CN114267215A - Semiconductor packaging technology education training and assessment method based on virtual reality - Google Patents
Semiconductor packaging technology education training and assessment method based on virtual reality Download PDFInfo
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Abstract
A semiconductor packaging technology education training and assessment method based on virtual reality selects different education modes according to different packaging processes, integrates education and assessment, not only displays the packaging preparation process to students completely, but also enables the students to master the semiconductor micro-nano processing process in a short time through an immersion type experience mode, breaks through the limits of time space and actual conditions, meanwhile, the cost is saved, unnecessary troubles and dangers are avoided, the teaching tool can be close to reality to the maximum extent, the defects of practical teaching conditions are overcome, can carry out practice teaching with complex operation, high cost or long period, breaks through space-time limitation, can realize anti-repeated barrier-free situational practice teaching, the practice teaching condition can be conveniently updated and upgraded, a novel teaching training project is easy to set, and education resource sharing is realized.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing education, and particularly relates to a semiconductor packaging technology education training and assessment method based on virtual reality.
Background
The complete preparation process of the semiconductor device is a complex systematic engineering chip with huge and complex production equipment, strict requirements on process environment and extremely high standards for the supply of production raw materials, reagents and high-purity special gases. At present, China seriously depends on chips imported from abroad, and although the domestic semiconductor industry is gradually breaking the foreign technology blockade, the international advanced level still has a small gap.
Chip packaging refers to the process of wire bonding circuit pins on a silicon die to external terminals for connection to other devices. The IC chip is packaged with three steps of scribing, bonding and detecting, and the complete process comprises the following steps: the method comprises a series of process operations of wafer cutting, chip sorting, chip mounting, curing, lead bonding, crystal grain sealing, baking after sealing, glue removing, tin-lead electroplating, front side code printing, frame removing, LS detection and packaging, plays roles in mounting, fixing, sealing, chip protection, electric heating performance enhancement and the like, and influences the performance of the chip and the design and manufacture of a PCB connected with the chip.
At present, in a packaging training, teaching contents such as basic principles and equipment information related to photoetching, basic flows and operation steps of a packaging process, corresponding cautions and the like are generally learned through characters, animation or videos in a classroom, then the whole-flow operation of an operator is observed in an actual ultra-clean room, the detailed explanation of a teacher is heard, and finally the operator participates in actual operation step by step.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems and the defects in the prior art, the invention aims to provide a semiconductor packaging technology education training and assessment method based on virtual reality, different education modes are selected according to different packaging processes, education and assessment are integrated, the cost is saved, unnecessary troubles and dangers are avoided, the method can be close to reality to the maximum extent, the defects of practical teaching conditions are overcome, a novel teaching training project is easy to set, and education resource sharing is realized.
The technical scheme is as follows: the invention provides a semiconductor packaging technology education training and assessment method based on virtual reality, which comprises the following steps:
step 1: the method comprises the steps that a host system is operated, a server side of the host system is connected with a client side, the client side is responsible for drawing and displaying a three-dimensional scene, interactive data generated by trainees are read, and the trainees log in the host system according to own accounts and passwords;
step 2: displaying a packaging operation skill training project on a main interface of the client, selecting a project to be operated by a trainee according to the requirement of the trainee, and entering a step 3 if scribing training is selected; selecting bonding training 6 and entering the step; otherwise, entering a step 8;
and step 3: the system interface displays a scribing specific operation skill list, trainees select specific projects according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all scribing projects are finished, the step 2 is returned;
and 4, step 4: the client generates a demonstration animation of each operation in a virtual scene, guides the trainee to finish each step of operation, and before formally starting the operation, virtual teaching aids simply introduce the current scribing process principle by combining characters, animations or models and explain some key and dangerous operations in detail; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 3;
and 5: the system prompts an operation error, simulates and demonstrates correct virtual actions corresponding to the non-standard behaviors to the trainee again, guides the trainee to finish the operation correctly, and enters the learning of the next operation;
step 6: displaying a specific operation skill list of bonding on a system interface, selecting a specific project by a trainee according to the requirement of the trainee, informing the host system that the preparation work is finished, finishing the initialization of the client by the host system, and returning to the step 2 if all the bonding projects are learned;
and 7: the client guides the trainees to finish each step of operation in a virtual scene, and generates demonstration animations to show actions on a chip under a microscope after corresponding operations are finished, and meanwhile, in some important operations, the animations can be operated for detailed description while demonstrating; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 6;
and 8: the system interface displays a detection specific operation skill list, trainees select specific items according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all detection items are learned, the step 2 is returned;
and step 9: in a virtual scene, a client firstly explains the detection standard, the detection principle and possible problems of a chip in detail by combining with animation and a real object photo, and if a user finishes the part of learning, the step 10 is carried out, otherwise, the step 8 is carried out;
step 10: the client guides the trained personnel to complete each step of operation in a virtual scene, interactive action data generated by a user is transmitted to the server, whether the trained personnel takes correct operation or not is judged, if so, the next step is carried out, and if not, the step 5 is carried out; if the user finishes all the operations, entering step 11;
step 11: the client randomly extracts a plurality of detection results obtained by actual cases from a database of the server, so that a user can judge whether the detection results have problems and indicate the existing problems, and after the user finishes answering, the step 12 is carried out;
step 12: the system compares the answer of the user with the built-in standard answer to judge the mastery degree of the user on the knowledge in the detection aspect, and feeds back the result to the user and returns to the step 8.
Further, in the above teaching training and assessment method based on virtual reality for semiconductor packaging technology, the training items of packaging operation skills in step 3 include scribing skill operation, bonding skill operation and detection skill operation.
Further, in the semiconductor packaging technology education training and assessment method based on virtual reality, the scribing skill operation comprises grinding wheel cutting, laser surface cutting and laser invisible cutting.
Further, according to the teaching training and assessment method based on the virtual reality semiconductor packaging technology, the scribing skill operating equipment comprises a cleavage machine, a dicing saw and a stealth cutter.
Further, the training and assessment method for the virtual reality-based semiconductor packaging technology education comprises the steps of wire bonding, flip chip bonding, reflow bonding, wafer bonding, cutting and parallel sealing and welding.
Further, according to the teaching training and examination method for the virtual reality-based semiconductor packaging technology, the bonding skill operating equipment comprises a bonding machine, a flip-chip welding machine and a vacuum high-temperature co-welding machine.
Further, according to the semiconductor packaging technology education training and assessment method based on the virtual reality, the detection skill operation comprises SEM detection, XRD detection, ultrasonic detection and tensile and shear force detection.
Further, according to the semiconductor packaging technology education training and examination method based on the virtual reality, the detection skill operating equipment comprises an X-ray diffractometer, an SEM (scanning Electron microscope) and a tension-shear force tester.
Further, in the above method for education training and assessment of semiconductor packaging technology based on virtual reality, the judgment criteria of the operation in the step 10 are as follows:
(1): whether the trained personnel operate according to the operation flow which is already standardized in the whole flow or not;
(2): whether the relevant operation meets the correct operation method set by the system or not, and if not, corresponding serious results are caused.
The technical scheme shows that the invention has the following beneficial effects: the virtual reality-based semiconductor packaging technology education training and assessment method disclosed by the invention has the advantages that different education modes are selected according to different packaging processes, education and assessment are integrated, basic packaging equipment and process flows are known through an equipment process module, basic packaging operation skills are mastered through an operation skill training module, and finally system scoring, archiving and related operation error points are given through the assessment module; make up the not enough of practice teaching condition, can operate the practice teaching of complicacy, expense height or cycle length, broken through the space-time restriction, can realize anti-relapseing accessible sight formula practice teaching, can be convenient carry out the renewal and the upgrading of practice teaching condition, easily set up novel teaching training project, realize education resource sharing, have very high spreading value.
Drawings
Fig. 1 is a frame diagram of the semiconductor packaging technology education training and assessment method based on virtual reality.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
Examples
The virtual reality-based semiconductor packaging technology education training and assessment method as shown in figure 1 comprises the following steps:
step 1: the method comprises the steps that a host system is operated, a server side of the host system is connected with a client side, the client side is responsible for drawing and displaying a three-dimensional scene, interactive data generated by trainees are read, and the trainees log in the host system according to own accounts and passwords;
step 2: displaying a packaging operation skill training project on a main interface of the client, selecting a project to be operated by a trainee according to the requirement of the trainee, and entering a step 3 if scribing training is selected; selecting bonding training 6 and entering the step; otherwise, entering a step 8;
and step 3: the system interface displays a scribing specific operation skill list, trainees select specific projects according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all scribing projects are finished, the step 2 is returned;
and 4, step 4: the client generates a demonstration animation of each operation in a virtual scene, guides the trainee to finish each step of operation, and before formally starting the operation, virtual teaching aids simply introduce the current scribing process principle by combining characters, animations or models and explain some key and dangerous operations in detail; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 3;
and 5: the system prompts an operation error, simulates and demonstrates correct virtual actions corresponding to the non-standard behaviors to the trainee again, guides the trainee to finish the operation correctly, and enters the learning of the next operation;
step 6: displaying a specific operation skill list of bonding on a system interface, selecting a specific project by a trainee according to the requirement of the trainee, informing the host system that the preparation work is finished, finishing the initialization of the client by the host system, and returning to the step 2 if all the bonding projects are learned;
and 7: the client guides the trainees to finish each step of operation in a virtual scene, and generates demonstration animations to show actions on a chip under a microscope after corresponding operations are finished, and meanwhile, in some important operations, the animations can be operated for detailed description while demonstrating; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 6;
and 8: the system interface displays a detection specific operation skill list, trainees select specific items according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all detection items are learned, the step 2 is returned;
and step 9: in a virtual scene, a client firstly explains the detection standard, the detection principle and possible problems of a chip in detail by combining with animation and a real object photo, and if a user finishes the part of learning, the step 10 is carried out, otherwise, the step 8 is carried out;
step 10: the client guides the trained personnel to complete each step of operation in a virtual scene, interactive action data generated by a user is transmitted to the server, whether the trained personnel takes correct operation or not is judged, if so, the next step is carried out, and if not, the step 5 is carried out; if the user finishes all the operations, entering step 11;
step 11: the client randomly extracts a plurality of detection results obtained by actual cases from a database of the server, so that a user can judge whether the detection results have problems and indicate the existing problems, and after the user finishes answering, the step 12 is carried out;
step 12: the system compares the answer of the user with the built-in standard answer to judge the mastery degree of the user on the knowledge in the detection aspect, and feeds back the result to the user and returns to the step 8.
The packaging operation skill training items in the step 3 comprise scribing skill operation, bonding skill operation and detection skill operation.
The scribing skill operation comprises grinding wheel cutting, laser surface cutting and laser invisible cutting. The scribing skill operating equipment comprises a cleavage machine, a scribing machine and a stealth cutter.
The connected tube cores are divided by adopting the modes of grinding wheel cutting, laser surface cutting, laser invisible cutting and the like. Film sticking, cutting, mold expanding and sampling. And (3) cutting by using a grinding wheel, namely cutting materials such as Si, glass, ceramics, Ge, lithium niobate and the like into chips with a certain size by using the high-speed rotation of the grinding wheel, so as to realize the purpose of chip cutting. Laser surface cutting is to concentrate laser energy in a tiny area within a very short time to sublimate and evaporate a solid to finish cutting, and different laser wavelengths are suitable for different materials, namely, only the materials absorb light with the wavelength, the cutting can be finished. Laser invisible cutting, which utilizes the optical damage phenomenon of multiphoton absorption to change the material from the whole which is compact in structure, tight in combination and not easy to be broken into the fragile whole which is loose in combination and easy to be broken, and then the chip is separated by expanding the film and utilizing the tension when the film is expanded.
The bonding skill operations include wire bonding, flip chip bonding, reflow bonding, wafer bonding, dicing, and parallel seal bonding. The bonding skill operating equipment comprises a bonding machine, a flip chip welding machine and a vacuum high-temperature co-welding machine.
Wire bonding, also known as wire bonding, is the joining of bare chip electrode pads to I/O leads of an electronic package or metal wiring pads on a substrate with a thin metal wire. The joining process is typically accomplished by heat, pressure, ultrasonic, etc. energy with a bond tool cleaver. Flip-chip bonding, in which a bump for connection is formed on a die electrode, and the bump and a package substrate are interconnected by soldering, hot-pressing, or the like, with the chip electrode facing downward. And reflow bonding, wherein the soldering paste is heated and melted by heating, so that the surface mount component and the PCB bonding pad are reliably combined together through the soldering paste alloy. Wafer bonding, bonding two or more layers of wafers together, either permanently or temporarily. The parallel seal welding belongs to resistance welding, when in seal welding, the electrodes rotate (through electrode wheels) while moving, and the electrodes are intermittently electrified under certain pressure, because contact resistance exists between the electrodes and the cover plate and between the cover plate and the welding frame, the welding current generates joule heat at the 2 contact resistance parts, so that the cover plate and the welding frame are locally molten, a welding point is formed after solidification, and the seal welding track looks like a seal, so the parallel seal welding is also called as 'seam welding'. Parallel sealing is one of the most common hermetic packaging methods.
The detection skill operation comprises SEM detection, XRD detection, ultrasonic detection and tensile and shearing force detection. The detection skill operating equipment comprises an X-ray diffractometer, an SEM (scanning Electron microscope) and a tension and shear force tester.
And (3) SEM detection, wherein high-energy electrons bombard the surface of the sample to excite various signals (such as secondary electrons, backscattered electrons, Auger electrons, characteristic X-rays and other signals) to obtain images and corresponding data through corresponding receivers, and the images and the corresponding data are used for observing the surface topography of the sample or configuring accessories for sample analysis. XRD detection is a nondestructive detection means for detecting defects by measuring the absorption of X-rays which are influenced by the existence of the defects in materials by utilizing the characteristic that the X-rays generate absorption and scattering when passing through an object. The ultrasonic detection is to detect the structure and defect of semiconductor and element and to qualitatively analyze the material by using different materials with different acoustic impedances and different absorption and reflection degrees of the sound wave. And detecting the tensile force and the shearing force, and performing reliability test on various packaging forms of the semiconductor.
The judgment criteria of the operation in the step 10 are as follows:
(1): whether the trained personnel operate according to the operation flow which is already standardized in the whole flow or not; (2): whether the relevant operation meets the correct operation method set by the system or not, and if not, corresponding serious results are caused. For example, for a sapphire substrate with a thickness of 80 microns, the optimal scribing conditions are a laser power of 0.44W and a speed of 24mm/s, but the laser power is adjusted within a certain range and cannot have a great influence on sapphire.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the present invention, and these modifications should also be construed as the protection scope of the present invention.
Claims (9)
1. A semiconductor packaging technology education training and assessment method based on virtual reality is characterized in that: the method comprises the following steps:
step 1: the method comprises the steps that a host system is operated, a server side of the host system is connected with a client side, the client side is responsible for drawing and displaying a three-dimensional scene, interactive data generated by trainees are read, and the trainees log in the host system according to own accounts and passwords;
step 2: displaying a packaging operation skill training project on a main interface of the client, selecting a project to be operated by a trainee according to the requirement of the trainee, and entering a step 3 if scribing training is selected; selecting bonding training 6 and entering the step; otherwise, entering a step 8;
and step 3: the system interface displays a scribing specific operation skill list, trainees select specific projects according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all scribing projects are finished, the step 2 is returned;
and 4, step 4: the client generates a demonstration animation of each operation in a virtual scene, guides the trainee to finish each step of operation, and before formally starting the operation, virtual teaching aids simply introduce the current scribing process principle by combining characters, animations or models and explain some key and dangerous operations in detail; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 3;
and 5: the system prompts an operation error, simulates and demonstrates correct virtual actions corresponding to the non-standard behaviors to the trainee again, guides the trainee to finish the operation correctly, and enters the learning of the next operation;
step 6: displaying a specific operation skill list of bonding on a system interface, selecting a specific project by a trainee according to the requirement of the trainee, informing the host system that the preparation work is finished, finishing the initialization of the client by the host system, and returning to the step 2 if all the bonding projects are learned;
and 7: the client guides the trainees to finish each step of operation in a virtual scene, and generates demonstration animations to show actions on a chip under a microscope after corresponding operations are finished, and meanwhile, in some important operations, the animations can be operated for detailed description while demonstrating; transmitting interactive action data generated by a user to a server, judging whether the trained personnel adopts a correct behavior mode, if so, entering the next step, otherwise, entering the step 5; if all the steps of the current scribing operation training project are finished, returning to the step 6;
and 8: the system interface displays a detection specific operation skill list, trainees select specific items according to own requirements to inform a host system that preparation work is finished, the host system finishes initialization on a client, and if all detection items are learned, the step 2 is returned;
and step 9: in a virtual scene, a client firstly explains the detection standard, the detection principle and possible problems of a chip in detail by combining with animation and a real object photo, and if a user finishes the part of learning, the step 10 is carried out, otherwise, the step 8 is carried out;
step 10: the client guides the trained personnel to complete each step of operation in a virtual scene, interactive action data generated by a user is transmitted to the server, whether the trained personnel takes correct operation or not is judged, if so, the next step is carried out, and if not, the step 5 is carried out; if the user finishes all the operations, entering step 11;
step 11: the client randomly extracts a plurality of detection results obtained by actual cases from a database of the server, so that a user can judge whether the detection results have problems and indicate the existing problems, and after the user finishes answering, the step 12 is carried out;
step 12: the system compares the answer of the user with the built-in standard answer to judge the mastery degree of the user on the knowledge in the detection aspect, and feeds back the result to the user and returns to the step 8.
2. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 1, wherein: the packaging operation skill training items in the step 3 comprise scribing skill operation, bonding skill operation and detection skill operation.
3. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 2, wherein: the scribing skill operation comprises grinding wheel cutting, laser surface cutting and laser invisible cutting.
4. The virtual reality based semiconductor packaging technology educational training and assessment method according to claim 3, wherein: the scribing skill operating equipment comprises a cleavage machine, a scribing machine and a stealth cutter.
5. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 2, wherein: the bonding skill operations include wire bonding, flip chip bonding, reflow bonding, wafer bonding, dicing, and parallel seal bonding.
6. The virtual reality based semiconductor packaging technology educational training and assessment method according to claim 5, wherein: the bonding skill operating equipment comprises a bonding machine, a flip chip welding machine and a vacuum high-temperature co-welding machine.
7. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 2, wherein: the detection skill operation comprises SEM detection, XRD detection, ultrasonic detection and tensile and shearing force detection.
8. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 7, wherein: the detection skill operating equipment comprises an X-ray diffractometer, an SEM (scanning Electron microscope) and a tension and shear force tester.
9. The virtual reality-based semiconductor packaging technology educational training and assessment method according to claim 1, wherein: the judgment criteria of the operation in the step 10 are as follows:
firstly, the method comprises the following steps: whether the trained personnel operate according to the operation flow which is already standardized in the whole flow or not;
secondly, the method comprises the following steps: whether the relevant operation meets the correct operation method set by the system or not, and if not, corresponding serious results are caused.
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| CN111899587A (en) * | 2020-08-11 | 2020-11-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Semiconductor micro-nano processing technology training system based on VR and AR and application thereof |
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