CN114192985B - Magnetic field assisted laser polishing device and magnetic field assisted polishing method - Google Patents
Magnetic field assisted laser polishing device and magnetic field assisted polishing method Download PDFInfo
- Publication number
- CN114192985B CN114192985B CN202111450935.6A CN202111450935A CN114192985B CN 114192985 B CN114192985 B CN 114192985B CN 202111450935 A CN202111450935 A CN 202111450935A CN 114192985 B CN114192985 B CN 114192985B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- laser
- magnetic
- polishing
- light spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
The application is applicable to the technical field of mechanical equipment, and provides a magnetic field auxiliary laser polishing device and a magnetic field auxiliary laser polishing method, wherein the magnetic field auxiliary laser polishing device comprises a cabinet; the workbench is arranged in the cabinet and is provided with a workpiece positioning area for placing a workpiece; a magnetic mechanism for causing the workpiece to be in a magnetic field; a laser system mounted within the cabinet, comprising: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a third laser emitting mechanism for annealing the surface of the workpiece. The magnetic field assisted laser polishing device provided by the invention can effectively reduce the surface roughness of a workpiece and improve the polishing effect by the magnetic field generated by the magnetic mechanism and the laser emitted by the laser system acting on the workpiece together.
Description
Technical Field
The present application relates to the field of metal polishing, and more particularly, to a magnetic field assisted laser polishing apparatus and a magnetic field assisted polishing method.
Background
The titanium alloy is suitable for the aerospace field due to the characteristics of high strength, high heat resistance, good corrosion resistance and the like, high-quality corrosion resistance and excellent biocompatibility are also highly accepted in the biomedical industry, and expensive medical instruments such as 3D printed titanium alloy artificial hearts, blood stents and the like are successfully applied to clinic. Moreover, titanium alloys are widely used in other industrial fields such as chemistry, oceans, automobiles, energy sources, and the like. The surface quality of the titanium alloy is critical to the performance and life of the titanium alloy product.
The laser has potential advantages in the aspect of polishing application of titanium alloy, not only can adjust the polishing speed in the polishing process, but also the polishing process belongs to non-contact polishing, and no cooling liquid is needed, so that the processing cost can be effectively reduced, and the environment is protected. However, the current laser polishing apparatus can only emit one laser beam, and the effect of one polishing of a single laser beam is often not ideal.
Disclosure of Invention
The embodiment of the application aims to provide a magnetic field assisted laser polishing device, and aims to solve the technical problem that the polishing effect of the titanium alloy surface in the prior art is relatively poor.
In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is a magnetic field assisted laser polishing apparatus including:
a cabinet;
the workbench is arranged in the cabinet and is provided with a workpiece positioning area for placing a workpiece;
a magnetic mechanism for causing the workpiece to be in a magnetic field;
a laser system mounted within the cabinet, comprising: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a third laser emitting mechanism for annealing the surface of the workpiece.
In one possible design, the magnetic mechanism includes a first electromagnetic structure and a second electromagnetic structure, the first electromagnetic structure and the second electromagnetic structure being disposed on two sides of the workpiece positioning area, respectively.
In one possible design, the first and second laser emitting mechanisms each comprise a continuous laser and the second laser emitting mechanism comprises a pulsed laser.
In one possible design, the magnetic field assisted laser polishing apparatus further comprises a sealed cabin and a gas supply mechanism, wherein the sealed cabin is communicated with the gas supply mechanism through a gas path, the workbench is located in the sealed cabin, and the gas supply mechanism is used for supplying inert gas to the sealed cabin through the gas path.
In one possible design, the magnetic field assisted laser polishing apparatus further comprises a controller disposed on the cabinet, the controller being electrically connected to the laser system and the magnetic mechanism, respectively.
In one possible design, the magnetic field assisted laser polishing apparatus further comprises a water cooler connected to the first, second and third laser emitting mechanisms via water pipes, respectively.
The application also provides a magnetic field auxiliary laser polishing method, which is applicable to the magnetic field auxiliary laser polishing device according to the technical scheme, and comprises the following steps:
mounting a workpiece to a workpiece positioning area of the table;
starting a magnetic mechanism to enable the workpiece to be in a magnetic field;
starting a laser system, enabling a first laser emission mechanism to emit a first light beam so as to enable the surface of a workpiece to form a preheating light spot, enabling a second laser emission mechanism to emit a second light beam so as to enable the surface of the workpiece to form a polishing light spot, enabling a third laser emission mechanism to emit a third light beam so as to enable the surface of the workpiece to form an annealing light spot, and enabling overlapping areas to be formed between the preheating light spot and the polishing light spot and between the polishing light spot and the annealing light spot, and moving the preheating light spot, the polishing light spot and the annealing light spot according to a set path so as to polish the workpiece.
In one possible design, there is an overlap region between the preheat spot and the polish spot, and between the polish spot and the anneal spot;
the overlap ratio between the preheating light spot and the polishing light spot is 30% -50%, and/or the overlap ratio between the polishing light spot and the annealing light spot is 30% -50%.
In one possible design, the scanning speed of the first light beam and the scanning speed of the second light beam are the same as the scanning speed of the third light beam and are all 20mm/s-60mm/s; and/or
The power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W.
In one possible design, before the step of starting the laser system, the method further comprises:
opening a gas supply mechanism to allow inert gas in the gas supply mechanism to enter the sealed cabin, and/or
And opening a water cooling machine to cool the first laser emission mechanism, the second laser emission mechanism and the third laser emission mechanism.
The application provides a supplementary laser burnishing device of magnetic field's beneficial effect lies in: compared with the prior art, the magnetic field auxiliary laser polishing device can be used for polishing the surface of a workpiece (such as the surface of a titanium alloy workpiece), and the polishing process is as follows: and placing the workpiece to be polished in a workpiece positioning area of a workbench, heating the workpiece surface area to be polished through a first laser emission mechanism, and heating the workpiece surface to be polished to raise the temperature of the workpiece surface after heating so as to preheat the workpiece surface. When the surface temperature of the workpiece is not increased to the melting point, the preheated region is polished through the second laser emission mechanism, and only small power is needed at the moment, so that the surface temperature of the workpiece can reach above the melting point. And in the polished area, annealing the surface of the workpiece through a third laser emission mechanism, so that defects such as cracks and gaps generated by rapid cooling of the surface can be effectively placed. When the laser system is used for polishing the surface of a workpiece, the magnetic mechanism is started, so that the workpiece is in a magnetic field, the magnetic field acts on the surface of the workpiece, the Lorentz force generated by the magnetic field can inhibit the flow of a molten pool on the surface of the workpiece, promote the nucleation of crystals in the solidification process of the molten pool, and enable the solidified crystal grains to be finer, thereby inhibiting the formation of the second roughness on the surface of the workpiece, further reducing the average roughness of the surface of the workpiece, increasing the mechanical property, and effectively inhibiting the defects of splashing, ripple, crack and the like generated by the oscillation of the molten pool in the flowing process of the molten pool.
In summary, the magnetic field generated by the magnetic mechanism and the laser emitted by the laser system of the magnetic field auxiliary laser polishing device provided by the application jointly act on the workpiece (including the workpiece made of titanium alloy), so that the surface roughness of the workpiece can be effectively reduced, and the polishing effect is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a magnetic field assisted laser polishing apparatus according to one embodiment of the present application;
FIG. 2 is a schematic view of another perspective structure of a magnetic field assisted laser polishing apparatus according to one embodiment of the present application;
FIG. 3 is a schematic diagram of the internal structure of a magnetic field assisted laser polishing apparatus according to one embodiment of the present application;
FIG. 4 is a perspective view of a capsule of a magnetic field assisted laser polishing apparatus provided in one embodiment of the present application;
FIG. 5 is a schematic diagram of the relative positional relationship between a magnetic mechanism of a magnetic field assisted laser polishing apparatus and a workpiece according to one embodiment of the present application;
fig. 6 is a schematic diagram of water and air connection of a magnetic field assisted laser polishing apparatus according to an embodiment of the present application.
Reference numerals related to the above figures are as follows:
10. a cabinet; 20. sealing the cabin; 31. a housing; 32. electrifying the joint; 41. a laser; 42. a beam expander; 43. scanning a vibrating mirror; 51. a display; 52. a host; 61. a gas cylinder; 62. an air pipe; 71. a water cooling machine; 72. a water pipe; 81. preheating the light spots; 82. polishing the light spots; 83. annealing the light spots; 90. a workpiece.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are directional or positional relationships as indicated based on the drawings, merely to facilitate the description of the present application and simplify the description, and do not indicate or imply that the magnetic field assisted laser polishing apparatus or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus are not to be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
For the purpose of illustrating the technical solutions described herein, the following detailed description is provided with reference to specific drawings and examples.
First embodiment
As shown in fig. 1 to 6, one embodiment of the present application provides a magnetic field assisted laser polishing apparatus comprising: cabinet 10, workstation, magnetic mechanism and laser system, wherein: the table, magnetic mechanism and laser system are all mounted within the cabinet 10, the table having a workpiece positioning area for placement of the workpiece 90. The magnetic mechanism is used to generate a magnetic field such that the workpiece 90 located in the workpiece positioning area is in the magnetic field. The laser system comprises three laser emission mechanisms, which are respectively: the polishing device comprises a first laser emission mechanism, a second laser emission mechanism and a third laser emission mechanism, wherein the first laser emission mechanism is used for preheating the surface of a workpiece 90 to be polished, the second laser emission mechanism is used for polishing the preheated area, and the third laser emission mechanism is used for annealing the area of the surface of the workpiece 90 polished by the second laser emission mechanism.
The bottom of the cabinet 10 may be provided with rollers, on which brake pads may be provided, the rollers preferably being universal wheels. Auxiliary supporting feet are also arranged at the bottom of the cabinet 10.
The magnetic mechanism comprises a first electromagnetic structure and a second electromagnetic structure, and the first electromagnetic structure and the second electromagnetic structure are respectively arranged on two sides of the workpiece positioning area. The first electromagnetic structure and the second electromagnetic structure may adopt the same structure, for example, as shown in fig. 5, the first electromagnetic structure and the second electromagnetic structure respectively include a housing 31, a coil is provided in the housing 31, an energizing connector 32 is provided on the housing 31, the coil is connected with the energizing connector 32, the energizing connector 32 may be connected with a cable, and the coil is energized by the cooperation of the cable and the energizing connector 32. For example, after the power is applied, a side of the first electromagnetic structure facing the second electromagnetic structure is an N pole, and a side of the second electromagnetic structure facing the first electromagnetic structure is an S pole.
In one possible design, each of the three laser emitting mechanisms includes a laser 41, a beam expander 42 and a scanning galvanometer 43, and the beam emitted by the laser 41 enters the scanning galvanometer 43 through the beam expander 42 and focuses the laser spot on the surface of the workpiece 90 after being focused by the galvanometer. Wherein the first laser emitting mechanism and the second laser emitting mechanism each comprise a continuous laser, and the second laser emitting mechanism comprises a pulsed laser.
Optionally, the magnetic field assisted laser polishing device further comprises a control mechanism, wherein the control mechanism is respectively and electrically connected with the magnetic mechanism and the laser system, the control mechanism can control whether the coil in the magnetic mechanism is electrified or not, the power level of the electrified coil is controlled, the control mechanism can also control the continuous laser/pulse laser parameters emitted by the laser 41 in the laser system, and the polishing range can be selected.
In an alternative embodiment, the control mechanism includes a control main board and a display screen connected to the control main board, where the display screen is fixed on the outer side of the cabinet 10, and the display screen is a touch screen, and performs a control operation by selecting or inputting information on the touch screen.
Preferably, in another alternative embodiment, the control mechanism may include a control computer, where the control computer includes a display 51, a host 52, and an input end, where the host 52 is mounted on the inside of the cabinet 10, a bracket is connected to the outer side wall of the cabinet 10, and the display 51 is mounted on the bracket, and the input end may include a mouse and a keyboard connected to the host 52. So set up, can place control mechanism's host computer 52 in cabinet 10 inboard, the rational utilization cabinet 10 inboard space, and display screen and input can be placed in convenient to use person's operation and do not influence the region of opening and shutting cabinet door.
In order to further improve the sealing effect, in one possible design, the magnetic field assisted laser polishing apparatus further includes a sealed cabin 20 and an air supply mechanism, wherein the sealed cabin 20 is communicated with the air supply mechanism through an air path, the workbench is located in the sealed cabin 20, and the air supply mechanism is used for providing inert gas to the sealed cabin 20 through the air path. For example, argon may be used as the inert gas. Before the laser system is started, the capsule 20 is locked so that the capsule 20 is maintained in a sealed state, and then argon gas is supplied into the capsule 20 through a gas supply mechanism to prevent the surface of the workpiece 90 from being oxidized during polishing.
The air supply mechanism includes an air cylinder 61, and the air cylinder 61 communicates with an air pipe 62. A valve is provided at the gas outlet of the gas cylinder 61 or the gas pipe 62, or a gas pump is provided at the gas pipe 62 so as to control whether the gas of the capsule 20 is introduced or not. The air supply mechanism is electrically connected with the control mechanism, and the working state of the air supply mechanism is controlled by the control mechanism. As shown in fig. 4, the sealing cavity is connected with two air pipes 62, wherein one air pipe 62 is an air inlet pipe, one end of the air inlet pipe is connected with the air bottle 61, and the other air pipe 62 is an air outlet pipe.
Specifically, the floor of the capsule 20 may be used as a table, or the table may exist independently of the capsule 20 and be fixed to the floor of the capsule 20.
The work table is provided with a work piece positioning area, wherein the work piece positioning area is an area, which is positioned between the first magnetic structure and the second magnetic structure, on the work table, and the area can be only divided in position and is structurally the same as other areas on the top surface of the work table. Or a limiting groove can be formed in the workbench, and a workpiece positioning area is formed in the limiting groove; or, a plurality of positioning holes can be formed in the workbench, positioning needles can be inserted into the positioning holes, and the area surrounded by the positioning needles is a workpiece positioning area. The different positioning holes into which the positioning pins are inserted can enable the size of the area surrounded by the positioning pins to be different, so that the positioning of the workpieces 90 with various different sizes is adapted.
In the magnetic mechanism, the distance between the first magnetic structure and the second magnetic structure can be changed, so that the distance between the coil and the workpiece 90 can be changed by adjusting the positions of the first magnetic structure and the second magnetic structure, and the magnitude of the magnetic field acting on the workpiece 90 can be adjusted.
In an alternative embodiment, only the first magnetic structure and the second magnetic structure may be placed on the table, with no connection between the first magnetic structure and the table, and between the second magnetic structure and the table. When the positions of the first magnetic structure and the second magnetic structure need to be changed, the positions of the first magnetic structure and the second magnetic structure are manually changed by an operator.
Or, in another alternative embodiment, a first guiding member is disposed on the workbench, and a second guiding member is disposed on the first magnetic structure and the second magnetic structure, where the first guiding member and the second guiding member are mounted in a matched manner, so that the first magnetic structure can move along the first guiding member in a direction away from or close to the second magnetic structure, and the second magnetic structure can move along the first guiding member in a direction away from or open into the first magnetic structure, and the first guiding member plays a role in guiding the first magnetic structure and the second magnetic structure to a certain extent respectively.
One of the first guide piece and the second guide piece is a guide groove, and the other is a guide rail.
For example, the first magnetic structure and the second magnetic structure are spaced apart along a first direction for positioning the workpiece 90 therebetween. The first guide piece is the guide rail, and the second guide piece is the guide way, and then the quantity of first guide piece is two, and two guide rails are placed along first direction interval, and work piece location area is located between two guide rails. The bottom of the shell 31 of the first magnetic structure and the bottom of the shell 31 of the second magnetic structure are respectively provided with a guide groove, the first magnetic structure is assembled on one of the guide rails in a sliding manner, and the second magnetic structure is assembled on the second guide rail in a sliding manner. So set up, first magnetic structure and second magnetic structure only can follow first direction under the effect of corresponding guide rail and remove, can make when changing the distance between coil and the work piece 90, first magnetic structure and second magnetic structure's removal stability is stronger, is difficult for appearing the route skew.
Alternatively, in yet another alternative embodiment, a driver is disposed outside the capsule 20, and an output end of the driver extends into the capsule 20 to be connected to at least one of the first magnetic mechanism and the second magnetic mechanism to push the first magnetic mechanism and/or the second magnetic mechanism connected thereto to move in the first direction. The number of the output ends of the driver can be two, one of the output ends is connected with the first magnetic mechanism, the other output end is connected with the second magnetic mechanism, and the two output ends are in transmission connection through the transmission mechanism, so that when the driver is started, the two output ends simultaneously operate to drive the first magnetic mechanism and the second magnetic mechanism to move in opposite directions so as to be close to or far away from each other. It should be noted that, the output end of the driver and the side wall of the sealed cabin 20 are sealed by combining dynamic sealing and static sealing, so as to achieve a good sealing effect under the condition of ensuring the movement of the output end.
In one possible design, the magnetic field assisted laser polishing apparatus further includes a water cooler 71, the water cooler 71 being connected to the first, second and third laser emitting mechanisms, respectively, via a water pipe 72. Specifically, the water cooler 71 is provided with twelve water pipes 72, wherein six water inlet pipes 72 and six water outlet pipes 72, one water inlet pipe 72 and one water outlet pipe 72 are a group of cooling water pipes, and each of the first laser emission mechanism, the second laser emission mechanism and the third laser emission mechanism is respectively connected with two groups of cooling water pipes. Specifically, in the laser emitting mechanism, a set of cooling water pipes is connected to the respective lasers 41 and scanning galvanometers 43, respectively, so that two sets of cooling water pipes are connected to one laser emitting mechanism.
Before the laser system is started, the water cooler 71 is started to cool the scanning galvanometer 43 and the laser 41 in advance, so that proper working temperatures are provided for the scanning galvanometer 43 and the laser 41 and for the scanning galvanometer 43 and the laser 41. For example, the temperature of the scanning galvanometer 43 and the laser 41 during operation is maintained below 24 ℃ by a water cooler.
The water cooler 71 may be electrically connected to a control mechanism to control the start and stop of the water cooler 71 through the control mechanism.
Second embodiment
The present embodiment provides a magnetic field assisted laser polishing method, which is applicable to the magnetic field assisted laser polishing apparatus provided in the first embodiment, and the magnetic field assisted laser polishing method includes:
mounting the workpiece 90 to a workpiece positioning area of a table;
activating the magnetic mechanism such that the workpiece 90 is in a magnetic field;
the laser system is started such that the first laser emitting mechanism emits a first light beam to form the preheating spot 81 on the surface of the workpiece 90, the second laser emitting mechanism emits a second light beam to form the polishing spot 82 on the surface of the workpiece 90, and the third laser emitting mechanism emits a third light beam to form the annealing spot 83 on the surface of the workpiece 90, and the preheating spot 81, the polishing spot 82, and the annealing spot 83 are moved in accordance with a set path to perform polishing treatment on the workpiece 90.
The magnetic field assisted laser polishing method provided in this embodiment is suitable for polishing a surface of a workpiece 90, and is particularly suitable for polishing a plane of the surface of the workpiece 90.
In an alternative embodiment, there is an overlap region between the preheat spot 81 and the polishing spot 82, and between the polishing spot 82 and the annealing spot 83. Because of the overlapping area, the area to be polished on the surface of the workpiece 90 to be polished can be polished immediately after being preheated, no interval exists in the middle, and the polishing effect is better.
In an alternative embodiment, the overlap between the preheat spot 81 and the polishing spot 82 is between 30% and 50%.
In an alternative embodiment, the overlap ratio between the polishing spot 82 and the annealing spot 83 is 30% -50%.
In an alternative embodiment, the first beam has a power of 150W to 250W, the second beam has a power of 20W to 50W, and the third beam has a power of 100W to 200W.
In an alternative embodiment, the scanning speed of the first beam and the scanning speed of the second beam are both 20mm/s-60mm/s, which is the same as the scanning speed of the third beam. The power, spot size, and scan speed of the various laser emitting mechanisms in the laser system can be controlled by the control mechanism so that arbitrarily selected areas of the workpiece 90 can be polished.
In one possible design, before the step of starting the laser system, further comprises: the gas supply mechanism is opened so that the inert gas in the gas supply mechanism enters the capsule 20.
In one possible design, before the step of starting the laser system, further comprises: the water cooling machine 71 is turned on to perform a cooling process for the first laser emitting mechanism, the second laser emitting mechanism, and the third laser emitting mechanism.
In summary, in one embodiment, the polishing method provided in this example is described by taking a planar surface of a workpiece 90 made of a polished titanium alloy material as an example.
The polishing method comprises the following steps:
the workpiece 90 is secured to the table.
The water cooling machine 71 is started to cool each of the laser 41 and the scanning galvanometer 43 in advance to ensure that the operating temperatures of the laser 41 and the scanning galvanometer 43 are maintained below 24 ℃.
The gas supply device is started, argon is injected into the sealed cabin 20 through the gas supply device, the sealing cover plate of the sealed cabin 20 is closed, and the sealing cover plate is locked, so that the sealed cabin 20 forms a closed cavity, and the workpiece 90 is positioned in the closed cavity.
The magnetic mechanism is activated to energize the energized contacts 32 to energize the coils, the magnitude of the magnetic field being varied by varying the magnitude of the current or the distance between the coils and the workpiece 90, the magnetic field being generated by the coils acting on the workpiece 90.
The laser system is started, and laser generated in the first laser emission mechanism enters the scanning galvanometer 43 through the beam expander 42, and acts on the surface of the workpiece 90 after being focused by the scanning galvanometer 43 to form a preheating light spot 81 with the diameter of 0.6 mm. While the first laser emission mechanism is started, laser generated in the second laser emission mechanism enters the scanning galvanometer 43 through the beam expander 42, and is focused through the scanning galvanometer 43 to act on the surface of the workpiece 90 to form a polishing light spot 82 with the diameter of 0.3 mm. While the second laser emission mechanism is started, laser generated in the third laser emission mechanism enters the scanning galvanometer 43 through the beam expander 42, and is focused through the scanning galvanometer 43 to act on the surface of the workpiece 90 to form an annealing light spot 83 with the diameter of 0.6 mm. The melting point of the titanium alloy material is 1900 ℃, the power of the first laser emitting mechanism is 150-250W, the power of the second laser emitting mechanism is 20-50W, and the power of the third laser emitting mechanism is 100-200W in order to improve the polishing efficiency and the polishing quality. The overlap ratio between the preheating spot 81 and the polishing spot 82, and the overlap ratio between the polishing spot 82 and the annealing spot 83 are both 30% -50%. To avoid heat build-up, the total area of finished polished areas of the surface of the titanium alloy workpiece 90 is as small as 100mm or less during a single polishing pass of the apparatus 2 . The scanning speeds of the first laser emission mechanism, the second laser emission mechanism and the third laser emission mechanism are all the same.
In the polishing process, laser polishing is a novel polishing technology for melting and resolidifying materials, from a microscopic level, the peak materials on the surface of the titanium alloy workpiece 90 are heated and melted under the action of laser energy to form a molten pool, the molten pool can be subjected to the action of gravity, buoyancy, surface tension and other forces, and if the molten pool is solidified and the forces are not balanced, the surface of the regenerated titanium alloy is uneven and cannot achieve the polishing effect. The multiple laser polishing is to heat the polishing area of the surface of the titanium alloy workpiece 90 by using the continuous laser 41, the surface temperature of the titanium alloy workpiece 90 is rapidly increased after heating, and then the titanium alloy material is polished by using the pulse laser after the temperature is slightly lower than 1900 ℃, so that the temperature of the surface of the sample can reach above the melting point by using the pulse laser with only small power, and finally the titanium alloy sample is annealed by using the continuous laser 41, thereby effectively preventing the defects of cracks, pores and the like caused by rapid cooling of the surface. The magnetic field assisted polishing is that in the laser polishing process, a magnetic field generated by an electrified coil acts on a titanium alloy plane, and Lorentz force generated by the magnetic field can inhibit the flow of a molten pool and promote the nucleation of titanium alloy crystals in the solidification process of the molten pool, so that the solidified titanium alloy crystals are more refined. Thereby inhibiting the formation of the second roughness on the surface of the titanium alloy, so that the average roughness of the surface of the titanium alloy is reduced and the mechanical property is increased.
In the polishing method provided by the embodiment, the combination of the multi-laser polishing method and the magnetic field assisted polishing is adopted, and the defects of cracks, pores and the like on the surface of the titanium alloy workpiece 90 due to the fact that the cooling speed is too high and the temperature gradient is too large can be effectively reduced by adding the preheating light spots 81 and the annealing light spots 83, so that the roughness of the polished titanium alloy surface is reduced. By adopting the magnetic field to assist polishing, the defects of splashing of a molten pool in the flowing process, ripple and crack generated by oscillation of the molten pool and the like can be effectively inhibited by adding the magnetic field generated by the electrified coils on two sides of the workpiece 90, and the surface roughness of the titanium alloy can be further reduced.
The foregoing is merely an alternative embodiment of the present application and is not intended to limit the present application, and any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of the present application.
Claims (8)
1. A magnetic field assisted laser polishing apparatus comprising:
a cabinet;
the workbench is arranged in the cabinet and is provided with a workpiece positioning area for placing a workpiece;
a magnetic mechanism for causing the workpiece to be in a magnetic field;
a laser system mounted within the cabinet, comprising: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a third laser emitting mechanism for annealing the surface of the workpiece; the first laser emission mechanism is used for emitting a first light beam so as to enable the surface of the workpiece to form a preheating light spot, the second laser emission mechanism is used for emitting a second light beam so as to enable the surface of the workpiece to form a polishing light spot, and the third laser emission mechanism is used for emitting a third light beam so as to enable the surface of the workpiece to form an annealing light spot; overlapping areas are formed between the preheating light spot and the polishing light spot and between the polishing light spot and the annealing light spot; the power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W; the overlapping rate between the preheating light spot and the polishing light spot is 30% -50%, and the overlapping rate between the polishing light spot and the annealing light spot is 30% -50%; the magnetic mechanism comprises a first electromagnetic structure and a second electromagnetic structure, and the first electromagnetic structure and the second electromagnetic structure are respectively arranged at two sides of the workpiece positioning area;
the first electromagnetic structure and the second electromagnetic structure respectively comprise a shell, a coil is arranged in the shell, an energizing connector is arranged on the shell, the coil is connected with the energizing connector, the energizing connector is connected with a cable, and the coil is energized by matching the cable with the energizing connector; the magnitude of the magnetic field can be changed by changing the magnitude of the current or the distance between the coil and the workpiece, and the magnetic field generated by the coil acts on the workpiece;
the workbench is provided with a first guide piece, the first magnetic structure and the second magnetic structure are provided with a second guide piece, and the first guide piece and the second guide piece are matched and installed, so that the first magnetic structure can move along the first guide piece in a direction away from or close to the second magnetic structure, the second magnetic structure can move along the first guide piece in a direction away from or open into the first magnetic structure, and the first guide piece has a guiding function on the first magnetic structure and the second magnetic structure respectively;
the first magnetic structure and the second magnetic structure are arranged at intervals along the first direction, and a workpiece is arranged between the first magnetic structure and the second magnetic structure;
a driver is arranged outside the sealed cabin, the output end of the driver extends into the sealed cabin and is connected with at least one of the first magnetic mechanism and the second magnetic mechanism so as to push the first magnetic mechanism and/or the second magnetic mechanism connected with the driver to move along the first direction, the number of the output ends of the driver can be two, one of the two output ends is connected with the first magnetic mechanism, the other one of the two output ends is connected with the second magnetic mechanism in a transmission way through a transmission mechanism, so that when the driver is started, the two output ends simultaneously operate to drive the first magnetic mechanism and the second magnetic mechanism to move in opposite directions so as to be close to or far away from each other; the output end of the driver is sealed with the side wall of the sealed cabin (20) in a mode of combining dynamic sealing and static sealing.
2. The magnetic field assisted laser polishing apparatus of claim 1 wherein the first laser emitting mechanism and the second laser emitting mechanism each comprise a continuous laser and the second laser emitting mechanism comprises a pulsed laser.
3. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a capsule and a gas supply mechanism, the capsule in communication with the gas supply mechanism via a gas path, the table positioned within the capsule, the gas supply mechanism configured to provide an inert gas to the capsule via the gas path.
4. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a controller disposed on the cabinet, the controller electrically connected to the laser system and the magnetic mechanism, respectively.
5. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a water cooler connected to the first, second and third laser emitting mechanisms, respectively, by a water line.
6. A magnetic field assisted laser polishing method suitable for use in a magnetic field assisted laser polishing apparatus according to any one of claims 1 to 5, comprising:
mounting the workpiece to a workpiece positioning area of the table;
starting a magnetic mechanism to enable the workpiece to be in a magnetic field;
starting a laser system, enabling a first laser emission mechanism to emit a first light beam so as to enable the surface of a workpiece to form a preheating light spot, enabling a second laser emission mechanism to emit a second light beam so as to enable the surface of the workpiece to form a polishing light spot, enabling a third laser emission mechanism to emit a third light beam so as to enable the surface of the workpiece to form an annealing light spot, and moving the preheating light spot, the polishing light spot and the annealing light spot according to a set path so as to polish the workpiece; overlapping areas are formed between the preheating light spot and the polishing light spot and between the polishing light spot and the annealing light spot; the power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W; the overlapping rate between the preheating light spot and the polishing light spot is 30% -50%, and the overlapping rate between the polishing light spot and the annealing light spot is 30% -50%.
7. The method of claim 6, wherein the scanning speed of the first beam and the scanning speed of the second beam are each 20mm/s to 60mm/s.
8. The magnetic field assisted laser polishing method of claim 6, further comprising, prior to the step of activating the laser system:
opening the gas supply mechanism to enable inert gas in the gas supply mechanism to enter the sealed cabin, and/or
And opening a water cooling machine to cool the first laser emission mechanism, the second laser emission mechanism and the third laser emission mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111450935.6A CN114192985B (en) | 2021-11-30 | 2021-11-30 | Magnetic field assisted laser polishing device and magnetic field assisted polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111450935.6A CN114192985B (en) | 2021-11-30 | 2021-11-30 | Magnetic field assisted laser polishing device and magnetic field assisted polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114192985A CN114192985A (en) | 2022-03-18 |
| CN114192985B true CN114192985B (en) | 2023-04-21 |
Family
ID=80650010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111450935.6A Active CN114192985B (en) | 2021-11-30 | 2021-11-30 | Magnetic field assisted laser polishing device and magnetic field assisted polishing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114192985B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283368A (en) * | 2022-08-24 | 2022-11-04 | 南京航空航天大学 | Method for improving laser removal stability and efficiency of metal plate surface coating |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5345334B2 (en) * | 2008-04-08 | 2013-11-20 | 株式会社レミ | Thermal stress cleaving method for brittle materials |
| CN107225328A (en) * | 2017-04-14 | 2017-10-03 | 北京航空航天大学 | A kind of single step pulse laser polishing method for metal surface |
| CN108436254B (en) * | 2018-03-26 | 2022-12-27 | 万津科技有限公司 | Glass polishing system and glass polishing method |
| CN108838548A (en) * | 2018-09-07 | 2018-11-20 | 中国工程物理研究院激光聚变研究中心 | Laser polishing device and polishing method |
| CN109516697A (en) * | 2019-01-11 | 2019-03-26 | 中国科学院上海光学精密机械研究所 | The laser polishing method of mobile phone display screen glass |
| CN109967863A (en) * | 2019-05-05 | 2019-07-05 | 北京航空航天大学 | A kind of magnetic field assistant laser polishing method based on existing laser process equipment |
| CN111055012A (en) * | 2019-12-31 | 2020-04-24 | 华中科技大学 | Thermo-magnetic field composite auxiliary processing system and method |
| CN111266740A (en) * | 2020-02-24 | 2020-06-12 | 深圳信息职业技术学院 | Ultrafast laser cleaning and fine polishing equipment for inner wall of component and control method |
| CN213835540U (en) * | 2020-11-27 | 2021-07-30 | 新疆大学 | Self-adaptive preheating slow-cooling laser cladding head |
| CN113118635A (en) * | 2021-04-21 | 2021-07-16 | 深圳信息职业技术学院 | Magnetic field laser polishing device and method |
| CN113275740B (en) * | 2021-05-24 | 2022-06-10 | 吉林大学 | Method for realizing laser zirconium nitride based amorphous alloy surface planarization by laser polishing |
-
2021
- 2021-11-30 CN CN202111450935.6A patent/CN114192985B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN114192985A (en) | 2022-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108213649B (en) | Material increase forming method and device for magnetic field control type electric arc robot | |
| CN114192985B (en) | Magnetic field assisted laser polishing device and magnetic field assisted polishing method | |
| CN111266740A (en) | Ultrafast laser cleaning and fine polishing equipment for inner wall of component and control method | |
| CN110640315A (en) | Laser welding method and device with additional variable frequency magnetic field | |
| CN103612019B (en) | A kind of CO of magnetic agitation2laser-TIG arc hybrid welding method | |
| CN115433937B (en) | Device and method for cladding iron-based amorphous coating by using magnetic field assisted ultra-high speed laser | |
| CN110202149A (en) | A kind of laser solid forming processing unit (plant) and method | |
| JP5021278B2 (en) | Surface grinding method for workpieces using surface grinding machine | |
| CN110682001B (en) | High-nitrogen steel composite welding device and method for reducing air holes under assistance of mechanical vibration | |
| CN110373666B (en) | Electromagnetic auxiliary laser synchronous cladding device and method for metal part remanufacturing | |
| KR20110021155A (en) | Welding device and method for stainless steel with high current tig welding | |
| CN113102891B (en) | Method and device for inhibiting aluminum alloy laser-MIG (Metal-inert gas) composite welding collapse by external magnetic field | |
| CN108515266B (en) | Method for high-frequency vibration-assisted laser welding of aluminum alloy | |
| CN116493757B (en) | Three-dimensional welding device and method for large cylinder | |
| CN112453600A (en) | Electric spark machine tool for processing metal products | |
| CN114147347A (en) | Polishing device and magnetic field auxiliary polishing method | |
| CN114535618B (en) | Three-dimensional printing system | |
| CN213497162U (en) | Machine head of film type wall surfacing machine and film type wall surfacing machine | |
| JPH05263125A (en) | Full automatic high-frequency induction quenching device | |
| CN217493063U (en) | Laser welding apparatus | |
| CN113798632B (en) | Forming method for arc fuse additive manufacturing | |
| JPS6237564A (en) | Manufacture of remelting chill cam shaft | |
| CN214978524U (en) | Laser polishing equipment for metal 3D printing part | |
| CN207498471U (en) | Laser cladding apparatus based on clamping electrified regulation and rotating electric field stirring | |
| CN206869330U (en) | A kind of laser enhancing device and arc welding system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |