CN114203678B - 一种集成封装结构及其制造方法 - Google Patents
一种集成封装结构及其制造方法 Download PDFInfo
- Publication number
- CN114203678B CN114203678B CN202210148414.3A CN202210148414A CN114203678B CN 114203678 B CN114203678 B CN 114203678B CN 202210148414 A CN202210148414 A CN 202210148414A CN 114203678 B CN114203678 B CN 114203678B
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- Prior art keywords
- metal
- layer
- manufacturing
- polymer layer
- fuse
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- 229920000642 polymer Polymers 0.000 claims abstract description 45
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 238000012545 processing Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fuses (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210148414.3A CN114203678B (zh) | 2022-02-18 | 2022-02-18 | 一种集成封装结构及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210148414.3A CN114203678B (zh) | 2022-02-18 | 2022-02-18 | 一种集成封装结构及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114203678A CN114203678A (zh) | 2022-03-18 |
CN114203678B true CN114203678B (zh) | 2022-05-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202210148414.3A Active CN114203678B (zh) | 2022-02-18 | 2022-02-18 | 一种集成封装结构及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN114203678B (zh) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7566593B2 (en) * | 2006-10-03 | 2009-07-28 | International Business Machines Corporation | Fuse structure including cavity and methods for fabrication thereof |
TWI385695B (zh) * | 2009-09-04 | 2013-02-11 | Cyntec Co Ltd | 保護元件及其製作方法 |
US8779592B2 (en) * | 2012-05-01 | 2014-07-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Via-free interconnect structure with self-aligned metal line interconnections |
KR101976039B1 (ko) * | 2012-12-04 | 2019-08-28 | 삼성전자 주식회사 | 반도체 장치 |
JP2015041546A (ja) * | 2013-08-22 | 2015-03-02 | デクセリアルズ株式会社 | 保護素子 |
JP6483987B2 (ja) * | 2014-09-26 | 2019-03-13 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、及び発熱体内蔵ヒューズ素子 |
JP6595873B2 (ja) * | 2015-03-06 | 2019-10-23 | エイブリック株式会社 | 半導体集積回路装置およびその製造方法 |
JP6707428B2 (ja) * | 2016-09-16 | 2020-06-10 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子 |
KR102203721B1 (ko) * | 2019-06-20 | 2021-01-18 | 한국생산기술연구원 | 용단부 단선 응답 속도 향상을 위한 단열패턴을 가지는 칩 퓨즈 및 상기 칩 퓨즈를 구비한 충전장치 |
CN112820654B (zh) * | 2021-01-05 | 2022-06-10 | 山东睿芯半导体科技有限公司 | 一种智能功率芯片结构及其制造方法 |
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- 2022-02-18 CN CN202210148414.3A patent/CN114203678B/zh active Active
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CN114203678A (zh) | 2022-03-18 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An integrated packaging structure and its manufacturing method Effective date of registration: 20230301 Granted publication date: 20220506 Pledgee: Weihai City Commercial Bank Limited by Share Ltd. Xinghai branch Pledgor: WEIHAI JIARUI OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023980033719 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PP01 | Preservation of patent right |
Effective date of registration: 20240511 Granted publication date: 20220506 |
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CI03 | Correction of invention patent |
Correction item: preservation of patent right Correct: No property preservation False: Effective date of patent preservation registration: May 11, 2024 Number: 22-01 Volume: 40 |