CN114269087B - High-precision machining device based on multilayer circuit manufacturing - Google Patents

High-precision machining device based on multilayer circuit manufacturing Download PDF

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CN114269087B
CN114269087B CN202210200678.9A CN202210200678A CN114269087B CN 114269087 B CN114269087 B CN 114269087B CN 202210200678 A CN202210200678 A CN 202210200678A CN 114269087 B CN114269087 B CN 114269087B
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axis
micropore
needle head
multilayer circuit
adjusting
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CN114269087A (en
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李赛锋
黄飞
蔡王灿
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Corevoxel Hangzhou Technology Development Co ltd
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Corevoxel Hangzhou Technology Development Co ltd
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Abstract

A high-precision machining device based on multilayer circuit manufacturing comprises a machining table and a five-axis motion system arranged on the machining table, wherein an adsorption device corresponding to the five-axis motion system is arranged on the machining table, a micropore printing needle head is arranged on the five-axis motion system, and a visual observation and alignment system, a multilayer circuit vertical interconnection mechanism, a height measurement and automatic following system and a slit coating mechanism corresponding to the micropore printing needle head are arranged on the five-axis motion system; a fluid control system is arranged in the five-axis motion system and is communicated with the micropore printing needle head; compared with the prior art, the method has the advantages that the ultra-high-precision five-axis motion system is utilized, the micropore printing spray head and the high-precision fluid control system are combined to prepare the precise electronic circuit, the visual observation and alignment system is adopted to perform real-time observation and visual alignment on the printing process, and the better stability of the printing process is ensured.

Description

High-precision machining device based on multilayer circuit manufacturing
Technical Field
The invention relates to the technical field of multilayer circuit manufacturing, in particular to a high-precision processing device based on multilayer circuit manufacturing.
Background
The manufacturing of the multilayer circuit generally adopts the methods of ink-jet or aerosol jet additive, nano-silver conductive ink and insulating ink cooperation, dispensing distribution technology, thin film technology, thick film technology, organic laminated board technology, photoetching + developing + chemical/electroplating, vapor deposition or screen printing and the like; forming holes by means of mechanical punching/drilling, laser drilling, chemical etching, plasma etching and the like; performing hole metallization by chemical/electroplating, screen printing and other modes; and carrying out multilayer stacking by means of vapor deposition, spin coating, stacking co-firing, laminating and the like.
The traditional process has the problems of large line width and poor precision (ranging from dozens of micrometers to hundreds of micrometers, and the like, the traditional process has various flows, needs a plurality of masks, is expensive in equipment and large in material waste, and if the line pattern is transferred by using the screen printing, the screen printing is limited by the mesh number of the screens, and simultaneously has the problem of large line width.
And the conductor circuit formed by the existing ink-jet or aerosol jet printing technology has the problems of large line width and poor precision, and only has some applications on low-end printed circuit boards.
Chinese patent No. CN202021159207.0 discloses a multi-axis suspension 3D printing system, which comprises a controller, a forming cylinder, an irradiation module, and a plurality of feeding modules and a plurality of recovery modules arranged around the forming cylinder; the controller controls each module; the forming cylinder bears gel medium; the irradiation module is used for irradiation curing; the feeding module comprises a feeding mechanical arm and a feeding unit connected with the feeding mechanical arm, and the feeding unit comprises a printing needle head; the recovery module comprises a recovery mechanical arm and a recovery unit connected with the recovery mechanical arm, and the recovery unit comprises a recovery needle head.
The printing mode disclosed by the above adopts a suspension printing mode, and although the printing mode can meet the requirement of printing a multi-layer circuit complex structure, the printing precision is difficult to control, and certain positioning and calibration problems exist.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a high-precision processing device which is manufactured integrally, has high precision and meets the requirements of a multilayer circuit and is manufactured based on the multilayer circuit.
In order to achieve the purpose, the invention adopts the following technical scheme: a high-precision machining device based on multilayer circuit manufacturing comprises a machining table and a five-axis motion system arranged on the machining table, wherein an adsorption device corresponding to the five-axis motion system is arranged on the machining table, a micropore printing needle head is arranged on the five-axis motion system, and a visual observation and alignment system, a multilayer circuit vertical interconnection mechanism, a height measurement and automatic following system and a slit coating mechanism corresponding to the micropore printing needle head are arranged on the five-axis motion system; a fluid control system is arranged in the five-axis motion system and is communicated with the micropore printing needle head; one side of the adsorption device is provided with a cleaning and preprinting mechanism corresponding to the micropore printing needle head, and one side of the adsorption device is also provided with a parallel adjusting mechanism corresponding to the slit coating mechanism; the fluid control system is internally provided with a voltage stabilizer communicated with the feeding bin of the micropore printing needle head, and the height measurement and automatic following system comprises a laser sensor and a matched sensor controller.
As a preferable scheme of the present invention, the five-axis motion system includes a three-axis driving base, a first lifting driving mechanism, and a second lifting driving mechanism, the three-axis driving base is disposed on the processing table, and the first lifting driving mechanism and the second lifting driving mechanism are disposed above the three-axis driving base in an overhead manner.
As a preferable aspect of the present invention, the micro-hole printing needle is disposed on the first elevation driving mechanism, the slit coating mechanism is disposed on the second elevation driving mechanism, the adsorption device is mounted on the three-axis driving base, and the grating rulers are disposed on the three-axis driving base, the first elevation driving mechanism, and the second elevation driving mechanism.
In a preferred embodiment of the present invention, the processing table is provided with a curing device which is provided in an overhead manner, and the curing device is located on a moving path of the three-axis driving base.
As a preferred aspect of the present invention, the visual observation and alignment system includes an inclined lens barrel and a vertical lens barrel, the inclined lens barrel is sleeved outside the fluid control system, the inclined lens barrel is disposed toward the micro-hole printing needle, the vertical lens barrel is disposed on one side of the micro-hole printing needle, and the vertical lens barrel is disposed toward the adsorption device.
As a preferable aspect of the present invention, the tilt lens barrel is provided with a manual adjustment unit for adjusting a position of the tilt lens barrel, the manual adjustment unit is a three-axis adjustment sliding table movable along XYZ axes, and a Z-axis adjustment sliding table for adjusting a position of the vertical lens barrel is disposed in the vertical lens barrel.
In a preferred embodiment of the present invention, a suction cup is disposed on a surface of the suction device, and the suction cup has a micro-hole or a V-shaped groove formed therein.
In a preferred embodiment of the present invention, the vertical interconnection mechanism of the multilayer circuit is a laser puncher or a mechanical puncher or a needle-pricking device.
As a preferable scheme of the invention, the cleaning and preprinting mechanism is provided with a calibration area, a preprinting area, a cleaning area and a waste collecting area which are positioned on the same straight line and are sequentially arranged, and an angular position adjusting mechanism and a lifting adjusting mechanism are arranged below the cleaning and preprinting mechanism.
As a preferable scheme of the invention, the slit coating mechanism comprises a slit scraper and an adjusting mechanism which are connected, the adjusting mechanism is connected to the second lifting driving mechanism, the parallel adjusting mechanism comprises an angle adjusting mechanism and a lifting adjusting mechanism, and a contact sensor corresponding to the slit scraper is arranged at the top of the angle adjusting mechanism
Compared with the prior art, the invention has the beneficial effects that:
1. a precise electronic circuit is prepared by utilizing an ultrahigh-precision five-axis motion system, combining a micropore printing spray head and a high-precision fluid control system, and a visual observation and alignment system is adopted to perform real-time observation and visual alignment on the printing process, so that the printing process is ensured to have better stability;
2. the adsorption device can adsorb and flatten the printing carrier plate, realize the high-efficiency forming of the medium layer by means of blade coating and slit coating, and realize the vertical interconnection among the multilayer circuits by means of laser assistance, mechanical assistance, direct forming of the upright column and the like, so that the circuit board is less interfered by the outside in the printing process, and the printing stability is ensured;
3. collect washing, mark and print in advance in the supplementary printing device of an organic whole, adopt infrared heating solidification equipment, carry out solidification treatment to the medium, print support plate surface altitude measurement and automatic following system's device, including sensor and sensor controller, be used for measuring the space coordinate of circuit board prints the coordinate system with the mapping, and the three structure realizes printing the high efficiency of multilayer circuit board in integral type structure, prevents repeated clamping for whole has better printing precision.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the connections of the various systems;
FIG. 3 is a schematic diagram of a five-axis motion system;
FIG. 4 is a schematic diagram of the connection of a fluid control system to a micro-well printing needle;
FIG. 5 is a schematic diagram of a visual inspection and alignment system;
fig. 6 is a schematic structural view of a vertical lens barrel;
FIG. 7 is a schematic view of the structure of the adsorption apparatus;
FIG. 8 is a schematic view of the cleaning and preprinting mechanism;
FIG. 9 is a schematic structural view of a slit coating mechanism;
FIG. 10 is a schematic structural view of a curing apparatus;
FIG. 11 is a schematic structural diagram of a multi-layer wire vertical interconnect mechanism;
FIG. 12 is a schematic diagram of the structure of the height measuring and automatic following system;
FIG. 13 is a schematic view of the structure of the parallelism adjusting mechanism;
reference numerals: a five-axis motion system 1, a three-axis driving base 1-1, a first lifting driving mechanism 1-2, a second lifting driving mechanism 1-3, a visual observation and alignment system 2, an inclined lens cone 2-1, a vertical lens cone 2-2, a three-axis adjusting sliding table 2-3, a Z-axis adjusting sliding table 2-4, an adsorption device 3, a cleaning and preprinting mechanism 4, a calibration area 4-1, a preprinting area 4-2, a cleaning area 4-3, a waste collecting area 4-4, a coating mechanism 5, a slit scraper 5-1, an adjusting mechanism 5-2, a curing device 6, a line vertical interconnection mechanism 7, a height measurement and automatic following system 8, a parallel adjusting mechanism 9, an angular position adjusting mechanism 9-1, a lifting adjusting mechanism 9-2 and a contact sensor 9-3, a micropore printing needle 10, a fluid control system 11 and a processing station 12.
Detailed Description
The following describes embodiments of the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1-13, a high-precision machining device based on multilayer circuit manufacturing includes a machining table 12 and a five-axis motion system 1 disposed on the machining table 12, wherein the machining table 12 is provided with an adsorption device 3 corresponding to the five-axis motion system 1, the five-axis motion system 1 is provided with a micropore printing needle 10, and the five-axis motion system 1 is provided with a visual observation and alignment system 2 corresponding to the micropore printing needle 10, a multilayer circuit vertical interconnection mechanism 7, a height measurement and automatic following system 8 and a slit coating mechanism 5; a fluid control system 11 is arranged in the five-axis motion system 1, and the fluid control system 11 is communicated with the micropore printing needle head 10; a cleaning and preprinting mechanism 4 corresponding to the micropore printing needle head 10 is arranged on one side of the adsorption device 3, and a parallel adjusting mechanism 9 corresponding to the slit coating mechanism 5 is also arranged on one side of the adsorption device 3; a voltage stabilizer communicated with a feeding bin of the micropore printing needle head 10 is arranged in the fluid control system 11, and the height measurement and automatic following system 8 comprises a laser sensor and a matched sensor controller.
The height measuring and automatic following system 8 adopts a laser sensor and a matched sensor controller, is connected with a computer and is used for measuring the space coordinate of the circuit board and the forming thickness of the multilayer medium.
The micropore printing needle head 10 can be a corresponding glass needle, a ceramic needle, a steel needle and other types of needles, the range of the outer diameter of the configurable needle is wide, the micropore printing needle head is arranged according to actual needs, and the fluid control system 11 is used for providing preset air pressure for the micropore printing needle head 10 under the action of the pressure stabilizer to control the output of printing materials.
The stabiliser can be for the atmospheric pressure generator and the pressure detector that are connected, and pressure detector sets up in the feeding storehouse of micropore printing syringe needle 10, and atmospheric pressure generator is used for supplying the pressure to the feeding storehouse of micropore printing syringe needle 10, and pressure detector is used for guaranteeing that the atmospheric pressure in the feeding storehouse of micropore printing syringe needle 10 is stable, is convenient for adjust atmospheric pressure generator in real time.
The five-axis motion system 1 comprises a three-axis driving base 1-1, a first lifting driving mechanism 1-2 and a second lifting driving mechanism 1-3, wherein the three-axis driving base 1-1 is arranged on a processing table 12, and the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 are arranged above the three-axis driving base 1-1 in an overhead manner.
The three-axis driving base 1-1 comprises an X-axis moving assembly arranged on a processing table 12, a Y-axis moving assembly is arranged on the X-axis moving assembly, the Y-axis moving assembly and the X-axis moving assembly are arranged perpendicularly, the Y-axis moving assembly and the X-axis moving assembly are both of a motor and a lead screw structure, a lead screw sliding block structure is formed by combination to drive a circuit board to move on an X axis and a Y axis, a Z-axis moving assembly is arranged on the Y-axis moving assembly and located below the circuit board, the Z-axis moving assembly can also be of a lead screw sliding block structure, and the circuit board is lifted under the action of the motor, so that the three-axis driving base 1-1 for the circuit board is formed under the action of the X-axis moving assembly, the Y-axis moving assembly and the Z-axis moving assembly.
The processing table 12 is provided with a portal frame, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 are arranged on the portal frame 12, and the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 only perform lifting movement on the portal frame, namely, the micropore printing needle head 10 only performs lifting movement under the action of the first lifting driving mechanism 1-2, so that the micropore printing needle head 10 is ensured to have better stability in the moving process and the printing process.
The workpiece moves in XYZ axes under the action of the three-axis driving base 1-1, the size of the whole three-axis driving base 1-1 is large, printing of the micropore printing needle head 10 is achieved through movement of the three-axis driving base 1-1 in the printing process, and the height of the micropore printing needle head 10 does not need to be adjusted in the same layer of the circuit printing process, so that the micropore printing needle head 10 is always in a relatively static state in the printing process, discharging of the micropore printing needle head 10 is stable, and the requirement of precise printing is met.
The three-axis driving base 1-1 is an X-direction motor screw rod structure at the bottom and a Y-direction motor screw rod structure arranged on the X-direction motor screw rod structure, a Z-direction motor screw rod structure is arranged on the Y-direction motor screw rod structure, the adsorption device 3 is arranged on the Z-direction motor screw rod structure, the position of the adsorption device 3 is adjusted under the combined action of the three parts, and the circuit board is arranged on the adsorption device 3 to realize the adjustment of the adsorption device 3.
The processing table 12 is provided with a support, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 are arranged on the corresponding support, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 are of motor screw rod structures, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3 are vertically arranged, and the three-axis driving base 1-1 is located in the moving range of the three-axis driving base 1-1.
Under the combined action of the three-axis driving base 1-1, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3, the five-axis motion system 1 is realized.
The micropore printing needle head 10 is arranged on the first lifting driving mechanism 1-2, the slit coating mechanism 5 is arranged on the second lifting driving mechanism 1-3, the adsorption device 3 is arranged on the three-axis driving base 1-1, and grating rulers are arranged on the three-axis driving base 1-1, the first lifting driving mechanism 1-2 and the second lifting driving mechanism 1-3.
The grating ruler is a high-resolution grating ruler, the grating ruler is connected with a computer and used for controlling movement of a printing sample and printing receiving distance, the Y-axis moving assembly and the X-axis moving assembly respectively drive the circuit board to move horizontally and in numerical directions to generate a printing path, the Z-axis moving assembly controls the circuit board to move up and down and is used for compensating vertical direction deviation of the circuit board, the first lifting driving mechanism 1-2 controls the micro-pore printing needle head 10 to move up and down and is used for controlling printing line width and thickness, and the second lifting driving mechanism 1-3 controls the slit coating mechanism 5 to move up and down and is used for forming single-layer or multi-layer circuit media.
The processing table 12 is provided with a curing device 6 arranged in an overhead manner, and the curing device 6 is positioned on the moving path of the three-axis driving base 1-1.
After a sample is coated with a medium layer in a scraping mode, the curing device 6 is moved through the five-axis motion system 1, the curing device 6 is provided with a corresponding heating light source, the heating light source is triggered to start, the medium is heated, the heating light source can set time and energy according to the type of materials, after heating is finished, the circuit board leaves the heating light source, the light source is turned off instantly, and finally a stable insulating medium layer with specific electric performance is formed.
The visual observation and alignment system 2 comprises an inclined lens cone 2-1 and a vertical lens cone 2-2, the inclined lens cone 2-1 is sleeved outside the fluid control system 11, the inclined lens cone 2-1 is arranged towards the micropore printing needle head 10, the vertical lens cone 2-2 is arranged at one side of the micropore printing needle head 10, and the vertical lens cone 2-2 is arranged towards the adsorption device 3.
The adjusting lens cone of the inclined lens cone 2-1 is aligned with the center of a printing part, the micropore printing needle head 10 is subjected to microscopic amplification and is connected with a high-pixel camera and connected into a system for observing the printing effect and state in time in the printing process, the inclined lens cone 2-1 is inclined to facilitate direct observation of an operator, a certain gap exists between the top of the inclined lens cone 2-1 and the five-axis motion system 1 due to the inclined lens cone 2-1, and when the operator observes the micropore printing needle head 10 through the inclined lens cone 2-1, a certain distance exists between the operator and the micropore printing needle head 10 to prevent the operator from colliding with the five-axis motion system 1 and ensure that the five-axis motion system 1 has better stability in the printing process.
The inclined lens cone 2-1 is provided with a manual adjusting component for adjusting the position of the inclined lens cone 2-1, the manual adjusting component is a three-axis adjusting sliding table 2-3 which can move along XYZ axes, and a Z-axis adjusting sliding table 2-4 for adjusting the position of the vertical lens cone 2-2 is arranged in the vertical lens cone 2-2.
The three-axis adjusting sliding table 2-3 can adjust the position of the adjusting lens barrel of the inclined lens barrel 2-1 in real time, so that the adjusting lens barrel of the inclined lens barrel 2-1 can be better aligned to the center of a printing part at different positions, the vertical lens barrel 2-2 is provided with the Z-axis adjusting sliding table 2-4, the focal length of the lens barrel is changed by adjusting the Z axis, and the vertical lens barrel is also connected with a high-pixel camera, is connected into a system and is used for sample mark point identification.
The inclined lens barrel 2-1 and the vertical lens barrel 2-2 are provided with certain fixing clamps in the using process and are fixed in the five-axis motion system 1, the universal range of the clamps is wide, the clamps can be adapted to various lens barrels, the inclined lens barrel 2-1 and the micropore printing needle head 10 can move synchronously under the action of fixed furniture, and the micropore printing needle head 10 is ensured to have better stability.
3 surface configurations of adsorption equipment have the sucking disc, is formed with micropore or V type groove on the sucking disc, and the sample is placed on the sucking disc, through the vacuum adsorption principle, guarantees that the circuit board is fixed firm and the machined surface adsorbs smoothly, and the sucking disc can dispose ceramic sucking disc, aluminium system sucking disc, marble sucking disc etc. and the sucking disc structure has micropore, V type groove etc. and the sucking disc also can carry out the subregion and adsorb, the multiple size's of adaptation sample.
The multilayer circuit vertical interconnection mechanism 7 is a laser puncher, a mechanical puncher or a needle pricking device, the device is provided with structures such as laser punching, mechanical punching and needle pricking, a dielectric layer above the upright column is damaged to form a hole, then the printing head is used for filling the hole, the upright column is led out to the upper surface of the dielectric layer to be interconnected with other layers of circuits, and finally the conduction of the multilayer circuit is formed.
The cleaning and preprinting mechanism 4 is provided with a calibration area 4-1, a preprinting area 4-2, a cleaning area 4-3 and a waste collecting area 4-4 which are positioned on the same straight line and are sequentially arranged, and an angle position adjusting mechanism and a lifting adjusting mechanism are arranged below the cleaning and preprinting mechanism 4.
The cleaning area 4-3 can be filled with alcohol or acetic acid or ethyl ester liquid for cleaning after printing for a period of time, or the printing part is soaked when the printing is stopped, so that the solidification of the needle part material is prevented, and meanwhile, the waste collecting area 4-4 is arranged, so that the pollution of the waste to equipment in the printing process is avoided. The calibration area 4-1 is used for calibration of the print head start position. And a sample plate with a smaller size is placed in the preprinting area 4-2 and is used for printing before printing a sample, and judging the printing characteristics and effects. Cleaning fluid, demarcation and the preprinting sample all conveniently dismantle and change, and be equipped with angular position adjustment mechanism and lift adjustment mechanism, guarantee to install the back and beat printer head perpendicularly, applicable multiple thickness preprinting product.
The lifting adjusting mechanism is a Z-axis horizontal lifting displacement sliding table with a crossed guide rail, adopts high-strength aluminum alloy, is subjected to sand blasting black anodic oxidation, is assembled with a high-precision crossed roller guide rail, is suitable for light and heavy loads and frequent adjustment, is a linear moving platform with excellent performance, can adopt an OMO-VM series cylindrical V-shaped adjusting frame with 2 M6x0.25 fine-tooth promoters, can realize precise adjustment of +/-3 degrees, and is provided with a flexible locking mechanism for providing long-term reliability.
The slit coating mechanism 5 comprises a slit scraper 5-1 and an adjusting mechanism 5-2 which are connected, the adjusting mechanism 5-2 is connected to a second lifting driving mechanism 1-3, the parallel adjusting mechanism 9 comprises an angle adjusting mechanism 9-1 and a lifting adjusting mechanism 9-2, and the top of the angle adjusting mechanism 9-1 is provided with a contact sensor 9-3 corresponding to the slit scraper 5-1.
The adjusting mechanism 5-2 is also provided with a feeding device, the feeding device is connected with the second lifting driving mechanism 1-3, and the feeding device can adjust parameters and control the weight and speed of feeding; the slit scraper 5-1 can change the width of blade coating by changing the length of a slit sealing ring of the scraper, and meanwhile, the scraper is provided with an adjusting mechanism 5-2, wherein the adjusting mechanism 5-2 comprises a rotating mechanism and a matched precise differential head, so that the slit scraper is parallel to a sample, and the uniformity of the thickness of a medium is ensured.
The lifting adjusting mechanism 9-2 is a Z-axis horizontal lifting displacement sliding table with a crossed guide rail, high-strength aluminum alloy is adopted, black anode oxidation is carried out through sand blasting, then a high-precision crossed roller guide rail is assembled, the lifting adjusting mechanism is suitable for light and heavy loads and is a direct-acting platform with excellent performance, the angular position adjusting mechanism 9-1 can adopt an OMO-VM series cylindrical V-shaped adjusting frame and is provided with 2 M6x0.25 fine tooth promoters, the precise adjustment of +/-3 degrees can be realized, and the fine tooth promoters are designed with flexible locking mechanisms to provide long-term reliability.
The machine platform is provided with a contact sensor 9-3, 4 points of the contact sensor 9-3 are tested through a height measuring sensor, and the 4 points are consistent in value through adjusting a contact angle adjusting mechanism 9-1, so that the contact sensor 9-3 is parallel to the height measuring sensor; then scanning the sample surface, and recording the numerical value and calculating the angle; and moving the slit scraper 5-1, enabling two ends of the scraper to be respectively contacted with the contact sensors 9-3, recording numerical values in the same way, and adjusting an angle adjusting mechanism of the scraper to ensure that the angle deviation of two ends of the slit scraper 5-1 is consistent with the deviation of the circuit board so as to judge that the slit scraper 5-1 is parallel to the sample.
In the actual use process, the scheme is to ensure that the circuit board has better precision in the printing process, the micropore printing needle head 10 is ensured to only move up and down under the action of the first lifting driving mechanism 1-2, the position of the micropore printing needle head 10 is locked after the micropore printing needle head is moved to a certain height, a workpiece is moved through the three-axis driving base 1-1, the three-axis driving base 1-1 is supported on the processing table 12, the interference of the three-axis driving base 1-1 in the moving process is reduced, the interference of external force on the micropore printing needle head 10 arranged in an overhead mode after being locked is small, the size of the whole overhead printing device is small, and the overhead printing device is convenient to lock and has better stability.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention; thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Although the reference numerals in the figures are used more here: a five-axis motion system 1, a three-axis driving base 1-1, a first lifting driving mechanism 1-2, a second lifting driving mechanism 1-3, a visual observation and alignment system 2, an inclined lens cone 2-1, a vertical lens cone 2-2, a three-axis adjusting sliding table 2-3, a Z-axis adjusting sliding table 2-4, an adsorption device 3, a cleaning and preprinting mechanism 4, a calibration area 4-1, a preprinting area 4-2, a cleaning area 4-3, a waste collecting area 4-4, a coating mechanism 5, a slit scraper 5-1, an adjusting mechanism 5-2, a curing device 6, a line vertical interconnection mechanism 7, a height measurement and automatic following system 8, a parallel adjusting mechanism 9, an angular position adjusting mechanism 9-1, a lifting adjusting mechanism 9-2 and a contact sensor 9-3, micro-porous printing tip 10, fluid control system 11, processing station 12, etc., but does not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

Claims (8)

1. A high-precision machining device based on multilayer circuit manufacturing comprises a machining table (12) and a five-axis motion system (1) arranged on the machining table (12), wherein an adsorption device (3) corresponding to the five-axis motion system (1) is arranged on the machining table (12), and the high-precision machining device is characterized in that a micropore printing needle head (10) is arranged on the five-axis motion system (1), and a visual observation and alignment system (2) corresponding to the micropore printing needle head (10), a multilayer circuit vertical interconnection mechanism (7), a height measurement and automatic following system (8) and a slit coating mechanism (5) are arranged on the five-axis motion system (1); a fluid control system (11) is arranged in the five-axis motion system (1), and the fluid control system (11) is communicated with the micropore printing needle head (10); a cleaning and preprinting mechanism (4) corresponding to the micropore printing needle head (10) is arranged on one side of the adsorption device (3), and a parallel adjusting mechanism (9) corresponding to the slit coating mechanism (5) is also arranged on one side of the adsorption device (3); a pressure stabilizer communicated with a feeding bin of the micropore printing needle head (10) is arranged in the fluid control system (11), and the height measurement and automatic following system (8) comprises a laser sensor and a matched sensor controller; the five-axis motion system (1) comprises a three-axis driving base (1-1), a first lifting driving mechanism (1-2) and a second lifting driving mechanism (1-3), the three-axis driving base (1-1) is arranged on a processing table (12), the first lifting driving mechanism (1-2) and the second lifting driving mechanism (1-3) are arranged above the three-axis driving base (1-1) in an overhead mode, a micropore printing needle head (10) is arranged on the first lifting driving mechanism (1-2), and a slit coating mechanism (5) is arranged on the second lifting driving mechanism (1-3); the adsorption device (3) is arranged on the three-axis driving base (1-1); the slit coating mechanism (5) comprises a slit scraper (5-1) and an adjusting mechanism (5-2) which are connected, the adjusting mechanism (5-2) is connected to the second lifting driving mechanism (1-3), the parallel adjusting mechanism (9) comprises an angle adjusting mechanism (9-1) and a lifting adjusting mechanism (9-2), and the top of the angle adjusting mechanism (9-1) is provided with a contact sensor (9-3) corresponding to the slit scraper (5-1).
2. The high-precision machining device based on multilayer circuit manufacturing according to claim 1 is characterized in that the micropore printing needle head (10) is arranged on the first lifting driving mechanism (1-2), the slit coating mechanism (5) is arranged on the second lifting driving mechanism (1-3), the adsorption device (3) is arranged on the three-axis driving base (1-1), and grating rulers are arranged on the three-axis driving base (1-1), the first lifting driving mechanism (1-2) and the second lifting driving mechanism (1-3).
3. The high-precision processing device based on multilayer circuit manufacturing according to claim 1, characterized in that the processing table (12) is provided with an overhead curing device (6), and the curing device (6) is located on the moving path of the three-axis driving base (1-1).
4. The high-precision machining device manufactured based on the multilayer circuit is characterized in that the visual observation and alignment system (2) comprises an inclined lens barrel (2-1) and a vertical lens barrel (2-2), the inclined lens barrel (2-1) is sleeved outside the fluid control system (11), the inclined lens barrel (2-1) is arranged towards the micropore printing needle head (10), the vertical lens barrel (2-2) is arranged on one side of the micropore printing needle head (10), and the vertical lens barrel (2-2) is arranged towards the adsorption device (3).
5. The high-precision machining device based on the multilayer circuit manufacturing of claim 4 is characterized in that the inclined drawtube (2-1) is provided with a manual adjusting component for adjusting the position of the inclined drawtube (2-1), the manual adjusting component is a three-axis adjusting sliding table (2-3) capable of moving along XYZ axes, and a Z-axis adjusting sliding table (2-4) for adjusting the position of the vertical drawtube (2-2) is arranged in the vertical drawtube (2-2).
6. The high-precision processing device based on multilayer circuit manufacturing according to claim 1, characterized in that the surface of the adsorption device (3) is provided with a suction cup, and the suction cup is provided with a micropore or a V-shaped groove.
7. The high-precision processing device based on multilayer circuit manufacturing according to claim 1, characterized in that the multilayer circuit vertical interconnection mechanism (7) is a laser puncher or a mechanical puncher or a needle pricker.
8. The high-precision machining device based on multilayer circuit manufacturing according to claim 1, characterized in that the cleaning and preprinting mechanism (4) is provided with a calibration area (4-1), a preprinting area (4-2), a cleaning area (4-3) and a waste collecting area (4-4) which are located on the same straight line and are sequentially arranged, and an angular position adjusting mechanism and a lifting adjusting mechanism are arranged below the cleaning and preprinting mechanism (4).
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