CN114181631A - High-temperature adhesive for ceramic material and preparation method and application thereof - Google Patents
High-temperature adhesive for ceramic material and preparation method and application thereof Download PDFInfo
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- CN114181631A CN114181631A CN202111367367.3A CN202111367367A CN114181631A CN 114181631 A CN114181631 A CN 114181631A CN 202111367367 A CN202111367367 A CN 202111367367A CN 114181631 A CN114181631 A CN 114181631A
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- 229910010293 ceramic material Inorganic materials 0.000 title claims abstract description 126
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 48
- 239000000853 adhesive Substances 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 225
- 239000002245 particle Substances 0.000 claims abstract description 203
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 112
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 107
- 239000003292 glue Substances 0.000 claims abstract description 89
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 74
- 239000004115 Sodium Silicate Substances 0.000 claims abstract description 26
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052911 sodium silicate Inorganic materials 0.000 claims abstract description 26
- 239000002994 raw material Substances 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 30
- 239000000919 ceramic Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 9
- 229910021485 fumed silica Inorganic materials 0.000 claims description 4
- 239000011044 quartzite Substances 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims 3
- 229910021487 silica fume Inorganic materials 0.000 claims 1
- 238000009997 thermal pre-treatment Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 16
- 238000001035 drying Methods 0.000 description 12
- 239000000843 powder Substances 0.000 description 8
- 230000007062 hydrolysis Effects 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000012466 permeate Substances 0.000 description 6
- 230000008961 swelling Effects 0.000 description 6
- 229940115440 aluminum sodium silicate Drugs 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 239000011819 refractory material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 239000002114 nanocomposite Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 silicon halide Chemical class 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
- C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-temperature adhesive for ceramic materials, a preparation method and application thereof, wherein the high-temperature adhesive for ceramic materials comprises the following components: 10-14 parts by weight of large-particle-size silica; 2-4 parts by weight of small-particle-size silica; 26-30 parts by weight of large-particle-size alumina; 5-7 parts by weight of alumina with a medium particle size; 2.5-4.5 parts by weight of small-particle-size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm. The technical scheme of the invention provides high-temperature glue for a ceramic material with stable high-temperature resistance.
Description
Technical Field
The invention relates to the technical field of high-temperature glue, in particular to high-temperature glue for a ceramic material and a preparation method and application thereof.
Background
The high-temperature adhesive is a high-temperature-resistant inorganic nano composite adhesive prepared by performing polycondensation on inorganic nano materials, and the obtained adhesive is a suspension dispersion system with a neutral pH value through screening component proportion and preparation process parameters, has strong adhesive force, has no corrosion to a metal matrix, can keep good adhesive property and corrosion resistance at high temperature, and has long service life. The high-temperature glue is convenient to use, can be used for directly bonding high-temperature-resistant materials, can be directly sprayed on the surface of a high-temperature matrix at 400-1000 ℃, can be instantly adhered to the surface of the matrix when water is volatilized, and can form a high-temperature-resistant protective coating which is uniform and compact, good in thermal shock resistance and remarkable in protection effect. The high-temperature glue has wide application range, can be applied to metal matrixes, and can also be used for high-temperature refractory materials and high-temperature kiln lining materials.
After the ceramic heating tube is assembled, an adhesive is required for packaging, and the ceramic heating tube has a high temperature resistance requirement because the ceramic heating tube is used in a high temperature environment. But the high temperature resistant glue in the current market has the problems of poor high temperature resistance and the like.
Disclosure of Invention
The invention mainly aims to provide a high-temperature adhesive for ceramic materials, aiming at improving the high-temperature resistance of the high-temperature adhesive for the ceramic materials.
In order to achieve the above object, the present invention provides a high temperature paste for ceramic materials, comprising:
10-14 parts by weight of large-particle-size silica;
2-4 parts by weight of small-particle-size silica;
26-30 parts by weight of large-particle-size alumina;
5-7 parts by weight of alumina with a medium particle size;
2.5-4.5 parts by weight of small-particle-size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
Optionally, the high-temperature glue for ceramic material comprises:
11-13 parts by weight of large-particle-size silica;
2.2 to 3.5 parts by weight of silica having a small particle diameter;
27 to 29 parts by weight of alumina having a large particle size;
5.5-6.5 parts by weight of alumina with a medium particle size;
3-4 parts by weight of small-particle-size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
Optionally, the high-temperature glue for ceramic material comprises:
12 parts by weight of large-particle-size silica;
3 parts by weight of a small-particle-diameter silica;
28 parts by weight of large-particle-size alumina;
6 parts by weight of alumina having a medium particle diameter;
3.5 parts by weight of small particle size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
Optionally, the silica is one or a mixture of more than one of natural quartz stone, natural silica, precipitated silica, silica micropowder and fumed silica.
Optionally, the alumina is alpha-alumina or gamma-alumina.
The invention also provides a preparation method of the high-temperature adhesive for the ceramic material, which comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for a preset time under the condition of a preset rotating speed to obtain the high-temperature glue for the ceramic material.
Optionally, the preset rotating speed range is 500-5000 r/min, and the preset time range is 100-500 s.
Optionally, the preset rotation speed is 1200r/min, and the preset time is 200 s.
The invention also provides application of the high-temperature glue for the ceramic material, wherein the ceramic material is coated on the surface of the ceramic to be bonded or packaged by the high-temperature glue and is subjected to multi-section heating pretreatment so as to be bonded on the surface of the ceramic by the high-temperature glue.
Optionally, the step of multi-stage heating pretreatment comprises:
(1) heat treating at 40 deg.C for 30 min;
(2) heat treating at 70 deg.C for 120 min;
(3) heat treating at 120 deg.C for 120 min;
(4) heat treatment at 150 deg.C for 30 min.
According to one technical scheme, the high-temperature glue for the ceramic material comprises silicon dioxide, aluminum oxide and sodium silicate, wherein the silicon dioxide adopts two types of large particle size and small particle size, and the aluminum oxide adopts three types of large particle size, medium particle size and small particle size, so that the high-temperature glue for the high-temperature resistant ceramic material is obtained. Compared with the prior art, on one hand, the high-temperature adhesive for the ceramic material can be obtained by only adopting three raw materials of silicon dioxide, aluminum oxide and sodium silicate, and the preparation process is simple and uncomplicated; on the other hand, the high-temperature-resistant adhesive for the ceramic material adopts silicon dioxide with large particle size and aluminum oxide with large particle size as framework components, medium-particle-size aluminum oxide, small-particle-size aluminum oxide and small-particle-size silicon dioxide as joint filling components, and sodium silicate as an adhesion component, so that the structure of the high-temperature adhesive for the ceramic material is more stable and ordered, and the high-temperature-resistant performance is more stable.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, "and/or" in the whole text includes three schemes, taking a and/or B as an example, including a technical scheme, and a technical scheme that a and B meet simultaneously; in addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The high-temperature adhesive is a high-temperature-resistant inorganic nano composite adhesive prepared by performing polycondensation on inorganic nano materials, and the obtained adhesive is a suspension dispersion system with a neutral pH value through screening component proportion and preparation process parameters, has strong adhesive force, has no corrosion to a metal matrix, can keep good adhesive property and corrosion resistance at high temperature, and has long service life. The high-temperature glue is convenient to use, can be used for directly bonding high-temperature-resistant materials, can be directly sprayed on the surface of a high-temperature matrix at 400-1000 ℃, can be instantly adhered to the surface of the matrix when water is volatilized, and can form a high-temperature-resistant protective coating which is uniform and compact, good in thermal shock resistance and remarkable in protection effect. The high-temperature glue has wide application range, can be applied to metal matrixes, and can also be used for high-temperature refractory materials and high-temperature kiln lining materials.
After the ceramic heating tube is assembled, an adhesive is required for packaging, and the ceramic heating tube has a high temperature resistance requirement because the ceramic heating tube is used in a high temperature environment. However, the high temperature resistant glue in the current market has the problems of poor high temperature resistance, complex production process and the like.
In view of this, the present invention provides a high temperature adhesive for ceramic materials.
In the embodiment of the invention, the high-temperature adhesive for the ceramic material comprises 10-14 parts by weight of silicon dioxide with large particle size; 2-4 parts by weight of small-particle-size silica; 26-30 parts by weight of large-particle-size alumina; 5-7 parts by weight of alumina with a medium particle size; 2.5-4.5 parts by weight of small-particle-size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
In the invention, sodium silicate in the high-temperature glue component for the ceramic material is an adhesive, sodium silicate can react with carbon dioxide in the air to form a silicic acid sol, and the silicic acid solution is dehydrated to form inorganic silica chain network macromolecules along with the evaporation of water, so that the toughness of the glue is improved, and the brittleness is reduced; meanwhile, the silicon dioxide and the alumina in the high-temperature glue component for the ceramic material can generate mullite at high temperature, and the mullite has the characteristics of uniform expansion, excellent thermal shock stability, small high-temperature creep value, large hardness and the like, so that the high-temperature resistance of the glue is improved, and the high-temperature glue for the ceramic material has good high-temperature resistance and adhesion.
In the invention, the components of the high-temperature glue for the ceramic material comprise large-particle-size silicon dioxide, small-particle-size silicon dioxide, large-particle-size aluminum oxide, medium-particle-size aluminum oxide, small-particle-size aluminum oxide and sodium silicate, wherein the framework component comprises large-particle-size silicon dioxide and large-particle-size aluminum oxide, and has high strength and large specific surface area, so that the structural stability of the high-temperature glue for the ceramic material can be maintained; the joint filling components comprise medium-grain-size alumina, small-grain-size alumina and small-grain-size silicon dioxide, and can enter the framework components, so that the structure of the high-temperature glue for the ceramic material is more ordered; the bonding component comprises sodium silicate which is a bonding agent and plays a role in bonding ceramic materials with high-temperature glue.
Preferably, the high-temperature glue for the ceramic material comprises 11-13 parts by weight of silica with large particle size; 2.2 to 3.5 parts by weight of silica having a small particle diameter; 27 to 29 parts by weight of alumina having a large particle size; 5.5-6.5 parts by weight of alumina with a medium particle size; 3-4 parts by weight of small-particle-size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm. In this embodiment, the obtained high-temperature glue for ceramic materials is subjected to parameter measurement by adjusting the proportion range of each raw material component of the high-temperature glue for ceramic materials, so that the high-temperature resistance is better, and the materials of each raw material component are less.
Preferably, the high temperature glue for ceramic material comprises 12 parts by weight of silica having a large particle size; 3 parts by weight of a small-particle-diameter silica; 28 parts by weight of large-particle-size alumina; 6 parts by weight of alumina having a medium particle diameter; 3.5 parts by weight of small particle size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm. In this embodiment, the ratio of each raw material component of the high temperature glue for ceramic material is adjusted, and the obtained high temperature glue for ceramic material has the best high temperature resistance when the parameter measurement is performed, and the used material of each raw material component is the least while the high temperature resistance is the highest.
According to one technical scheme, the high-temperature glue for the ceramic material comprises silicon dioxide, aluminum oxide and sodium silicate, wherein the silicon dioxide adopts two types of large particle size and small particle size, and the aluminum oxide adopts three types of large particle size, medium particle size and small particle size, so that the high-temperature glue for the high-temperature resistant ceramic material is obtained. Compared with the prior art, on one hand, the high-temperature adhesive for the ceramic material can be obtained by only adopting three raw materials of silicon dioxide, aluminum oxide and sodium silicate, and the preparation process is simple and uncomplicated; on the other hand, the high-temperature-resistant adhesive for the ceramic material adopts silicon dioxide with large particle size and aluminum oxide with large particle size as framework components, medium-particle-size aluminum oxide, small-particle-size aluminum oxide and small-particle-size silicon dioxide as joint filling components, and sodium silicate as an adhesion component, so that the structure of the high-temperature adhesive for the ceramic material is more stable and ordered, and the high-temperature-resistant performance is more stable.
Further, the silicon dioxide is one or a mixture of more than one of natural quartz stone, natural silicon dioxide, precipitated silicon dioxide, silicon micropowder and gas phase method silicon dioxide. In the present invention, the water content in the silica is not limited, and the composition of the natural quartz stone is the simplest SiO2(silicon dioxide), the silicon dioxide content is more than 94%; the natural silicon dioxide is SiO2The content of silicon dioxide is more than 95 percent; the precipitated silica is commonly called white carbon black, also called hydrated silicic acid and light silica, and has a chemical expression of mSiO 2. nH2O, and the content of the silica is 98 percent; the silicon powder is quartz powder, and the content of silicon dioxide is more than 99 percent; the fumed silica is nano white powder generated by high-temperature hydrolysis of silicon halide in oxyhydrogen flame, is commonly called fumed silica, and the content of the silica is not less than 99.8 percent. The content of the silicon dioxide in the types of the silicon dioxide is relatively high, and in the invention, the water content in the silicon dioxide is not limited, namely, one or more of natural quartzite, natural silicon dioxide, precipitated silicon dioxide, silicon micropowder and gas phase method silicon dioxide can be used as a bonding agent in high-temperature glue for ceramic materials to play a role in bonding. Here, the specific kind of silica is not limited.
Further, the alumina is alpha-alumina or gamma-alumina. The specific type of alumina is not limited herein. The alpha-alumina is the most stable phase in all the aluminas, has uniform particle size distribution, strong heat resistance, good formability, stable crystal phase, high hardness and good dimensional stability, is widely applied to reinforcement and toughening of products such as ceramics, refractory materials and the like, and particularly has remarkable performance in the aspects of improving the compactness, the smoothness and the like of the ceramics. The gamma-alumina is a porous substance, is completely converted into alpha-alumina when heated to 1200 ℃, has high temperature resistance and inertia, and is widely applied to reinforcement and toughening of products such as ceramics, refractory materials and the like.
The invention also provides a preparation method of the high-temperature adhesive for the ceramic material, which comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material; and dispersing and mixing the raw materials for a preset time under the condition of a preset rotating speed to obtain the high-temperature glue for the ceramic material. Specifically, the preset rotating speed range is 500-5000 r/min, and the preset time range is 100-500 s. In this embodiment, in the preset rotating speed range and the preset time range, the raw materials of the high-temperature glue for the ceramic material can be better mixed, so that the chemical reaction among the raw materials is more sufficient, and the obtained high-temperature glue for the ceramic material has better high-temperature resistance. Preferably, the preset rotating speed is 1200r/min, and the preset time is 200 s. In this embodiment, the high temperature resistant performance of the obtained high temperature glue for ceramic materials is best by performing parameter measurement on the obtained high temperature glue for ceramic materials.
The invention also provides application of the high-temperature glue for the ceramic material, which is to coat the ceramic material on the surface of the ceramic to be bonded or packaged by the high-temperature glue and bond the ceramic material on the surface of the ceramic by the high-temperature glue after multi-section heating pretreatment. Specifically, the multi-stage heating pretreatment comprises the following steps:
(1) heat treating at 40 deg.C for 30 min;
(2) heat treating at 70 deg.C for 120 min;
(3) heat treating at 120 deg.C for 120 min;
(4) heat treatment at 150 deg.C for 30 min.
When the high-temperature glue for the ceramic material is used, the ceramic material is coated on the surface of the ceramic to be bonded or packaged by the high-temperature glue, and then the ceramic material is bonded on the surface of the ceramic by the high-temperature glue through multi-section heating pretreatment. Compared with single-stage heating pretreatment, the rapid heating can reduce the bonding strength and the high-temperature resistance of the high-temperature glue for the ceramic material, so that the product quality of the high-temperature glue for the ceramic material is influenced, and the multi-stage heating pretreatment does not influence the bonding strength and the high-temperature resistance of the high-temperature glue for the ceramic material.
Example one
The high-temperature adhesive for the ceramic material comprises 10 parts by weight of silicon dioxide with large particle size; 2 parts by weight of a small-particle-diameter silica; 26 parts by weight of large-particle-size alumina; 5 parts by weight of alumina having a medium particle diameter; 2.5 parts by weight of small particle size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp. resistance (730 deg.C), no swelling and no cracking.
Example two
The high-temperature adhesive for the ceramic material comprises 11 parts by weight of silicon dioxide with large particle size; 2.2 parts by weight of silica having a small particle diameter; 27 parts by weight of large-particle-size alumina; 5.5 parts by weight of alumina of medium particle size; 3 parts by weight of small-particle-size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp. resistance (750 deg.C), no swelling and no cracking.
EXAMPLE III
The high-temperature adhesive for the ceramic material comprises 12 parts by weight of silicon dioxide with large particle size; 3 parts by weight of a small-particle-diameter silica; 28 parts by weight of large-particle-size alumina; 6 parts by weight of alumina having a medium particle diameter; 3.5 parts by weight of small particle size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp resistance (800 deg.C), no swelling and no cracking.
Example four
The high-temperature adhesive for the ceramic material comprises 13 parts by weight of silicon dioxide with large particle size; 3.5 parts by weight of silica having a small particle diameter; 29 parts by weight of large-particle-size alumina; 6.5 parts by weight of alumina of medium particle size; 4 parts by weight of small-particle-size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp resistance (800 deg.C), no swelling and no cracking.
EXAMPLE five
The high-temperature adhesive for the ceramic material comprises 14 parts by weight of silicon dioxide with large particle size; 4 parts by weight of a small-particle-diameter silica; 30 parts by weight of large-particle-size alumina; 7 parts by weight of alumina having a medium particle diameter; 4.5 parts by weight of small particle size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp resistance (800 deg.C), no swelling and no cracking.
Comparative example 1
The high-temperature adhesive for the ceramic material comprises 12 parts by weight of silicon dioxide with large particle size; 3 parts by weight of a small-particle-diameter silica; 20 parts by weight of large-particle-size alumina; 6 parts by weight of alumina having a medium particle diameter; 3.5 parts by weight of small particle size alumina; the balance of sodium silicate; wherein the particle size range of the silicon dioxide with large particle size is 40-50 mu m, and the particle size range of the silicon dioxide with small particle size is 2.4-4.4 mu m; the large-particle alumina has a particle size of 33 to 43 μm, the medium-particle alumina has a particle size of 8 to 12 μm, and the small-particle alumina has a particle size of 5.5 to 7.5 μm.
A preparation method of high-temperature glue for ceramic materials comprises the following steps:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for 200s by using a defoaming stirrer under the condition of the rotating speed of 1200r/min to obtain the high-temperature adhesive for the ceramic material.
The application of the high-temperature glue for the ceramic material prepared in the above embodiment to the ceramic material comprises the following specific application methods:
coating a ceramic material on the surface of the ceramic to be bonded or packaged by using high-temperature glue, and firstly carrying out heat treatment at 40 ℃ for 30 min; then heat treating at 70 deg.C for 120 min; then heat-treating at 120 deg.C for 120 min; finally, heat treatment is carried out for 30min at 150 ℃ so as to bond the ceramic material on the surface of the ceramic by high-temperature glue.
Through detection, the parameters of the high-temperature adhesive for the ceramic material prepared by the embodiment are as follows:
surface drying time, at room temperature, 30 min;
curing temperature, drying in oven at 150 deg.C for 30 min;
the bonding strength is not less than 10 MPa;
the water resistance is 72 hours, the rubber powder does not fall off, the water cannot permeate, and the hydrolysis is avoided;
high temp resistance (600 deg.C), no swelling and no cracking.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present invention in the specification or directly/indirectly applied to other related technical fields under the inventive concept are included in the scope of the present invention.
Claims (10)
1. A high-temperature adhesive for ceramic materials, comprising:
10-14 parts by weight of large-particle-size silica;
2-4 parts by weight of small-particle-size silica;
26-30 parts by weight of large-particle-size alumina;
5-7 parts by weight of alumina with a medium particle size;
2.5-4.5 parts by weight of small-particle-size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
2. The high temperature cement for ceramic materials according to claim 1, comprising:
11-13 parts by weight of large-particle-size silica;
2.2 to 3.5 parts by weight of silica having a small particle diameter;
27 to 29 parts by weight of alumina having a large particle size;
5.5-6.5 parts by weight of alumina with a medium particle size;
3-4 parts by weight of small-particle-size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
3. The high temperature cement for ceramic materials according to claim 1, comprising:
12 parts by weight of large-particle-size silica;
3 parts by weight of a small-particle-diameter silica;
28 parts by weight of large-particle-size alumina;
6 parts by weight of alumina having a medium particle diameter;
3.5 parts by weight of small particle size alumina;
the balance of sodium silicate;
wherein the particle size range of the large-particle-size silicon dioxide is 40-50 mu m, and the particle size range of the small-particle-size silicon dioxide is 2.4-4.4 mu m;
the particle size range of the alumina with large particle size is 33-43 mu m, the particle size range of the alumina with medium particle size is 8-12 mu m, and the particle size range of the alumina with small particle size is 5.5-7.5 mu m.
4. A high temperature cement for ceramic materials as claimed in any one of claims 1 to 3, wherein said silica is one or more of natural quartzite, natural silica, precipitated silica, silica fume, fumed silica.
5. A high temperature paste for ceramic material according to any of claims 1 to 3 wherein the alumina is alpha-alumina or gamma-alumina.
6. The method for preparing a high temperature paste for ceramic materials according to any one of claims 1 to 5, comprising the steps of:
weighing and mixing the raw materials for forming the high-temperature glue for the ceramic material according to the formula to obtain a mixed raw material;
and dispersing the mixed raw materials for a preset time under the condition of a preset rotating speed to obtain the high-temperature glue for the ceramic material.
7. The method for preparing high-temperature glue for ceramic materials according to claim 6, wherein the preset rotating speed is 500-5000 r/min, and the preset time is 100-500 s.
8. The method for preparing high-temperature glue for ceramic materials according to claim 6, wherein the preset rotating speed is 1200r/min, and the preset time is 200 s.
9. The use of high temperature glue for ceramic materials according to any of claims 1 to 5, wherein the ceramic material is coated on the ceramic surface to be bonded or packaged with the high temperature glue, and is subjected to multi-stage heating pretreatment to bond the ceramic material to the ceramic surface with the high temperature glue.
10. The use of a high temperature glue for ceramic materials according to claim 9, wherein the step of multistage thermal pretreatment comprises:
(1) heat treating at 40 deg.C for 30 min;
(2) heat treating at 70 deg.C for 120 min;
(3) heat treating at 120 deg.C for 120 min;
(4) heat treatment at 150 deg.C for 30 min.
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| JPH10316430A (en) * | 1997-05-16 | 1998-12-02 | Mitsubishi Heavy Ind Ltd | Filling material for high temperature and production thereof |
| JP2003192472A (en) * | 2001-12-26 | 2003-07-09 | Nichias Corp | Heat-resistant structure |
| CN101735733A (en) * | 2010-01-04 | 2010-06-16 | 唐连明 | High-temperature-resistant adhesive for vacuum filling-sealing of ceramic heaters |
| CN101993664A (en) * | 2009-08-29 | 2011-03-30 | 襄樊封神胶业有限公司 | High temperature resistant inorganic ceramic adhesive |
| CN113355025A (en) * | 2021-06-18 | 2021-09-07 | 广西三晶化工科技有限公司 | High-temperature binding agent of phosphosilicate aluminum and preparation method thereof |
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2021
- 2021-11-17 CN CN202111367367.3A patent/CN114181631A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10316430A (en) * | 1997-05-16 | 1998-12-02 | Mitsubishi Heavy Ind Ltd | Filling material for high temperature and production thereof |
| JP2003192472A (en) * | 2001-12-26 | 2003-07-09 | Nichias Corp | Heat-resistant structure |
| CN101993664A (en) * | 2009-08-29 | 2011-03-30 | 襄樊封神胶业有限公司 | High temperature resistant inorganic ceramic adhesive |
| CN101735733A (en) * | 2010-01-04 | 2010-06-16 | 唐连明 | High-temperature-resistant adhesive for vacuum filling-sealing of ceramic heaters |
| CN113355025A (en) * | 2021-06-18 | 2021-09-07 | 广西三晶化工科技有限公司 | High-temperature binding agent of phosphosilicate aluminum and preparation method thereof |
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