CN114188255B - Automatic processing device for semiconductor field effect transistor - Google Patents

Automatic processing device for semiconductor field effect transistor Download PDF

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Publication number
CN114188255B
CN114188255B CN202111444793.2A CN202111444793A CN114188255B CN 114188255 B CN114188255 B CN 114188255B CN 202111444793 A CN202111444793 A CN 202111444793A CN 114188255 B CN114188255 B CN 114188255B
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transmission
plate
clamping
assembly
sleeved
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CN114188255A (en
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柴力
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Semtech Semiconductor Technology Dongguan Co Ltd
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Semtech Semiconductor Technology Dongguan Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission Devices (AREA)

Abstract

The invention relates to the technical field of field effect transistor processing devices, in particular to an automatic processing device for a semiconductor field effect transistor, which comprises a frame and a conveyor belt, wherein the conveyor belt is also provided with a supporting platform, a top plate, a transmission plate, a linear driver, a rotating assembly, a transmission assembly, a clamping assembly and a plurality of stand columns, the transmission plate is driven by the linear driver to move, the transmission plate drives a clamp assembly to move, the transistor is clamped by the clamping assembly, the transmission plate drives the transmission assembly at the same time, the rotating assembly is driven by the transmission assembly to move, the transistor and a heat dissipation plate are processed by the rotating assembly, the transmission plate is driven by one driving device of the linear driver to move, the running synchronism of equipment is improved, the equipment is convenient to adjust, the processing efficiency of the equipment is improved, and the existing equipment is replaced by linkage, thus, high-speed operation of the equipment is ensured, and the precision of synchronous operation is improved.

Description

Automatic processing device for semiconductor field effect transistor
Technical Field
The invention relates to the technical field of field effect transistor processing devices, in particular to an automatic processing device for a semiconductor field effect transistor.
Background
A Field Effect Transistor (FET) is a semiconductor device that controls an output loop current by controlling an electric field effect of an input loop, and is named as such, since it conducts electricity only by majority carriers in a semiconductor, it is also called a unipolar type transistor, and it belongs to a voltage control type semiconductor device; the input resistor is high (107-1015 omega), the noise is low, the power consumption is low, the dynamic range is large, the integration is easy, the secondary breakdown phenomenon is avoided, the safe working area is wide, the transistor is a powerful competitor of a bipolar transistor and a power transistor, in the process of processing the field effect transistor, a radiating fin is generally installed on a shell of the transistor, the stable operation of the field effect transistor in the working process is ensured, in the prior art, a lifting device is generally required to drive a rotating device to process the radiating fin, but clamping equipment is required to work in a matching mode in the processing process, the working rhythm of the transistor is matched, the additionally-installed device cannot keep the consistency with the action of the lifting device, the synchronism cannot be ensured, and the adjustment is troublesome.
Disclosure of Invention
In view of the above, it is necessary to provide an automatic processing apparatus for a semiconductor field effect transistor, which addresses the problems of the related art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
an automatic processing device for a semiconductor field effect transistor comprises a rack and a conveyor belt, wherein the rack stretches over the conveyor belt, and is characterized in that the rack is also provided with a supporting platform, a top plate, a transmission plate, a linear driver for driving the transmission plate, a rotating assembly for processing the transistor, a transmission assembly for driving the rotating assembly to rotate, a clamping assembly for clamping the transistor and a plurality of stand columns, the supporting platform is positioned in the middle of the rack, all the stand columns are positioned on the supporting platform in a vertical state, the top plate is fixedly connected to the top ends of all the stand columns, the transmission plate is sleeved on all the stand columns, the linear driver is positioned at the top of the rack, the transmission plate is in transmission connection with the linear driver, the rotating assembly is positioned in the center of the bottom of the transmission plate, the transmission assembly is positioned between the top plate and the supporting platform, and the clamping assembly is positioned on the supporting platform, and the clamping component is in transmission connection with the transmission plate.
Preferably, the transmission assembly comprises a mounting seat, a rotating shaft, a gear, a rack, a first helical gear, a second helical gear and a transmission shaft, wherein the mounting seat is positioned at the edge of one side of the transmission plate, the rotating shaft is horizontally sleeved on the mounting seat, the gear is sleeved on the rotating shaft and is fixedly connected with the rotating shaft, the rack is vertically positioned between the top plate and the supporting platform, the rack is connected with the gear in a meshed manner, the first helical gear is sleeved on one end of the rotating shaft, the transmission shaft is positioned beside the first helical gear and is mutually perpendicular to the axis of the first helical gear and the axis of the first helical gear, the transmission shaft is sleeved on the second helical gear, the second helical gear is meshed with the first helical gear, and the rotating assembly is in transmission connection with the transmission shaft.
Preferably, rotating assembly includes first synchronizing wheel, second synchronizing wheel, hold-in range and drive head, and the bottom of transmission shaft is located to first synchronizing wheel cover, and the bottom center of driving plate is located to the second synchronizing wheel cover, and the hold-in range cover is located between first synchronizing wheel and the second synchronizing wheel, and the drive head is vertical state and is located the bottom of second synchronizing wheel and rather than the transmission and be connected.
Preferably, still be provided with the cushion socket between second synchronizing wheel and the driving head, the cushion socket includes circular shape base, elastic component and six head rods, and the driving head is installed in the bottom central authorities of base, and six head rods are extending structure, and six head rods all are that the even encircleing of vertical state sets up rather than the axis, and the elastic component is installed between the bottom of base and second synchronizing wheel.
Preferably, a driving shaft is arranged at the top of the second synchronizing wheel, a ratchet wheel is sleeved on the driving shaft, a plurality of elastic supporting arms which are uniformly distributed around the axis of the elastic supporting arms are arranged on the ratchet wheel, pawls are arranged on all the supporting arms, and unidirectional ratchets matched with the pawls are arranged at the bottom of the transmission plate.
Preferably, the clamping assembly comprises a support frame, two second connecting rods, two clamping plates and a plurality of springs, the support frame is sleeved on all the stand columns and is in sliding connection with the stand columns, all the springs are respectively sleeved on all the stand columns, all the springs are located at the bottom of the support frame, the two clamping plates are respectively located below two sides of the support frame, the two second connecting rods are respectively located between the two clamping plates and the support frame, two ends of each second connecting rod are respectively connected with the clamping plates and the support plate in a pin mode, a sliding groove is formed in the support platform, and the two clamping plates are in sliding connection in the sliding groove of the support platform in a horizontal state.
Preferably, the clamping blocks are provided on opposite sides of both of the clamping plates.
Preferably, limiting plates are arranged at two ends of the sliding groove of the supporting platform.
Preferably, a sensor is arranged on the clamping assembly.
Preferably, the stand has four, and four stands are vertical state respectively and are located four corners of supporting platform, and the driving plate cover is located four stands, and the linear actuator is the cylinder, and the cylinder is vertical state and is located the top of roof, and the output shaft of cylinder runs through roof and driving plate fixed connection.
Compared with the prior art, the beneficial effect of this application is:
1. the direction of rotation is converted through the first helical gear and the second helical gear, the transmission assembly is conveniently connected with the rotating assembly, the rotating assembly can be driven to move through the movement of the transmission plate through the meshing connection of the gears and the racks, a plurality of assemblies can be driven to operate through one driving source, the expenditure of equipment cost is reduced, the synchronism of the operation of the equipment is conveniently improved, the equipment can be conveniently adjusted, the processing efficiency of the equipment is improved, the existing equipment is replaced by linkage, the high-speed operation of the equipment is ensured, and the precision of the synchronous operation is improved;
2. according to the transistor processing device, the driving plate can continuously move for one end distance through the arrangement of the buffer seat, all the first connecting rods shrink at the moment, and the elastic piece is extruded at the same time, so that the gear can continuously keep meshed with the rack to rotate, the driving assembly can drive the rotating assembly to continuously rotate, the driving head is kept to rotate, the transistor is processed through the driving head, the stability of equipment operation is ensured, and the problems that when the driving head processes the transistor, the driving plate does not have allowance to continuously move due to the fact that the driving head is connected with the transistor, the gear and the rack cannot drive the rotating assembly to operate, and the transistor can be processed cannot be guaranteed are solved;
3. when the driving plate moves downwards, the rotation of the ratchet wheel is driven by the rotation of the second synchronizing wheel, the ratchet wheel drives the pawls on all the supporting arms to rotate, the supporting arms are of an elastic structure, and the ratchets are unidirectional, so that the ratchet wheel can normally drive the pawls on the supporting arms to rotate along the ratchets at the bottom of the driving plate, when the driving plate rises, the rack drives the gear to reversely rotate, the ratchet wheel drives the supporting arms to reversely rotate, the pawls on the supporting arms and the ratchets are clamped together and cannot continuously rotate, the rotating direction of the processing of the transistor is always reverse, the working stability of the equipment is ensured, and the problem that when the driving head processes the transistor, in the rising process of the driving plate, the gear and the rack of the driving assembly drive the rotation of the driving head of the rotating assembly, so that the gear can drive the driving head to reversely rotate is solved, leading to the problem of the inability to process transistors;
4. the clamping component provided by the application drives the support frame to move through the movement of the transmission plate, so that the support frame moves along the axis direction of the upright post, the support frame drives the second connecting rods in pin joint with the support frame, and the two second connecting rods respectively drive the two clamping plates to slide towards opposite sides on the support platform due to the sliding connection of the clamping plates and the support platform, so that a transistor below the support platform is clamped, the transistor is fixed, the transistor is positioned and conveniently processed by the rotating component, a spring on the upright post plays a buffering role, the clamping plates are prevented from clamping the transistor too tightly, the damage of the transistor is avoided, a plurality of components can be driven to operate through one driving source, the expenditure of equipment cost is reduced, the synchronism of equipment operation is conveniently improved, and the equipment is convenient to adjust, the processing efficiency of the equipment is improved, and the existing equipment is replaced by linkage, so that the high-speed operation of the equipment is ensured, and the precision of synchronous operation is improved;
5. the clamping plate provided by the application is driven by the clamping plate through the clamping block, so that the clamping block is contacted with the transistor, and a buffering space is provided between the clamping block and the transistor through the arrangement of the flexible material, so that the impact force of the clamping block on the transistor is reduced, the damage of the transistor is prevented, the running stability of equipment is improved, the yield is improved, and the problem that the transistor is damaged because the clamping plate still has the transistor contact is solved;
6. the sliding chute of the supporting platform provided by the application can limit the moving distance of the clamping plate in the sliding chute of the supporting platform through the limiting plate when the spring is reset, so that the resetting of the clamping plate cannot be excessively expanded, and the clamping assembly is failed when the driving plate drives the clamping assembly next time, so that the production efficiency is influenced;
7. the application provides a clamping component passes through the setting of sensor, when transistor displacement to clamping component department, through the setting of sensor for it triggers lifting unit, drives transmission assembly, rotating assembly and clamping component through lifting unit in proper order, and the precision of the automatic operation of improve equipment ensures that equipment can need not artificial intervention automatic operation, has solved processingequipment and still possesses the precision inadequately, leads to the problem that processing can't be accomplished.
Drawings
FIG. 1 is a schematic perspective view of the present invention as a whole;
FIG. 2 is a partial perspective view of the present invention;
FIG. 3 is a side view of the housing of the present invention;
FIG. 4 is a first perspective view of the drive assembly and clamping assembly of the present invention;
FIG. 5 is a second perspective view of the drive assembly and clamping assembly of the present invention;
FIG. 6 is a perspective view of the rotating assembly of the present invention;
FIG. 7 is an exploded view of the rotating assembly of the present invention;
FIG. 8 is a bottom view of the drive plate of the present invention;
FIG. 9 is a perspective view of the clamping assembly of the present invention;
FIG. 10 is a perspective view of the clamping assembly of the present invention;
FIG. 11 is a schematic perspective view of the housing of the present invention;
FIG. 12 is an enlarged schematic view at A of FIG. 9 of the present invention;
the reference numbers in the figures are:
1-a frame; 1 a-a support platform; 1 b-a top plate; 1 c-a drive plate; 1 d-column; 1d 1-Linear drive; 1d 2-cylinder;
2-a conveyor belt;
3-a rotating assembly; 3 a-a first synchronizing wheel; 3a 1-synchronous belt; 3 b-a second synchronizing wheel; 3b1 — drive shaft; 3b 2-ratchet; 3b 3-support arm; 3b 4-pawl; 3b 5-ratchet; 3 c-a drive head; 3 d-a buffer seat; 3d 1-base; 3d2 — first connecting rod; 3d 3-elastic member;
4-a transmission assembly; 4 a-a mounting seat; 4a 1-axis of rotation; 4a 2-gear; 4a3 — first beveled gear; 4 b-a rack; 4 c-a second bevel gear; 4c 1-drive shaft;
5-a clamping assembly; 5 a-a support frame; 5 b-a second connecting rod; 5 c-a clamping plate; 5c 1-clamping block; 5c 2-sensor; 5 d-spring; 5 e-a chute; 5e 1-limit plate.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-12:
an automatic processing device for a semiconductor field effect transistor comprises a rack 1 and a conveyor belt 2, wherein the rack 1 stretches over the conveyor belt 2, the rack 1 is also provided with a supporting platform 1a, a top plate 1b, a transmission plate 1c, a linear driver 1d1 for driving the transmission plate 1c, a rotating component 3 for processing the transistor, a transmission component 4 for driving the rotating component 3 to rotate, a clamping component 5 for clamping the transistor and a plurality of upright posts 1d, the supporting platform 1a is positioned in the middle of the rack 1, all the upright posts 1d are positioned on the supporting platform 1a in a vertical state, the top plate 1b is fixedly connected with the top ends of all the upright posts 1d, the transmission plate 1c is sleeved on all the upright posts 1d, the linear driver 1d1 is positioned at the top of the rack 1, and the transmission plate 1c is in transmission connection with the linear driver 1d1, the rotating assembly 3 is located in the center of the bottom of the transmission plate 1c, the transmission assembly 4 is located between the top plate 1b and the supporting platform 1a, the clamping assembly 5 is located on the supporting platform 1a, and the clamping assembly 5 is in transmission connection with the transmission plate 1 c.
Based on the above embodiment, the transistor is moved to the lower part of the supporting platform 1a of the rack 1 by the conveyor belt 2, by activating the linear driver 1d1, the linear driver 1d1 drives the driving plate 1c to move along the axis of the upright post 1d, so that the driving plate 1c approaches to the transistor, firstly, the driving plate 1c drives the clamping component 5 to move, the transistor is clamped by the clamping component 5, meanwhile, the driving plate 1c moves to drive the driving component 4, the driving component 4 drives the rotating component 3 to move, the transistor and the heat dissipation plate are installed by the rotating component 3, after the installation is completed, the driving plate 1c is driven by the linear driver 1d1 to move to the top of the rack 1, so that the driving plate drives the rotating component 3 to move away from the transistor, and simultaneously, the clamping component 5 releases the transistor, so that the transistor can continue to move along the conveyor belt 2, thereby the work of accomplishing processing, the removal of drive plate 1c has been driven through a drive arrangement of linear actuator 1d1, and rethread drive plate 1c drives clamping component 5, drive assembly 4 and rotating assembly 3 in proper order, makes things convenient for improve equipment moving synchronism, conveniently adjusts equipment, and improve equipment's machining efficiency replaces present equipment through the linkage to ensure the fast-speed operation of equipment, improve synchronous operation's precision.
Further, in order to solve the technical problem that the transmission plate 1c drives the transmission assembly 4 to move, as shown in fig. 3-6:
the transmission assembly 4 comprises a mounting seat 4a, a rotating shaft 4a1, a gear 4a2, a rack 4b, a first bevel gear 4a3, a second bevel gear 4c and a transmission shaft 4c1, wherein the mounting seat 4a is located at the edge of one side of the transmission plate 1c, the rotating shaft 4a1 is horizontally sleeved on the mounting seat 4a, the gear 4a2 is sleeved on the rotating shaft 4a1 and is fixedly connected with the same, the rack 4b is vertically located between the top plate 1b and the supporting platform 1a, the rack 4b is engaged with the gear 4a2, the first bevel gear 4a3 is sleeved on one end of the rotating shaft 4a1, the transmission shaft 4c1 is located beside the first bevel gear 4a3, the axis of the transmission shaft 4c1 is perpendicular to the axis of the rotating shaft 4a1, the second bevel gear 4c is sleeved on the transmission shaft 4c1, the second bevel gear 4c is engaged with the first bevel gear 4a3, and the rotating component 3 is in transmission connection with the transmission shaft 4c 1.
Based on the above embodiments, when the lifting component moves, the driving plate 1c provided by the present application moves, the mounting seat 4a moves by moving, the movement of the mounting seat 4a drives the movement of the rotating shaft 4a1, the movement of the rotating shaft 4a1 drives the movement of the gear 4a2, since the gear 4a2 is meshed with the rack 4b, as the driving plate 1c moves along the axis of the column 1d, the gear 4a2 rotates, the rotation of the gear 4a2 drives the rotation of the rotating shaft 4a1, the rotation of the rotating shaft 4a1 drives the rotation of the first helical gear 4a3 connected thereto, the rotation of the first helical gear 4a3 drives the rotation of the second helical gear 4c meshed therewith, the rotation of the transmission shaft 4c1 is driven by the rotation of the second helical gear 4c 8628, so as to drive the rotating component 3 to rotate by the transmission shaft 4c1, thereby make things convenient for rotating assembly 3 to process the transistor, the direction conversion of will rotating through first helical gear 4a3 and second helical gear 4c, make things convenient for transmission assembly 4 to be connected with rotating assembly 3, connect through the meshing of gear 4a2 and rack 4b, make the removal through driving plate 1c just can drive rotating assembly 3 and remove, just can drive a plurality of subassemblies through a driving source and operate, the expenditure of equipment cost has been reduced, make things convenient for improve equipment moving synchronism, conveniently adjust equipment, improve equipment's machining efficiency replaces present equipment through the linkage, thereby ensure the fast-speed operation of equipment, improve synchronous operation's precision, the problem is solved.
Further, in order to solve the technical problem of the rotating assembly 3 for processing the transistor, as shown in fig. 3 and fig. 6 to 8:
the rotating assembly 3 comprises a first synchronizing wheel 3a, a second synchronizing wheel 3b, a synchronous belt 3a1 and a driving head 3c, the first synchronizing wheel 3a is sleeved at the bottom of the transmission shaft 4c1, the second synchronizing wheel 3b is sleeved at the center of the bottom of the transmission plate 1c, the synchronous belt 3a1 is sleeved between the first synchronizing wheel 3a and the second synchronizing wheel 3b, and the driving head 3c is in a vertical state, is positioned at the bottom of the second synchronizing wheel 3b and is in transmission connection with the second synchronizing wheel 3 b.
Based on the above embodiments, the rotation component 3 provided by the present application drives the rotation of the first synchronous wheel 3a through the rotation of the transmission shaft 4c1, the rotation of the first synchronous wheel 3a drives the synchronous belt 3a1, the rotation of the second synchronous wheel 3b is driven through the synchronous belt 3a1, so that the second synchronous wheel 3b drives the rotation of the driving head 3c at the bottom thereof, the rotation component 3 is driven through the transmission plate 1c to move, the driving head 3c is driven to approach the transistor, the transistor is processed through the rotating driving head 3c, a plurality of components can be driven to operate through one driving source, the expenditure of the equipment cost is reduced, the synchronism of the equipment operation is improved, the equipment can be conveniently adjusted, the processing efficiency of the equipment is improved, the existing equipment is replaced through linkage, the high-speed operation of the equipment is ensured, and the precision of the synchronous operation is improved, the above problems are solved.
Further, when the driving head 3c processes the transistor, after the driving head 3c contacts the transistor, the driving plate 1c does not have a margin and continues to move, so that the gear 4a2 and the rack 4b cannot drive the rotating assembly 3 to operate, and it cannot be ensured that the transistor can be processed, and in order to solve the problem, as shown in fig. 3 and fig. 6 to 8:
still be provided with buffering seat 3d between second synchronizing wheel 3b and the driving head 3c, buffering seat 3d includes circular shape base 3d1, elastic component 3d3 and six head rod 3d2, driving head 3c installs in the bottom center of base 3d1, six head rod 3d2 are extending structure, six head rod 3d2 all are the even surrounding of vertical state and set up rather than the axis, elastic component 3d3 installs between the bottom of base 3d1 and second synchronizing wheel 3 b.
Based on the above embodiment, the driving head 3c that this application provided drives its back with the transistor through driving plate 1c, because the setting of buffer seat 3d, make driving plate 1c can continue to displace one end distance, all head rods 3d2 shrink this moment, extrude elastic component 3d3 simultaneously, thereby make gear 4a2 can continue to keep rotating with the meshing of rack 4b, make drive assembly 4 can drive rotating assembly 3 and continue to rotate, thereby make driving head 3c keep rotating, process to the transistor through driving head 3c, ensure the stability of equipment work, the above-mentioned problem has been solved.
Further, when the driving head 3c processes the transistor, in the process that the driving plate 1c ascends, since the gear 4a2 and the rack 4b of the transmission assembly 4 drive the driving head 3c of the rotation assembly 3 to rotate, the gear 4a2 drives the driving head 3c to rotate in the opposite direction, which results in that the transistor cannot be processed, as shown in fig. 3 and fig. 6 to 8:
the top of the second synchronizing wheel 3b is provided with a driving shaft 3b1, a ratchet wheel 3b2 is sleeved on the driving shaft 3b1, a plurality of elastic supporting arms 3b3 which are uniformly distributed around the axis of the ratchet wheel 3b2 are arranged on the ratchet wheel 3b2, pawls 3b4 are arranged on all the supporting arms 3b3, and unidirectional ratchets 3b5 matched with the pawls 3b4 are arranged at the bottom of the transmission plate 1 c.
Based on the above embodiments, when the driving plate 1c provided by the present application moves down, the transmission shaft 4c1 drives the second synchronizing wheel 3b to rotate, the rotation of the second synchronizing wheel 3b drives the rotation of the ratchet wheel 3b2 connected thereto, the ratchet wheel 3b2 drives the pawls 3b4 on all the supporting arms 3b3 to rotate, because the supporting arm 3b3 is of an elastic structure and the ratchet 3b5 is unidirectional, the ratchet 3b2 can normally drive the pawls 3b4 on the supporting arms 3b3 to rotate along the ratchet 3b5 at the bottom of the driving plate 1c, when the driving plate 1c moves up, the rack 4b drives the gear 4a2 to rotate in the opposite direction, at this time, the ratchet 3b2 is also driven, the ratchet 3b2 drives the ratchet 3b3 to rotate in the opposite direction, so that the pawls 3b4 on the supporting arms 3b3 and the 3b5 are clamped together and cannot rotate continuously, thereby ensuring that the rotation direction of the transistor processing is always a reverse direction, the stability of equipment work is ensured, and the problems are solved.
Further, in order to solve the technical problem that the clamping assembly 5 clamps the transistor, as shown in fig. 4, 5, 9, 10 and 12:
the clamping assembly 5 comprises a support frame 5a, two second connecting rods 5b, two clamping plates 5c and a plurality of springs 5d, the support frame 5a is sleeved on all the stand columns 1d and is in sliding connection with the stand columns, all the springs 5d are respectively sleeved on all the stand columns 1d, all the springs 5d are located at the bottom of the support frame 5a, the two clamping plates 5c are respectively located below two sides of the support frame 5a, the two second connecting rods 5b are respectively located between the clamping plates 5c on two sides and the support frame 5a, two ends of each second connecting rod 5b are respectively in pin connection with the clamping plates 5c and a support plate, a sliding groove 5e is formed in the support platform 1a, and the two clamping plates 5c are in horizontal sliding connection in the sliding groove 5e of the support platform 1 a.
Based on the above embodiments, the clamping assembly 5 provided by the present application drives the support frame 5a to move through the movement of the transmission plate 1c, so that the support frame 5a moves along the axial direction of the upright post 1d, the movement of the support frame 5a drives the movement of the second connection rod 5b in pin connection with the support frame, because the clamping plate 5c is in sliding connection with the support platform 1a, the two second connection rods 5b respectively drive the two clamping plates 5c to slide towards opposite sides in the sliding chute 5e of the support platform 1a, so as to clamp the transistor below the support platform 1a, so as to fix the transistor, thereby positioning the transistor, and facilitating the processing of the transistor by the rotating assembly 3, the spring 5d on the upright post 1d plays a role of buffering, so as to prevent the clamping plate 5c from clamping the transistor too tightly, thereby causing damage to the transistor, and can drive a plurality of assemblies to operate through one driving source, the expenditure of equipment cost is reduced, the running synchronism of the equipment is conveniently improved, the equipment is conveniently adjusted, the machining efficiency of the equipment is improved, the existing equipment is replaced by linkage, the high-speed running of the equipment is ensured, the synchronous running precision is improved, and the problems are solved.
Further, the clamping plate 5c provided in the present application still has the defect that the transistor contact causes the transistor to be damaged, and in order to solve this problem, as shown in fig. 4, 5, 9, 10 and 12:
the two clamping plates 5c are each provided with a clamping block 5c1 of flexible material on opposite sides.
Based on the above embodiment, the clamping plate 5c provided by the application is driven by the clamping plate 5c through the clamping block 5c1, so that the clamping block 5c1 is in contact with the transistor, and through the arrangement of the flexible material, a buffering space is provided between the clamping block 5c1 and the transistor, the impact force of the clamping block on the transistor is reduced, the transistor is prevented from being damaged, the stability of the operation of the equipment is improved, the yield is improved, and the problems are solved.
Further, the two clamping plates 5c provided by the present application still have no limiting device, so that when the spring 5d is reset, the displacement of the clamping plate 5c may be over-limited, which results in the defect that clamping cannot be completed next time, and in order to solve the problem, as shown in fig. 11:
limiting plates 5e1 are arranged at two ends of the sliding groove 5e of the supporting platform 1 a.
Based on above-mentioned embodiment, the setting that passes through limiting plate 5e1 of supporting platform 1 a's spout 5e that this application provided can be when spring 5d resets, limiting plate 5e1 has injectd the displacement of clamp plate 5c in supporting platform 1a spout 5e for the reset of clamp plate 5c can not be too abducted, thereby when leading to next time driving plate 1c to drive clamp assembly 5, cause the trouble of clamp assembly 5, thereby influence the efficiency of production, the problem is solved.
Further, the machining device provided by the present application still has a defect that machining cannot be completed due to insufficient precision, and in order to solve this problem, as shown in fig. 12:
the clamping assembly 5 is provided with a sensor 5c 2.
Based on the above embodiment, the clamping component 5 provided by the application is provided with the sensor 5c2, when the transistor is displaced to the clamping component 5, the lifting component is triggered through the setting of the sensor 5c2, the transmission component 4, the rotating component 3 and the clamping component 5 are sequentially driven through the lifting component, the automatic running precision of the equipment is improved, the equipment is ensured to automatically run without manual intervention, and the problems are solved.
Further, in order to solve the technical problem that the linear actuator 1d1 drives the driving plate 1c to move, as shown in fig. 1-3:
stand 1d has four, and four stands 1d are four corners that vertical state is located supporting platform 1a respectively, and driving plate 1c cover is located four stands 1d, and linear actuator 1d1 is cylinder 1d2, and cylinder 1d2 is the top that vertical state is located roof 1b, and cylinder 1d 2's output shaft runs through roof 1b and driving plate 1c fixed connection.
Based on the above-mentioned embodiment, when the driving plate 1c that this application provided needs to remove, through starting cylinder 1d2, the output shaft through cylinder 1d2 stretches out the removal that has driven driving plate 1c, driving plate 1c moves along the axis of four stands 1d, the effect of the removal of driving plate 1c drive transmission subassembly 4 and clamping component 5 removal, four stands 1d play and carry out the effect of supporting roof 1b and cylinder 1d2, still have the effect of leading to driving plate 1c simultaneously, roof 1b is used for supporting cylinder 1d2, the problem of the aforesaid is solved.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. An automatic processing device for a semiconductor field effect transistor comprises a rack (1) and a conveyor belt (2), wherein the rack (1) stretches over the conveyor belt (2), and is characterized in that the rack (1) is also provided with a supporting platform (1 a), a top plate (1 b), a transmission plate (1 c), a linear driver (1 d 1) for driving the transmission plate (1 c), a rotating assembly (3) for processing the transistor, a transmission assembly (4) for driving the rotating assembly (3) to rotate, a clamping assembly (5) for clamping the transistor and a plurality of stand columns (1 d), the supporting platform (1 a) is positioned in the middle of the rack (1), all the stand columns (1 d) are positioned on the supporting platform (1 a) in a vertical state, the top plate (1 b) is fixedly connected to the top ends of all the stand columns (1 d), the transmission plate (1 c) is sleeved on all the stand columns (1 d), the linear driver (1 d 1) is positioned at the top of the rack (1), the transmission plate (1 c) is in transmission connection with the linear driver (1 d 1), the rotating component (3) is positioned at the center of the bottom of the transmission plate (1 c), the transmission component (4) is positioned between the top plate (1 b) and the supporting platform (1 a), the clamping component (5) is positioned on the supporting platform (1 a), the clamping component (5) is in transmission connection with the transmission plate (1 c), the linear driver (1 d 1) drives the transmission plate (1 c) to move along the axis of the stand columns (1 d), so that the transmission plate (1 c) is close to the transistors, the clamping component (5) is driven to move through the transmission plate (1 c), the transistors are clamped through the clamping component (5), and the transmission plate (1 c) drives the transmission component (4) to drive, the transmission component (4) drives the rotating component (3) to move;
the transmission assembly (4) comprises a mounting seat (4 a), a rotating shaft (4 a 1), a gear (4 a 2), a rack (4 b), a first helical gear (4 a 3), a second helical gear (4 c) and a transmission shaft (4 c 1), wherein the mounting seat (4 a) is positioned at the edge of one side of the transmission plate (1 c), the rotating shaft (4 a 1) is horizontally sleeved on the mounting seat (4 a), the gear (4 a 2) is sleeved on the rotating shaft (4 a 1) and fixedly connected with the rotating shaft, the rack (4 b) is vertically positioned between the top plate (1 b) and the supporting platform (1 a), the rack (4 b) is meshed with the gear (4 a 2), the first helical gear (4 a 3) is sleeved on one end of the rotating shaft (4 a 1), the transmission shaft (4 c 1) is positioned beside the first helical gear (4 a 3), and the axis of the transmission shaft (4 a 1) is perpendicular to the axis of the rotating shaft (4 a 1), the transmission shaft (4 c 1) is sleeved with the second bevel gear (4 c), the second bevel gear (4 c) is meshed with the first bevel gear (4 a 3), and the rotating component (3) is in transmission connection with the transmission shaft (4 c 1).
2. The automatic processing device for the semiconductor field effect transistor according to claim 1, wherein the rotating assembly (3) comprises a first synchronizing wheel (3 a), a second synchronizing wheel (3 b), a synchronous belt (3 a 1) and a driving head (3 c), the first synchronizing wheel (3 a) is sleeved on the bottom of the transmission shaft (4 c 1), the second synchronizing wheel (3 b) is sleeved on the center of the bottom of the transmission plate (1 c), the synchronous belt (3 a 1) is sleeved between the first synchronizing wheel (3 a) and the second synchronizing wheel (3 b), and the driving head (3 c) is vertically positioned on the bottom of the second synchronizing wheel (3 b) and is in transmission connection with the second synchronizing wheel.
3. The automatic processing device for the semiconductor field effect transistor according to claim 2, wherein a buffer seat (3 d) is further disposed between the second synchronizing wheel (3 b) and the driving head (3 c), the buffer seat (3 d) comprises a circular base (3 d 1), an elastic member (3 d 3) and six first connecting rods (3 d 2), the driving head (3 c) is mounted at the center of the bottom of the base (3 d 1), the six first connecting rods (3 d 2) are all of a telescopic structure, the six first connecting rods (3 d 2) are all uniformly arranged around the axis in a vertical state, and the elastic member (3 d 3) is mounted between the bottom of the base (3 d 1) and the second synchronizing wheel (3 b).
4. The automatic processing device for the semiconductor field effect transistor according to claim 3, wherein a driving shaft (3 b 1) is arranged at the top of the second synchronizing wheel (3 b), a ratchet wheel (3 b 2) is sleeved on the driving shaft (3 b 1), a plurality of elastic supporting arms (3 b 3) which are uniformly distributed around the axis of the ratchet wheel (3 b 2) are arranged on the ratchet wheel (3 b 2), pawls (3 b 4) are arranged on all the supporting arms (3 b 3), and unidirectional ratchets (3 b 5) matched with the pawls (3 b 4) are arranged at the bottom of the transmission plate (1 c).
5. The automatic processing device for the semiconductor field effect transistor according to claim 1, wherein the clamping assembly (5) comprises a support frame (5 a), two second connecting rods (5 b), two clamping plates (5 c) and a plurality of springs (5 d), the support frame (5 a) is sleeved on all the columns (1 d) and is in sliding connection with the columns, all the springs (5 d) are respectively sleeved on all the columns (1 d), all the springs (5 d) are positioned at the bottom of the support frame (5 a), the two clamping plates (5 c) are respectively positioned below two sides of the support frame (5 a), the two second connecting rods (5 b) are respectively positioned between the clamping plates (5 c) at two sides and the support frame (5 a), two ends of the second connecting rods (5 b) are respectively pinned to the clamping plates (5 c) and the support plate, a chute (5 e) is arranged on the support platform (1 a), the two clamping plates (5 c) are horizontally connected in the sliding groove (5 e) of the supporting platform (1 a) in a sliding way.
6. The automatic processing device for mosfets according to claim 5, wherein the two clamping plates (5 c) are provided with clamping blocks (5 c 1) of flexible material on opposite sides.
7. The automatic processing device for the semiconductor field effect transistor according to claim 5, wherein both ends of the sliding groove (5 e) of the supporting platform (1 a) are provided with a limiting plate (5 e 1).
8. The automatic processing device for semiconductor field effect transistors according to claim 1, characterized in that a sensor (5 c 2) is provided on the clamping assembly (5).
9. The automatic processing device for the semiconductor field effect transistor according to claim 1, wherein the number of the columns (1 d) is four, the four columns (1 d) are respectively located on four corners of the supporting platform (1 a) in a vertical state, the transmission plate (1 c) is sleeved on the four columns (1 d), the linear driver (1 d 1) is a cylinder (1 d 2), the cylinder (1 d 2) is located on the top of the top plate (1 b) in a vertical state, and an output shaft of the cylinder (1 d 2) penetrates through the top plate (1 b) and is fixedly connected with the transmission plate (1 c).
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6402497B1 (en) * 1992-03-24 2002-06-11 Toshinobu Banjyo Mold clamping device with improved clamping force transmission mechanism
CN102034728A (en) * 2010-09-30 2011-04-27 东莞宏威数码机械有限公司 Positioning transmission apparatus
CN108682641A (en) * 2018-05-28 2018-10-19 吴连根 Transistor and cooling fin automatic assembly equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6402497B1 (en) * 1992-03-24 2002-06-11 Toshinobu Banjyo Mold clamping device with improved clamping force transmission mechanism
CN102034728A (en) * 2010-09-30 2011-04-27 东莞宏威数码机械有限公司 Positioning transmission apparatus
CN108682641A (en) * 2018-05-28 2018-10-19 吴连根 Transistor and cooling fin automatic assembly equipment

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