CN114262604A - 一种垂直导电胶、焊接方法及焊接结构 - Google Patents
一种垂直导电胶、焊接方法及焊接结构 Download PDFInfo
- Publication number
- CN114262604A CN114262604A CN202111550352.0A CN202111550352A CN114262604A CN 114262604 A CN114262604 A CN 114262604A CN 202111550352 A CN202111550352 A CN 202111550352A CN 114262604 A CN114262604 A CN 114262604A
- Authority
- CN
- China
- Prior art keywords
- vertical conductive
- conductive adhesive
- welding
- vertical
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 238000003466 welding Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000002923 metal particle Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 239000007790 solid phase Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111550352.0A CN114262604A (zh) | 2021-12-17 | 2021-12-17 | 一种垂直导电胶、焊接方法及焊接结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111550352.0A CN114262604A (zh) | 2021-12-17 | 2021-12-17 | 一种垂直导电胶、焊接方法及焊接结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114262604A true CN114262604A (zh) | 2022-04-01 |
Family
ID=80827713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111550352.0A Pending CN114262604A (zh) | 2021-12-17 | 2021-12-17 | 一种垂直导电胶、焊接方法及焊接结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114262604A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103380188A (zh) * | 2011-02-24 | 2013-10-30 | 迪睿合电子材料有限公司 | 导热性粘接剂 |
CN108251030A (zh) * | 2016-12-28 | 2018-07-06 | 株式会社田村制作所 | 各向异性导电糊及电子基板的制造方法 |
CN113512387A (zh) * | 2021-03-24 | 2021-10-19 | 深圳市百柔新材料技术有限公司 | 用于光伏叠瓦组件的导电胶及其应用 |
-
2021
- 2021-12-17 CN CN202111550352.0A patent/CN114262604A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103380188A (zh) * | 2011-02-24 | 2013-10-30 | 迪睿合电子材料有限公司 | 导热性粘接剂 |
CN108251030A (zh) * | 2016-12-28 | 2018-07-06 | 株式会社田村制作所 | 各向异性导电糊及电子基板的制造方法 |
CN113512387A (zh) * | 2021-03-24 | 2021-10-19 | 深圳市百柔新材料技术有限公司 | 用于光伏叠瓦组件的导电胶及其应用 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6646355B2 (en) | Structure comprising beam leads bonded with electrically conductive adhesive | |
JP4983913B2 (ja) | 異方性導電材料 | |
US6238599B1 (en) | High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications | |
US8188605B2 (en) | Components joining method and components joining structure | |
CN102482540B (zh) | 用于超声波粘合的各向异性导电粘合剂、和使用其的电子部件连接方法 | |
EP0708582A1 (en) | Electrically conductive paste materials and applications | |
US20020005247A1 (en) | Electrically conductive paste materials and applications | |
CN101366326B (zh) | 电子部件连接方法 | |
JP4828151B2 (ja) | 導電性接着シート及び回路基板 | |
CN101128927A (zh) | 电子元件焊接结构及电子元件焊接方法 | |
CN114262604A (zh) | 一种垂直导电胶、焊接方法及焊接结构 | |
US20230070488A1 (en) | Method for manufacturing connection body, and connection body | |
JP5113390B2 (ja) | 配線間接続方法 | |
CN112961633A (zh) | 一种低温固化的导电胶及其制备方法 | |
CN115053640A (zh) | 连接体的制造方法以及连接体 | |
EP3257109B1 (en) | Electrical connection tape | |
JP5168110B2 (ja) | 電子装置の製造方法 | |
JP2009135447A (ja) | 回路接続方法 | |
Kang et al. | Development of low cost, low temperature conductive adhesives | |
JP4378788B2 (ja) | Icチップの接続方法 | |
Aschenbrenner et al. | Fluxless flip‐chip bonding on flexible substrates: A comparison between adhesive bonding and soldering | |
Kang et al. | New high conductivity lead (Pb)-free conducting adhesives | |
JPH08148496A (ja) | 半導体装置及び半導体装置用バンプ | |
CN117458180A (zh) | 包括接合pcb和fpcb的导电性接合部的电池模块及pcb接合方法 | |
JP2003504847A (ja) | 電子回路系と支持体との間の電気機械的接続装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240516 Address after: 215300, 2nd Floor, Building 002, No. 26 Jinyan Road, Dianshanhu Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshan Zhongshengwei Entrepreneurship Investment Partnership Enterprise (Limited Partnership) Country or region after: China Address before: Room 418b-74, building 6, No. 25, Lushan Road, high tech Zone, Suzhou, Jiangsu 215010 Applicant before: Suzhou ouyidi Semiconductor Co.,Ltd. Country or region before: China |