CN114257726B

CN114257726B - Camera module and electronic equipment

Info

Publication number: CN114257726B
Application number: CN202111565675.7A
Authority: CN
Inventors: 马忠科; 陈小凤
Original assignee: Jiangxi Jinghao Optical Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2024-02-09
Anticipated expiration: 2041-12-20
Also published as: CN114257726A

Abstract

The invention discloses a camera shooting module and electronic equipment, wherein the camera shooting module comprises a lens assembly, an elastic supporting structure, a chip assembly and a power assembly, wherein the chip assembly is arranged on a movable plate of the elastic supporting structure, the power assembly comprises a first bracket, a connecting bracket, a first elastic component and a first power component, the first bracket is connected with a bearing plate of the elastic supporting structure, the connecting bracket is connected with the chip assembly, two ends of the first elastic component are respectively connected with the first bracket and the connecting bracket, the first elastic component bends and extends towards a first direction, the first direction is the direction from the joint of the first elastic component and the first bracket to the joint of the first elastic component and the connecting bracket, and the first power component is connected with the first bracket and the connecting bracket and is used for enabling the chip assembly to move along the optical axis direction for automatic focusing. By adopting the embodiment, the miniaturized design of the camera module can be realized, the resistance of the chip assembly when moving along the optical axis direction is reduced, and the response speed of automatic focusing is improved.

Description

Camera module and electronic equipment

Technical Field

The present invention relates to the field of imaging devices, and in particular, to a camera module and an electronic device.

Background

Related art's camera, smart mobile phone, electronic equipment such as intelligent wrist-watch are provided with the module of making a video recording often, in order to improve the shooting quality when shooing, the module of making a video recording of vast majority can include driving motor to realize automatic focusing through driving motor drive camera lens motion, in order to improve the shooting quality of the module of making a video recording. Along with the increase of the pixel level of the photosensitive chip, the overall dimension of the chip is increased, synchronously, the size and the weight of the lens are also increased, the requirements on the bearing and the belt power of the driving motor are higher and higher, the bearing performance of the driving motor is required to be higher and higher, the belt power is higher and higher, the overall dimension of the driving motor is increased, and therefore the overall dimension of the camera module is increased, and the miniaturization design of the camera module is not facilitated.

Disclosure of Invention

The embodiment of the invention discloses a camera module and electronic equipment, which can reduce the resistance of a chip assembly when moving along the optical axis direction while realizing the miniaturization design of the camera module, thereby being beneficial to improving the response speed of automatic focusing and facilitating automatic focusing.

In order to achieve the above object, in a first aspect, the present invention discloses an image capturing module, including:

A lens assembly;

the elastic support structure is arranged on the image side of the lens assembly and comprises a bearing plate and a movable plate electrically connected with the bearing plate;

the chip component is arranged on the movable plate and is positioned between the movable plate and the lens component; and

the power assembly is positioned at the image side of the lens assembly and comprises a first bracket, a connecting bracket, a first elastic component and a first power component, wherein the first bracket is connected with the bearing plate, the connecting bracket is connected with the chip assembly, two ends of the first elastic component are respectively connected with the first bracket and the connecting bracket, the first elastic component is bent towards a first direction to form at least one first bending part, the first power component is respectively connected with the first bracket and the connecting bracket, and the first power component is used for enabling the connecting bracket to move along the optical axis direction of the lens assembly so as to enable the chip assembly to move along the optical axis direction to realize automatic focusing of the camera module;

the first direction is from the connection position of the first elastic component and the first support to the connection position of the first elastic component and the connection support.

In the module of making a video recording that this application provided, through setting up power component in order to drive the chip subassembly and take place the removal along the optical axis direction, with the automatic focusing of module of making a video recording, although along with the rising of chip subassembly pixel level, chip subassembly and lens subassembly's overall dimension and weight all increase thereupon, but the weight of the chip subassembly after the increase is still lighter than the weight of lens subassembly usually, compare in the mode of driving the lens subassembly to remove along the optical axis direction through power component and realizing automatic focusing, it carries out the automatic focusing of module of making a video recording to drive the chip subassembly along the optical axis direction through power component, the requirement to power component's bearing and belt power is lower, so can adopt the power component that overall dimension is less alright drive the chip subassembly and remove along the optical axis direction, realize the automatic focusing function of module of making a video recording, be favorable to reducing the overall dimension of module of making a video recording like this, in order to realize the miniaturized design of module of making a video recording.

In addition, first support and linking bridge in this application are connected through first elastomeric element, drive the linking bridge at first power component and remove along the optical axis direction, when making the chip subassembly remove along the optical axis direction and focusing automatically, first elastomeric element receives the effect of linking bridge and can take place the single armed swing and take place deformation as the fulcrum with the junction of first elastomeric element and first support, buckle in order to form at least one first kink along first direction through prescribing a limit to first elastomeric element, make first elastomeric element have longer swing arm, thereby make first elastomeric element only need overcome less material stress alright crooked, deformation when focusing automatically, reduce the linking bridge and receive the pulling force from first elastomeric element when removing along the optical axis direction, make the chip subassembly receive less resistance when focusing, and then be favorable to improving the automatic response speed of focusing of chip subassembly, be convenient for focus automatically.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the power assembly is located between the elastic supporting structure and the lens assembly, or the power assembly is located on a side of the elastic supporting structure, which is opposite to the lens assembly, where it is apparent that the location of the power assembly is not limited to one location, and the power assembly may be set at different locations according to actual needs, so that the application scope is wider. In addition, when the power component is arranged on one side of the elastic supporting structure, which is opposite to the chip component, compared with the mode that the power component is arranged between the elastic supporting structure and the lens component, the distance from the lens component to the chip component can be shortened, which is equivalent to the reduction of the image distance of the camera module, and the camera module can be made into a short back focus camera module; meanwhile, the overall thickness of the camera module in the optical axis direction can be reduced, and the miniaturization design of the camera module is facilitated.

In an embodiment of the first aspect of the present invention, the first elastic component includes a plurality of first elastic portions, the plurality of first elastic portions are sequentially connected, two adjacent first elastic portions are connected at an angle to form the first bending portion, a first elastic portion located at a head portion is connected with the first bracket, a first elastic portion located at a tail portion is connected with the connecting bracket, and extension directions of the first elastic portion located at the head portion and the first elastic portion located at the tail portion are parallel to the first direction. The first elastic member is structured such that the first elastic member has a small reaction force in the optical axis direction and a large reaction force in a direction perpendicular to the optical axis. Also because the first elastic component has less reaction force in the direction of the optical axis, the reaction force from the first elastic component is less when the connecting bracket moves along the direction of the optical axis, and meanwhile, because the first elastic component has larger reaction force in the direction vertical to the optical axis, the reaction force from the first elastic component is greater when the connecting bracket moves along the direction vertical to the optical axis, the first elastic component is beneficial to the movement of the chip component along the direction of the optical axis, and is unfavorable for the movement of the chip component along the direction vertical to the optical axis, and the first power component is convenient to drive the chip component to move along the direction of the optical axis so as to perform automatic focusing.

In an embodiment of the first aspect of the present invention, the power assembly further includes a second bracket, a second elastic component, and a second power component, where the second bracket is connected to the lens assembly, two ends of the second elastic component are connected to the second bracket and the first bracket respectively, the second elastic component is bent along a second direction to form at least one second bending portion, the second direction is a direction from a connection position of the second elastic component and the second bracket to a connection position of the second elastic component and the first bracket, the second power component is connected to the second bracket and the first bracket, and the second power component is used to drive the first bracket to move relative to the second bracket, so as to make the chip assembly move to perform optical anti-shake. The chip assembly can be moved along the optical axis direction by utilizing the first power component of the power assembly so as to perform automatic focusing, and simultaneously, the chip assembly can be moved along the direction vertical to the optical axis and rotated around the optical axis by utilizing the second power component of the power assembly so as to perform optical anti-shake, namely, the power assembly can drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing function of the camera module; meanwhile, the chip assembly can be driven to move along the direction perpendicular to the optical axis and rotate around the optical axis, so that the optical anti-shake function of the camera module is realized, and the improvement of the shooting quality of the camera module is facilitated.

In addition, second support and first support in this application are connected through second elastomeric element, drive first support at second power component and remove along perpendicular to optical axis direction, when making the chip subassembly remove along perpendicular to optical axis direction and carrying out optics anti-shake, second elastomeric element receives the effect of first support and can take place the single armed swing and take place deformation with the junction of second elastomeric element and second support as the fulcrum, buckle in order to form at least one second kink along the second direction through inject second elastomeric element, make second elastomeric element have longer swing arm, thereby make second elastomeric element only need overcome less material stress alright bending, deformation when carrying out autofocus, receive the pulling force from second elastomeric element when reducing first support motion, make the chip subassembly receive less resistance when carrying out optics anti-shake, and then be favorable to improving the optics anti-shake response speed of chip subassembly, be convenient for carry out optics anti-shake.

In an embodiment of the first aspect of the present invention, the second elastic component includes a plurality of second elastic portions, the plurality of second elastic portions are sequentially connected, and two adjacent second elastic portions are connected at an angle to form the second bending portion, among the plurality of second elastic portions, a second elastic portion located at a head portion is connected with the second support, a second elastic portion located at a tail portion is connected with the first support, and extension directions of the second elastic portion located at the head portion and the second elastic portion located at the tail portion are parallel to the second direction. The second elastic member is structured such that the second elastic member has a small reaction force in a direction perpendicular to the optical axis and a large reaction force in the optical axis direction. And because the second elastic component has smaller reaction force in the direction perpendicular to the optical axis, the first bracket receives smaller reaction force from the second elastic component when moving along the direction perpendicular to the optical axis, and meanwhile, because the second elastic component has larger reaction force in the direction of the optical axis, the first bracket receives larger reaction force from the second elastic component when moving along the direction of the optical axis, therefore, the second elastic component is beneficial to the movement of the chip component along the direction perpendicular to the optical axis, and is unfavorable for the movement of the chip component along the direction of the optical axis, and the second power component is convenient for driving the chip component to move along the direction perpendicular to the optical axis so as to perform optical anti-shake.

As an alternative embodiment, in an embodiment of the first aspect of the present invention, the chip assembly and/or the movable plate are provided with a spacer, and the chip assembly and the movable plate are connected by the spacer. This is mainly considered: if the chip assembly is directly stacked on the movable plate, the chip assembly can be in contact with the flexible connecting belt, when the chip assembly moves along the optical axis direction, particularly moves along the direction opposite to the lens assembly (namely moves downwards), the first connecting end of the flexible connecting belt, which is connected with the bearing plate, can be abutted against the chip assembly, so that interference is caused to prevent the downward movement of the chip assembly, and therefore, a gap can exist between the chip assembly and the flexible connecting belt through the cushion block between the chip assembly and the movable plate, which is equivalent to a downward movable space for the chip assembly, so that the situation that the chip assembly moves due to the influence of the contact of the chip assembly with the first connecting end when the chip assembly moves downwards is avoided, and the possibility is provided for the movement of the chip assembly.

In an embodiment of the first aspect of the present invention, the carrier plate is a hollowed substrate, the carrier plate includes hollowed portions, and the plurality of movable plates are arranged at intervals and located in the hollowed portions;

The elastic supporting structure further comprises a connecting portion and a plurality of spiral flexible connecting bands, wherein the connecting portion is located in the hollow portion, the flexible connecting bands are arranged at intervals and located in the hollow portion, the flexible connecting bands are all fixed and electrically connected to the connecting portion, the flexible connecting bands respectively wind the connecting portion to extend spirally in the same direction, among the flexible connecting bands, one part of the flexible connecting bands is far away from one end of the connecting portion and is provided with a first connecting end, the other part of the flexible connecting bands is far away from one end of the connecting portion and is provided with a second connecting end, the first connecting end is electrically connected with the bearing plate, the movable plates are respectively arranged at the corresponding second connecting ends and are electrically connected with the corresponding second connecting ends, and the chip assembly is arranged on the movable plates and is electrically connected with the movable plates.

It can be known that when the chip assembly moves along the optical axis direction to perform automatic focusing, the movable plate moves along the optical axis direction along with the chip assembly, so that the flexible connecting bands deform, and therefore, by arranging a plurality of flexible connecting bands, the electric connection between the movable plate and the bearing plate can be realized, the flexible connecting bands are in a band shape under the condition of ensuring that the wiring quantity is unchanged, namely, under the condition of not influencing the electric conduction of the chip assembly, the flexible connecting bands can bend and deform only by overcoming smaller material stress when stressed, and the resistance of the chip assembly is smaller when the chip assembly moves; and the flexible connecting band is the spiral and extends, and for linear bar structure, it has certain redundant volume, only needs overcome less material stress alright crooked, deformation when carrying out the chip subassembly motion to the resistance that needs overcome when being favorable to reducing flexible connecting band deformation, the resistance that makes the chip subassembly receive when following the optical axis direction and remove is less. In other words, when the automatic focusing is performed, the resistance to the photosensitive chip when moving along the optical axis direction can be reduced, so that the response speed of the automatic focusing is improved, and the automatic focusing is facilitated.

Or, the elastic supporting structure further comprises a plurality of spiral flexible connecting bands, the flexible connecting bands are independently arranged and located in the hollowed-out parts, each flexible connecting band is provided with a first connecting end and a second connecting end, the first connecting ends are electrically connected with the bearing plate, the movable plates are arranged at the corresponding second connecting ends and are electrically connected with the corresponding second connecting ends, and the chip assembly is arranged at the movable plates and is electrically connected with the movable plates.

Through making many flexible connecting strips relatively independent setting, each flexible connecting strip disconnection interval each other sets up promptly, like this, in each flexible connecting strip atress by tensile deformation in-process, can reduce the effect of pinning between each flexible connecting strip to avoid taking place mutual interference when warping, make each flexible connecting strip more by tensile deformation, in order to further reduce the resistance that the chip assembly received when removing along the optical axis direction, thereby can further improve the response speed of autofocus, more conveniently carry out autofocus.

In an alternative embodiment, in an embodiment of the first aspect of the present invention, the elastic supporting structure further includes a vertical flexible board, the vertical flexible board includes a cantilever portion, a first connection arm and a second connection arm, the cantilever portion surrounds the bearing plate, the first connection arm is connected to the cantilever portion, and bends from the cantilever portion toward the bearing plate and is electrically connected to the bearing plate, and the second connection arm is connected to the cantilever portion, bends from the cantilever portion away from the bearing plate and is electrically connected to an external circuit.

Adopt vertical type soft board to realize the electric connection between chip subassembly and the external circuit, move and rotate around the optical axis along perpendicular to optical axis direction at the chip subassembly, in order to carry out optics anti-shake, can use the junction of second linking arm and external circuit as the fulcrum, use first linking arm and cantilever portion to take place the swing as the cantilever, can make vertical type soft board have longer swing arm like this, thereby when carrying out optics anti-shake, can reduce the resistance of chip subassembly motion, thereby be favorable to improving optics anti-shake's response speed, be convenient for carry out optics anti-shake.

In an embodiment of the first aspect of the present invention, the cantilever portion is a bending plate, the cantilever portion includes a plurality of cantilever portions, the cantilever portions are sequentially connected, and two adjacent cantilever portions are disposed at an angle to form an enclosed space, at least one cantilever portion is bent towards the bearing plate to form the first connecting arm, at least another cantilever portion is bent away from the bearing plate to form the second connecting arm, and at least one quarter of the bearing plate is located in the enclosed space, that is, the cantilever portion may implement a quarter of an enclosure, a half of an enclosure, a three-quarter of an enclosure, or substantially all of an enclosure for the bearing plate, so as to ensure that the cantilever portion has a longer length, so that when performing optical anti-shake, resistance of movement of the chip assembly can be further reduced, thereby being more beneficial to improving response speed of optical anti-shake, and facilitating optical anti-shake.

In an embodiment of the first aspect of the present invention, when the power assembly is located between the elastic support structure and the lens assembly, the second bracket has a first accommodating space with an opening facing away from the lens assembly, and the elastic support structure, the chip assembly, the first bracket, the connecting bracket, the first elastic component, the first power component, the second elastic component and the second power component are all located in the first accommodating space, and the camera module further includes a base, where the base covers the opening of the first accommodating space, and the base has an avoidance groove that is communicated with the first accommodating space, and the avoidance groove is used for avoiding the chip assembly and the movable plate when the chip assembly moves along the optical axis direction.

The first accommodating space is formed in the second bracket, so that the elastic supporting structure, the chip assembly, the first bracket, the connecting bracket, the first elastic component, the first power component, the second elastic component, the second power component and other parts are arranged in the first accommodating space, and the parts occupy the inner space of the second bracket, so that the power assembly is more compact in structure and smaller in volume, the whole volume of the camera module is smaller, and the miniaturization design of the camera module is facilitated; moreover, the first accommodation space is arranged, so that the second bracket is lighter in weight, the overall weight of the camera module is lighter, and the lightweight design of the camera module is facilitated.

By arranging the opening in the first accommodating space, the elastic supporting structure, the chip assembly, the first bracket, the connecting bracket, the first elastic component, the first power component, the second elastic component, the second power component and other parts can be conveniently assembled in the first accommodating space, and the camera module can be conveniently assembled; and meanwhile, the base is arranged to cover the opening of the first accommodating space, so that the camera shooting module is formed into a closed structure, external light can be prevented from entering the lens assembly from the opening of the first accommodating space to influence the imaging effect of the lens assembly, and the camera shooting module can also play a role in protecting parts such as an elastic supporting structure, a chip assembly, a first bracket, a connecting bracket, a first elastic part, a first power part, a second elastic part and a second power part which are packaged inside. Moreover, because when carrying out automatic focusing, chip subassembly and fly leaf can take place to remove along the optical axis direction, in order to avoid there being the interference between chip subassembly and fly leaf and the base, the base is equipped with the slot of dodging of opening orientation fly leaf, thereby dodging the slot and can be used to dodge chip subassembly and fly leaf when chip subassembly takes place to remove along the optical axis direction, for the removal of chip subassembly and fly leaf provides the possibility.

Or when the power assembly is positioned on one side of the elastic support structure, which is opposite to the lens assembly, the second support is provided with a first accommodating space with an opening facing the lens assembly, the image side of the lens assembly is provided with a second accommodating space with an opening facing the second support, the lens assembly is connected with the second support, the second accommodating space is communicated with the first accommodating space, and the elastic support structure, the first support, the connecting support, the first elastic component, the first power component, the second elastic component and the second power component are all positioned in the first accommodating space, and the chip assembly is positioned in the second accommodating space.

The first accommodating space is formed in the second bracket, so that the elastic supporting structure, the first bracket, the connecting bracket, the first elastic part, the first power part, the second elastic part, the second power part and other parts are arranged in the first accommodating space, and the inner space of the second bracket is occupied, so that the structure of the power assembly is more compact, the volume is smaller, the whole volume of the camera module is smaller, and the miniaturization design of the camera module is facilitated; moreover, the first accommodation space is arranged, so that the second bracket is lighter in weight, the overall weight of the camera module is lighter, and the lightweight design of the camera module is facilitated.

By arranging the opening in the first accommodating space, the elastic supporting structure, the first bracket, the connecting bracket, the first elastic component, the first power component, the second elastic component, the second power component and other parts can be conveniently assembled in the first accommodating space, and the camera module can be conveniently assembled; simultaneously, the second accommodating space with the opening facing the second bracket is formed on the image side of the lens assembly, the lens assembly is connected with the second bracket, and the opening of the first accommodating space and the opening of the second accommodating space are mutually covered, so that the camera module is formed into a closed structure, a cover plate is not required to be additionally arranged, fewer parts are needed, the overall structure of the camera module is more compact, the size is smaller, and the miniaturization design of the camera module is facilitated.

In an embodiment of the first aspect of the present invention, the camera module further includes a filter, where the filter is disposed on a side of the chip assembly facing the lens assembly, and the chip assembly is connected to the power assembly through the filter, or the filter is disposed on a side of the lens assembly facing the chip assembly and is disposed corresponding to the chip assembly, or when the power assembly is located between the elastic support structure and the lens assembly, the filter is disposed on the connection bracket and is disposed corresponding to the chip assembly.

By arranging the filter, such as an infrared filter, light rays of other wave bands such as visible light can be filtered, and only infrared light can pass through the filter, so that the infrared filter is selected, and the imaging quality is improved by filtering infrared light, so that the imaging is more in accordance with the visual experience of human eyes; and the camera module can be used as an infrared camera module, namely, the camera module can image under dim environment and other special application scenes and can obtain better image effect.

And when locating the filter on one side of the lens subassembly towards the chip subassembly, perhaps locating the linking bridge with the filter, compare with directly setting up the filter on the chip subassembly, and the linking bridge is connected with the chip subassembly and encircle the mode at the periphery of filter, need not to reserve the attached position of filter on the one side of the perpendicular optical axis direction of chip subassembly for the linking bridge can correspondingly reduce in the size of perpendicular optical axis direction, thereby be favorable to reducing the whole size of power module in perpendicular optical axis direction, accord with miniaturized design.

In a second aspect, the invention discloses an electronic device, which is provided with the camera module set in the first aspect. The electronic equipment with the camera module reduces the resistance of the chip assembly when moving along the optical axis direction while realizing the miniaturization design of the camera module, thereby being beneficial to improving the response speed of automatic focusing and facilitating automatic focusing.

Compared with the prior art, the invention has the beneficial effects that:

(1) The miniaturized design of the camera module can be realized. According to the camera module and the electronic device, the power assembly is arranged to drive the chip assembly to move along the optical axis direction so as to realize automatic focusing of the camera module, while the overall size and the weight of the chip assembly and the lens assembly are increased along with the increase of the pixel level of the chip assembly, the weight of the increased chip assembly is usually much lighter than that of the lens assembly, compared with the mode that the power assembly drives the lens assembly to move along the optical axis direction so as to realize automatic focusing, the power assembly drives the chip assembly to move along the optical axis direction so as to realize automatic focusing of the camera module, and the requirements on the bearing and the power of the power assembly are lower, so that the power assembly with smaller overall size can be adopted to drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing function of the camera module, and the overall size of the camera module is reduced, so that the miniaturization design of the camera module is realized.

(2) The response speed of automatic focusing can be improved, and the focusing effect is ensured. The power component in this application includes first support, the linking bridge, first elastomeric element and first power component, first support and linking bridge are connected through first elastomeric element, it removes along the optical axis direction to drive the linking bridge at first power component, when making the chip subassembly remove and focusing along the optical axis direction, first elastomeric element receives the effect of linking bridge can take place the single armed swing and take place deformation as the fulcrum with the junction of first elastomeric element and first support, buckle in order to form at least one kink along first direction through prescribing a limit to first elastomeric element, make first elastomeric element have longer swing arm, thereby make first elastomeric element only need overcome less material stress alright crooked, deformation when focusing, receive the pulling force from first elastomeric element when following the optical axis direction removal at the linking bridge, make the chip subassembly receive less resistance when focusing, and then be favorable to improving the automatic response speed of focusing of chip subassembly, be convenient for focusing automatically.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an image capturing module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an exploded structure of a camera module according to an embodiment of the present invention;

FIG. 3 is a top view of an imaging module according to an embodiment of the present invention;

FIG. 4 is a first cross-sectional view of the camera module of FIG. 3 taken along the direction A-A;

FIG. 5 is a schematic view of the first bracket, the connecting bracket and the first elastic member disclosed in the embodiment of the present invention;

FIG. 6 is a schematic view of the first bracket, the second bracket and the second elastic member disclosed in the embodiment of the present invention;

FIG. 7 is a second cross-sectional view of the camera module of FIG. 3 taken along the direction A-A;

FIG. 8 is a third cross-sectional view of the camera module of FIG. 3 taken along the direction A-A;

FIG. 9 is a fourth cross-sectional view of the camera module of FIG. 3 taken along the direction A-A;

FIG. 10 is a first schematic illustration of a resilient support structure disclosed in an embodiment of the present invention;

FIG. 11 is a schematic view of a second construction of an elastic support structure according to an embodiment of the present invention;

FIG. 12 is a schematic view of a third construction of an elastic support structure according to an embodiment of the present invention;

FIG. 13 is an enlarged view of a portion of FIG. 12 at M;

fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Icon: 100. a camera module; 1. a lens assembly; 11. a second accommodation space; 2. an elastic support structure; 21. a carrying plate; 211. a hollowed-out part; 22. a movable plate; 23. a connection part; 24. a flexible connecting band; 24a, a sub-flexible connecting strip; 241. a first connection end; 242. a second connection end; 25. vertical soft board; 251. a cantilever portion; 2511. a cantilever portion; 252. a first connecting arm; 253. a second connecting arm; 3. a chip assembly; 31. a circuit board; 32. a photosensitive chip; 4. a power assembly; 41. a first bracket; 42. a connecting bracket; 43. a first elastic member; 431. a first elastic portion; 44. a first power component; 441. a coil; 442. a magnetic section; 45. a second bracket; 451. a first accommodation space; 452. a recessed portion; 46. a second elastic member; 461. a second elastic portion; 47. a second power component; 5. a base; 51. an avoidance groove; 6. a filter; 7. a cushion block; 200. an electronic device; 201. a housing.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present invention and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present invention will be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.

The technical scheme of the invention will be further described with reference to the examples and the accompanying drawings.

Referring to fig. 1 to 4, an embodiment of the invention discloses a camera module, which can be applied to electronic devices such as mobile phones and tablet computers, wherein the camera module 100 can include a lens assembly 1, an elastic support structure 2, a chip assembly 3 and a power assembly 4, the elastic support structure 2 is disposed on an image side of the lens assembly 1, the elastic support structure 2 includes a carrier 21 and a movable plate 22 electrically connected with the carrier 21, the carrier 21 can be electrically connected with a motherboard of the electronic device through a golden finger, a board-to-board connector and the like, the chip assembly 3 is disposed between the movable plate 22 and the lens assembly 1, and the chip assembly 3 is further electrically connected with the movable plate 22, so that the chip assembly 3 can be electrically connected with the electronic device through the elastic support structure 2. The power assembly 4 is located at the image side of the lens assembly 1, the power assembly 4 may include a first bracket 41, a connecting bracket 42, a first elastic component 43 and a first power component 44, the first bracket 41 is connected to the carrier 21, the connecting bracket 42 is connected to the chip assembly 3, two ends of the first elastic component 43 are respectively connected to the first bracket 41 and the connecting bracket 42, the first elastic component 43 is bent in a first direction to form at least one first bending part, the first power component 44 is respectively connected to the first bracket 41 and the connecting bracket 42, and the first power component 44 is used for moving the connecting bracket 42 along the optical axis direction of the lens assembly 1, so that the chip assembly 3 moves along the optical axis direction to realize automatic focusing of the camera module 100.

The first direction is a direction from a connection point of the first elastic member 43 and the first bracket 41 to a connection point of the first elastic member 43 and the connection bracket 42, as shown in fig. 5 a, as shown in fig. 4 and 5. The first elastic member 43 is bent in the first direction: the first elastic member 43 is bent to form a structure in which the entire longitudinal direction (the extending direction of the first elastic member 43) matches the first direction. The first elastic member 43 may be disposed in a spiral shape, a loop shape, or a corrugated shape, and the spiral, loop and corrugated structures are relatively simple to implement, and have low process requirements, so as to reduce the processing difficulty of the first elastic member 43.

Illustratively, the chip assembly 3 in the present embodiment may include a circuit board 31 and a photosensitive chip 32 provided on the circuit board 31. The elastic support structure 2 in this embodiment may be a plate-like structure that can deform and conduct electricity, such as a flexible circuit board, so that the chip assembly 3 can be electrically connected to an external circuit and can deform when subjected to stress. The first bracket 41 and the connecting bracket 42 in this embodiment may be hollow cylindrical structures, the first bracket 41 surrounds the periphery of the connecting bracket 42, and the hollow portion of the connecting bracket 42 is disposed corresponding to the lens of the lens assembly 1 and the photosensitive chip 32 of the chip assembly 3, so that incident light entering through the lens assembly 1 can enter the chip assembly 3 through the hollow portion of the connecting bracket 42 and can be imaged on the photosensitive surface of the photosensitive chip 32 of the chip assembly 3.

In the camera module 100 provided by the application, through setting up power component 4 in order to drive the chip component 3 and take place to take place the removal along the optical axis direction, in order to realize the autofocus of camera module 100, although along with the rising of chip component 3 pixel level, chip component 3 and camera module 1's overall dimension and weight all increase thereupon, but the weight of chip component 3 after the increase is still usually lighter than the weight of camera module 1, compare in the mode that drives camera module 1 along the optical axis direction through power component 4 and remove in order to realize autofocus, drive chip component 3 along the optical axis direction through power component 4 and remove and carry out the autofocus of camera module 100, the requirement to the bearing of power component 4 and take power is lower, so can adopt the power component 4 that overall dimension is less alright drive chip component 3 along the optical axis direction and remove, realize the autofocus function of camera module 100, be favorable to reducing the overall dimension of camera module 100 like this, in order to realize the miniaturized design of camera module 100.

It can be appreciated that, in the present application, the first support 41 and the connecting support 42 are connected through the first elastic component 43, when the first power component 44 drives the connecting support 42 to move along the optical axis direction, so that the chip assembly 3 moves along the optical axis direction to perform automatic focusing, the first elastic component 43 is acted by the connecting support 42 to swing and deform with a single arm taking the connection position of the first elastic component 43 and the first support 41 as a pivot, and the first elastic component 43 is limited to bend and extend along the first direction, so that the first elastic component 43 has a longer swing arm, so that the first elastic component 43 can bend and deform only by overcoming smaller material stress when performing automatic focusing, the pulling force from the first elastic component 43 when the connecting support 42 moves along the optical axis direction is reduced, so that the resistance of the chip assembly 3 when performing focusing is smaller, thereby being beneficial to improving the automatic focusing response speed of the chip assembly 3, and being convenient for performing automatic focusing.

In some embodiments, as shown in fig. 5, the first elastic member 43 may include a plurality of first elastic portions 431, where the plurality of first elastic portions 431 are sequentially connected, and two adjacent first elastic portions 431 are connected at an angle to form the aforementioned first bending portion, and among the plurality of first elastic portions 431, the first elastic portion 431 located at the head is connected to the first bracket 41, the first elastic portion 431 located at the tail is connected to the connecting bracket 42, and the extending directions of the first elastic portion 431 located at the head and the first elastic portion 431 located at the tail are both parallel to the first direction. The first elastic member 43 adopts a structure such that the first elastic member 43 has a small reaction force in the optical axis direction and a large reaction force in a direction perpendicular to the optical axis. It is also because the first elastic member 43 has a smaller reaction force in the optical axis direction, so that the connection bracket 42 receives a smaller reaction force from the first elastic member 43 when moving along the optical axis direction, and meanwhile, because the first elastic member 43 has a larger reaction force in the direction perpendicular to the optical axis, the connection bracket 42 receives a larger reaction force from the first elastic member 43 when moving along the direction perpendicular to the optical axis, so that the first elastic member 43 is beneficial to the movement of the chip assembly 3 along the optical axis direction, and is not beneficial to the movement of the chip assembly 3 along the direction perpendicular to the optical axis, and the first power member 44 is convenient to drive the chip assembly 3 to move along the optical axis direction for automatic focusing.

As shown in fig. 4, the first power component 44 of the present application may be an Auto Focus Motor (AF Motor for short), the first power component 44 may include a coil 441 and a magnetic portion 442, the coil 441 and the magnetic portion 442 are disposed at intervals along a direction perpendicular to the optical axis O, and the coil 441 may be disposed on the first support 41, and the magnetic portion 442 may be disposed on the connecting support 42, so that when the coil 441 is powered on, the coil 441 generates a thrust to the magnetic portion 442, so that the magnetic portion 442 drives the connecting support 42 to move along the optical axis direction, so that the chip assembly 3 moves along the optical axis direction for Auto Focus, and meanwhile, the first elastic component 43 swings and deforms with a joint of the first elastic component 43 and the first support 41 as a pivot, and then when the coil 441 stops being powered on, the first elastic component 43 returns to deform to pull the connecting support 42 back to the original position, so as to pull the chip assembly 3 back to the original position. The magnetic portion 442 may be a magnet or a magnetite. It is understood that in other embodiments, the first power member 44 may also be a piezo-electric focusing motor.

In some embodiments, as shown in fig. 4, the power assembly 4 is located between the elastic support structure 2 and the lens assembly 1, i.e., the first bracket 41, the connection bracket 42, the first elastic member 43, and the first power member 44 are located on a side of the elastic support structure 2 facing the lens assembly 1; or, as shown in fig. 7, the power assembly 4 is located on a side of the elastic support structure 2 facing away from the lens assembly 1, that is, the first bracket 41, the connecting bracket 42, the first elastic component 43 and the first power component 44 are located on a side of the elastic support structure 2 facing away from the lens assembly 1, and therefore, the setting position of the power assembly 4 is not limited to one position, and the power assembly 4 can be set at different positions according to actual requirements, so that the application range is wider. In addition, when the power assembly 4 is disposed on the side of the elastic support structure 2 facing away from the chip assembly 3, the distance from the lens assembly 1 to the chip assembly 3 can be shortened compared with the manner in which the power assembly 4 is disposed between the elastic support structure 2 and the lens assembly 1, which corresponds to the reduction of the image distance of the camera module 100, and the camera module 100 can be made to be a short back focus; meanwhile, the overall thickness of the camera module 100 in the optical axis direction can be reduced, which is beneficial to the miniaturization design of the camera module 100.

In some embodiments, as shown in fig. 4, 6 and 7, the power assembly 4 may further include a second bracket 45, a second elastic member 46 and a second power member 47, where the second bracket 45 is connected to the lens assembly 1, two ends of the second elastic member 46 are respectively connected to the second bracket 45 and the first bracket 41, and the second elastic member 46 is bent along a second direction to form at least one second bending portion, the second direction is a direction from a connection position of the second elastic member 46 and the second bracket 45 to a connection position of the second elastic member 46 and the first bracket 41, the second power member 47 is connected to the second bracket 45 and the first bracket 41, and the second power member 47 is used to drive the first bracket 41 to move relative to the second bracket 45, so that the second power member 47 can drive the first bracket 41, the connection bracket 42, the first elastic member 43, the first power member 44, the elastic support structure 2 and the chip assembly 3 to move along a direction perpendicular to the optical axis and rotate around the optical axis to perform optical shake prevention.

As is clear from the foregoing description, the present application can use the first power component 44 of the power component 4 to move the chip component 3 along the optical axis direction for automatic focusing, in this process, the connection bracket 42, the chip component 3 and the movable plate 22 of the elastic support structure 2 move together along the optical axis direction under the action of the first power component 44, while the first elastic component 43 is deformed, and meanwhile, the present application can use the second power component 47 of the power component 4 to move the chip component 3 along the direction perpendicular to the optical axis and rotate around the optical axis O for optical anti-shake, in this process, the first bracket 41, the connection bracket 42, the first elastic component 43, the first power component 44, the chip component 3, the carrier plate 21 of the elastic support structure 2 and the movable plate 22 move together along the direction perpendicular to the optical axis under the action of the second power component 47, while the second elastic component 46 is deformed. Therefore, the power assembly 4 in the present application can drive the chip assembly 3 to move along the optical axis direction, so as to realize the auto-focusing function of the camera module 100; meanwhile, the chip assembly 3 can be driven to move along the direction perpendicular to the optical axis O and rotate around the optical axis O, so that the optical anti-shake function of the camera module 100 is realized, and the shooting quality of the camera module 100 is improved.

It will be appreciated that in other embodiments, the two ends of the first elastic member 43 may be connected to the first bracket 41 and the second bracket 45, respectively, and the first power member 44 is connected to the first bracket 41 and the second bracket 45, respectively, so that the chip assembly 3 moves along the optical axis direction for performing auto-focusing, and in this process, the first bracket 41, the connecting bracket 42, the second elastic member 46, the second power member 47, the chip assembly 3, and the carrier 21 and the movable plate 22 of the elastic support structure 2 move together along the optical axis direction under the action of the first power member 44 for performing auto-focusing, and the first elastic member 43 may be deformed. The two ends of the second elastic component 46 can be respectively connected to the connecting bracket 42 and the first bracket 41, the second power component 47 is connected to the connecting bracket 42 and the first bracket 41, and is used for driving the connecting bracket 42 to move relative to the first bracket 41 so as to make the chip assembly 3 move for optical anti-shake, in this process, the connecting bracket 42, the chip assembly 3 and the movable plate 22 of the elastic supporting structure 2 move together along the direction perpendicular to the optical axis under the action of the second power component 47 for optical anti-shake, and the second elastic component 46 can deform.

As shown in fig. 4, 6 and 7, the second direction is a direction from a connection point of the second elastic member 46 and the second bracket 45 to a connection point of the second elastic member 46 and the first bracket 41, such as a direction b in fig. 6. The second elastic member 46 is bent in the second direction: the second elastic member 46 is bent to form a structure in which the entire longitudinal direction (the extending direction of the second elastic member 46) matches the second direction. The second elastic member 46 may be disposed in a spiral shape, a loop shape, or a corrugated shape, and the spiral, loop and corrugated structures are relatively simple to implement, and have low process requirements, so as to reduce the processing difficulty of the second elastic member 46.

As can be appreciated, in the present application, the second support 45 and the first support 41 are connected by the second elastic component 46, when the second power component 47 drives the first support 41 to move along the direction perpendicular to the optical axis, so that when the chip assembly 3 moves along the direction perpendicular to the optical axis to perform optical anti-shake, the second elastic component 46 is subjected to the action of the first support 41, and the joint of the second elastic component 46 and the second support 45 is used as a fulcrum to swing and deform in a single arm manner, and the second elastic component 46 is limited to bend and extend along the second direction, so that the second elastic component 46 has a longer swing arm, so that the second elastic component 46 can bend and deform only by overcoming smaller material stress when performing auto-focus, the pulling force from the second elastic component 46 when the first support 41 moves is reduced, so that the resistance of the chip assembly 3 is smaller when performing optical anti-shake, thereby being beneficial to improving the optical anti-shake response speed of the chip assembly 3, and being convenient for performing optical anti-shake.

It should be noted that, in the image capturing module 100 provided in the embodiment of the present application, there is an internal coordinate system (also referred to as an internal reference coordinate system), referring to fig. 1 and 2, the internal coordinate system is a three-dimensional coordinate system, which uses the center of the chip assembly 3 as an origin, and the internal coordinate system includes: a z-axis parallel to the optical axis direction of the lens assembly 1, an x-axis perpendicular to the z-axis and parallel to the longitudinal direction of the lens assembly 1, and a y-axis perpendicular to the z-axis and perpendicular to the longitudinal direction of the lens assembly 1. Wherein rotation about the z-axis is referred to as turning (roll), also known as providing roll compensation. To more clearly illustrate the coordinate system, the origin of the internal coordinate system shown in fig. 1 and 2 is translated relative to the actual coordinate system origin, but does not represent the actual position of the coordinate system.

In the image capturing module 100 provided in the present application, the first power unit 44 can drive the chip assembly 3 to move along the z direction for performing auto-focusing, and the second power unit 47 can drive the chip assembly 3 to move along the x direction (i.e. provide x-direction compensation), move along the y direction (i.e. provide y-direction compensation), and rotate around the z axis (i.e. provide roll compensation), so as to perform optical anti-shake, thereby improving the imaging quality of the image capturing module 100.

In some embodiments, as shown in fig. 6, the second elastic component 46 may include a plurality of second elastic portions 461, where the plurality of second elastic portions 461 are sequentially connected, and two adjacent second elastic portions 461 are connected at an angle to form the aforementioned second bending portion, and in the plurality of second elastic portions 461, the second elastic portion 461 located at the head is connected to the second bracket 45, the second elastic portion 461 located at the tail is connected to the first bracket 41, and the extension directions of the second elastic portion 461 located at the head and the second elastic portion 461 located at the tail are both parallel to the second direction. The second elastic member 46 adopts a structure such that the second elastic member 46 has a small reaction force in a direction perpendicular to the optical axis and a large reaction force in the optical axis direction. It is also because the second elastic member 46 has a smaller reaction force in the direction perpendicular to the optical axis, so that the first bracket 41 receives a smaller reaction force from the second elastic member 46 when moving along the direction perpendicular to the optical axis, and meanwhile, because the second elastic member 46 has a larger reaction force in the direction of the optical axis, the first bracket 41 receives a larger reaction force from the second elastic member 46 when moving along the direction of the optical axis, so that the second elastic member 46 adopts the structure, which is beneficial to the movement of the chip assembly 3 along the direction perpendicular to the optical axis, and is unfavorable to the movement of the chip assembly 3 along the direction of the optical axis, and the second power member 47 is convenient to drive the chip assembly 3 to move along the direction perpendicular to the optical axis, so as to perform optical anti-shake.

As shown in fig. 4 to 7, the second power component 47 of the present application is a OIS (Optical Image Stabilization) motor, for example, the second power component 47 may be an anti-shake motor with a suspension wire structure, specifically, the second support 45 and the first support 41 may be connected by a shape memory alloy (Shape Memory Alloys, SMA) suspension wire, the SMA suspension wire contracts when heated, stretches when radiating heat, and drives the first support 41, the connecting support 42, the first elastic component 43, the first power component 44 and the chip assembly 3 to move along the direction (x, y) perpendicular to the optical axis, and rotate around the optical axis O (roll axis) for optical anti-shake. It is understood that in other embodiments, the second power member 47 may be an anti-shake motor such as a magneto-structure anti-shake motor or a piezo-structure anti-shake motor.

As an alternative embodiment, as shown in fig. 4, when the power assembly 4 is located between the elastic support structure 2 and the lens assembly 1, the second bracket 45 may have a first accommodating space 451 open away from the lens assembly 1, and the elastic support structure 2, the chip assembly 3, the first bracket 41, the connection bracket 42, the first elastic member 43, the first power member 44, the second elastic member 46, and the second power member 47 may be located in the first accommodating space 451. The camera module 100 may further include a base 5, where the base 5 covers the opening of the first accommodating space 451, and the base 5 has an avoidance groove 51 that communicates with the first accommodating space 451, where the avoidance groove 51 may be used to avoid the chip assembly 3 and the movable plate 22 when the chip assembly 3 moves along the optical axis direction, so as to provide a possibility for movement of the chip assembly 3 and the movable plate 22.

By arranging the first accommodating space 451 in the second bracket 45, the elastic supporting structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other parts are arranged in the first accommodating space 451, and the parts occupy the inner space of the second bracket 45, so that the structure of the power assembly 4 is more compact, the volume is smaller, the overall volume of the camera module 100 is smaller, and the miniaturization design of the camera module 100 is facilitated; moreover, the arrangement of the first accommodating space 451 makes the mass of the second bracket 45 lighter, which is beneficial to making the overall mass of the camera module 100 lighter, thereby being beneficial to the lightweight design of the camera module 100.

In addition, the first accommodating space 451 is provided with an opening, so that the components such as the elastic support structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and the like can be conveniently assembled in the first accommodating space 451, and the assembly of the camera module 100 is convenient; meanwhile, the base 5 is further arranged to cover the opening of the first accommodating space 451, so that the camera module 100 is formed into a closed structure, external light can be prevented from entering the lens assembly 1 from the opening of the first accommodating space 451 to affect the imaging effect of the lens assembly 1, and the components such as the elastic supporting structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46 and the second power component 47 which are packaged inside can be protected from the outside. Moreover, since the chip assembly 3 and the movable plate 22 move along the optical axis direction when the automatic focusing is performed, in order to avoid interference between the chip assembly 3 and the movable plate 22 and the base 5, the base 5 is provided with the avoidance groove 51 with an opening facing the movable plate 22, so that the avoidance groove 51 can be used for avoiding the chip assembly 3 and the movable plate 22 when the chip assembly 3 moves along the optical axis direction, thereby providing possibility for movement of the chip assembly 3 and the movable plate 22.

In the embodiment shown in fig. 4, a concave portion 452 is formed by concave recessing on a side of the second support 45 facing away from the base 5, and a light passing hole is formed at the bottom of the concave portion 452, the light passing hole is communicated with the hollow portion of the connecting support 42, the lens assembly 1 is disposed at the concave portion 452, and the lens of the lens assembly 1 is disposed corresponding to the light passing hole, so that incident light entering through the lens assembly 1 can sequentially pass through the light passing hole, the hollow portion of the connecting support 42, enter the chip assembly 3, and can image on the light sensing surface of the light sensing chip 32 of the chip assembly 3. Through set up depressed part 452 at the side of second support 45 that is dorsad base 5 to hold lens assembly 1, make lens assembly 1 occupy the inner space of second support 45, thereby be favorable to reducing the whole thickness of camera module 100 in the optical axis orientation, and then be favorable to realizing camera module 100's miniaturized design.

As another alternative embodiment, as shown in fig. 7, when the power assembly 4 is located on the side of the elastic support structure 2 facing away from the lens assembly 1, the second bracket 45 may have a first accommodating space 451 opened toward the lens assembly 1, while the image side of the lens assembly 1 may have a second accommodating space 11 opened toward the second bracket 45, the lens assembly 1 is connected to the second bracket 45, and the second accommodating space 11 is in communication with the first accommodating space 451, and the elastic support structure 2, the first bracket 41, the connection bracket 42, the first elastic member 43, the first power member 44, the second elastic member 46, and the second power member 47 may be located in the first accommodating space 451, and the chip assembly 3 is located in the second accommodating space 11.

By arranging the first accommodating space 451 in the second bracket 45, the elastic supporting structure 2, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other parts are arranged in the first accommodating space 451, and the parts occupy the inner space of the second bracket 45, so that the structure of the power assembly 4 is more compact, the volume is smaller, the overall volume of the camera module 100 is smaller, and the miniaturization design of the camera module 100 is facilitated; moreover, the arrangement of the first accommodating space 451 makes the mass of the second bracket 45 lighter, which is beneficial to making the overall mass of the camera module 100 lighter, thereby being beneficial to the lightweight design of the camera module 100.

In addition, the first accommodating space 451 is provided with an opening, so that the components such as the elastic support structure 2, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and the like can be conveniently assembled in the first accommodating space 451, and the assembly of the camera module 100 is convenient; meanwhile, the second accommodating space 11 with an opening facing the second bracket 45 is formed on the image side of the lens assembly 1, the lens assembly 1 is connected with the second bracket 45, and the opening of the first accommodating space 451 and the opening of the second accommodating space 11 are mutually sealed, so that the camera module 100 is formed into a closed structure, a cover plate is not required to be additionally arranged, fewer parts are needed, the overall structure of the camera module 100 is more compact, the size is smaller, and the miniaturization design of the camera module 100 is facilitated.

As shown in fig. 4, fig. 7, fig. 8 and fig. 9, the camera module 100 in the present application may further utilize the second power component 47 to enable the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the chip component 3, and the carrying plate 21 and the movable plate 22 of the elastic supporting structure 2 to be suspended, so as to avoid friction generated when the second power component 47 drives the chip component 3 to move along the direction perpendicular to the optical axis, or contact the carrying plate 21 and the movable plate 22 of the elastic supporting structure 2 with the base 5, or contact the first bracket 41 with the second bracket 45 to generate friction, thereby reducing the resistance when the chip component 3 moves along the direction perpendicular to the optical axis, so as to facilitate optical anti-shake.

In some embodiments, as shown in fig. 7 to 9, the image capturing module 100 may further include a filter 6, where the filter 6 is disposed between the lens assembly 1 and the chip assembly 3. By arranging the filter 6, for example, an infrared filter, light rays of other wave bands such as visible light can be filtered, and only infrared light can pass through the filter, so that the infrared filter is selected, and the imaging quality is improved by filtering infrared light, so that the imaging is more in line with the visual experience of human eyes; the camera module 100 can be used as an infrared camera module 100, that is, the camera module 100 can image in dim environment and other special application scenes and can obtain better image effect.

As a first alternative embodiment, as shown in fig. 4 and 7, the filter 6 may be disposed on a side of the chip assembly 3 facing the lens assembly 1, so as to filter out light rays of other bands such as visible light, and only let infrared light pass through, so as to improve imaging quality, and make imaging more in line with the visual experience of human eyes. In this embodiment, the chip assembly 3 may be connected to the power assembly 4 via a filter 6. For example, in the embodiment shown in fig. 4, specifically, the fixing support may be disposed on a side of the chip assembly 3 facing the lens assembly 1, one end of the first support 41 of the power assembly 4 is connected to the lens assembly 1 through the first elastic component 43, and the other end of the first support 41 is connected to the carrier 21 of the elastic support structure 2, the connecting support 42 of the power assembly 4 may be connected to the circuit board 31 of the chip assembly 3 through the fixing support, and during auto-focusing, the first power component 44 may drive the connecting support 42 to move along the optical axis direction relative to the first support 41, so as to drive the chip assembly 3 to move along the optical axis direction, thereby implementing the auto-focusing function of the camera module 100.

As a second alternative embodiment, as shown in fig. 8, when the power assembly 4 is located between the elastic supporting structure 2 and the lens assembly 1, the filter 6 may be disposed on the connection bracket 42 and disposed corresponding to the chip assembly 3, specifically, a first accommodating groove is disposed on a side surface of the connection bracket 42 of the power assembly 4 facing the lens assembly 1, and the filter 6 is disposed in the first accommodating groove. By adopting such design mode, compared with the mode that the filter 6 is directly arranged on the chip assembly 3, and the connecting bracket 42 is connected with the chip assembly 3 and surrounds the periphery of the filter 6, the attaching position of the filter 6 does not need to be reserved on one surface of the chip assembly 3 in the vertical optical axis direction, so that the size of the connecting bracket 42 in the vertical optical axis direction can be correspondingly reduced, the overall size of the power assembly 4 in the vertical optical axis direction is reduced, and the miniaturization design is met.

As a third alternative embodiment, as shown in fig. 9, the filter 6 may be disposed on a side of the lens assembly 1 facing the chip assembly 3 and disposed corresponding to the chip assembly 3, specifically, a second accommodating groove is disposed on a side of the lens assembly 1 facing the chip assembly 3, and the filter 6 is disposed in the second accommodating groove. Likewise, in such a design manner, compared with the manner that the filter 6 is directly arranged on the chip assembly 3, and the connecting bracket 42 is connected with the chip assembly 3 and surrounds the periphery of the filter 6, the attaching position of the filter 6 does not need to be reserved on one surface of the chip assembly 3 in the vertical optical axis direction, so that the size of the connecting bracket 42 in the vertical optical axis direction can be correspondingly reduced, thereby being beneficial to reducing the overall size of the power assembly 4 in the vertical optical axis direction and conforming to the miniaturization design.

As an alternative embodiment, as shown in fig. 10, the carrier 21 is a hollow substrate, that is, the carrier 21 may include a hollow portion 211, and the movable plates 22 may be plural, and the plural movable plates 22 are disposed at intervals and located in the hollow portion 211; and the elastic supporting structure 2 may further include a connecting portion 23 and a plurality of spiral flexible connecting strips 24, where the connecting portion 23 is located in the hollow portion 211, the plurality of flexible connecting strips 24 are disposed at intervals and located in the hollow portion 211, the plurality of flexible connecting strips 24 are all fixed and electrically connected to the connecting portion 23, and each flexible connecting strip 24 extends spirally around the connecting portion 23 in the same direction, among the plurality of flexible connecting strips 24, one end of a part of flexible connecting strips 24 away from the connecting portion 23 has a first connecting end 241, one end of another part of flexible connecting strips 24 away from the connecting portion 23 has a second connecting end 242, the first connecting end 241 is electrically connected with the carrier plate 21, each movable plate 22 is respectively disposed at the corresponding second connecting end 242 and is electrically connected with the corresponding second connecting end 242, and the chip assembly 3 is disposed on each movable plate 22 and electrically connected with each movable plate 22. For example, in the embodiment shown in fig. 10, there may be two movable plates 22, and there may be 4 flexible connection strips 24, where one end of the two flexible connection strips 24 away from the connection portion 23 has a first connection end 241, the two first connection ends 241 are electrically connected to the carrier plate 21, and the other end of the two flexible connection strips 24 away from the connection portion 23 has a second connection end 242, and the two movable plates 22 are respectively disposed at the corresponding second connection ends 242 and electrically connected to the corresponding second connection ends 242, and the chip assembly 3 is disposed at the two movable plates 22 and electrically connected to the two movable plates 22.

It can be known that when the chip assembly 3 moves along the optical axis direction to perform automatic focusing, each movable plate 22 moves along the optical axis direction along with the chip assembly 3, so that the flexible connection belt 24 deforms, therefore, by arranging a plurality of flexible connection belts 24 to realize the electrical connection between the movable plates 22 and the bearing plate 21, the flexible connection belt 24 is in a belt shape under the condition of ensuring that the wiring quantity is unchanged, namely, under the condition of not influencing the electrical connection and conduction of the chip assembly 3, and only small material stress needs to be overcome when the chip assembly 3 is stressed, so that the chip assembly 3 can be bent and deformed, and the resistance applied when moving is small; and, the flexible connecting band 24 extends spirally, and has a certain redundancy compared with a linear strip-shaped structure, and can bend and deform only by overcoming smaller material stress when the chip assembly 3 moves, so that the resistance required to be overcome when the flexible connecting band 24 deforms is reduced, and the resistance applied to the chip assembly 3 when moving along the optical axis direction is smaller. In other words, when the autofocus is performed, the resistance to the movement of the photosensitive chip 32 in the optical axis direction can be reduced, which is advantageous in that the response speed of the autofocus is increased, and the autofocus is facilitated.

As another alternative embodiment, as shown in fig. 11, the carrying plate 21 is a hollow substrate, that is, the carrying plate 21 may include a hollow portion 211, and the movable plates 22 may be plural, and the plural movable plates 22 are disposed at intervals and located in the hollow portion 211; the elastic supporting structure 2 may further include a plurality of spiral flexible connection strips 24, where the flexible connection strips 24 are independently disposed and located in the hollowed-out portion 211, each flexible connection strip 24 has a first connection end 241 and a second connection end 242, the first connection end 241 is electrically connected with the carrier plate 21, each movable plate 22 is disposed at the corresponding second connection end 242 and electrically connected with the corresponding second connection end 242, and the chip assembly 3 is disposed at each movable plate 22 and electrically connected with each movable plate 22. For example, in the embodiment shown in fig. 11, there may be two movable plates 22, two flexible connection strips 24 may be provided, each of the two flexible connection strips 24 has a first connection end 241 and a second connection end 242, each of the two first connection ends 241 is electrically connected to the carrier plate 21, each of the two movable plates 22 is disposed at a corresponding second connection end 242 and is electrically connected to a corresponding second connection end 242, and the chip assembly 3 is disposed at each of the two movable plates 22 and is electrically connected to each of the two movable plates 22.

Through making many flexible connection area 24 relative independence set up, each flexible connection area 24 break off the interval setting each other promptly, like this, in each flexible connection area 24 atress by tensile deformation in-process, can reduce the effect of pinning between each flexible connection area 24, in order to avoid taking place mutual interference when the deformation, make each flexible connection area 24 more easily by tensile deformation, in order to further reduce the resistance that chip assembly 3 received when removing along the optical axis direction, thereby can further improve the response speed of autofocus, more conveniently carry out autofocus.

In some embodiments, as shown in fig. 12 and 13, at least one flexible connecting strip 24 includes a plurality of sub flexible connecting strips 24a, and in the embodiment shown in fig. 12 and 13, each flexible connecting strip 24 includes a plurality of sub flexible connecting strips 24a, and the plurality of sub flexible connecting strips 24a are arranged at intervals in a direction perpendicular to the optical axis O. This is equivalent to decomposing a single wide flexible connecting band 24 into a plurality of finer sub flexible connecting bands 24a, so that the elastic modulus of the flexible connecting band 24 can be reduced and the flexibility of the flexible connecting band 24 can be improved and the deformation resistance can be reduced under the condition of ensuring the wiring amount unchanged, so that the flexible connecting band 24 is easier to be stretched and deformed, and the resistance applied to the movement of the chip assembly 3 along the optical axis direction can be reduced, thereby improving the response speed of automatic focusing and ensuring the focusing effect.

In some embodiments, as shown in connection with fig. 8 and 9, the chip assembly 3 and/or the movable plate 22 are provided with a spacer 7, and the chip assembly 3 and the movable plate 22 are connected by the spacer 7. That is, when the pad 7 is provided on the side of the circuit board 31 of the chip module 3 facing the movable plate 22, the pad 7 is connected to the movable plate 22; when the cushion block 7 is arranged on one side of the movable plate 22 facing the chip assembly 3, the cushion block 7 is connected with the circuit board 31 of the chip assembly 3; when the side of the circuit board 31 of the chip assembly 3 facing the movable plate 22 is provided with the cushion block 7 and the side of the movable plate 22 facing the chip assembly 3 is provided with the cushion block 7, the cushion block 7 on the circuit board 31 is connected with the cushion block 7 on the movable plate 22.

This is mainly considered: if the chip assembly 3 is directly stacked on the movable plate 22, the chip assembly 3 will contact with the flexible connection belt 24, and when the chip assembly 3 moves along the optical axis direction, particularly moves along the direction opposite to the lens assembly 1 (i.e. moves downwards), the first connection end 241 of the flexible connection belt 24 connected with the bearing plate 21 will abut against the chip assembly 3, so that interference hinders the downward movement of the chip assembly 3, therefore, through the cushion block 7 between the chip assembly 3 and the movable plate 22, a gap can exist between the chip assembly 3 and the flexible connection belt 24, which is equivalent to a downward movement space for the chip assembly 3, so as to avoid the situation that the movement of the chip assembly 3 is affected due to the contact with the first connection end 241 when the chip assembly 3 moves downwards, and provide possibility for the movement of the chip assembly 3.

In some embodiments, as shown in fig. 10 to 12, the elastic supporting structure 2 may further include a vertical flexible board 25, the vertical flexible board 25 may include a cantilever portion 251, a first connecting arm 252 and a second connecting arm 253, the cantilever portion 251 surrounds the carrier 21, the first connecting arm 252 is connected to the cantilever portion 251, and bends from the cantilever portion 251 toward the direction of the carrier 21 and is electrically connected to the carrier 21, and the second connecting arm 253 is connected to the cantilever portion 251, bends from the cantilever portion 251 away from the direction of the carrier 21 and is electrically connected to an external circuit (such as the motherboard of the electronic device), that is, the carrier 21 may be electrically connected to the motherboard of the electronic device through the vertical flexible board 25.

Through adopting vertical type soft board 25 to realize the electric connection between chip subassembly 3 and the external circuit, when chip subassembly 3 moves and rotates around optical axis O along perpendicular to optical axis direction, in order to carry out optics anti-shake, can regard second linking arm 253 and external circuit's junction as the fulcrum, take place the swing with first linking arm 252 and cantilever part 251 as the cantilever, can make vertical type soft board 25 have longer swing arm like this, thereby when carrying out optics anti-shake, can reduce the resistance that chip subassembly 3 moved, thereby be favorable to improving optics anti-shake's response speed, be convenient for carry out optics anti-shake.

Further, as shown in fig. 10 to 12, the cantilever portion 251 may be a bending plate, the cantilever portion 251 includes a plurality of cantilever portions 2511, the plurality of cantilever portions 2511 are sequentially connected, and two adjacent cantilever portions 2511 are disposed at an angle to form an enclosed space, at least one cantilever portion 2511 is bent towards the carrier plate 21 to form a first connecting arm 252, at least another cantilever portion 2511 is bent away from the carrier plate 21 to form a second connecting arm 253, at least one quarter of the carrier plate 21 is located in the enclosed space, that is, the cantilever portion 251 may implement one quarter of the enclosure (as shown in fig. 10), one half of the enclosure (as shown in fig. 11), three quarters of the enclosure, or substantially all of the enclosure (as shown in fig. 12) on the carrier plate 21, so as to ensure that the cantilever portion 251 has a longer length to ensure that the upright soft plate 25 has a longer swing arm, thereby being capable of further reducing the resistance of the movement of the chip assembly 3 when performing optical anti-shake, thereby being more beneficial for improving the response speed of optical anti-shake.

Referring to fig. 13, the present invention discloses an electronic device 200 having an image capturing module 100 according to the foregoing embodiment. Specifically, as shown in fig. 13, the electronic device 200 may include a housing 201 and the aforementioned camera module 100, where a motherboard is disposed in the housing 201, and the camera module 100 is disposed in the housing 201 and electrically connected to the motherboard in the housing 201, so that the electronic device 200 has a photographing function. The electronic device 200 may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, etc. It can be appreciated that the electronic device 200 having the camera module 100 described in the foregoing embodiment also has all the technical effects of the camera module 100 described in the foregoing embodiment. That is, the electronic device 200 with the camera module 100 is provided with the power assembly to drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing of the camera module 100, while the overall dimensions and the weight of the chip assembly and the lens assembly are increased along with the increase of the pixel level of the chip assembly, the weight of the increased chip assembly is generally much lighter than that of the lens assembly, compared with the way that the power assembly drives the lens assembly to move along the optical axis direction so as to realize the automatic focusing, the power assembly drives the chip assembly to move along the optical axis direction so as to realize the automatic focusing of the camera module 100, and the requirements on the bearing and the driving force of the power assembly are lower, so that the power assembly with smaller overall dimension can be adopted to drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing function of the camera module 100, thereby being beneficial to reducing the overall dimension of the camera module 100 so as to realize the miniaturization design of the camera module 100.

In addition, the power component in this application includes first support, the linking bridge, first elastomeric element and first power component, first support and linking bridge are connected through first elastomeric element, drive the linking bridge at first power component and remove along the optical axis direction, when making the chip subassembly remove along the optical axis direction and focusing automatically, first elastomeric element receives the effect of linking bridge and can take place the single armed swing and take place deformation as the fulcrum with the junction of first elastomeric element and first support, buckle and extend along first direction through prescribing a limit to first elastomeric element, make first elastomeric element have longer swing arm, thereby make first elastomeric element only need overcome less material stress alright crooked, deformation when focusing automatically, reduce the linking bridge and receive the pulling force from first elastomeric element when removing along the optical axis direction, make the chip subassembly receive less resistance when focusing, and then be favorable to improving the automatic response speed of focusing of chip subassembly, be convenient for focus automatically.

The above describes in detail a camera module and an electronic device disclosed in the embodiments of the present invention, and specific examples are applied to describe the principles and embodiments of the present invention, where the description of the above embodiments is only for helping to understand the camera module, the electronic device and the core ideas of the present invention; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present invention, the present disclosure should not be construed as limiting the present invention in summary.

Claims

1. A camera module, comprising:

a lens assembly;

the chip component is arranged on the movable plate of the elastic supporting structure and is positioned between the movable plate and the lens component; and

The first direction is from the connection position of the first elastic component and the first bracket to the connection position of the first elastic component and the connection bracket;

the power assembly further comprises a second support, a second elastic component and a second power component, wherein the second support is connected with the lens assembly, two ends of the second elastic component are respectively connected with the second support and the first support, the second elastic component is bent towards a second direction to form at least one second bending part, the second power component is connected with the second support and the first support, and the second power component is used for driving the first support to move relative to the second support so as to enable the chip assembly to move for optical anti-shake;

the second direction is from the connection position of the second elastic part and the second bracket to the connection position of the second elastic part and the first bracket;

the first support is of a hollow columnar structure, the first elastic component and the first power component are respectively connected to the inner peripheral side face of the first support, and the second power component is connected to the outer peripheral side face of the first support.

2. The camera module of claim 1, wherein the power assembly is located between the elastic support structure and the lens assembly, or the power assembly is located on a side of the elastic support structure facing away from the lens assembly.

3. The camera module according to claim 1, wherein the first elastic component includes a plurality of first elastic portions, the plurality of first elastic portions are sequentially connected, two adjacent first elastic portions are connected at an angle to form the first bending portion, a first elastic portion located at a head portion is connected with the first bracket, a first elastic portion located at a tail portion is connected with the connecting bracket, and extension directions of the first elastic portion located at the head portion and the first elastic portion located at the tail portion are parallel to the first direction.

4. The camera module according to claim 1, wherein the second elastic component includes a plurality of second elastic portions, the plurality of second elastic portions are sequentially connected, two adjacent second elastic portions are connected at an angle to form the second bending portion, the second elastic portion located at the head is connected with the second support, the second elastic portion located at the tail is connected with the first support, and extension directions of the second elastic portion located at the head and the second elastic portion located at the tail are parallel to the second direction.

5. The camera module according to claim 1, wherein the bearing plate is a hollowed-out substrate, the bearing plate comprises a hollowed-out portion, the number of the movable plates is plural, and the plurality of the movable plates are arranged at intervals and located in the hollowed-out portion;

the elastic supporting structure further comprises a connecting part and a plurality of spiral flexible connecting belts, wherein the connecting part is positioned in the hollowed part, the flexible connecting belts are arranged at intervals and positioned in the hollowed part, the flexible connecting belts are all fixed and electrically connected to the connecting part, each flexible connecting belt spirally extends around the connecting part in the same direction, one part of the flexible connecting belts is provided with a first connecting end at one end far away from the connecting part, the other part of the flexible connecting belts is provided with a second connecting end at one end far away from the connecting part, the first connecting end is electrically connected with the bearing plate, each movable plate is respectively arranged at the corresponding second connecting end and is electrically connected with the corresponding second connecting end, and the chip assembly is arranged on each movable plate and is electrically connected with each movable plate; or alternatively

The elastic supporting structure further comprises a plurality of spiral flexible connecting bands, the flexible connecting bands are independently arranged and located in the hollowed-out portions, each flexible connecting band is provided with a first connecting end and a second connecting end, the first connecting ends are electrically connected with the bearing plate, the movable plates are arranged at the corresponding second connecting ends and are electrically connected with the corresponding second connecting ends, and the chip assembly is arranged at the movable plates and is electrically connected with the movable plates.

6. The camera module according to claim 1 or 5, wherein the elastic support structure further comprises a vertical flexible board, the vertical flexible board comprises a cantilever portion, a first connecting arm and a second connecting arm, the cantilever portion surrounds the bearing plate, the first connecting arm is connected to the cantilever portion, bends from the cantilever portion to the bearing plate and is electrically connected with the bearing plate, and the second connecting arm is connected to the cantilever portion, bends from the cantilever portion back to the bearing plate.

7. The camera module of claim 6, wherein the cantilever portion is a bending plate, the cantilever portion includes a plurality of cantilever portions, the cantilever portions are sequentially connected, two adjacent cantilever portions are disposed at an angle to form an enclosed space, at least one cantilever portion is bent toward the bearing plate to form the first connecting arm, at least another cantilever portion is bent away from the bearing plate to form the second connecting arm, and at least one quarter of the bearing plate is located in the enclosed space.

8. The camera module of claim 1, wherein when the power assembly is located between the elastic support structure and the lens assembly, the second bracket has a first accommodating space with an opening facing away from the lens assembly, the elastic support structure, the chip assembly, the first bracket, the connecting bracket, the first elastic member, the first power member, the second elastic member, and the second power member are all located in the first accommodating space, the camera module further comprises a base, the base covers the opening of the first accommodating space, and the base has an avoidance groove communicated with the first accommodating space, the avoidance groove is used for avoiding the chip assembly and the movable plate when the chip assembly moves along the optical axis direction; or alternatively

When the power component is located on one side of the elastic support structure, which is opposite to the lens component, the second support is provided with a first accommodating space with an opening facing the lens component, the image side of the lens component is provided with a second accommodating space with an opening facing the second support, the lens component is connected with the second support, the second accommodating space is communicated with the first accommodating space, and the elastic support structure, the first support, the connecting support, the first elastic component, the first power component, the second elastic component and the second power component are all located in the first accommodating space, and the chip component is located in the second accommodating space.

9. The camera module of any of claims 1-5, wherein the chip assembly and/or the movable plate are provided with a spacer, and the chip assembly and the movable plate are connected by the spacer.

10. The camera module according to any one of claims 1 to 5, further comprising a filter, wherein the filter is disposed on a side of the chip assembly facing the lens assembly, and the chip assembly is connected to the power assembly through the filter, or the filter is disposed on a side of the lens assembly facing the chip assembly and corresponding to the chip assembly, or the filter is disposed on the connection bracket and corresponding to the chip assembly when the power assembly is located between the elastic support structure and the lens assembly.

11. An electronic device having a camera module according to any one of claims 1-10.