45 degrees with respect to the length direction of the package back plate 3. The width of the grid lines in the grid structure is 0.2-1 MM, and the gaps among the grid lines are 0.2-1 MM.
The copper retention rate on the lamp surface 1 is larger than that on the driving surface 2, and preferably, the copper retention rate ratio of the lamp surface 1 to the driving surface 2 is 100:65.
referring to fig. 3, a first process side 11 covered with copper is provided at the edge of the lamp surface 1, a second process side 21 covered with copper is provided at the edge of the driving surface 2, and the copper layer covered on the first process side 11 is of a solid structure; the copper layer covered on the second process side 21 is of a second grid structure, and grid lines of the second grid structure of the second process side 21 are inclined to the length direction of the package backboard 3. In the present embodiment, the width of the first process side 11 and the second process side 21 ranges from 3 MM to 10MM.
Of course, the copper layer covered on the second process side 21 may be designed as a solid structure, but the width of the first process side 11 is larger than the width of the second process side 21, so as to ensure that the copper remaining rate on the first process side 11 is larger than the copper remaining rate on the second process side 21.
The embodiment also provides a manufacturing method of the LED backboard, which comprises the following steps:
s1, according to the target warping degree of the packaging backboard 3 after SMT, asymmetric design is carried out on wiring on the lamp surface 1 and the driving surface 2; wherein, the copper retention rate on the lamp surface 1 is larger than the copper retention rate on the driving surface 2; the copper layer covered on the lamp surface 1 is of a solid structure; the copper layer covered by the grounding area on the driving surface 2 is in a grid structure, and grid lines of the grid structure are inclined to the edge of the packaging backboard 3.
S2, preparing a packaging backboard 3; the manufacture of the packaging backboard 3 is consistent with the existing HDI technology, and the main flow is as follows: cutting, drilling, copper deposition electroplating, resin plugging, grinding, inner layer circuit, AOI, pressing (laser drilling, copper deposition electroplating, circuit, AOI, pressing), laser drilling, copper deposition electroplating, circuit, word welding prevention, surface treatment, forming, testing and inspection. Wherein the process in brackets can be repeated as many times as desired.
S3, bonding a first surface bonding sheet 4 on the front surface of the packaging backboard 3 according to the wiring design in the step S1, manufacturing a bonding pad and a circuit trace of the lamp surface 1 on the first surface bonding sheet 4, bonding a second surface bonding sheet 5 on the back surface of the packaging backboard 3, and manufacturing a first grid structure, a second grid structure and a circuit trace of the driving surface 2 on the second surface bonding sheet 5; wherein the thickness of the first skin adhesive sheet 4 is greater than the thickness of the second skin adhesive sheet 5.
S4, after the product is manufactured, a reflow test is carried out by simulating parameters of the mounting drive IC, the warping degree of the plate is measured, the influence is evaluated, and meanwhile, the flatness of the LED backboard after SMT is adjusted by changing the grid line width of the first grid structure on the drive surface 2 and the thickness of the second surface bonding sheet 5.
According to the embodiment, the MINI LED back plate is manufactured by adopting an asymmetric stacking design, and the reverse stress of bending stress which is necessarily generated in the SMT mounting process due to large difference of copper remained on two sides is prestored in the PCB production stage, so that the phenomenon that the LED back plate is slightly bent towards the lamp surface possibly generated after the completion of the LED back plate is solved, the LED back plate can be leveled according to the actual use requirement, the prestored stress generated by the asymmetric design is not influenced by the leveling, and the bending stress towards the lamp surface generated by SMT processing at the rear end of the product can be partially or completely counteracted. The driving surface 2 is provided with grid lines inclined to the length direction of the packaging backboard 3, so that more internal stress can be reserved on the lamp surface through asymmetric design and used for counteracting bending stress to the driving surface in the process of mounting the driving surface IC, the warping deformation problem of the flip LED backboard in an SMT link can be solved, and the mounting efficiency and yield of the wafer are improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. An asymmetric prestress eliminating type LED backboard comprises a lamp surface for welding an LED, a driving surface for welding a driving device and a packaging backboard positioned between the lamp surface and the driving surface, wherein the packaging backboard comprises a plurality of inner circuit layers; the lamp surface is connected with the packaging backboard through a first surface bonding sheet, and the driving surface is connected with the packaging backboard through a second surface bonding sheet; the method is characterized in that the thickness of the first surface layer bonding sheet is larger than that of the second surface layer bonding sheet; the copper layer covered on the lamp surface is of a solid structure; the copper layer covered by the grounding area on the driving surface is of a first grid structure, and grid lines of the first grid structure are inclined to the length direction of the packaging backboard; the copper retention rate on the lamp face is greater than the copper retention rate on the driving face.
2. The asymmetric pre-stress relief type LED back plate as set forth in claim 1, wherein the edge of said lamp face is provided with a first process side covered with copper, the edge of said driving face is provided with a second process side covered with copper, and the copper layer covered on said first process side is of a solid structure; and the copper layer covered on the second process side is of a second grid structure, and grid lines of the second grid structure are inclined to the length direction of the packaging backboard.
3. The asymmetric pre-stress relief type LED back plate as defined in claim 1, wherein the edge of said lamp face is provided with a first process side covered with copper, the edge of said driving face is provided with a second process side covered with copper, and the width of said first process side is greater than the width of said second process side.
4. The asymmetric pre-stress relief type LED back plate as set forth in claim 3, wherein the first process side and the second process side have a width in the range of 3 MM to 10MM.
5. The asymmetric pre-stress relief LED back sheet according to any one of claims 1 to 4, wherein said first and second skin adhesive sheets are prepregs, and the length direction of glass fibers in said first and second skin adhesive sheets is parallel or perpendicular to the length direction of said package back sheet.
6. The asymmetric pre-stress relief LED back sheet as recited in any one of claims 1 to 4, wherein said first skin adhesive sheet is a prepreg and said second skin adhesive sheet is a copper-clad resin without glass fibers.
7. The asymmetric pre-stress relief LED back plane of claim 2, wherein the length direction of the network lines of the first and second mesh structures are inclined 45 degrees with respect to the length direction of the package back plane.
8. The asymmetric pre-stress relief LED back plane of any one of claims 1 to 4, wherein the ratio of copper retention of the lamp face to the driving face is 100:65.
9. the asymmetric pre-stress relief LED back plate as recited in any one of claims 1 to 4, wherein the grid line width in said first and second grid structures is 0.2MM to 1MM and the gap between said grid lines is 0.2MM to 1MM.
10. A method of making an asymmetric pre-stress relief LED back-plate as claimed in any one of claims 1-9, comprising the steps of:
s1, according to the target warping degree of the packaging backboard after SMT, asymmetrically designing wiring on a lamp surface and a driving surface; wherein, the copper retention rate on the lamp surface is larger than the copper retention rate on the driving surface; the copper layer covered on the lamp surface is of a solid structure; the copper layer covered by the grounding area on the driving surface is of a first grid structure, and grid lines of the first grid structure are inclined to the edge of the packaging backboard;
s2, preparing a packaging backboard;
s3, bonding a first surface bonding sheet on the front surface of the packaging backboard according to the wiring design in the step S1, manufacturing a bonding pad of a lamp surface and a circuit trace on the first surface bonding sheet, bonding a second surface bonding sheet on the back surface of the packaging backboard, and manufacturing a grid structure of a driving surface and the circuit trace on the second surface bonding sheet; wherein the thickness of the first surface layer bonding sheet is greater than the thickness of the second surface layer bonding sheet;
s4, after the product is manufactured, a reflow test is carried out by simulating parameters of the mounting drive IC, the warping degree of the plate is measured, the influence is evaluated, and meanwhile, the flatness of the LED backboard after SMT is adjusted by changing the grid line width of the first grid structure and the thickness of the second surface bonding sheet on the driving surface.
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| CN202111447042.6A CN114286513B (en) | 2021-11-30 | 2021-11-30 | Asymmetric prestress eliminating type LED backboard and manufacturing method thereof |
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| CN202111447042.6A CN114286513B (en) | 2021-11-30 | 2021-11-30 | Asymmetric prestress eliminating type LED backboard and manufacturing method thereof |
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