CN114232060A - Preparation equipment and preparation system of multifunctional composite film - Google Patents
Preparation equipment and preparation system of multifunctional composite film Download PDFInfo
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- CN114232060A CN114232060A CN202111388735.2A CN202111388735A CN114232060A CN 114232060 A CN114232060 A CN 114232060A CN 202111388735 A CN202111388735 A CN 202111388735A CN 114232060 A CN114232060 A CN 114232060A
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- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title abstract description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 161
- 239000010936 titanium Substances 0.000 claims abstract description 161
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 161
- 238000009713 electroplating Methods 0.000 claims abstract description 106
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 238000004804 winding Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 113
- 239000010408 film Substances 0.000 claims description 95
- 238000004519 manufacturing process Methods 0.000 claims description 39
- 239000010409 thin film Substances 0.000 claims description 25
- 230000007704 transition Effects 0.000 claims description 15
- 238000002955 isolation Methods 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 238000002425 crystallisation Methods 0.000 abstract description 2
- 230000008025 crystallization Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000007888 film coating Substances 0.000 description 4
- 238000009501 film coating Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 210000005056 cell body Anatomy 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
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- 238000013473 artificial intelligence Methods 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Abstract
The embodiment of the invention provides a multifunctional composite film preparation device and a multifunctional composite film preparation system, which comprise a winding and unwinding unit and a steering unit, wherein an electroplating unit is arranged between the winding and unwinding unit and the steering unit, and the electroplating unit comprises an electroplating bath body, and a plurality of liquid interception columns, a plurality of conductive columns and a plurality of titanium blue columns which are arranged in the electroplating bath body. The arrangement positions of the plurality of liquid interception columns, the plurality of conductive columns and the plurality of titanium blue columns can be flexibly arranged, the tension of the film in the electroplating bath body and the optimal electroplating distance between the film and the plurality of titanium blue columns can be well controlled, meanwhile, the plurality of conductive columns are arranged, a small amount of current can be carried in each conductive column to prevent the conductive columns from being plated with copper, in addition, the plurality of conductive columns are arranged in the electroplating solution, the metal crystallization formed on the conductive columns is avoided, and the film is prevented from being punctured.
Description
Technical Field
The invention relates to the technical field of film production, in particular to a preparation device and a preparation system of a multifunctional composite film.
Background
With the development of the technology, the demand of coating on the surface of the flexible film substrate is more and more increased. In industrial production, water electroplating equipment is generally used for electroplating the flexible film substrate, namely, a water plating solution is prepared according to the requirements of various bodies and coatings, so that the flexible film substrate can be finished in a short time by the water plating solution. In a conventional electroplating apparatus, a plurality of plating tanks for supplying a plating solution are generally provided, anodes are provided in the tanks so as to face a plating surface functioning as a cathode, and the plurality of plating tanks are arranged side by side in a conveying direction of a flexible film substrate; the plating apparatus is provided with a power supply part for supplying power to each plating tank and a continuous conveying and tensioning mechanism for the flexible film base material, and the power supply amount of each plating tank is controlled to increase the power supply amount of each plating tank in turn according to the supply sequence of the flexible film base material, so that a uniform and good plating film can be formed continuously.
In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: because current film plating equipment is not enough in the design, lead the easy copper plate that forms in electrical pillar surface, the copper plate punctures or the fish tail film, and the process roller is numerous simultaneously, and the roller height sets up and leads to tension control difficulty, the easy fold of flexible film or deformation easily to reduced the yields of conductive film product by a wide margin, seriously influenced enterprise's whole production efficiency. Meanwhile, the current electroplating equipment is formed by arranging a plurality of electroplating baths in a straight line side by side, so that the occupied space is increased. In addition, the film can not be continuously coated for many times in the plating solution, and the efficiency is low.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a multifunctional composite film manufacturing apparatus and system, so as to solve the technical problems in the prior art that the conductive post is plated with copper and the tension of the film is difficult to control.
To achieve the above object, in a first aspect, the present invention provides a multifunctional composite film manufacturing apparatus, comprising: receive and release the roll unit, turn to the unit and electroplate the unit, it is in to electroplate the unit set up receive and release the roll unit with turn to between the unit.
In some possible embodiments, the plating unit includes a plating tank body, and a plurality of cutoff columns, a plurality of conductive columns, and a plurality of titanium blue columns vertically disposed in the plating tank body, wherein,
the electroplating bath comprises an electroplating bath body and is characterized in that a first gap, a second gap, a third gap and a fourth gap are vertically arranged on two side surfaces of the electroplating bath body, and a film to be prepared penetrates through the first gap, the second gap, the third gap and the fourth gap.
In some possible embodiments, the plurality of cut-off columns may include: the first liquid interception column and the second liquid interception column are vertically arranged at the liquid inlet end in the electroplating bath body, and a first liquid isolation space is formed among the first liquid interception column, the second liquid interception column and the side wall of the electroplating bath body where the first gap is located;
the third liquid interception column and the fourth liquid interception column are vertically arranged at a first steering end in the electroplating bath body, and a second liquid isolation space is formed among the third liquid interception column, the fourth liquid interception column and the side wall of the electroplating bath body where the second gap is located;
a fifth liquid interception column and a sixth liquid interception column which are vertically arranged at a second steering end in the electroplating bath body, and a third liquid isolation space is formed among the fifth liquid interception column, the sixth liquid interception column and the side wall of the electroplating bath body where the third gap is located;
and the seventh liquid interception column and the eighth liquid interception column are vertically arranged at a second steering end in the electroplating bath body, and a fourth liquid isolation space is formed among the seventh liquid interception column, the eighth liquid interception column and the side wall of the electroplating bath body where the fourth gap is located.
In some possible embodiments, the plurality of titanium blue pillars may include:
the first titanium blue column, the second titanium blue column and the third titanium blue column are vertically arranged at the bottom of the electroplating bath body.
In some possible embodiments, the plurality of conductive pillars may include:
the first conductive column and the second conductive column are vertically arranged on the first side between the first titanium blue column and the second titanium blue column;
and the third conductive column and the fourth conductive column are vertically arranged on the first side between the second titanium blue column and the third titanium blue column.
In some possible embodiments, the plurality of conductive pillars may include:
the fifth conductive column and the sixth conductive column are vertically arranged on the second side between the first titanium blue column and the second titanium blue column;
and the seventh conductive column and the eighth conductive column are vertically arranged on the second side between the second titanium blue column and the third titanium blue column.
In some possible embodiments, the plurality of titanium blue pillars may further include:
the fourth titanium blue column, the fifth titanium blue column and the sixth titanium blue column are arranged on the first sides of the first titanium blue column, the second titanium blue column and the third titanium blue column, and the fourth titanium blue column, the fifth titanium blue column and the sixth titanium blue column are vertically arranged at the bottom of the electroplating bath body;
the seventh titanium blue column, the eighth titanium blue column and the ninth titanium blue column are arranged on the second sides of the first titanium blue column, the second titanium blue column and the third titanium blue column, and the seventh titanium blue column, the eighth titanium blue column and the ninth titanium blue column are vertically arranged at the bottom of the electroplating bath body.
In some possible embodiments, the plurality of titanium blue pillars each include a frame with micro-holes, and a handle disposed on the frame;
the bottom of the electroplating bath body is provided with a plurality of grooves matched with the bottoms of the plurality of titanium blue columns, and the plurality of titanium blue columns are fixed in the electroplating bath body through the plurality of grooves.
In some possible embodiments, the unwinding unit comprises an unwinding roller and a winding roller, and the turning unit comprises a first turning roller and a second turning roller, wherein,
the unwind roll and the first turning roll are aligned with the first gap and the second gap, respectively, such that the film is fed in-line between the unwind roll, the first gap, the second gap, and the first turning roll;
the second steering roller and the winding roller are respectively aligned with the third gap and the fourth gap, so that the film is linearly wound among the winding roller, the third gap, the fourth gap and the second steering roller.
In some possible embodiments, the preparation apparatus further comprises:
the first transition unit is arranged between the winding and unwinding unit and the electroplating unit and used for receiving the plating solution overflowing from the electroplating bath body and the plating solution brought out by the film during the tape winding;
and the second transition unit is arranged between the electroplating unit and the steering unit and is used for receiving the plating solution overflowing from the electroplating bath body and the plating solution brought out by the film during the tape-out process.
In a second aspect, an embodiment of the present invention provides a system for preparing a multifunctional composite film, where the system includes: the manufacturing equipment, the driving equipment, the tension detecting equipment and the control equipment, wherein the driving equipment is arranged at the lower part of the electroplating unit in the manufacturing equipment and used for providing driving force for the manufacturing equipment, the tension detecting equipment is arranged at the lower part of the steering unit in the manufacturing equipment and used for detecting the tension of the film in the manufacturing equipment and feeding the tension back to the control equipment, and the control equipment is used for controlling the working state of the manufacturing equipment.
The technical scheme has the following technical effects:
the invention provides a multifunctional composite film preparation device and a multifunctional composite film preparation system, which comprise a winding and unwinding unit and a steering unit, wherein an electroplating unit is arranged between the winding and unwinding unit and the steering unit, and the electroplating unit comprises an electroplating bath body, and a plurality of liquid interception columns, a plurality of conductive columns and a plurality of titanium blue columns which are arranged in the electroplating bath body. According to the multifunctional composite film preparation equipment provided by the embodiment of the invention, multiple times of continuous electroplating of the film can be realized only by one electroplating unit, so that the occupied area is small, and the cost is greatly saved. In addition, the arrangement positions of the plurality of liquid interception columns, the plurality of conductive columns and the plurality of titanium blue columns can be flexibly arranged, so that the travelling tension of the film in the electroplating bath body and the optimal electroplating distance between the film and the plurality of titanium blue columns can be well controlled; through setting up a plurality of electrically conductive poles, can have a small amount of electric current in every electrically conductive pole and prevent to lead the copper facing of electrical pillar, set up a plurality of electrically conductive poles in the plating solution in addition, avoided forming the metal crystallization on the electrically conductive pole, puncture the film.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of an apparatus for preparing a multifunctional composite film according to an embodiment of the present invention;
FIG. 2 is a top view of a first apparatus for producing a multifunctional composite film according to an embodiment of the present invention;
FIG. 3 is a top view of a second apparatus for producing a multifunctional composite film according to an embodiment of the present invention;
FIG. 4 is a plan view of an apparatus for manufacturing a third multifunctional composite film according to an embodiment of the present invention;
FIG. 5 is a side view of a titanium blue pillar according to an embodiment of the present invention;
FIG. 6 is a left side view of a plating cell body according to an embodiment of the invention;
FIG. 7 is a right side view of a plating cell body according to an embodiment of the invention;
FIG. 8 is a plan view of a fourth apparatus for producing a multifunctional composite film according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an overall system for preparing a multifunctional composite film according to an embodiment of the present invention.
The reference numbers illustrate:
1. a winding and unwinding unit; 2. a steering unit; 3. an electroplating unit; 4. a first transition unit; 5. a second transition unit;
11. unwinding rollers; 12. a wind-up roll; 21. a first steering roller; 22. a second turning roll; 30. a plating bath body;
311. a first slit; 312. a second slit; 313. a third gap; 314. a fourth gap;
321. a first cut-off liquid column; 322. a second liquid interception column; 323. a third liquid interception column; 324. a fourth liquid interception column; 325. a fifth liquid interception column; 326. a sixth cut-off column; 327. a seventh cut-off column; 328. an eighth cut liquid column;
301. a first liquid-barrier space; 302. a second liquid-barrier space; 303. a third liquid-tight space; 304. a fourth liquid-tight space;
331. a first titanium blue column; 332. a second titanium blue pillar; 333. a third titanium blue column; 334. a fourth titanium blue column; 335. a fifth titanium blue column; 336. a sixth titanium blue column; 337. a seventh titanium blue column; 338. an eighth titanium blue column; 339. a ninth titanium blue column;
341. a first conductive post; 342. a second conductive post; 343. a third conductive pillar; 344. a fourth conductive post; 345. a fifth conductive post; 346. a sixth conductive post; 347. a seventh conductive post; 348. an eighth conductive post;
3301. a frame body; 3302. a handle;
100. preparing equipment, 200, driving equipment; 300. a tension detection device; 400. and controlling the equipment.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Example one
As shown in fig. 1 to 8, a multifunctional composite film manufacturing apparatus 100 provided in an embodiment of the present invention includes a winding and unwinding unit 1, a turning unit 2, and an electroplating unit 3, where the electroplating unit 3 is disposed between the winding and unwinding unit 1 and the turning unit 2. In the traditional electroplating process, the film is horizontally transported, a plurality of electroplating baths are required to be arranged for realizing the continuous electroplating of the film for a plurality of times, and the electroplating baths are arranged in a straight line, so that the occupied space is large, the cost for arranging the electroplating baths is high, and the multifunctional composite film preparation equipment 100 provided by the embodiment of the invention can realize the continuous electroplating of the film for a plurality of times only by one electroplating unit 3, so that the occupied area is small, and the cost is greatly saved. In some embodiments, the plating unit 3 includes a plating tank body 30, and a plurality of liquid intercepting columns, a plurality of conductive columns, and a plurality of titanium blue columns vertically disposed in the plating tank body 30, wherein a first slit 311, a second slit 312, a third slit 313, and a fourth slit 314 are disposed on both side surfaces of the plating tank body 30, and a thin film to be prepared passes through between the first slit 311, the second slit 312, the third slit 313, and the fourth slit 314. The arrangement positions of the plurality of liquid interception columns, the plurality of conductive columns and the plurality of titanium blue columns in the embodiment of the invention can be flexibly arranged, and the tension of the film in the electroplating bath body 30 and the optimal electroplating distance between the film and the plurality of titanium blue columns can be well controlled. By arranging the plurality of conductive columns, a small amount of current can be carried in each conductive column to prevent the conductive column from being plated with copper, and the plurality of liquid interception columns, the plurality of conductive columns and the plurality of titanium blue columns in the electroplating bath body 30 are vertically arranged, so that only one end of each conductive column is required to be arranged in the electroplating bath body 30, the installation procedure is saved, and the space utilization rate inside the electroplating bath body 30 can be improved; in addition, the plurality of conductive columns are arranged in the plating solution, so that the conductive columns are prevented from forming metal crystals to puncture the thin film.
In some embodiments, the plurality of cut-off columns includes a first cut-off column 321, a second cut-off column 322, a third cut-off column 323, a fourth cut-off column 324, a fifth cut-off column 325, a sixth cut-off column 326, a seventh cut-off column 327, and an eighth cut-off column 328. The first cut-off column 321 and the second cut-off column 322 are vertically arranged at the liquid inlet end of the plating tank body 30, and a first liquid isolating space 301 is formed between the first cut-off column 321, the second cut-off column 322 and the side wall of the plating tank body 30 where the first gap 311 is located, namely the first cut-off column 321 and the second cut-off column 322 are respectively in contact with the side wall of the plating tank body 30 where the first gap 311 is located after being in contact with each other to form the first liquid isolating space 301, so that the plating solution in the plating tank body 30 is isolated from the first gap 311 through the first liquid isolating space 301, and the plating solution in the plating tank body 30 can be prevented from flowing out from the first gap 311; the third cut-off column 323 and the fourth cut-off column 324 are vertically arranged at the first turning end in the plating tank body 30, and a second liquid isolating space 302 is formed between the third cut-off column 323, the fourth cut-off column 324 and the side wall of the plating tank body 30 where the second gap 312 is located, namely, the third cut-off column 323 and the fourth cut-off column 324 are respectively in contact with the side wall of the plating tank body 30 where the second gap 312 is located to form the second liquid isolating space 302, and the plating solution in the plating tank body 30 is isolated from the second gap 312 through the second liquid isolating space 302, so that the plating solution in the plating tank body 30 can be prevented from flowing out from the second gap 312; the fifth cut-off column 325 and the sixth cut-off column 326 are vertically arranged at a second turning end in the plating bath body 30, and a third liquid isolating space 303 is formed between the fifth cut-off column 325, the sixth cut-off column 326 and the side wall of the plating bath body 30 where the third gap 313 is located, namely the fifth cut-off column 325 and the sixth cut-off column 326 are respectively in contact with the side wall of the plating bath body 30 where the third gap 313 is located after being in contact with each other to form the third liquid isolating space 303, and the plating solution in the plating bath body 30 can be prevented from flowing out of the third gap 313 through the third liquid isolating space 303 to separate the plating solution from the third gap 313; the seventh cut-off column 327 and the eighth cut-off column 328 are vertically disposed at the second turning end in the plating tank body 30, and a fourth liquid-blocking space 304 is formed between the sidewalls of the plating tank body 30 where the seventh cut-off column 327, the eighth cut-off column 328 and the fourth slit 314 are located, that is, the seventh cut-off column 327 and the eighth cut-off column 328 are respectively in contact with the sidewalls of the plating tank body 30 where the fourth slit 314 is located after being in contact with each other to form the fourth liquid-blocking space 304, and the plating solution is separated from the fourth slit 314 by the fourth liquid-blocking space 304, so that the plating solution can be prevented from flowing out of the fourth slit 314.
In some embodiments, the plurality of titanium blue pillars include a first titanium blue pillar 331, a second titanium blue pillar 332, and a third titanium blue pillar 333, the first titanium blue pillar 331, the second titanium blue pillar 332, and the third titanium blue pillar 333 are vertically disposed at the bottom of the plating bath body 30, an anode electrode is provided during plating of the first titanium blue pillar 331, the second titanium blue pillar 332, and the third titanium blue pillar 333, the anode electrode is provided by the first titanium blue pillar 331 when plating the second side of the conductive thin film, the anode electrode is provided for the first side of the conductive thin film by the second titanium blue pillar 332 when plating the first side of the conductive thin film, the anode electrode is provided for the second side of the conductive thin film by the third titanium blue pillar 333, it should be noted that the second titanium blue pillar 332 may provide the anode electrode twice for the first side of the thin film during plating, and perform a secondary plating of the thin film by disposing the first titanium blue pillar 331, the second titanium blue pillar 332, and the third titanium blue pillar 333, the electroplating quality is improved, and the cost is saved.
In some embodiments, the plurality of conductive pillars includes a first conductive pillar 341, a second conductive pillar 342, a third conductive pillar 343, and a fourth conductive pillar 344, wherein the first conductive pillar 341 and the second conductive pillar 342 are vertically disposed on a first side between the first titanium blue pillar 331 and the second titanium blue pillar 332, and the third conductive pillar 343 and the fourth conductive pillar 344 are vertically disposed on a first side between the second titanium blue pillar 332 and the third titanium blue pillar 333. The first conductive pillar 341 and the fourth conductive pillar 344 are disposed on and in contact with the first surface of the thin film to conduct electricity to the first surface of the thin film, and the second conductive pillar 342 and the third conductive pillar 343 are disposed on and in contact with the second surface of the thin film to conduct electricity to the second surface of the thin film. The conductive column in the embodiment is arranged in the plating solution, so that the formation of metal crystals on the conductive column, such as copper crystals, can be avoided, the thin film is damaged, and the preparation quality of the thin film is improved.
In some embodiments, the plurality of conductive pillars may further include a fifth conductive pillar 345, a sixth conductive pillar 346, a seventh conductive pillar 347, and an eighth conductive pillar 348, wherein the fifth conductive pillar 345 and the sixth conductive pillar 346 are vertically disposed on the second side between the first titanium blue pillar 331 and the second titanium blue pillar 332, and the seventh conductive pillar 347 and the eighth conductive pillar 348 are vertically disposed on the second side between the second titanium blue pillar 332 and the third titanium blue pillar 333. The first surface of the thin film is simultaneously electrically conducted through the first conductive pillar 341, the fourth conductive pillar 344, the fifth conductive pillar 345 and the eighth conductive pillar 348, and the second surface of the thin film is simultaneously electrically conducted through the second conductive pillar 342, the third conductive pillar 343, the sixth conductive pillar 346 and the seventh conductive pillar 347. In addition, the size of the conductive column in the embodiment can be set at will, so that the cost is further saved.
In some embodiments, referring to fig. 4, the plurality of titanium blue pillars further includes a fourth titanium blue pillar 334, a fifth titanium blue pillar 335, and a sixth titanium blue pillar 336 disposed on a first side of the first titanium blue pillar 331, the second titanium blue pillar 332, and the third titanium blue pillar 333, and the fourth titanium blue pillar 334, the fifth titanium blue pillar 335, and the sixth titanium blue pillar 336 are vertically disposed at the bottom of the plating bath body 30; the seventh titanium blue column 337, the eighth titanium blue column 338 and the ninth titanium blue column 339 are disposed on the second sides of the first titanium blue column 331, the second titanium blue column 332 and the third titanium blue column 333, and the seventh titanium blue column 337, the eighth titanium blue column 338 and the ninth titanium blue column 339 are vertically disposed at the bottom of the plating bath body 30, and anode electrodes are provided during the plating process by the plurality of titanium blue columns. In the embodiment of the invention, the plurality of titanium blue columns are arranged in the electroplating bath body 30, so that the two sides of the film can be electroplated for a plurality of times, the electroplating efficiency is improved, the space utilization rate of the electroplating bath body 30 can be improved, and the film preparation cost is reduced. In addition, in the embodiment of the present invention, the functions of the plurality of titanium blue pillars are the same, and the positions thereof may be interchanged with each other, and the embodiment of the present invention is only for convenience of describing the present invention and simplifying the description, and does not mean that each titanium blue pillar has a specific orientation.
In some embodiments, referring to fig. 5, a plurality of titanium blue pillars each having the same structure, each of the titanium blue pillars includes a frame 3301 having micro holes, the shape of the frame 3301 is preferably rectangular parallelepiped, of course, the shape of the frame 3301 may be arbitrarily set according to practical circumstances as long as it is able to uniformly electroplate the material to be plated on the conductive film, and a handle 3302 provided on the frame 3301, the handle 3302 is provided on the top of the frame 3301, and a metal ball, such as a copper ball, is provided in the frame 3301, and the diameter of the micro holes is smaller than that of the metal ball, so as to prevent the metal ball from leaking out of the frame. The titanium blue column can be conveniently taken out from the electroplating bath body 30 through the handle 3302, so that the metal ball can be conveniently added.
In addition, the bottom of the electroplating bath body 30 is provided with a plurality of grooves matched with the bottoms of the plurality of titanium blue columns, and the plurality of titanium blue columns are fixed in the electroplating bath body 30 through the plurality of grooves, so that the plurality of titanium blue columns and the electroplating bath body 30 can be conveniently detached and installed.
In some embodiments, the unwinding unit 1 comprises an unwinding roller 11 and a winding roller 12, and the turning unit 2 comprises a first turning roller 21 and a second turning roller 22, wherein the unwinding roller 11 and the first turning roller 21 are respectively aligned with the first slit 311 and the second slit 312, so that the film is linearly fed between the unwinding roller 11, the first slit 311, the second slit 312 and the first turning roller 21; the second turning roll 22 and the wind-up roll 12 are aligned with the third gap 313 and the fourth gap 314, respectively, so that the film is routed in a straight line between the wind-up roll 12, the third gap 313, the fourth gap 314 and the second turning roll 22. In the invention, the films are all linearly transported in the preparation process, the tension of the films is more convenient to control, the films are uniformly coated on the surfaces of the films, and the electroplating quality is improved. In addition, during the electroplating process, one or more observation lamps may be respectively disposed between the second gap 312 and the first steering roller 21 and between the third gap 313 and the second steering roller 22, so as to facilitate observation of the film coating condition of the film, for example, whether a hole appears on the film surface of the film or whether the color of the film coating is consistent, and the position of the film where the defects appear may be located, so as to facilitate adjustment of the film coating strategy at any time, for example, whether the hole on the film or the defect such as color of the film coating appears in the section between the unwinding roller 11 and the first steering roller 21, or in the section between the second steering roller 22 and the winding roller 12, so as to facilitate adjustment at any time.
In some embodiments, referring to fig. 8, the preparation apparatus 100 further includes a first transition unit 4 disposed between the winding and unwinding unit 1 and the electroplating unit 3; and a second transition unit 5 disposed between the plating unit 3 and the steering unit 2. By arranging the first transition unit 4 and the second transition unit 5 on two sides of the electroplating unit 3, the phenomenon that the plating solution brought out in the film tape-moving process overflows to cause environmental pollution can be avoided. Preferably, a pump body may be disposed in each of the first transition unit 4 and the second transition unit 5, and the plating solutions in the first transition unit 4 and the second transition unit 5 are pumped back to the plating tank body 30, so as to avoid waste of the plating solutions.
The working principle of the embodiment of the invention is as follows:
the film to be prepared is unreeled by the unreeling roller 11, passes through the first transition unit 4, enters the plating bath body 30 through the first gap 311, sequentially passes through the first liquid interception column 321, the second liquid interception column 322, the first conductive column 341, the second conductive column 342, the fifth conductive column 345, the sixth conductive column 346, the third liquid interception column 323 and the fourth liquid interception column 324, passes through the second gap 312, and is diverted by the first diverting roller 21 and the second diverting roller 22, so that the conductive film after being deflected passes through the third gap 313 and enters the plating bath body 30 again, the third conductive column passes through the fifth liquid interception column 325, the sixth liquid interception column 326, the seventh conductive column 347, the eighth conductive column 348, the third conductive column 343, the fourth conductive column 344, the seventh liquid interception column 327, and the eighth liquid interception column 328 in sequence, then passes through the fourth gap 314, and is wound by the winding roll 12.
In this process, the plurality of titanium blue pillars provide anode electricity during the electroplating process, the first surface of the conductive thin film is electrically conducted through the first conductive pillar 341 and the fifth conductive pillar 345, the second conductive pillar 342 and the sixth conductive pillar 346 are electrically conducted to the second surface of the conductive thin film, a first electroplating circulation loop is formed between the eighth titanium blue pillar 338, the plating solution in the plating tank body 30 and the first surface of the conductive thin film, a second electroplating circulation loop is formed between the seventh titanium blue pillar 337, the plating solution in the plating tank body 30 and the second surface of the conductive thin film, a third electroplating circulation loop is formed between the second titanium blue pillar 332, the plating solution in the plating tank body 30 and the first surface of the conductive thin film, a fourth electroplating circulation loop is formed between the first titanium blue pillar 331, the plating solution in the plating tank body 30 and the second surface of the conductive thin film, a fifth electroplating circulation loop is formed between the fifth titanium blue pillar 335, the plating solution in the plating tank body 30 and the first surface of the conductive thin film, a sixth electroplating circulation loop is formed among the fourth titanium blue column 334, the plating solution in the plating bath body 30 and the second surface of the conductive film, a seventh electroplating circulation loop is formed among the fifth titanium blue column 335, the plating solution in the plating bath body 30 and the first surface of the conductive film, an eighth electroplating circulation loop is formed among the sixth titanium blue column 336, the plating solution in the plating bath body 30 and the second surface of the conductive film, and the second titanium blue column 332, a ninth plating circulation loop is formed between the plating solution in the plating bath body 30 and the first surface of the conductive film, a tenth plating circulation loop is formed between the plating solution in the third titanium blue column 333, the plating solution in the plating bath body 30, and the second surface of the conductive film, an eleventh plating circulation loop is formed between the eighth titanium blue column 338, the plating solution in the plating bath body 30, and the first surface of the conductive film, and a twelfth plating circulation loop is formed between the ninth titanium blue column 339, the plating solution in the plating bath body 30, and the second surface of the conductive film.
The first surface of the conductive film is continuously coated for a plurality of times through the first electroplating circulating loop, the third electroplating circulating loop, the fifth electroplating circulating loop, the seventh electroplating circulating loop, the ninth electroplating circulating loop and the eleventh electroplating circulating loop, and the second surface of the conductive film is continuously coated for a plurality of times through the second electroplating circulating loop, the fourth electroplating circulating loop, the sixth electroplating circulating loop, the eighth electroplating circulating loop, the tenth electroplating circulating loop and the twelfth electroplating circulating loop.
Example two
As shown in fig. 9, an embodiment of the present invention provides a multifunctional composite film manufacturing system, including: the manufacturing apparatus 100, the driving apparatus 200, the tension detecting apparatus 300, and the control apparatus 400 of any one of the above, the driving apparatus 200 is provided at a lower portion of the plating unit 3 in the manufacturing apparatus 100 for providing a driving force to the manufacturing apparatus 100, the tension detecting apparatus 300 is provided at a lower portion of the steering unit 2 in the manufacturing apparatus 100 for detecting a tension of the film in the manufacturing apparatus 100 and feeding back the tension to the control apparatus 400, and the control apparatus 400 is used for controlling an operating state of the manufacturing apparatus 100. The drive device 200 may comprise one or more drive motors, the power outputs or output shafts of which are connected to the respective rollers.
Specifically, the power is controlled to be turned on or off by the control device 400 to control the operating state of the preparation device 100. When the manufacturing equipment 100 is started, the manufacturing equipment 100 starts electroplating, in the electroplating process, the tension force applied to the film surface on the steering unit 2 (i.e. the first steering roller 21 and the second steering roller 22) is detected by the tension force detection equipment 300, the detected tension force (tension value) is fed back to the control equipment 400, the control equipment 400 can automatically control and adjust the rotating speed of the driving equipment 200 according to the fed-back film tension value, or an alarm module gives an alarm to an operator, and the control panel above the alarm module receives parameters set by the operator to control the rotating speed of the driving equipment 200, so that the rotating speeds of the first steering roller 21 and the second steering roller 22 are controlled, the tension force applied to the film is adjusted at any time, the film is in an optimal tension state in the whole electroplating process, and the yield of film production is improved. The alarm module comprises an audible and visual alarm module arranged on the site, or a display screen on a control panel is used for displaying alarm information, or a communication module is used for sending alarm information with the film tension value exceeding the limit to communication equipment, an email account number, a social media account number or an application program APP of an operator based on the Internet of things, the Internet or a mobile communication network. Alternatively, the control device 400 may automatically determine the rotation speed of the driving device 200 according to the fed back film tension value and a correspondence table between the film tension value preset in the program and the rotation speed of the driving device 200, so as to implement adaptive control of the dynamic rotation speed. Alternatively, the control device 400 may also obtain an output value of the model, that is, the rotation speed of the driving device 200, as an optimal rotation speed according to the fed-back film tension value and a pre-trained artificial intelligence model (e.g., a neural network model), and control the driving device 200 to operate at the optimal rotation speed. Further, the control apparatus 400 is also used to control the operating current of each conductive post.
In the description of the embodiment of the present invention, it should be noted that the number of the conductive pillars, the number of the steering rollers, and the number of the titanium blue pillars may be arbitrarily adjusted according to practical situations, and the embodiment of the present invention is not limited. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein. The terms "upper, lower, inner and outer" and the like refer to orientations and positional relationships based on those shown in the drawings, and are used for convenience in describing and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted, connected" and the like are to be understood broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A multifunctional composite film production apparatus (100), wherein the production apparatus (100) comprises: receive and unreel unit (1), turn to unit (2) and electroplate unit (3), it sets up to electroplate unit (3) receive and unreel unit (1) with turn to between unit (2).
2. The multifunctional composite thin film production apparatus (100) according to claim 1, wherein the plating unit (3) comprises a plating tank body (30), and a plurality of cutoff columns, a plurality of conductive columns, and a plurality of titanium blue columns vertically disposed in the plating tank body (30), wherein,
a first gap (311), a second gap (312), a third gap (313) and a fourth gap (314) are vertically arranged on two side surfaces of the electroplating bath body (30), and a conductive film to be prepared penetrates through the first gap (311), the second gap (312), the third gap (313) and the fourth gap (314).
3. The multifunctional composite membrane production apparatus (100) according to claim 2, wherein said plurality of cutoff columns comprises:
the first liquid interception column (321) and the second liquid interception column (322) are vertically arranged at a liquid inlet end in the electroplating bath body (30), and a first liquid isolation space (301) is formed among the first liquid interception column (321), the second liquid interception column (322) and the side wall of the electroplating bath body (30) where the first gap (311) is located;
a third liquid interception column (323) and a fourth liquid interception column (324), which are vertically arranged at the first turning end in the electroplating bath body (30), and a second liquid isolation space (302) is formed between the third liquid interception column (323), the fourth liquid interception column (324) and the side wall of the electroplating bath body (30) where the second gap (312) is located;
a fifth liquid interception column (325) and a sixth liquid interception column (326) which are vertically arranged at a second turning end in the electroplating bath body (30), and a third liquid isolation space (303) is formed among the fifth liquid interception column (325), the sixth liquid interception column (326) and the side wall of the electroplating bath body (30) where the third gap (313) is located;
a seventh liquid interception column (327) and an eighth liquid interception column (328), which are vertically disposed at a second turning end of the plating tank body (30), and a fourth liquid isolation space (304) is formed between the seventh liquid interception column (327), the eighth liquid interception column (328) and a sidewall of the plating tank body (30) where the fourth gap (314) is located.
4. The multifunctional composite film production apparatus (100) according to claim 3, wherein said plurality of titanium blue pillars comprises:
a first titanium blue column (331), a second titanium blue column (332) and a third titanium blue column (333), wherein the first titanium blue column (331), the second titanium blue column (332) and the third titanium blue column (333) are vertically arranged at the bottom of the electroplating bath body (30).
5. The multifunctional composite film manufacturing apparatus (100) according to claim 4, wherein said plurality of conductive posts comprises:
a first conductive pillar (341) and a second conductive pillar (342) vertically disposed on a first side between the first titanium blue pillar (331) and the second titanium blue pillar (332);
a third conductive pillar (343) and a fourth conductive pillar (344) vertically disposed on a first side between the second titanium blue pillar (332) and the third titanium blue pillar (333);
a fifth conductive pillar (345) and a sixth conductive pillar (346) vertically disposed on a second side between the first titanium blue pillar (331) and the second titanium blue pillar (332);
a seventh conductive post (347) and an eighth conductive post (348) disposed vertically on a second side between the second titanium blue post (332) and the third titanium blue post (333).
6. The multifunctional composite film production apparatus (100) according to claim 5, wherein said plurality of titanium blue pillars further comprises:
a fourth titanium blue column (334), a fifth titanium blue column (335), and a sixth titanium blue column (336) disposed on a first side of the first titanium blue column (331), the second titanium blue column (332), and the third titanium blue column (333), and the fourth titanium blue column (334), the fifth titanium blue column (335), and the sixth titanium blue column (336) are vertically disposed at the bottom of the plating bath body (30);
a seventh titanium blue column (337), an eighth titanium blue column (338), and a ninth titanium blue column (339) disposed at second sides of the first titanium blue column (331), the second titanium blue column (332), and the third titanium blue column (333), and the seventh titanium blue column (337), the eighth titanium blue column (338), and the ninth titanium blue column (339) are vertically disposed at a bottom of the plating bath body (30).
7. The multifunctional composite film manufacturing apparatus (100) according to claim 6, wherein each of the plurality of titanium blue pillars comprises a frame body (3301) having micro holes, and a handle (3302) provided on the frame body (3301), and a metal ball is provided in the frame body (3301);
the bottom of the electroplating bath body (30) is provided with a plurality of grooves matched with the bottoms of the plurality of titanium blue columns, and the plurality of titanium blue columns are fixed in the electroplating bath body (30) through the plurality of grooves.
8. The multifunctional composite film manufacturing apparatus (100) according to claim 7, wherein the unwinding unit (1) comprises an unwinding roller (11) and a winding roller (12), and the turning unit (2) comprises a first turning roller (21) and a second turning roller (22), wherein,
-said unwinding roller (11) and said first turning roller (21) are aligned with said first slit (311) and said second slit (322), respectively, so that said film is fed in a straight line between said unwinding roller (11), said first slit (311), said second slit (322) and said first turning roller (21);
the second turning roll (22) and the take-up roll (12) are aligned with the third gap (313) and the fourth gap (314), respectively, such that the film is fed in line between the take-up roll (12), the third gap (313), the fourth gap (314) and the second turning roll (22).
9. The multifunctional composite film production apparatus (100) according to claim 8, wherein said production apparatus (100) further comprises:
the first transition unit (4) is arranged between the winding and unwinding unit (1) and the electroplating unit (3) and is used for receiving the plating solution overflowing from the electroplating bath body (30) and the plating solution brought out by the film during the tape running;
and the second transition unit (5) is arranged between the electroplating unit (3) and the turning unit (2) and is used for receiving the plating solution overflowing from the electroplating bath body (30) and the plating solution brought out by the film during the tape running.
10. A system for preparing a multifunctional composite film, the system comprising:
the production apparatus (100) according to any one of claims 1 to 9, a driving apparatus (200), a tension detecting apparatus (300), and a control apparatus (400), the driving apparatus (200) being provided at a lower portion of a plating unit (3) in the production apparatus (100) for providing a driving force to the production apparatus (100), the tension detecting apparatus (300) being provided at a lower portion of a turning unit (2) in the production apparatus (100) for detecting a tension of a thin film in the production apparatus (100) and feeding back the tension to the control apparatus (400), the control apparatus (400) being for controlling an operating state of the production apparatus (100).
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| CN101956221A (en) * | 2010-09-30 | 2011-01-26 | 深圳市信诺泰创业投资企业(普通合伙) | Continuous plating device for films and method for performing continuous plating on films |
| CN106637366A (en) * | 2017-01-18 | 2017-05-10 | 武汉光谷创元电子有限公司 | Electroplating device |
| JP2017222907A (en) * | 2016-06-15 | 2017-12-21 | 住友金属鉱山株式会社 | Plating device |
| JP2018204049A (en) * | 2017-05-31 | 2018-12-27 | 住友金属鉱山株式会社 | Production method and production apparatus of copper-clad laminated resin film |
| CN212451694U (en) * | 2020-04-30 | 2021-02-02 | 深圳市元子科技有限公司 | Water electroplating equipment for electroplating processing of surface of flexible film substrate |
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2021
- 2021-11-22 CN CN202111388735.2A patent/CN114232060B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101956221A (en) * | 2010-09-30 | 2011-01-26 | 深圳市信诺泰创业投资企业(普通合伙) | Continuous plating device for films and method for performing continuous plating on films |
| JP2017222907A (en) * | 2016-06-15 | 2017-12-21 | 住友金属鉱山株式会社 | Plating device |
| CN106637366A (en) * | 2017-01-18 | 2017-05-10 | 武汉光谷创元电子有限公司 | Electroplating device |
| JP2018204049A (en) * | 2017-05-31 | 2018-12-27 | 住友金属鉱山株式会社 | Production method and production apparatus of copper-clad laminated resin film |
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