CN114214028A - Organosilicon packaging material for network transformer - Google Patents
Organosilicon packaging material for network transformer Download PDFInfo
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- CN114214028A CN114214028A CN202111589711.3A CN202111589711A CN114214028A CN 114214028 A CN114214028 A CN 114214028A CN 202111589711 A CN202111589711 A CN 202111589711A CN 114214028 A CN114214028 A CN 114214028A
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- silicone oil
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- vinyl silicone
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention discloses an organic silicon packaging material for a network transformer, which comprises the following components: A) vinyl silicone oil; B) vinyl silicone resin; C) a platinum catalyst capable of improving the rate of heat release, being the reaction product of PEG and chloroplatinic acid; D) h-containing silicone oil; each molecule of the compound contains H-Si functional groups, and the mass content of H is 0.5-1.55%; E) a cohesion accelerator; F) a fluorescent indicator; G) an inhibitor; according to the invention, the platinum catalyst and the inhibitor for improving the heat release rate are added to achieve normal temperature storage and reduce the curing heat release rate, and the reduction of bubbles and stress in the production process of the network transformer is realized by reducing the curing heat release rate, so that the yield is improved.
Description
Technical Field
The invention relates to the technical field of organic silicon materials, in particular to an organic silicon packaging material for a network transformer, which is mainly applied to packaging of the network transformer.
Background
Network transformers are also known as network isolation transformers, or data mercury. The high-voltage isolation and lightning protection circuit is mainly used in network switches, routers, network cards, hubs and the like, and plays roles in signal coupling, high-voltage isolation, impedance matching, electromagnetic interference suppression, lightning protection and the like.
With the continuous development of network technology, 5G technology has been applied comprehensively, 6G technology, and even higher technology has been in the process of research and development, in this society of everything interconnection, the network transformer is used as a part of its components, the performance requirements are continuously improved, the devices need to be more miniaturized, and the forms and styles are diversified; wave soldering and other requirements need higher temperature resistance, and partial products even reach 250-300 ℃; automobile modules and the like require higher stability, interference resistance, vibration resistance, environmental aging resistance and other performances.
The conventional network transformer mainly comprises: organic silicon packaging, epoxy packaging, molding compound packaging and the like. Wherein, the organic silicon encapsulation mainly comprises: RTV, silicone encapsulation, forms such as LSR, because the most solvent-borne mode that adopts of silicone, along with the coming off of national VOC management and control standard, for example GB33372, the use of this kind of product has received certain restriction. RTVs are highly inefficient because they require moisture in the air to cure, which cures from the surface layer back into the film. The LSR mostly adopts two components, needs on-site mixing, has the influence of equipment and proportion precision, and the product is easy to generate bubbles, and stability is influenced to a certain extent, and the sealing performance of the product is slightly poor.
Patent CN103773235B discloses the application of primer to network transformers, but the production efficiency is seriously affected by adopting the method.
Disclosure of Invention
In order to solve the technical problems, the invention provides an organic silicon packaging material for a network transformer, and the packaging material can solve the application problem of the network transformer.
In order to achieve the technical effects, the invention provides the following technical scheme:
an organic silicon packaging material for a network transformer comprises the following components:
A)100 parts by weight of vinyl silicone oil, preferably a mixture of two structures of vinyl silicone oil, wherein the viscosity of vinyl silicone oil A1 is: 300-20000 mPa.s, the structural formula is as follows:
the viscosity of vinyl silicone oil A2 was: 300-10000 mPa.s, the structural formula is as follows:
the vinyl silicone oil is more preferably a mixture of the structural formula A1 and the structural formula A2, wherein the structural formula A1 accounts for 80-100 wt%; the structural formula A2 accounts for 0-20%; wherein n is an integer not zero.
B)5 to 50 parts by weight of a vinyl silicone resin,
preferably, the vinyl silicone resin compound contains CH2＝CH2-Si functional groups, M mer and Q mer, where M/Q mer is 0.5 to 1.2, CH2＝CH20.5-4.5% by mass of CH2＝CH2The content of (b) is more preferably 1.0 to 3.5% by mass.
C) 0.1-2 parts by weight of a platinum catalyst capable of improving the heat release rate, which is a reaction product of PEG and chloroplatinic acid,
the synthesis process of the catalyst comprises the steps of weighing chloroplatinic acid, dissolving the chloroplatinic acid with isopropanol, putting the solution into a three-neck flask, adding PEG200, heating to 70-80 ℃, reacting for 2 hours, and adding NaHCO3Reacting for 1 hour, cooling, filtering to obtain light yellow transparent liquid, diluting with isopropanol to 3000ppm, and obtaining the platinum catalyst used in the invention for improving the heat release rate.
D) An H-containing silicone oil cross-linking agent compound comprises an H-Si functional group, wherein the mass content of H is 0.5-1.55%, and the molar ratio of the H-Si functional group to a vinyl functional group in the composition is 0.6-3.5;
the compound has the structural formula D1
The compound has the structural formula D2
Wherein n and m are integers different from zero.
The H-containing silicone oil cross-linking agent is more preferably a mixture of the structural formula D1 and the structural formula D2, wherein the structural formula D1 accounts for 60-100 wt%; the structural formula D2 accounts for 0-40%; wherein n is an integer not zero.
E) 0.1-3 parts by weight of an adhesion promoter, wherein the adhesion promoter is a hydrolysis reaction product (E1) of vinyltrimethyloxy silane and gamma- (2, 3-glycidoxy) propyltrimethyloxy silane through a hydrolysis reaction, or a reactant (E2) of the hydrolysis reaction product and gamma-aminopropyltrimethyloxy silane; more preferably, the hydrolysis reaction product is further reacted with gamma-aminopropyl trimethyl (ethoxy) silane in an amount of 0.5 to 2.0 parts by weight.
Wherein E1 is a hydrolysis reaction product of vinyl trimethoxy silane and gamma- (2, 3-glycidoxy) propyltrimethoxy silane, or a hydrolysis reaction product of vinyl trimethoxy silane and gamma- (2, 3-glycidoxy) propyltriethoxy silane, or a hydrolysis reaction product of vinyl triethoxy silane and gamma- (2, 3-glycidoxy) propyltrimethoxy silane, or a hydrolysis reaction product of vinyl triethoxy silane and gamma- (2, 3-glycidoxy) propyltriethoxy silane. Wherein E2 is specifically a reactant of E1 and gamma-aminopropyltrimethoxysilane or a reactant of E1 and gamma-aminopropyltriethoxysilane.
F)0.001 to 0.05 parts by weight of a fluorescence indicator, more preferably 0.003 to 0.03 parts by weight of a benzoxazinone.
G)0.03 to 0.5 part by weight of an inhibitor.
The inhibitor is one or more of 2-methyl-3-butyne-2-ol, 1-ethynylcyclohexanol and triphenylphosphine, and more preferably a mixture of 0.05-0.2 parts by weight of 2-methyl-3-butyne-2-ol and triphenylphosphine.
It should be noted that the same symbols for n and m in the above different structural formulas are not represented by the same numerical values, but only by a numerical code.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the platinum catalyst and the inhibitor for improving the heat release rate are added to achieve the purposes of normal temperature storage and curing heat release rate reduction, the purposes of reducing bubbles and stress in the production process of the network transformer and improving the yield are achieved by reducing the curing heat release rate, the bonding force promoter is added to achieve the purpose of increasing the bonding capacity of the packaging material and the network transformer interface, and the vinyl silicone resin is added to improve the bulk strength of the packaging material, so that the capacity of 255 ℃ through wave soldering is achieved.
Drawings
FIG. 1 is a DSC chart of a part of examples and comparative examples;
FIG. 2 is a DSC chart of a portion of the examples.
Detailed Description
The invention will be further explained and illustrated with reference to specific examples.
A, C, D, E in the present invention can be obtained by known methods, B, F, G is commercially available.
The main parameters and the test method of the produced packaging material for the network transformer are as follows: the curing conditions all adopt 125 ℃ and 60 min.
GB/T528-2009 vulcanized rubber or thermoplastic rubber tensile stress strain performance measurement shows that the thickness is 2mm, and the tensile rate is 500 mm/min.
GB/T1692-.
The tensile shear strength of the adhesive GB/T7124 and 2008 (rigid material to rigid material) is measured by bonding aluminum to aluminum at a tensile rate of 10 mm/min.
GB/T1695-2005-one-frequency breakdown dielectric strength and voltage resistance determination method, thickness is 1mm, and boosting rate is 1 kV/s.
ISO11357-3 Differential Scanning Calorimetry (DSC) weight 10mg, heating rate 10 deg.C/min test.
Example 1
80 parts of vinyl silicone oil (A1) with the viscosity of 1000 mPas, wherein the viscosity is as follows: 20 parts of 500 mPas vinyl silicone oil (A2), 20 parts of vinyl silicone resin (B), 2.5 percent of vinyl content and 0.9 percent of M/Q are dispersed in the silicone oil by using n-heptane, transparent silicone oil and vinyl silicone resin composition are obtained by removing the n-heptane by adopting a heating and vacuum treatment method, 0.005 part of fluorescence indicator (F) is added, 0.24 part of platinum catalyst (C) for improving exothermic peak rate, 0.08 part of inhibitor (G) 2-methyl-3-butyne-2-ol and 1.2 parts of reactant (E2) are uniformly dispersed, 10 parts of silicone oil cross-linking agent (D1) containing H is added, the H content is 0.8 percent, the dispersion is uniform, and bubbles are removed in vacuum, thus obtaining the packaging material for the network transformer.
Example 2
0.12 part of 1-ethynylcyclohexanol was used in place of 2-methyl-3-butyn-2-ol in example 1, and the remainder of the starting materials was unchanged.
Example 3
The 2-methyl-3-butyn-2-ol in example 1 was replaced with 0.12 part of 1-ethynylcyclohexanol and 0.001 part of triphenylphosphine, and the remaining raw materials were unchanged.
Example 4
100 parts of vinyl silicone oil (A1) having a viscosity of 500 mPas was used in place of the vinyl silicone oil (A1, A2) in example 1, 9 parts of H-containing silicone oil crosslinking agent (D1) having an H content of 1.0% and 3 parts of H-containing silicone oil crosslinking agent (D2) having an H content of 0.08% in place of the H-containing silicone oil crosslinking agent (D1) in example 1, and 0.12 part of 1-ethynylcyclohexanol was used in place of 2-methyl-3-butyn-2-ol in example 1, and the remaining raw materials were not changed.
Example 5
1.2 parts of the reaction product (E1) was used in place of the reaction product (E2) in example 1, and 0.12 part of 1-ethynylcyclohexanol was used in place of 2-methyl-3-butyn-2-ol in example 1, the rest being unchanged.
Example 6
Vinyl-based silicone resin (B) in example 1 was replaced with 30 parts of vinyl-based silicone resin (B) having a vinyl group content of 2.0% and an M/Q of 0.8, and H-containing silicone oil crosslinking agent (D1) was replaced with 11.5 parts of H-containing silicone oil crosslinking agent (D1) in example 1, and 2-methyl-3-butyn-2-ol was replaced with 0.08 part of 2-methyl-3-butyn-2-ol and 0.001 part of triphenylphosphine in example 1.
Comparative example 1
1, 3-Divinyl-1, 1,3, 3-tetramethyldisiloxane platinum (0) was used, the platinum content was 3000ppm,0.24 part, instead of the platinum catalyst (C) for improved exothermic peak rate in example 1, and 0.12 part of 1-ethynylcyclohexanol was used instead of 2-methyl-3-butyn-2-ol in example 1, the rest being unchanged.
Comparative example 2
Platinum (0) -2,4,6, 8-tetramethyl-2, 4,6, 8-tetravinylcyclotetrasiloxane chelate with a platinum content of 3000ppm,0.24 part, instead of the platinum catalyst (C) for improved peak exotherm in example 1, and 0.12 part of 1-ethynylcyclohexanol instead of 2-methyl-3-butyn-2-ol in example 1, the rest being unchanged.
The products of examples and comparative examples were subjected to performance tests, and the test results are shown in table 1.
TABLE 1 Performance test data of examples and comparative examples
The data in table 1 prove that the packaging material for the network transformer achieves halogen-free and environment-friendly effects, reduces the heat release rate, has a certain adhesive force and excellent electrical property, and can pass through 255 ℃ wave soldering of the network transformer.
Although the present invention has been described herein with reference to the illustrated embodiments thereof, which are intended to be preferred embodiments of the present invention, it is to be understood that the invention is not limited thereto, and that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure.
Claims (9)
1. An organic silicon packaging material for a network transformer is characterized by comprising the following components:
A)100 parts by weight of vinyl silicone oil;
B) 5-50 parts by weight of vinyl silicone resin;
C) 0.1-2 parts by weight of a platinum catalyst capable of improving the heat release rate, which is a reaction product of PEG and chloroplatinic acid;
D) h-containing silicone oil; each molecule of the compound contains H-Si functional groups, the mass content of H is 0.5-1.55%,
E)0.1 to 3 parts by weight of a cohesive force promoter;
F)0.001 to 0.05 parts by weight of a fluorescent indicator;
G)0.03 to 0.5 part by weight of an inhibitor;
the molar ratio of H-Si to vinyl contained in the organic silicon packaging material is 0.6-3.5.
2. The silicone encapsulating material for network transformers according to claim 1, wherein the vinyl silicone oil is a mixture of two or more vinyl silicone oils of different viscosity or structure.
3. The silicone encapsulating material for network transformers according to claim 1 or 2, wherein the vinyl silicone oil is a mixture comprising 80 to 100% by weight of vinyl silicone oil A1 and 0 to 20% by weight of vinyl silicone oil A2, the viscosity of the vinyl silicone oil A1 is 300 to 20000mPa.s, and the structural formula is
The viscosity of the vinyl silicone oil A2 is 300-10000 mPa.s, and the structural formula is
Wherein n is an integer not zero.
4. The silicone encapsulating material for network transformers according to claim 1, wherein the vinyl silicone resin comprises CH2＝CH2-Si functional groups, M mer and Q mer, where M/Q mer is 0.5 to 1.2, CH2＝CH2The mass content of (A) is 0.5-4.5%.
5. The silicone encapsulating material for network transformers according to claim 1, wherein the platinum content in the platinum catalyst is 3000 ppm.
6. The silicone encapsulating material for network transformers according to claim 1, wherein the structural formula of the H-containing silicone oil is D1
Or D2
7. The silicone encapsulating material for network transformers according to claim 1, wherein said adhesion promoter is a hydrolysis product E1 of a hydrolysis reaction of vinyltrimethoxysilane and γ - (2, 3-glycidoxy) propyltrimethoxysilane, or a reactant E2 of the above hydrolysis product and γ -aminopropyltrimethoxysilane.
8. The silicone encapsulating material for the network transformer according to claim 1, wherein the inhibitor is one or more of 2-methyl-3-butyn-2-ol, 1-ethynylcyclohexanol, and triphenylphosphine.
9. The silicone encapsulating material for network transformers according to claim 1, wherein the fluorescent indicator is benzoxazinone.
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| CN202111589711.3A CN114214028A (en) | 2021-12-23 | 2021-12-23 | Organosilicon packaging material for network transformer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11140324A (en) * | 1997-11-05 | 1999-05-25 | Shin Etsu Chem Co Ltd | Adhesive silicone composition |
| CN102030992A (en) * | 2010-11-25 | 2011-04-27 | 浙江科创新材料科技有限公司 | Liquid silicon rubber platinum catalyst taking polyethylene glycol as ligand and preparation method thereof |
| JP2015134937A (en) * | 2015-04-30 | 2015-07-27 | 三井化学株式会社 | Crosslinkable rubber composition and crosslinked rubber molded body |
| JP2020100764A (en) * | 2018-12-25 | 2020-07-02 | 信越化学工業株式会社 | Silicone release agent composition, release sheet and release film |
| CN112694865A (en) * | 2020-12-18 | 2021-04-23 | 广东普赛达密封粘胶有限公司 | Single-component thermosetting organic silicon adhesive for adhering electric kettle and preparation method thereof |
-
2021
- 2021-12-23 CN CN202111589711.3A patent/CN114214028A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11140324A (en) * | 1997-11-05 | 1999-05-25 | Shin Etsu Chem Co Ltd | Adhesive silicone composition |
| CN102030992A (en) * | 2010-11-25 | 2011-04-27 | 浙江科创新材料科技有限公司 | Liquid silicon rubber platinum catalyst taking polyethylene glycol as ligand and preparation method thereof |
| JP2015134937A (en) * | 2015-04-30 | 2015-07-27 | 三井化学株式会社 | Crosslinkable rubber composition and crosslinked rubber molded body |
| JP2020100764A (en) * | 2018-12-25 | 2020-07-02 | 信越化学工業株式会社 | Silicone release agent composition, release sheet and release film |
| CN112694865A (en) * | 2020-12-18 | 2021-04-23 | 广东普赛达密封粘胶有限公司 | Single-component thermosetting organic silicon adhesive for adhering electric kettle and preparation method thereof |
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