CN114189994A - Manufacturing method of PCB with stepped groove - Google Patents
Manufacturing method of PCB with stepped groove Download PDFInfo
- Publication number
- CN114189994A CN114189994A CN202111409203.2A CN202111409203A CN114189994A CN 114189994 A CN114189994 A CN 114189994A CN 202111409203 A CN202111409203 A CN 202111409203A CN 114189994 A CN114189994 A CN 114189994A
- Authority
- CN
- China
- Prior art keywords
- milling machine
- depth control
- bottom plate
- manufacturing
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000003801 milling Methods 0.000 claims abstract description 40
- 230000006698 induction Effects 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Milling Processes (AREA)
Abstract
The invention provides a manufacturing method of a PCB with a step groove, which comprises the following steps: s1: manufacturing a blank plate to be milled; s2: etching the first conductive layer on the inner layer; s3: a depth control milling machine is used for installing preset parameter milling grooves according to the distance of the induction bottom plate; s4: and manufacturing a conductive stepped groove. According to the invention, by means of the induction bottom plate and the sensing assembly, the depth of the milling cutter is accurately adjusted by measuring the distance between the induction bottom plate and the induction bottom plate, so that the thickness between the dielectric layer and the second conducting layer is accurately controlled, stepped grooves with various sizes can be formed at one time, and the packaging requirement during a special shape period is met.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to a manufacturing method of a PCB with a stepped groove.
Background
With the accelerated popularization of information technology, the rapid promotion of internet and the maturity of automobile intelligent technology, the pace of the auto-driving automobile industry is certainly accelerated to develop, and in order to realize the auto-driving function, a large number of control systems are arranged in an automobile, so that the volume of a PCB (printed circuit board) serving as a component carrier plate is required to be correspondingly reduced. In order to meet the requirement of miniaturization of electronic products, the current method is to embed components into the PCB or to design a step groove into which the components can be embedded.
At present, the grooves are milled by embedding the buffering glue-resisting gaskets, the gaskets need to be put in advance, more gaskets need to be put into step grooves with various size requirements, the gasket putting is more complicated and difficult, and the requirement on the precision of the gasket putting is high; and the packaging requirements of some devices with special shapes cannot be met.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for manufacturing a PCB having a step groove.
The main content of the invention comprises:
a method for manufacturing a PCB with a stepped groove comprises a dielectric layer, a first conducting layer arranged on the upper surface of the dielectric layer and a second conducting layer arranged on the lower surface of the dielectric layer; the method comprises the following steps:
s1, preparing a blank plate through film coating and exposure;
s2, etching a corresponding area of the inner layer on the first conducting layer according to a preset position of the step groove to be milled;
s3, placing the blank plate obtained in the step S2 on an induction bottom plate of a depth control milling machine, and performing depth control milling and fishing on the daughter plate according to set parameters through the distance between the depth control milling machine and the induction bottom plate, which is measured by a sensing assembly of the depth control milling machine, so as to obtain a primary step groove;
and S4, carrying out copper deposition and copper plating on the preliminary stepped groove to obtain the conductive stepped groove.
Preferably, the method further comprises the step of initializing the deep milling machine, and the method comprises the following steps: and the substep of zero calibration of the depth control milling machine and recording the parameters of the step groove to be milled into the depth control milling machine.
Preferably, the depth control milling machine comprises a measuring unit, a control unit, a spindle and a milling cutter, the measuring unit and the spindle are connected with the control unit, the milling cutter is mounted on the spindle, the measuring unit is used for calculating the distance between the milling cutter measured by the sensing assembly and the induction bottom plate, and the control unit receives data collected by the measuring unit and controls the spindle to drive the milling cutter to mill the groove according to the set depth.
Preferably, the induction bottom plate is an aluminum plate.
Preferably, the sensing component is a sensor.
The invention has the beneficial effects that: the invention provides a manufacturing method of a PCB with a step groove.
Detailed Description
The technical solution protected by the present invention will be specifically explained below.
The invention discloses a method for manufacturing a PCB with a stepped groove, wherein the PCB comprises a dielectric layer, a first conducting layer arranged on the upper surface of the dielectric layer and a second conducting layer arranged on the lower surface of the dielectric layer; the manufacturing method of the invention can not only form the stepped groove meeting the requirements of devices with special shapes in one step.
Specifically, the manufacturing method provided by the invention comprises the following steps:
s1, preparing a blank plate through film coating and exposure; i.e. the blank is a double panel.
S2, etching a corresponding area of the inner layer on the first conducting layer according to the preset position of the step groove to be milled.
S3, preparing to start slot milling, wherein a depth control milling machine is used for processing in the step and comprises a measuring unit, a control unit, a main shaft and a milling cutter, the measuring unit and the main shaft are connected with the control unit, the milling cutter is installed on the main shaft, the measuring unit comprises an induction bottom plate and a sensing assembly, the induction bottom plate is used for placing a blank plate to be milled, the sensing assembly is installed on the milling cutter, the distance between the milling cutter and the induction bottom plate is collected through the sensing assembly, namely the depth needing to be cut is calculated by measuring the distance between the cutting position and the induction bottom plate, the control unit receives data collected by the measuring unit and controls the main shaft to drive the milling cutter to mill the slot according to the set depth. The method can not only save the complex process of placing the base plate, but also accurately mill the stepped grooves with various sizes according to the requirements.
Preferably, the induction bottom plate is an aluminum plate. The sensing component is a plurality of sensors.
Specifically, firstly, parameters of a step groove to be milled are input into a control unit, the depth control milling machine is initialized and zeroed before the groove milling is started, then a blank plate obtained in S2 is placed on an induction bottom plate of the depth control milling machine, the depth control milling machine performs depth control milling on the daughter board according to set parameters through the distance between the depth control milling machine and the induction bottom plate, and the daughter board is obtained.
And S4, carrying out copper deposition and copper plating on the preliminary stepped groove to obtain the conductive stepped groove.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A manufacturing method of a PCB with a step groove is characterized in that the PCB comprises a dielectric layer, a first conducting layer arranged on the upper surface of the dielectric layer and a second conducting layer arranged on the lower surface of the dielectric layer; the method comprises the following steps:
s1, preparing a blank plate through film coating and exposure;
s2, etching a corresponding area of the inner layer on the first conducting layer according to a preset position of the step groove to be milled;
s3, placing the blank plate obtained in the step S2 on an induction bottom plate of a depth control milling machine, and performing depth control milling and fishing on the daughter plate according to set parameters through the distance between the depth control milling machine and the induction bottom plate, which is measured by a sensing assembly of the depth control milling machine, so as to obtain a primary step groove;
and S4, carrying out copper deposition and copper plating on the preliminary stepped groove to obtain the conductive stepped groove.
2. The method as claimed in claim 1, further comprising the step of initializing a deep milling machine comprising: and the substep of zero calibration of the depth control milling machine and recording the parameters of the step groove to be milled into the depth control milling machine.
3. The method as claimed in claim 2, wherein the depth control milling machine comprises a measuring unit, a control unit, a spindle and a milling cutter, the measuring unit and the spindle are connected to the control unit, the milling cutter is mounted on the spindle, the measuring unit is used for calculating a distance between the milling cutter measured by the sensing assembly and the sensing substrate, and the control unit receives data collected by the measuring unit and controls the spindle to drive the milling cutter to mill the slot according to a set depth.
4. The method of claim 1, wherein the induction base plate is an aluminum plate.
5. The method of claim 1, wherein the sensing component is a sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111409203.2A CN114189994A (en) | 2021-11-25 | 2021-11-25 | Manufacturing method of PCB with stepped groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111409203.2A CN114189994A (en) | 2021-11-25 | 2021-11-25 | Manufacturing method of PCB with stepped groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114189994A true CN114189994A (en) | 2022-03-15 |
Family
ID=80602521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111409203.2A Pending CN114189994A (en) | 2021-11-25 | 2021-11-25 | Manufacturing method of PCB with stepped groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114189994A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08150599A (en) * | 1994-11-29 | 1996-06-11 | Matsushita Electric Works Ltd | Hole machining method of printed wiring board and hole machining device using the hole machining method of printed wiring board |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN204669733U (en) * | 2015-06-15 | 2015-09-23 | 深圳市迅捷兴电路技术有限公司 | Pcb board adds the dark device of industry control |
| CN105792526A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making blind slot of double-sided board |
| CN207824532U (en) * | 2017-10-30 | 2018-09-07 | 深圳市华建数控科技有限公司 | Numerical control drilling machine drill detection device and numerically-controlled machine tool |
| CN110278660A (en) * | 2019-06-27 | 2019-09-24 | 浪潮商用机器有限公司 | A kind of pcb board back drill apparatus and system |
| CN211592038U (en) * | 2020-01-16 | 2020-09-29 | 洛阳德野专用车辆有限公司 | A permanent thick engraver for processing of welt in car as a house |
-
2021
- 2021-11-25 CN CN202111409203.2A patent/CN114189994A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08150599A (en) * | 1994-11-29 | 1996-06-11 | Matsushita Electric Works Ltd | Hole machining method of printed wiring board and hole machining device using the hole machining method of printed wiring board |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN204669733U (en) * | 2015-06-15 | 2015-09-23 | 深圳市迅捷兴电路技术有限公司 | Pcb board adds the dark device of industry control |
| CN105792526A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making blind slot of double-sided board |
| CN207824532U (en) * | 2017-10-30 | 2018-09-07 | 深圳市华建数控科技有限公司 | Numerical control drilling machine drill detection device and numerically-controlled machine tool |
| CN110278660A (en) * | 2019-06-27 | 2019-09-24 | 浪潮商用机器有限公司 | A kind of pcb board back drill apparatus and system |
| CN211592038U (en) * | 2020-01-16 | 2020-09-29 | 洛阳德野专用车辆有限公司 | A permanent thick engraver for processing of welt in car as a house |
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