CN114198363A - Non-similar redundancy pressure sensor and aircraft hydraulic system - Google Patents
Non-similar redundancy pressure sensor and aircraft hydraulic system Download PDFInfo
- Publication number
- CN114198363A CN114198363A CN202111531433.6A CN202111531433A CN114198363A CN 114198363 A CN114198363 A CN 114198363A CN 202111531433 A CN202111531433 A CN 202111531433A CN 114198363 A CN114198363 A CN 114198363A
- Authority
- CN
- China
- Prior art keywords
- core
- pressure sensor
- film
- redundancy
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
- F15B19/00—Testing; Calibrating; Fault detection or monitoring; Simulation or modelling of fluid-pressure systems or apparatus not otherwise provided for
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/40—Weight reduction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The application provides a non-similar redundancy pressure sensor and aircraft hydraulic system, belong to airborne aviation pressure sensor technical field, specifically include the mouthpiece connect with peg graft first core and the second core on the mouthpiece connects, one in first core and the second core sets up to two chip architecture realization dual-redundancy output, another in first core and the second core sets up to single chip architecture realization single-redundancy output, and first core and second core adopt different theory of operation. A double chip adopting the working principle of semiconductor silicon piezoresistive effect is arranged in the first core, and the double chip is packaged by adopting a film isolation oil-filled packaging process; a single chip adopting the working principle of the sputtering film is arranged in the second core body, and the single chip is prepared through the sputtering film process. Through the processing scheme of this application, solve because of the problem of the synchronous inefficacy of the same two cores that lead to of theory of operation, effectively improve the reliability of being connected between pressure core and mouthpiece joint welding seam.
Description
Technical Field
The application relates to the technical field of airborne aviation pressure sensors, in particular to a non-similar redundancy pressure sensor and an airplane hydraulic system.
Background
The aircraft hydraulic system is generally provided with a pressure sensor which is generally arranged on an aircraft hydraulic pneumatic subsystem and used for measuring gas pressure and transmitting a pressure signal to the flight control system. The measuring range of the pressure sensor reaches 30MPa, and the accuracy and stability of the output of the pressure sensor directly influence the flight safety, so that the aircraft has very high requirements on the reliability and stability of a sensor matched with a hydraulic system. In order to meet the requirement on the reliability of the pressure sensor on the machine, the position sensor generally adopts a dual-redundancy design, and once one path of signal fails, the whole sensor is prevented from failing. The remaining signal can ensure the normal output of the sensor, and after the airplane lands, the fault part is removed and the spare part is replaced.
The traditional dual-redundancy pressure sensor generally adopts a dual-core structure, namely two identical pressure cores are installed through the structural design of a sensor pipe joint, the two cores are sequentially installed in the pipe joint through a welding process, and then signal transmission is realized through an aviation socket. However, the design scheme has the following disadvantages: 1) because the double core bodies adopt the same working principle, the condition that the double core bodies fail at the same time is possible to occur, so that the integral failure of the sensor is caused; 2) when the signals of the dual-redundancy sensors are inconsistent, particularly when the output difference is within the range of 1% -10%, the difficulty is brought to the airplane fault judgment logic; 3) for a wide-range pressure sensor, the welding seam position of the core body and the pipe joint is most prone to weld seam cracking, so that inaccurate measurement is caused and even the sensor is failed integrally.
Disclosure of Invention
In view of this, the embodiment of the present application provides a non-similar redundancy pressure sensor and an aircraft hydraulic system, where two pressure cores adopt different working principles, so as to at least partially solve the problem of dual-core synchronization failure caused by the same working principle in the prior art.
In a first aspect, an embodiment of the present application provides a non-similar redundancy pressure sensor, including the mouthpiece joint and peg graft first core and second core on the mouthpiece joint, first core with one in the second core sets up to realize dual-redundancy output for the dual-chip structure, first core with another in the second core sets up to realize single-redundancy output for the single-chip structure, just first core with the second core adopts different theory of operation.
According to a specific implementation manner of the embodiment of the application, a double chip adopting a semiconductor silicon piezoresistive effect working principle is arranged in the first core, and the double chip is packaged by adopting a film isolation oil-filled packaging process; and a single chip adopting the working principle of the sputtering film is arranged in the second core body, and the single chip is prepared by a sputtering film process.
According to a specific implementation manner of the embodiment of the present application, the first core includes:
the first base is provided with a groove;
the two first pressure sensing chips are positioned in the groove, electric signals are led out through a gold wire bonding process, and ceramics are filled on two sides of each of the two first pressure sensing chips; and
and the isolation diaphragm is arranged above the first pressure sensing chip and is welded and fixed with the top edge of the groove.
According to a specific implementation manner of the embodiment of the present application, the second core includes a second base and a second pressure sensing chip located on the second base, and the second pressure sensing chip has a structure including:
the elastic base is used for playing a role of elastic support;
an insulating film on the elastic base;
a resistive film on the insulating film;
a protective film on the resistive film; and
and one end of the electrode film is positioned in the resistance film, and the other end of the electrode film extends out of the protection film and is welded with a lead.
According to a concrete implementation mode of this application embodiment, first core with the front end of second core inserts respectively the mouthpiece connects, first core with the tail end of second core is equipped with the core step respectively, the mouthpiece connect with first core with the grafting department of second core is equipped with mouthpiece joint step respectively, the core step with mouthpiece connects the step welding.
According to a concrete implementation mode of the embodiment of the application, the core body step and the nozzle joint step are welded by adopting a continuous laser welding process, and the depth of a welding seam is more than or equal to 1.5 mm.
According to a specific implementation manner of the embodiment of the application, the parameters of the continuous laser welding process are set as follows: the laser power range is 800W-1000W, the welding speed range is 3500mm/min-4000mm/min, and the defocusing amount is +2 mm.
According to a specific implementation manner of the embodiment of the application, the first core body and the second core body are in threaded connection with the nozzle joint.
According to a specific implementation manner of the embodiment of the application, the front end interface positions of the first core and the second core are designed to be M10X 1-6g external threads, and the interface position of the nozzle joint is designed to be M10X 1-6H internal threads.
In a second aspect, embodiments of the present application further provide an aircraft hydraulic system, including a non-similar redundancy pressure sensor as described in any of the embodiments of the first aspect.
Advantageous effects
The non-similar redundancy pressure sensor and the aircraft hydraulic system in the embodiment of the application, through setting up the different pressure core body of two theory of operation, carry out the design of non-similar redundancy, one of them core adopts single core body double chip design to realize two redundancy outputs, another core adopts single core body single chip design to realize single redundancy output, thereby solve the problem of the synchronous inefficacy of the double core body that leads to because of the theory of operation is the same, improve the condition that can't judge the trouble that original two redundancy output nonconformities lead to.
The pressure core body and the pipe nozzle joint are installed and positioned in a threaded mode, the step is arranged, and the side face of the step is fixedly connected with the pipe nozzle joint in a continuous laser welding mode, so that the pressure core body and the pipe joint are welded more stably, and the reliability of connection between welding seams of the pressure core body and the pipe nozzle joint is effectively improved.
Through setting up the sensor to three redundancy outputs, when one party's output goes wrong, can realize that quick judgement was taken the event on the aircraft, in time acquireed aircraft hydraulic system's performance, improved whole flight control system's security performance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a perspective view of a non-similar redundancy pressure sensor in accordance with an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a non-similar redundancy pressure sensor according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a first core according to an embodiment of the invention;
fig. 4 is a schematic view of a second core according to an embodiment of the present invention.
In the figure: 1. a first core; 2. a second core; 21. an electrode film; 22. a protective film; 23. a resistive film; 24. an insulating film; 25. an elastic base; 3. a nozzle adapter; 4. welding seams; 5. a core step; 6. the nozzle connects the step.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application rather than the number, shape and size of the components in actual implementation, and the type, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
In a first aspect, an embodiment of the present application provides a non-similar redundancy pressure sensor, including a nozzle joint 3 and a first core 1 and a second core 2 plugged in the nozzle joint 3, one of the first core 1 and the second core 2 is configured to implement dual redundancy output for a dual-chip structure, the other of the first core 1 and the second core 2 is configured to implement single redundancy output for a single-chip structure, and the first core 1 and the second core 2 adopt different working principles. The pressure sensor can solve the problem of synchronous failure of the double cores caused by the same working principle through the non-similar redundancy design concept.
Furthermore, a double chip is arranged in the first core 1, and the semiconductor silicon piezoresistive effect working principle is adopted, and the preparation is carried out by adopting a film isolation oil-filling packaging process; a single chip is arranged in the second core body 2, and the second core body is prepared by adopting the working principle of sputtering a film and a film sputtering process. The first core body 1 realizes the dual-redundancy output of the core body through the design of a single core body and a dual-chip body, and the single-redundancy output of the second core body 2 is added to realize the integral three-redundancy output of the sensor, thereby improving the condition that the failure judgment is caused by the inconsistent dual-redundancy output in the prior art.
In one embodiment, the first core 1 adopts a thin film isolation oil-filled packaging process, that is, the first core 1 is an oil-filled core, and specifically includes: the first base is provided with a groove; two first pressure sensing chips are uniformly arranged in the groove, the first pressure sensing chips lead out electric signals through a gold wire bonding process, and ceramics are filled on two sides of the two first pressure sensing chips; and the isolation diaphragm is arranged above the first pressure sensing chip and is welded and fixed with the top edge of the groove. The inner cavity of the first core body 1 is filled with ceramic, so that the oil filling amount can be reduced, and the temperature drift of the chip is reduced. The isolation diaphragm is a metal isolation diaphragm, the welding ring and the first base are connected through an argon arc welding process, and finally, an oil filling and ball sealing process is carried out to complete the assembly of the first core body 1.
In the above embodiment, the front end of the first core 1 has a corrugated sheet structure, and the stress isolation groove base is adopted to develop processes of surface mounting, oil filling, stress release and the like, so that the packaging residual stress is effectively reduced, and the accuracy and stability of the sensor are improved.
Further, the second core body 2 comprises a second base and a second pressure sensing chip positioned on the second base, the second pressure sensing chip comprises an elastic base 25, an insulating film 24, a resistive film 23, a protective film 22 and an electrode film 21, the elastic base 25 is made of stainless steel material and is used for playing a role of elastic support; an insulating film 24 is formed on the elastic substrate 25 using SiO2The material ensures the insulation of the resistance film 23 and the elastic matrix 25; the resistance film 23 is positioned on the insulating film 24, the resistance film 23 is made of Karman alloy, and the resistance value of the resistance film is adjusted by a laser resistance trimmer after sputtering; a protective film 24 formed on the resistive film and made of SiO2The material isolates the communication between the inner cavity of the core body and the atmosphere; one end of the electrode film 21 is positioned in the film layer of the resistor film 23, and the other end thereof protrudes from the protective film 22 and is bonded to a lead, and the electrode film 21 is made of Ag material for facilitating bonding of the lead.
In the above embodiment, the chip main structure includes the elastic base 25, the insulating film 24, the resistive film 23, and the protective film 22, which are finally enclosed inside the core housing. The front end of the second core 2 is different from the front end of the first core 1, and the corrugated plate structure does not exist at the front end of the second core 2, because the sputtering template process chip is back pressure-sensing, and the Wheatstone bridge does not directly contact with the medium, therefore, the front end of the second core 2 only keeps a pressure inlet hole structure.
In a preferred embodiment, the front ends of the first core 1 and the second core 2 are respectively inserted into the nozzle joint 3, the tail ends of the first core 1 and the second core 2 are respectively provided with a core step 5, the insertion positions of the nozzle joint 3 and the first core 1 and the second core 2 are respectively provided with a nozzle joint step 6, and the contact positions of the core step 5 and the nozzle joint step 6 are subjected to side welding. In this embodiment, adopt design stair structure to carry out the side welding, rather than directly weld in the interface that the mouthpiece connects 3, make impact pressure have a process that weakens in the gap of core and mouthpiece joint contact site to can effectively reduce the direct impact of pressure to the seam, make core and coupling welding more stable, effectively promote the connection reliability of this position welding seam, and then improve the stability of structure.
Specifically, the core step 5 is dimensioned: the diameter range is 14 +/-0.2 mm, the step height range is 4 +/-0.5 mm, and the size of the step 6 part of the nozzle joint is designed as follows: the vertical falling range is 14 +/-0.2 mm, and the step height range is 2 +/-0.5 mm.
Preferably, the core body step 5 and the nozzle joint step 6 are welded by adopting a continuous laser welding process, and through calculation, the pressure range of 30MPa needs a welding seam to bear the shearing force of 80MPa, and the designed value of the depth of the welding seam needs to be more than or equal to 1.5 mm.
During specific welding, considering the depth requirement of a welding seam, the parameters of the continuous laser welding process are set as follows: the laser power range is 800W-1000W, the welding speed range is 3500mm/min-4000mm/min, the defocusing amount is +2mm, and the melting depth requirement can be met.
After welding, weld section analysis and X-ray inspection of welding strength are required, test pieces are extracted from each batch of products for sectioning test, and weld penetration is detected to ensure that the penetration is more than or equal to 1.5 mm. After welding of each batch of products is finished, 1 product is extracted for high-low voltage alternating test, the test method refers to GJB4409A-2011, the fatigue load is 100kPa at the valley value and 30MPa at the peak value, the alternating frequency is 60 times/minute, and the test frequency is 10000 times per week. And (4) after the test is finished, performing performance detection, and performing subsequent assembly after the test is qualified.
In another preferred embodiment, the first core 1 and the second core 2 are in threaded connection with the nozzle joint 3, specifically, two grooves are formed in the nozzle joint 3, the first core 1 and the second core 2 are respectively inserted into the two grooves, inner threads are formed on side walls of the grooves of the nozzle joint 3, outer threads are formed on outer walls of the first core 1 and the second core 2, the outer threads are arranged at a front end interface position of the cores and do not exceed a position of the core step 5, and the cores are in threaded connection with the nozzle joint 3. The connection mode can be used for concentric positioning assembly, the problem of welding eccentricity is solved, and meanwhile, the threaded connection plays a certain role in sharing the pressure bearing of the welding seam for the large-pressure range sensor.
Further, the front end interfaces of the first core 1 and the second core 2 are designed to be M10 multiplied by 1-6g external threads, and the positions of the nozzle joint plug cores are designed to be M10 multiplied by 1-6H internal threads.
In any of the above embodiments, the first core 1, the second core 2 and the nozzle joint 3 all adopt 316L stainless steel as a shell material, the grade of which is 022Cr17Ni12Mo2, and the shell material has good corrosion resistance and weldability, and the material is widely applied to the field with strong corrosion of the aviation sensor.
In another aspect, an aircraft hydraulic system is further provided in an embodiment of the present application, including the non-similar redundancy pressure sensor as in any embodiment of the first aspect.
The invention designs a pressure sensor based on non-similar redundancy, and two pressure core bodies adopt different working principles. The first core adopts the working principle of semiconductor silicon piezoresistive effect, the second core adopts the working principle of sputtering film, and the problem of synchronous failure of the double cores caused by the same working principle is solved through the non-similar redundancy design concept. The first core realizes double-redundancy output of the first core through single-core and double-chip design, and the single-redundancy output of the second core realizes integral triple-redundancy output of the sensor, so that the condition that the failure cannot be judged due to inconsistent original double-redundancy output is improved. For improving the reliability of connection between the pressure core body and the pipe joint welding seam, the first core body and the second core body are installed and positioned in a threaded mode, and finally the first core body and the second core body are fixed through side continuous laser welding, so that the welding of the core body and the pipe joint is more stable, and the reliability of connection of the welding seam at the position is effectively improved.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a non-similar redundancy pressure sensor, its characterized in that includes the mouthpiece joint and pegs graft first core and second core on the mouthpiece joint, first core with one in the second core sets up to realize two redundancy outputs for the double chip structure, first core with another in the second core sets up to realize single redundancy output for single chip structure, just first core with the second core adopts different theory of operation.
2. The non-similar redundancy pressure sensor according to claim 1, wherein a dual chip using semiconductor silicon piezoresistive effect working principle is disposed in the first core, and the dual chip is packaged by a thin film isolation oil-filled packaging process; and a single chip adopting the working principle of the sputtering film is arranged in the second core body, and the single chip is prepared by a sputtering film process.
3. The non-similar redundancy pressure sensor of claim 2, wherein the first core comprises:
the first base is provided with a groove;
the two first pressure sensing chips are positioned in the groove, electric signals are led out through a gold wire bonding process, and ceramics are filled on two sides of each of the two first pressure sensing chips; and
and the isolation diaphragm is arranged above the first pressure sensing chip and is welded and fixed with the top edge of the groove.
4. The non-similar redundancy pressure sensor of claim 2, wherein the second core comprises a second base and a second pressure sensing die on the second base, the second pressure sensing die configured to comprise:
the elastic base is used for playing a role of elastic support;
an insulating film on the elastic base;
a resistive film on the insulating film;
a protective film on the resistive film; and
and one end of the electrode film is positioned in the resistance film, and the other end of the electrode film extends out of the protection film and is welded with a lead.
5. The dissimilar redundancy pressure sensor according to claim 1, wherein the front ends of the first core and the second core are respectively inserted into the nozzle joints, the tail ends of the first core and the second core are respectively provided with a core step, the insertion positions of the nozzle joints and the first core and the second core are respectively provided with a nozzle joint step, and the core steps are welded with the nozzle joint steps.
6. The non-similar redundancy pressure sensor of claim 5, wherein the core body step and the nozzle joint step are welded using a continuous laser welding process with a weld depth of 1.5mm or more.
7. The non-similar redundancy pressure sensor of claim 6, wherein the continuous laser welding process parameters are set to: the laser power range is 800W-1000W, the welding speed range is 3500mm/min-4000mm/min, and the defocusing amount is +2 mm.
8. The non-similar redundancy pressure sensor of claim 1, wherein the first core and the second core are threaded with the nozzle fitting.
9. The dissimilar redundancy pressure sensor of claim 8, wherein the front interface position of the first core and the second core is designed as M10 x 1-6g male threads and the interface position of the nozzle adapter is designed as M10 x 1-6H female threads.
10. An aircraft hydraulic system comprising a non-similar redundancy pressure sensor according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111531433.6A CN114198363B (en) | 2021-12-14 | 2021-12-14 | Dissimilar redundancy pressure sensor and aircraft hydraulic system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111531433.6A CN114198363B (en) | 2021-12-14 | 2021-12-14 | Dissimilar redundancy pressure sensor and aircraft hydraulic system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114198363A true CN114198363A (en) | 2022-03-18 |
| CN114198363B CN114198363B (en) | 2023-07-11 |
Family
ID=80653914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111531433.6A Active CN114198363B (en) | 2021-12-14 | 2021-12-14 | Dissimilar redundancy pressure sensor and aircraft hydraulic system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114198363B (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0552691A (en) * | 1991-08-22 | 1993-03-02 | Fuji Electric Co Ltd | Semiconductor pressure sensor |
| JP2004317263A (en) * | 2003-04-15 | 2004-11-11 | Toyoda Mach Works Ltd | Manufacturing method of pressure detection chip |
| US20060230755A1 (en) * | 2005-04-19 | 2006-10-19 | Emerson Process Management Power & Water Solutions, Inc. | Electronically controllable and testable turbine trip system |
| US20070089526A1 (en) * | 2005-10-26 | 2007-04-26 | Kurtz Anthony D | High accuracy, high temperature, redundant media protected differential transducers |
| CN101000270A (en) * | 2007-01-05 | 2007-07-18 | 电子科技大学 | Sputtering film high temp. pressure sensor |
| CN101718606A (en) * | 2009-11-27 | 2010-06-02 | 李维平 | Pressure sensor with double redundancies and high reliability |
| CN203365047U (en) * | 2013-08-16 | 2013-12-25 | 中国电子科技集团公司第四十八研究所 | Dual-path pressure sensitive core |
| CN103869781A (en) * | 2014-03-14 | 2014-06-18 | 北京航空航天大学 | Non-similar three-redundancy onboard electric load management center |
| CN105628289A (en) * | 2015-12-25 | 2016-06-01 | 陕西电器研究所 | Four-redundancy pressure sensor adopting sputtering film core body |
| CN206695932U (en) * | 2017-03-02 | 2017-12-01 | 南京沃天科技有限公司 | Triplex redundance pressure sensor |
| CN108254121A (en) * | 2017-12-14 | 2018-07-06 | 中国航空工业集团公司成都飞机设计研究所 | Inflation valve with temperature and pressure detection function |
| CN207622899U (en) * | 2017-11-27 | 2018-07-17 | 陕西电器研究所 | A kind of diaphragm pressure sensing element of triplex redundance |
| CN110986753A (en) * | 2019-11-29 | 2020-04-10 | 苏州长风航空电子有限公司 | Double-redundancy non-contact transformer type angular displacement sensor |
| CN111141430A (en) * | 2019-12-23 | 2020-05-12 | 陕西电器研究所 | Film core body sealing assembly in sputtering film pressure sensor and preparation thereof |
| CN211013131U (en) * | 2019-12-04 | 2020-07-14 | 四川泛华航空仪表电器有限公司 | Non-similar dual-redundancy position automatic oil level identification information acquisition system |
| CN211346898U (en) * | 2020-01-08 | 2020-08-25 | 苏州长风航空电子有限公司 | Aviation airborne dual-redundancy temperature and pressure combined sensor |
| CN112729621A (en) * | 2020-12-21 | 2021-04-30 | 苏州长风航空电子有限公司 | Dual-redundancy pressure sensor and manufacturing method thereof |
| CN213148194U (en) * | 2020-09-07 | 2021-05-07 | 中国航发控制***研究所 | Multi-chip pressure sensor |
| CN112798176A (en) * | 2021-01-27 | 2021-05-14 | 慧石（上海）测控科技有限公司 | Double-redundancy pressure sensor buffer structure |
| CN113432764A (en) * | 2021-06-23 | 2021-09-24 | 广州市智芯禾科技有限责任公司 | Three-redundancy film pressure sensor |
| CN214621580U (en) * | 2021-01-27 | 2021-11-05 | 慧石（上海）测控科技有限公司 | Double-redundancy pressure sensor buffer structure |
-
2021
- 2021-12-14 CN CN202111531433.6A patent/CN114198363B/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0552691A (en) * | 1991-08-22 | 1993-03-02 | Fuji Electric Co Ltd | Semiconductor pressure sensor |
| JP2004317263A (en) * | 2003-04-15 | 2004-11-11 | Toyoda Mach Works Ltd | Manufacturing method of pressure detection chip |
| US20060230755A1 (en) * | 2005-04-19 | 2006-10-19 | Emerson Process Management Power & Water Solutions, Inc. | Electronically controllable and testable turbine trip system |
| US20070089526A1 (en) * | 2005-10-26 | 2007-04-26 | Kurtz Anthony D | High accuracy, high temperature, redundant media protected differential transducers |
| CN101000270A (en) * | 2007-01-05 | 2007-07-18 | 电子科技大学 | Sputtering film high temp. pressure sensor |
| CN101718606A (en) * | 2009-11-27 | 2010-06-02 | 李维平 | Pressure sensor with double redundancies and high reliability |
| CN203365047U (en) * | 2013-08-16 | 2013-12-25 | 中国电子科技集团公司第四十八研究所 | Dual-path pressure sensitive core |
| CN103869781A (en) * | 2014-03-14 | 2014-06-18 | 北京航空航天大学 | Non-similar three-redundancy onboard electric load management center |
| CN105628289A (en) * | 2015-12-25 | 2016-06-01 | 陕西电器研究所 | Four-redundancy pressure sensor adopting sputtering film core body |
| CN206695932U (en) * | 2017-03-02 | 2017-12-01 | 南京沃天科技有限公司 | Triplex redundance pressure sensor |
| CN207622899U (en) * | 2017-11-27 | 2018-07-17 | 陕西电器研究所 | A kind of diaphragm pressure sensing element of triplex redundance |
| CN108254121A (en) * | 2017-12-14 | 2018-07-06 | 中国航空工业集团公司成都飞机设计研究所 | Inflation valve with temperature and pressure detection function |
| CN110986753A (en) * | 2019-11-29 | 2020-04-10 | 苏州长风航空电子有限公司 | Double-redundancy non-contact transformer type angular displacement sensor |
| CN211013131U (en) * | 2019-12-04 | 2020-07-14 | 四川泛华航空仪表电器有限公司 | Non-similar dual-redundancy position automatic oil level identification information acquisition system |
| CN111141430A (en) * | 2019-12-23 | 2020-05-12 | 陕西电器研究所 | Film core body sealing assembly in sputtering film pressure sensor and preparation thereof |
| CN211346898U (en) * | 2020-01-08 | 2020-08-25 | 苏州长风航空电子有限公司 | Aviation airborne dual-redundancy temperature and pressure combined sensor |
| CN213148194U (en) * | 2020-09-07 | 2021-05-07 | 中国航发控制***研究所 | Multi-chip pressure sensor |
| CN112729621A (en) * | 2020-12-21 | 2021-04-30 | 苏州长风航空电子有限公司 | Dual-redundancy pressure sensor and manufacturing method thereof |
| CN112798176A (en) * | 2021-01-27 | 2021-05-14 | 慧石（上海）测控科技有限公司 | Double-redundancy pressure sensor buffer structure |
| CN214621580U (en) * | 2021-01-27 | 2021-11-05 | 慧石（上海）测控科技有限公司 | Double-redundancy pressure sensor buffer structure |
| CN113432764A (en) * | 2021-06-23 | 2021-09-24 | 广州市智芯禾科技有限责任公司 | Three-redundancy film pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114198363B (en) | 2023-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7526962B1 (en) | High pressure delta P sensor | |
| CN213148194U (en) | Multi-chip pressure sensor | |
| CN104246462B (en) | Ceramic pressure sensor and method for production thereof | |
| EP0982576B1 (en) | Sensor and method of producing the same | |
| CN101738280B (en) | Mems pressure sensor and manufacturing method thereof | |
| CN105241371B (en) | Resistance strain gage | |
| US4726233A (en) | Electric pressure pick-off | |
| CN101561430A (en) | System for monitoring crack of piezoelectric-array converged alertness network structure and monitoring and installing methods | |
| CN208399071U (en) | Silicon piezoresistance type pressure sensor packaging structure | |
| CN211346898U (en) | Aviation airborne dual-redundancy temperature and pressure combined sensor | |
| JPH01276035A (en) | Pressure transmitter | |
| CN112345158B (en) | Differential pressure sensing method of high-static-pressure monocrystalline silicon differential pressure sensor | |
| CN107228731A (en) | A kind of differential pressure sensor arrangement and its method for packing | |
| CN114198363A (en) | Non-similar redundancy pressure sensor and aircraft hydraulic system | |
| CN207622684U (en) | Bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor | |
| CN113483941A (en) | Leadless packaging dynamic pressure sensor integrated with ASIC chip | |
| WO2024093444A1 (en) | Elastomer of torque sensor and torque sensor | |
| CN205373926U (en) | Soil pressure multiple spot distribution test sensor | |
| CN208419913U (en) | Portable three-coordinate measuring machine | |
| CN214224409U (en) | Double-range force transducer | |
| CN205384107U (en) | Sextuple force transducer decouples in part based on stewart structure | |
| CN115727981A (en) | Leadless packaged pressure chip flexible tactile measurement sensor and preparation method thereof | |
| CN215414159U (en) | Pressure sensor assembly | |
| CN208313214U (en) | A kind of flexible probe based on capacitance method detection roughness | |
| CN205642689U (en) | Detect sensor of connector elasticity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |