CN114231205B - Heat-resistant UV (ultraviolet) adhesive-reducing tape - Google Patents
Heat-resistant UV (ultraviolet) adhesive-reducing tape Download PDFInfo
- Publication number
- CN114231205B CN114231205B CN202111675087.9A CN202111675087A CN114231205B CN 114231205 B CN114231205 B CN 114231205B CN 202111675087 A CN202111675087 A CN 202111675087A CN 114231205 B CN114231205 B CN 114231205B
- Authority
- CN
- China
- Prior art keywords
- adhesive
- adhesive layer
- parts
- meth
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides a heat-resistant UV (ultraviolet) viscosity reducing adhesive tape, which comprises a substrate and an adhesive layer arranged on one side of the substrate, wherein a release coating is arranged on one side of the substrate on the opposite side of the adhesive layer, the Young modulus of the adhesive layer at 100 ℃ is more than 50000Pa, the adhesive force of the adhesive layer to an adherend reaches more than 100gf/25mm when the adhesive layer is used at a high temperature of 120 ℃, the peeling is effectively prevented, the yield is greatly improved, the peeling force of the adhesive layer to the adherend is less than 50gf/25mm under the normal temperature condition after high-temperature molding, the adhesive layer can be easily peeled, and the residual adhesive is effectively improved. According to the invention, the high-modulus acrylic adhesive under the high-temperature condition is selected, so that the high-modulus acrylic adhesive has higher elastic modulus during high-temperature molding, meanwhile, the photosensitizer and the UV resin are matched, the adhesive can be rapidly reduced in a UV short-time irradiation mode after the adhesive is used, the operation efficiency is improved, and the resin containing amino can be self-crosslinked and solidified under the high-temperature condition, so that the hardness of the adhesive is improved, and the residual adhesive is effectively improved.
Description
Technical Field
The invention relates to the technical field of composite material processing technology, in particular to a heat-resistant UV (ultraviolet) viscosity-reducing adhesive tape.
Background
With the development of ever-thinner smart phones, especially 5G smart phones, in order to avoid interference of 5G signals, the current rear cover of the smart phone does not use metal materials, but adopts glass and composite materials, such as PC-PMMA composite materials, etc. In order to protect the surface of the composite material from being damaged in the forming process, a protective tape is attached to one side surface of the composite material, for example, the composite material is formed by heating at 160 ℃ for 2-3 min to soften the material, and then cooled to normal temperature after the high-temperature forming process, and then the protective tape is peeled off. In the prior art, the adhesive tape often falls off or bubbles due to insufficient viscosity in the high-temperature forming process, and the adhesive tape can pollute the surface of an adherend by residual adhesive, and the adhesive tape has large stripping force under normal temperature after forming, so that stripping is difficult to perform.
Disclosure of Invention
The invention aims to provide a heat-resistant UV (ultraviolet) visbreaking adhesive tape which not only can realize excellent adhesive force to an adherend in high-temperature molding, but also can be easily peeled off from the adherend under normal temperature conditions after high-temperature molding, and can not generate residual adhesive.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a heat-resistant UV-reducing adhesive tape comprising a substrate 2, an adhesive layer 1 provided on one side of the substrate 2, a release coating 3 provided on the side of the substrate 2 opposite to the side on which the adhesive layer 1 is provided, the adhesive layer 1 being a heat-resistant UV-reducing adhesive layer, characterized in that the heat-resistant UV-reducing adhesive tape has a luminous intensity of 300mJ/cm 2 ～600mJ/cm 2 The wavelength is 365nm, the viscosity is reduced after the UV light irradiation under the condition of at least 10s, and the stripping force can reach below 50gf/25 mm.
Further, the Young's modulus of the adhesive layer 1 at 100 ℃ is 50000Pa or more, and the adhesion force of the adhesive layer 1 to an adherend at 120 ℃ high temperature is 100gf/25mm or more.
Further, the adhesive layer 1 includes an adhesive substance for imparting tackiness, the adhesive substance being selected from one or more of a rubber-based adhesive such as natural rubber, synthetic rubber, etc., a silicone-based adhesive, an acrylic-based adhesive, a vinyl alkyl ether-based adhesive, a polyester-based adhesive, a polyamide-based adhesive, a polyurethane-based adhesive, or a styrene-diene block copolymer-based adhesive.
Preferably, the adhesive substance of the adhesive layer 1 is selected from acrylic adhesives based on acrylic polymers obtained by copolymerizing an alkyl (meth) acrylate or a cycloalkyl ester selected from alkyl (meth) acrylates or cycloalkyl esters having a linear or branched alkyl group having 1 to 22 carbon atoms with other functional group-containing monomers having improved adhesion, and the functional group-containing monomers having one or more of carboxyl groups and hydroxyl groups.
Preferably, the monomers used for polymerization to form the acrylic polymer further include one or more monomers containing aromatic groups, ester ring groups.
Further, the functional group-containing monomer is used in an amount of 40% by weight or less of the total monomer components, at least 0.1% by weight or more of the total monomer components.
Further, the soluble portion of the acrylic polymer has a weight average molecular weight of at least 7.5X10 5 g/mol or more, and the glass transition temperature Tg of the acrylic polymer is at least-35 ℃.
Further, the adhesive layer 1 comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of photo-curing resin (UV resin), 0.5-1.5 parts of photoinitiator, 0.5-5 parts of curing agent and 5-20 parts of resin with amino groups, wherein the amino groups are selected from one or more of urea formaldehyde resin (UF), melamine formaldehyde resin (MF), alkyl melamine formaldehyde resin, aniline formaldehyde resin and polyamide polyamine epichlorohydrin (PAE).
Further, the base material 2 is an elastic material having an elongation after stretching of at least 120% or more, and the elastic material is one selected from a polyvinyl chloride film (PVC film), a polynaphthalate film (PN film), a polyolefin copolymer film (PO film) and a polyolefin film.
Further, a release layer 4 is further disposed on the outermost side of at least one side of the adhesive layer 1.
The invention ensures higher elastic modulus in high-temperature molding by selecting the high-modulus adhesive under high-temperature condition, adopts the photosensitizer to match with the UV resin, can rapidly reduce viscosity in a short-time UV irradiation mode after use, improves the operation efficiency, and adopts the amino-containing resin to carry out self-crosslinking curing under high-temperature environment, thereby improving the hardness of the adhesive and effectively improving the residual adhesive. Compared with the prior art, the invention has the beneficial effects that: the adhesive force to the adhered object reaches more than 100gf/25mm when the adhesive is used at a high temperature of 120 ℃, the falling off is effectively prevented, the yield is greatly improved, the peeling force to the adhered object after high-temperature molding is not more than 50gf/25mm under the normal temperature condition, the adhered object can be easily peeled, and the residual adhesive is effectively improved.
Drawings
FIG. 1 is a schematic view of the structure of a heat-resistant UV-curable adhesive tape in accordance with a preferred embodiment of the present invention;
FIG. 2 is another schematic structural view of a heat resistant UV curable adhesive tape in accordance with a preferred embodiment of the present invention;
FIG. 3 is a schematic view of still another construction of a heat resistant UV curable adhesive tape in accordance with a preferred embodiment of the present invention;
reference numerals illustrate:
1: an adhesive layer; 2: a substrate; 3: a release coating; 4: and (5) a release layer.
Detailed Description
The invention will now be described in further detail with reference to the drawings and to specific examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in FIG. 1, the heat-resistant UV-reducing adhesive tape provided by the invention comprises a substrate 2 and an adhesive layer 1 arranged on one side of the substrate 2, wherein the adhesive layer 1 is a heat-resistant UV-reducing adhesive layer, and the light intensity of the heat-resistant UV-reducing adhesive tape is 300mJ/cm 2 ～600mJ/cm 2 The wavelength is 365nm, the adhesion can be reduced rapidly after the UV light irradiation under the condition that the illumination time is at least 10s, and the stripping force can reach below 50gf/25 mm;
the Young's modulus of the adhesive layer 1 at 100 ℃ is preferably 50000Pa or more, and the Young's modulus of the adhesive layer 1 is within the above range, so that the adhesive layer 1 can be ensured to have excellent adhesive force to an adherend when used at a high temperature of 120 ℃ and can reach 100gf/25mm or more;
the adhesive layer 1 includes an adhesive substance for imparting tackiness, and as the adhesive substance, one or more of a rubber-based adhesive such as natural rubber, synthetic rubber, and the like, a silicone-based adhesive, an acrylic-based adhesive, a vinyl alkyl ether-based adhesive, a polyester-based adhesive, a polyamide-based adhesive, a polyurethane-based adhesive, and a styrene-diene block copolymer-based adhesive are selected;
in order to ensure excellent adhesion to an adherend when the adhesive layer 1 is used at a high temperature of 120 ℃, an acrylic adhesive or the like may be used, which is preferably an acrylic adhesive comprising an acrylic polymer (homopolymer or copolymer) as a base polymer, preferably a polymer comprising one or two or more alkyl (meth) acrylates or cycloalkyl esters as a main monomer, and optionally a polymer comprising an alkyl (meth) acrylate or cycloalkyl ester as a main monomer copolymerized with other functional group-containing monomers for improving adhesion, as required;
examples of the alkyl (meth) acrylate or cycloalkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, eicosanyl (meth) acrylate, and undecyl (meth) acrylate, alkyl (meth) acrylates or cycloalkyl esters having a linear or branched alkyl group having 1 to 22 carbon atoms such as behenyl (meth) acrylate; in order to improve the young's modulus of the adhesive layer 1 at a high temperature, for example, at 100 ℃, among the above monomers, the alkyl (meth) acrylate or the cycloalkyl ester is preferably a monomer having a molecular chain length, preferably an alkyl (meth) acrylate or a cycloalkyl ester having 4 to 20 carbon atoms in the alkyl group, more preferably an alkyl (meth) acrylate or a cycloalkyl ester having 4 to 12 carbon atoms in the alkyl group, still more preferably 2-ethylhexyl acrylate (2-EHA), n-butyl acrylate; in the present invention, (meth) acrylate means acrylate or methacrylate, and "(meth)" in the present invention means all of the same meanings;
examples of the functional group-containing monomer include carboxyl group-containing monomers such as (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid; anhydride monomers such as maleic anhydride and itaconic anhydride;
hydroxy (hydroxy) containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, 4-hydroxymethylcyclohexyl (meth) methyl (meth) acrylate, vinyl alcohol, allyl alcohol and the like; cyano-containing monomers such as (meth) acrylonitrile; amide group-containing monomers such as (meth) acrylamide; n-substituted amide group-containing monomers such as N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-dimethyl (meth) acrylamide, N-t-butyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-octylacrylamide, and N-carboxyethyl acrylamide; amino group-containing monomers such as aminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; glycidyl group-containing monomers such as glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate; sulfonic acid group-containing monomers such as styrene sulfonic acid, propenyl sulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamide propane sulfonic acid, thiopropyl methacrylate, and (meth) acryloxynaphthalene sulfonic acid; phosphate group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; among the functional group-containing monomers, carboxyl group-containing monomers and hydroxyl group-containing monomers are preferable, and acrylic acid and hydroxyethyl acrylate are more preferable; in order to improve the Young's modulus of the adhesive layer 1 at a high temperature, for example, 100 ℃, the functional group-containing monomer is preferably a monomer having a glass transition temperature of at least 50 ℃ or more, for example, acrylamide, methyl methacrylate, or the like; the functional group-containing monomer may be used in an amount of 1 or 2 or more than 2; the functional group-containing monomer is preferably used in an amount of 40% by weight or less of the total monomer components, more preferably 20% by weight or less of the total monomer components, at least 0.1% by weight or more of the total monomer components, preferably 0.5% by weight or more of the total monomer components, more preferably 2% by weight or more of the total monomer components, and still more preferably 5% by weight or more of the total monomer components;
for the purpose of promoting crosslinking, the acrylic polymer may contain a polyfunctional monomer or the like as a comonomer component, and examples thereof include hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, polyurethane (meth) acrylate, and the like; the polyfunctional monomer may be used in an amount of 1, 2 or more than 2; the amount of the polyfunctional monomer is preferably 30% by weight or less of the total monomer components;
the acrylic polymer is prepared by polymerizing 1 monomer or a mixture of 2 or more monomers; the polymerization may be carried out by any means such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc.; since the increase of the molecular weight is favorable for improving the Young's modulus of the adhesive layer 1 at high temperature, the polymerization temperature is controlled to be more proper at 60 ℃, and the high molecular weight acrylic polymer is favorable for being obtained when the initiator is decomposed; the initiator may be chosen from Azobisisobutyronitrile (AIBN) in order to achieve a weight average molecular weight of the soluble fraction of the acrylic polymer of 7.5X10 5 The amount of the initiator used in the polymerization is preferably controlled within 0.5 Phr;
preferably, the adhesive layer 1 comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of photo-curing resin (UV resin), 0.5-1.5 parts of photoinitiator and 0.5-5 parts of curing agent; the adhesive layer 1 may be controlled by adjusting the composition of the base polymer, the type and composition of the photo-curing resin, the type and composition of the curing agent, and the like; for example, the initial young's modulus of the adhesive layer 1 may be controlled by adjusting monomers used for polymerization to form the base polymer, controlling the glass transition temperature Tg of the base polymer, crosslinking density, and the like;
in order to ensure that the Young's modulus of the adhesive layer 1 reaches 50000Pa or more at a high temperature, for example, 100 ℃, the monomer for polymerization to form an acrylic polymer further includes a monomer having a relatively large molecular weight such as an aromatic group, an ester ring group, etc., and examples thereof include benzyl acrylate (BZA), isobornyl acrylate (IBOA), etc.; on the other hand, it is preferable that the weight average molecular weight of the soluble portion of the acrylic polymer is preferably at least 7.5X10 5 g/mol or more, the glass transition temperature Tg of the acrylic polymer is preferably at least-35 ℃ or more;
the adhesive layer 1 includes a photo-curable resin (UV resin) which may be selected from one or more of modified epoxy acrylic resin, urethane acrylate and polyester acrylate; preferably, the modified epoxy acrylic resin is bisphenol a epoxy acrylic resin;
the adhesive layer 1 comprises a photoinitiator, which may be one or more of benzophenone, acetophenone, anthraquinone, preferably two or more of 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide (TPO), and a photoinitiator 184, for widening the UV wavelength range suitable for photocuring the adhesive layer 1
One or more of (Irgacure 184,1-hydroxycyclohexyl phenyl ketone), photoinitiator 127 (Irgacure 127,1,1' - (methylenebis-4, 1-phenylene) bis [ 2-hydroxy-2-methyl-1-propanone ]);
the adhesive layer 1 also comprises 5-20 parts by weight of resin with amino groups, and can be self-crosslinked and cured in a high-temperature environment, so that the hardness of the adhesive layer 1 is improved, and the problem of residual glue is solved; the amino resin can be selected from one or more of urea formaldehyde resin (UF), melamine formaldehyde resin (MF), alkyl melamine formaldehyde resin, aniline formaldehyde resin and polyamide polyamine epichlorohydrin (PAE); in order to improve cohesive strength of the adhesive layer 1, amino resins having a larger molecular weight and a larger molecular structure, such as melamine formaldehyde resin (MF), are preferable;
the adhesive layer 1 comprises a curing agent, wherein the curing agent can be one or more of an epoxy curing agent and an isocyanate curing agent; preferably, the epoxy curing agent is one or more of aliphatic amine, alicyclic amine, aromatic amine, polyamide, anhydride, resin or tertiary amine; preferably, the epoxy curing agent is one or more of Diamine Diphenyl Sulfone (DDS), modified amine curing agent (MA) or Dicyandiamide (DICY); preferably, the isocyanate curing agent is selected from one or more of HDI curing agent, MDI curing agent, XDI curing agent, HMDI, TDI or IPDI curing agent;
the base material 2 may be an elastic material having good expansibility, preferably an elastic material having an elongation after stretching of at least 120%, such as a polyvinyl chloride film (PVC film), a polynaphthalate film (PN film), a polyolefin copolymer film (PO film) or a polyolefin film, preferably a polyolefin copolymer film (PO film), a polyvinyl chloride film (PVC film), and a polyolefin film is preferably a polypropylene film (PP film); the thickness is not particularly limited and may be adjusted according to the actual situation, and is preferably in the range of 30 μm to 150 μm, more preferably in the range of 50 μm to 100 μm; the release coating 3 is provided on the opposite side of the substrate 2 from the adhesive layer 1, and the release coating 3 may be selected from the currently known back surface treatment techniques, such as a silicon-containing release coating, a hard-acyl urethane polyethylene finger, and the like;
as shown in fig. 2, the heat-resistant UV-curable adhesive tape according to the present invention may be provided with a release layer 4 on the side opposite to the substrate 2 of the adhesive layer 1, the release layer 4 is used for protecting the layer of the adhesive layer 1, the release layer 4 is not particularly limited, and conventionally known release films, for example, polyester release films (PET), fluorine release films, silicone release films, silicon-free release films or release papers may be used according to actual conditions, and the thickness thereof is not particularly limited, and may be adjusted according to actual conditions, preferably in the range of 25 μm to 100 μm, and more preferably in the range of 25 μm to 50 μm;
as shown in fig. 3, the heat-resistant UV-reducing adhesive tape provided by the present invention may be a double-sided adhesive tape including a base material 2, adhesive layers 1 respectively provided on both sides of the base material 2, a release layer 4 provided on a side of the adhesive layers 1 opposite to the base material 2;
examples
The present invention is described in more detail below by referring to examples, but the present invention is not limited to these examples; the tapes obtained in examples and comparative examples were evaluated by the following methods;
young's modulus: coating an adhesive substance on a release material by a rotary rheometer through a hand scraping rod, drying in an oven at 120 ℃ for 2-3 min to remove redundant solvent, preparing an adhesive into a 1mm thick adhesive layer, then placing the adhesive layer on a die of the rheometer, heating from normal temperature to 150 ℃ under the condition of fixing the frequency of 1Hz, and obtaining Young modulus data of the adhesive layer through software processing;
appearance after high temperature molding: cutting a 25mm (MD direction) multiplied by 150mm (TD direction) adhesive tape sample, repeatedly pressing and attaching the adhesive tape sample to the PMMA surface of the PC-PMMA composite material by a 2kg roller for one time, standing for 2-3 min at 160 ℃ under the high temperature condition of 50% RH to soften the composite material, and then cooling to normal temperature; visual observation and hand touch were used to confirm the appearance of the tape after molding the composite material at high temperature, and the samples without floating and bubbles were evaluated as "o", and the samples with floating and bubbles were evaluated as "x";
and (5) residual glue inspection after high-temperature molding: cutting a 25mm (MD direction) by 150mm (TD direction) adhesive tape sample, applying the adhesive tape sample onto an SUS304 plate by a 2kg roller in a reciprocating manner, standing for 20-40 min at 120 ℃ under 50% RH, peeling the sample with the appearance tested by a universal tensile compression tester at 120 ℃ and 50% RH at a stretching speed of 300mm/min in a direction of 180 DEG, confirming the residual adhesive state on a stainless steel plate (SUS 304) by visual observation and manual touch, evaluating the sample with basically no residual adhesive on the stainless steel plate (SUS 304) as an O, and evaluating the sample with residual adhesive on the plate as an X;
adhesion at 120 ℃ environment: cutting a 25mm (MD direction) by 150mm (TD direction) adhesive tape sample, applying the adhesive tape sample to a stainless steel plate (SUS 304) by a 2kg roller in a reciprocating and once pressing manner, standing for 20-40 min at 120 ℃ under 50% RH, and measuring the peeling strength of the adhesive tape in a 180 DEG peeling direction at 23 ℃ and 50% RH by a universal tensile compression tester at a stretching speed of 300mm/min to obtain adhesive force;
residual gum inspection after stripping at 120 ℃): the adhesive force of the sample was measured, the residual adhesive state on the stainless steel plate (SUS 304) was confirmed by visual observation and hand touch, the sample without residual adhesive was evaluated as "o", and the sample with residual adhesive was evaluated as "x";
peel force before UV irradiation: cutting a 25mm (MD direction) by 150mm (TD direction) adhesive tape sample, applying the adhesive tape sample onto a stainless steel plate (SUS 304) by a 2kg roller in a reciprocating and once pressing manner, standing for 30min at normal temperature, and measuring the peeling strength of the adhesive tape in a 180 DEG peeling direction by a universal tensile compression tester at 23 ℃ and 50% RH at a stretching speed of 300mm/min to obtain the peeling strength before UV irradiation;
peel force after UV irradiation: a25 mm (MD direction). Times.150 mm (TD direction) tape sample was cut, and was attached to a stainless steel plate (SUS 304) by reciprocating and once pressing with a 2kg roller, and the irradiation intensity by UV irradiation was 500mJ/cm 2 Reducing the viscosity of the adhesive tape under the condition of illumination time of 10s, measuring the peeling strength of the adhesive tape in the 180 DEG peeling direction by using a universal tension-compression tester at 23 ℃ and 50% RH at a stretching speed of 300mm/min, and taking the peeling strength as the peeling force; if the peel force is less than 50gf/25mm, this means that the peeling can be easily performed;
residual gum inspection after UV irradiation: the samples with the peeling force were visually and manually checked for the residual glue state on the stainless steel plate (SUS 304), the samples with substantially no residual glue on the stainless steel plate (SUS 304) were evaluated as "o", and the samples with residual glue on the plate were evaluated as "x";
example 1
Mixing the components of acrylic acid ester monomers such as butyl acrylate, acrylic acid and the like, and then carrying out free radical copolymerization in ethyl acetate under the action of an initiator AIBN at a polymerization temperature of 60 ℃ to obtain an acrylic base polymer containing a soluble part and having a weight average molecular weight of 80 ten thousand, wherein the specific formula composition is shown in a table 1; the acrylic base polymer obtained above was prepared by mixing 100 parts by weight of a photo-curable resin, 12 parts by weight of a photo-initiator, 1.5 parts by weight of an amino resin, 5 parts by weight of a curing agent, 1 part by weight of a modified epoxy acrylic resin, 0.9 part by weight of a photo-initiator 184 and 0.6 part by weight of a photo-initiator 127, respectively, a melamine formaldehyde resin, and an isocyanate-based fixing agent (the reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L) as a curing agent to obtain an adhesive substance having a young modulus of 80000Pa at 100 ℃; adhesive tape with the thickness of 25mm of the adhesive layer 1 was prepared by using a PO-based substrate, and the specific weight ratios and evaluation results are shown in Table 2;
table 1:
example 2
Acrylic acid base polymers containing soluble parts and having weight average molecular weight of 80 ten thousand are obtained by using acrylic ester monomers such as 2-ethylhexyl acrylate, acrylic acid and the like, mixing all the monomer components, and carrying out free radical copolymerization in ethyl acetate under the action of an initiator AIBN, wherein the polymerization temperature is 60 ℃, and the specific formula composition is shown in table 1; the acrylic base polymer obtained above was prepared by mixing 100 parts by weight of a photo-curable resin, 12 parts by weight of a photo-initiator, 1.5 parts by weight of an amino resin, 5 parts by weight of a curing agent, 1 part by weight of a modified epoxy acrylic resin, 0.9 part by weight of a photo-initiator 184 and 0.6 part by weight of a photo-initiator 127, respectively, a melamine formaldehyde resin, and an isocyanate-based fixing agent (the reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L) as a curing agent to obtain an adhesive substance having a young modulus of 50000Pa at 100 ℃; adhesive tape with the thickness of 25mm of the adhesive layer 1 was prepared by using a PVC-based substrate, and the specific weight ratios and evaluation results are shown in Table 2;
example 3
Acrylic acid base polymers containing soluble parts and having a weight average molecular weight of 75 ten thousand are obtained by free radical copolymerization in ethyl acetate under the action of an initiator AIBN, wherein the specific formula compositions are shown in table 1 after the monomer components are mixed by using acrylic acid ester monomers such as acrylic acid-2-ethylhexyl ester, acrylamide and the like; the acrylic base polymer obtained above was prepared by mixing 100 parts by weight of a photo-curable resin, 24 parts by weight of a photo-initiator, 1.5 parts by weight of an amino resin, 5 parts by weight of a curing agent, 1 part by weight of a modified epoxy acrylic resin, 0.9 part by weight of a photo-initiator 184 and 0.6 part by weight of a photo-initiator 127, respectively, a melamine formaldehyde resin, and an isocyanate-based fixing agent (the reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L) as a curing agent to obtain an adhesive substance having a young modulus of 50000Pa at 100 ℃; adhesive tape with the thickness of 25mm of the adhesive layer 1 was prepared by using a PO-based substrate, and the specific weight ratios and evaluation results are shown in Table 2;
comparative examples 1 to 3
The specific weight proportions and the evaluation results are shown in tables 1 and 2;
the tapes obtained in examples and comparative examples were evaluated by the foregoing methods, see table 2;
table 2:
as can be seen from the results of Table 1 and Table 2, the heat-resistant UV-curable adhesive tape according to the preferred embodiment of the present invention has excellent appearance after molding at high temperature, has excellent adhesion to an adherend at high temperature of 120℃and can reach 100gf/25mm or more, and has an illumination intensity of 500mJ/cm by UV illumination 2 The peeling force after UV irradiation is below 50gf/25mm under the condition of 10s of illumination time, so that the adhesive can be easily peeled off, and no adhesive residue can be generated.
The invention ensures higher elastic modulus in high-temperature molding by selecting the high-modulus adhesive under high-temperature condition, adopts the photosensitizer to match with the UV resin, can rapidly reduce viscosity in a short-time UV irradiation mode after use, improves the operation efficiency, and adopts the amino-containing resin to carry out self-crosslinking curing under high-temperature environment, thereby improving the hardness of the adhesive and effectively improving the residual adhesive. The heat-resistant UV viscosity-reducing adhesive tape provided by the invention can realize that the adhesive force to an adherend reaches more than 100gf/25mm when being molded at a high temperature of 120 ℃, effectively prevents falling off, greatly improves the yield, has a peeling force of less than 50gf/25mm under the normal temperature condition after molding, can be easily peeled off, and effectively improves the residual adhesive.
Claims (9)
1. A heat resistant UV reducing adhesive tape comprising a substrate (2), an adhesive layer (1) provided on one side of the substrate (2), the substrate (2) being provided with a release coating (3) on the side of the substrate on which the opposite side of the adhesive layer (1) is provided, the adhesive layer (1) being a heat resistant UV reducing adhesive layer, characterized in that the adhesive layer (1) comprises an adhesive substance for imparting tackiness, the adhesive substance of the adhesive layer (1) being selected from acrylic adhesives based on acrylic polymers, the acrylic polymers being polymers obtained by copolymerizing alkyl (meth) acrylates or cycloalkyl esters as the main monomer with other functional group-containing monomers for improving tackiness, the alkyl (meth) acrylates or cycloalkyl esters being selected from alkyl (meth) acrylates or cycloalkyl esters having a linear or branched alkyl group with a carbon number of 1 to 22, the functional group-containing monomers being selected from one or more of carboxyl groups, hydroxyl groupsA monomer having a functional group, wherein the Young's modulus of the adhesive layer (1) at 100 ℃ is 50000Pa or more, the adhesion of the adhesive layer (1) to an adherend at 120 ℃ high temperature is 100gf/25mm or more, and the heat-resistant UV-curable adhesive tape has a luminous intensity of 300mJ/cm 2 ～600mJ/cm 2 The wavelength is 365nm, the viscosity is reduced after the UV light irradiation under the condition of at least 10s, and the stripping force can reach below 50gf/25 mm.
2. A heat resistant UV curable adhesive tape according to claim 1 wherein the monomers used to polymerize the acrylic polymer further comprise one or more monomers comprising aromatic groups, ester ring groups.
3. A heat resistant UV curable adhesive tape according to claim 1 or 2, wherein the functional group-containing monomer is used in an amount of 40% by weight or less of the total monomer components, at least 0.1% by weight or more of the total monomer components.
4. A heat resistant UV curable adhesive tape according to claim 1 or 2 wherein the soluble portion of the acrylic polymer has a weight average molecular weight of at least 7.5×
10 5 g/mol or more, and the glass transition temperature Tg of the acrylic polymer is at least-35 ℃.
5. A heat resistant UV reducing adhesive tape according to claim 1 or 2, wherein the adhesive layer (1) comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of photo-curing resin, 0.5-1.5 parts of photoinitiator, 0.5-5 parts of curing agent and 5-20 parts of resin with amino, wherein the amino resin is selected from one or more of urea formaldehyde resin (UF), melamine formaldehyde resin (MF), alkyl melamine formaldehyde resin, aniline formaldehyde resin and polyamide polyamine epichlorohydrin (PAE).
6. A heat resistant UV reducing adhesive tape according to claim 1 or 2, wherein the adhesive layer (1) comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of UV resin, 0.5-1.5 parts of photoinitiator, 0.5-5 parts of curing agent and 5-20 parts of resin with amino, wherein the amino resin is selected from one or more of urea formaldehyde resin (UF), melamine formaldehyde resin (MF), alkyl melamine formaldehyde resin, aniline formaldehyde resin and polyamide polyamine epichlorohydrin (PAE).
7. A heat resistant UV reducing adhesive tape according to claim 1, wherein the substrate (2) is selected from an elastic material having an elongation after stretching of at least 120% or more, said elastic material being selected from one of a polyvinyl chloride film (PVC film), a polynaphthalate film or a polyolefin film.
8. A heat resistant UV reducing adhesive tape according to claim 1, wherein the substrate (2) is selected from elastomeric materials having an elongation after stretching of at least 120% or more, said elastomeric materials being selected from polyolefin copolymer films.
9. A heat resistant UV reducing adhesive tape according to claim 1, wherein the outermost side of at least one side of the adhesive layer (1) is further provided with a release layer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111675087.9A CN114231205B (en) | 2021-12-31 | 2021-12-31 | Heat-resistant UV (ultraviolet) adhesive-reducing tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111675087.9A CN114231205B (en) | 2021-12-31 | 2021-12-31 | Heat-resistant UV (ultraviolet) adhesive-reducing tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114231205A CN114231205A (en) | 2022-03-25 |
| CN114231205B true CN114231205B (en) | 2023-09-19 |
Family
ID=80745381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111675087.9A Active CN114231205B (en) | 2021-12-31 | 2021-12-31 | Heat-resistant UV (ultraviolet) adhesive-reducing tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114231205B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115232578B (en) * | 2022-08-17 | 2024-02-23 | 苏州赛伍应用技术股份有限公司 | UV (ultraviolet) adhesive and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016052424A1 (en) * | 2014-09-30 | 2016-04-07 | 日東電工株式会社 | Adhesive sheet |
| CN105925220A (en) * | 2016-06-14 | 2016-09-07 | 绍兴振德医用敷料有限公司 | Medical pressure-sensitive adhesive capable of being excellently adhered to skin and preparation method and application thereof |
| CN110591611A (en) * | 2019-09-20 | 2019-12-20 | 上海精珅新材料有限公司 | UV (ultraviolet) viscosity-reducing protective film glue with reduced viscosity at high temperature and protective film production method thereof |
| CN111440574A (en) * | 2019-12-27 | 2020-07-24 | 宁波激智科技股份有限公司 | Adhesive composition and anti-adhesive tape applied to cutting optical filter |
-
2021
- 2021-12-31 CN CN202111675087.9A patent/CN114231205B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016052424A1 (en) * | 2014-09-30 | 2016-04-07 | 日東電工株式会社 | Adhesive sheet |
| CN105925220A (en) * | 2016-06-14 | 2016-09-07 | 绍兴振德医用敷料有限公司 | Medical pressure-sensitive adhesive capable of being excellently adhered to skin and preparation method and application thereof |
| CN110591611A (en) * | 2019-09-20 | 2019-12-20 | 上海精珅新材料有限公司 | UV (ultraviolet) viscosity-reducing protective film glue with reduced viscosity at high temperature and protective film production method thereof |
| CN111440574A (en) * | 2019-12-27 | 2020-07-24 | 宁波激智科技股份有限公司 | Adhesive composition and anti-adhesive tape applied to cutting optical filter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114231205A (en) | 2022-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107267080B (en) | Surface protection sheet | |
| CN108138004B (en) | Stress dispersion film, optical member, and electronic member | |
| US20190071589A1 (en) | Pressure-sensitive adhesive sheet | |
| US10815396B2 (en) | Thermally conductive pressure-sensitive adhesive sheet | |
| US8710139B2 (en) | Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, and acrylic pressure-sensitive adhesive tape | |
| US20190077999A1 (en) | Pressure-sensitive adhesive sheet | |
| KR101622867B1 (en) | Adhesive composition and adhesive tape using same | |
| EP2385090B1 (en) | Acrylic pressure-sensitive adhesive tape | |
| KR101567131B1 (en) | Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer | |
| TW201726849A (en) | Pressure-sensitive adhesive sheet, process for producing laminate including pressure-sensitive adhesive layer, laminate including pressure-sensitive adhesive layer, image display device, and touch panel | |
| KR20140016842A (en) | Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet and optical film | |
| JPWO2011118181A1 (en) | Acrylic adhesive composition and acrylic adhesive tape | |
| KR20130094724A (en) | Acrylic resin solution, acrylic adhesive compositon, acrylic adhesive, adhesive sheet, acrylic adhesive for optical member, and optical member with adhesive layer | |
| KR20210126632A (en) | reinforcing film | |
| EP2706101A1 (en) | Double-sided pressure-sensitive adhesive sheet | |
| CN110862775A (en) | Laminated body | |
| TW201811947A (en) | Adhesive sheet having excellent properties both for adhesion and peeling and having no residual paste after peeling | |
| CN110699008A (en) | Adhesive sheet | |
| JP2017155099A (en) | Adhesive composition for protection films, and protection film | |
| CN114231205B (en) | Heat-resistant UV (ultraviolet) adhesive-reducing tape | |
| TWI806823B (en) | Adhesive composition, adhesive member, optical member, and electronic member | |
| JP6334197B2 (en) | Composite sheet for forming protective film, chip with protective film, and method for manufacturing chip with protective film | |
| US20230144464A1 (en) | Pressure-sensitive adhesive sheet and use thereof | |
| EP2706100A1 (en) | Double-sided pressure-sensitive adhesive sheet | |
| JP2004161919A (en) | Double-sided pressure-sensitive adhesive tape and adhering method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |