CN114176263A - Heating assembly, preparation method of heating assembly and electronic atomization device - Google Patents
Heating assembly, preparation method of heating assembly and electronic atomization device Download PDFInfo
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- CN114176263A CN114176263A CN202111337607.5A CN202111337607A CN114176263A CN 114176263 A CN114176263 A CN 114176263A CN 202111337607 A CN202111337607 A CN 202111337607A CN 114176263 A CN114176263 A CN 114176263A
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- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
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- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
Abstract
The application relates to the technical field of electronic atomizers, in particular to a heating component, a preparation method of the heating component and an electronic atomizing device. The heating component comprises a heating body, wherein the heating body is made of metal and ceramic, wherein in the heating body, the mass ratio of the metal is 40-75%, and the mass ratio of the ceramic is 25-60%. The heating element prepared by 40-75% of metal and 25-60% of ceramic by mass has resistivity larger than that of alloy resistor and smaller than that of thermistor, and can meet the requirements of specific heating and non-combustion aerosol forming devices on the resistivity of heating components when aerosol forming substrates are heated to form aerosol.
Description
Technical Field
The application relates to the technical field of electronic atomizers, in particular to a heating component, a preparation method of the heating component and an electronic atomizing device.
Background
The conventional heating non-combustible aerosol forming apparatus is generally heated by tubular peripheral heating or central embedded heating. Tubular peripheral heating means that a heating tube is wrapped around the aerosol-forming substrate to heat the aerosol-forming substrate; centre-embedded heating is the insertion of a heating element into an aerosol-forming substrate to heat the aerosol-forming substrate. The heating assembly is formed by mainly using ceramic or metal subjected to insulation treatment as a substrate, then printing or coating a resistance heating circuit on the substrate, and fixing the resistance heating circuit on the substrate after high-temperature treatment.
Current heating assemblies mainly include alloy resistors and thermistors. Wherein the resistivity of the alloy resistance is generally less than 10-7Omega m, thermistors generally greater than 10-2Omega.m. However, in the actual use process, for some specific heat-generating components of the heat-generating non-combustible aerosol forming device, the resistivity of the alloy resistor and the thermistor cannot meet the use requirements due to the limitation of factors such as power and the like.
Disclosure of Invention
In view of this, the present application provides a heating element, a method for manufacturing the heating element, and an electronic atomization apparatus, so as to solve the technical problem in the prior art that the resistivity of the alloy resistor and the thermistor cannot meet the use requirement.
In order to solve the above technical problem, a first technical solution provided by the present application is: the heating component comprises a heating body, wherein the heating body is made of metal and ceramic, the volume mass ratio of the metal in the heating body is 40-75%, and the mass ratio of the ceramic is 25-60%.
Wherein the metal comprises at least one of nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel.
Wherein the ceramic comprises at least one of alumina, zirconia, silica, yttria, lanthana, ceria, and magnesia.
The ceramic is doped ceramic, and the doped elements in the ceramic are used for improving the stability and toughness of a ceramic phase.
Wherein the heating element has a resistivity of 4X 10-6Ω·m～8×10-4Ω·m。
Wherein the resistance temperature coefficient of the heating element is more than 600 ppm/DEG C.
The heating body is provided with an open slot, the open slot is arranged on the heating body along the length direction of the heating body, and the length of the open slot along the length direction of the heating body is 50% -95% of the length of the heating body.
The heating body is flat, and comprises a sheet-shaped pointed head part with two opposite surfaces in an isosceles triangle shape and a main body part with two opposite surfaces in a rectangular shape and connected to the bottom edge of the pointed head part.
The heating element is columnar, and comprises a conical tip part and a columnar main body part connected to the bottom surface of the tip part.
The device also comprises a filling body, wherein the filling body is filled in the open slot, and the resistivity of the filling body is greater than 8 multiplied by 10-3Ω。
The heating device also comprises a fixed base and a wire, wherein the fixed base is arranged at one end of the heating body; the wire is connected to one end, provided with the fixed base, of the heating body and used for being electrically connected with the power supply assembly to supply power to the heating body.
Wherein, the fixed base is arranged at the opening end of the opening groove.
In order to solve the above technical problem, a second technical solution provided by the present application is: an electronic atomization device is provided, which comprises a shell, a power supply component and a heating component; the power supply assembly is arranged in the shell; the heating component is arranged in the shell and connected with the power supply component, and the power supply component supplies power to the heating component; wherein, the heating component is the heating component.
The beneficial effect of this application: different from the prior art, the heating assembly comprises a heating body, wherein the heating body comprises metal and ceramic, the mass ratio of the metal is 40% -75%, and the mass ratio of the ceramic is 25% -60%. The heating element prepared by the proportion has the resistivity which is larger than that of the alloy resistor and smaller than that of the thermistor, and can meet the requirements of certain specific heating and non-combustion aerosol forming devices on the resistivity of the heating component when the aerosol forming substrate is heated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat generating component according to an embodiment of the present disclosure;
fig. 2 is a first top view of a heat generating component provided in an embodiment of the present application;
fig. 3 is a second top view of a heat generating component provided in an embodiment of the present application;
fig. 4 is a third top view of a heat generating component according to an embodiment of the present application;
fig. 5 is another schematic structural diagram of a heat generating component according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a heat generating component according to another embodiment of the present application;
fig. 7 is a schematic structural diagram of an electronic atomization device provided in an embodiment of the present application;
FIG. 8 is a flow chart of a method for manufacturing a heat-generating component according to an embodiment of the present disclosure;
fig. 9 is a flowchart of a method for manufacturing a heat generating component according to another embodiment.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Please refer to fig. 1, which is a schematic structural diagram of a heating element according to an embodiment of the present disclosure. The heat generating component 10 includes a heat generating body 11, a fixing base 13, and a lead wire 14. The heat-generating body 11 is used to heat the aerosol-forming substrate after insertion thereof without combustion, so as to facilitate the user's smoking. The fixing base 13 is disposed at one end of the heating element 11, and is used for fixing and mounting the heating element 11 in the electronic atomization device. The lead wire 14 is connected to one end of the heating element 11 where the fixing base 13 is provided, and is electrically connected to a power supply unit 30 (shown in fig. 7) for supplying power to the heating element 11. It will be appreciated that the fixed base 13 and the wire 14 are of alternative construction.
The heating element 11 is formed by mixing a metal material and a ceramic material and then sintering the mixture. In the sintering process, the metal phase and the ceramic phase do not undergo chemical reaction and high-temperature chemical diffusion, so that the heating element 11 has high resistivity stability. The resistivity of which is greater than 10 of the resistivity of the alloy-7Omega m, less than 10 of the resistivity of the thermistor-2Omega · m, which is between the resistivity of the alloy resistor and the resistivity of the thermistor, fills the application range of the conventional heating resistor at present, and can meet the requirements of some specific heating non-combustible aerosol forming devices on the resistivity of the heating component 10.
Specifically, the material of the heating element 11 comprises metal and ceramic, wherein the mass ratio of the metal in the heating element 11 is 40-75%, and the mass ratio of the ceramic is 25-60%. That is, in the heating element 11, the mass of the metal material accounts for 40 to 75 percent of the total mass of the heating element 11, and the mass of the ceramic material accounts for 25 to 60 percent of the total mass of the heating element 11.
Further, the metal includes at least one of nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel. It will be appreciated that at least one of nickel, iron, cobalt, copper, titanium, aluminium and stainless steel is added as an electrically conductive material to the heating element 11 and the aerosol-forming substrate is heated non-combustively after the heating element 11 is powered. The stainless steel includes one or more of 316L stainless steel, 304 stainless steel and 430 stainless steel, and may be other types of stainless steel.
Further, the ceramic includes at least one of alumina, zirconia, silica, yttria, lanthana, ceria, and magnesia. It will be appreciated that, because of the lower resistivity and higher Temperature Coefficient of Resistance (TCR) of metal, the resistivity for fabrication is between 10-7Omega. m and 10-2The heating element 11 between Ω · m is required to be added with a metal oxide, an inorganic nonmetal, or a non-stainless steel metal to adjust the resistivity of the metal. In this embodiment, the ceramic is at least one of alumina, zirconia, silica, yttria, lanthana, ceria, and magnesia, and is used to adjust the resistivity of the heating element 11. In addition, the ceramic also enhances the strength of the heating element 11, facilitating insertion of the aerosol-forming substrate into the heating element 11.
In one embodiment, the mass ratio of the metal in the heating element 11 is more than 70%, and the mass ratio of the ceramic is less than 30%. The heating body 11 has a low resistivity due to a high mass ratio of the metal. In another embodiment, the mass ratio of the metal in the heating body 11 is less than 50%, and the mass ratio of the ceramic is more than 50%. The heating body 11 has a high resistivity due to the low mass ratio of the metal.
Further, in order to improve the structural stability of the ceramic phase, improve the mechanical properties of the ceramic phase and improve the toughness of the ceramic phase, the ceramic is doped ceramic. For example, in one embodiment, the zirconia may be doped with yttrium to improve the phase structure stability of the zirconia. In another embodiment, the alumina may be doped with zirconium to increase the toughness of the alumina. In addition, it is specifically stated that the substitution of doping with any element and with any doping amount for the ceramic phase in the present application is within the scope of the present application.
Further, the heating element 11 has a resistivity of 4X 10-6Ω·m～8×10-4Omega. m, the temperature coefficient of resistance of the heating element 11 is more than 600 ppm/deg.C, preferably more than 700 ppm/deg.C. Specifically, the specific resistance of the heating element 11 is related to the mass ratio of the metal and the ceramic, the selected material components of the metal and the ceramic, the grain size of the metal and the ceramic material, and the sintering process. In one embodiment, the metal may be 40-75 wt%, the ceramic may be 25-60 wt%, the metal may be at least one of nickel, iron, cobalt, copper, titanium, aluminum and stainless steel, and the ceramic may be alumina, zirconia, silica, yttria, lanthana, ceria and magnesiaAt least one of (1) sintering vacuum degree of 10-3Pa～10-1Pa, the sintering temperature is 1200-1500 ℃, so as to meet the requirements of the resistivity and the resistance temperature coefficient of the heating element 11.
Further, the heating element 11 is also provided with an open slot 12, the open slot 12 is opened on the heating element 11 along the length direction of the heating element 11, and the length of the open slot 12 along the length direction of the heating element 11 is 50% -95% of the length of the main body of the heating element 11.
It is to be understood that the shape of the heat-generating body 11 in the present application includes one or a combination of plural kinds of a cylinder, a cone, a rectangular parallelepiped, a sheet and the like. Specifically, in one embodiment, for example, as shown in fig. 1 and 2, the heat-generating body 11 includes a sheet-like prong portion having two opposite surfaces in an isosceles triangle shape and a cylindrical body portion connected to a bottom surface of the prong portion. In one embodiment, as shown in FIGS. 1 and 3, the heat-generating body 11 is a flat plate shape, and the heat-generating body 11 includes a plate-like spike portion having two opposite surfaces in the shape of an isosceles triangle and a body portion connected to the bottom edge of the spike portion and having two opposite surfaces in the shape of a rectangle. In another embodiment, as shown in FIGS. 1 and 4, the heating element 11 has a columnar shape, and the heating element 11 includes a conical tip portion and a columnar body portion connected to the bottom surface of the tip portion. The pointed portion in the above embodiment is for reducing friction between the aerosol-forming substrate and the heat-generating body 11 when the aerosol-forming substrate is inserted into the heat-generating body 11, and facilitating insertion of the aerosol-forming substrate. The main body part is provided with an open slot 12, and the length of the open slot 12 along the length direction of the heating element 11 is 50-95% of the total length of the sharp head part and the main body part. Further, in one embodiment, the open groove 12 is a blind groove in order to facilitate cleaning of the aerosol-forming substrate on the heating body 11 and keep the heating body 11 clean. In another embodiment, the opening 12 may be hollowed out.
It is further understood that, in order to facilitate the heating element 11 to regulate the temperature field close to the fixed base 13 and the temperature field far from the fixed base 13, the slot widths of the open slots 12 may be equal from one end far from the fixed base 13 to one end near the fixed base 13, as shown in fig. 1. Or the width of the open slot 12 may be gradually increased or decreased from the end far away from the fixed base 13 to the end near the fixed base 13. As shown in fig. 5, the width of the open groove 12 gradually increases from the end away from the fixed base 13 to the end near the fixed base 13.
It can be further understood that the length of the open slot 12 along the length direction of the heating element 11 is 50% -95% of the length of the heating element 11, so that the temperature field of one end of the heating element 11 far from the fixing base 13 is concentrated, the aerosol-forming substrate inserted into the heating element 11 is heated without burning, the temperature of one end of the heating element 11 near the fixing base 13 is lower, and the heat loss is reduced. The main body of the heating element 11 is a portion of the heating element 11 excluding the tip.
Fig. 6 is a schematic structural diagram of a heating element according to another embodiment of the present application. Furthermore, the heating element 11 further comprises a filling body 15, the filling body 15 is filled in the open slot 12, and the material of the filling body 15 has the resistivity larger than 8 multiplied by 10-3Omega material. In the present embodiment, the filler 15 includes at least one of ceramic and glass, and the ceramic is at least one of alumina, zirconia, silica, yttria, lanthana, ceria, and magnesia.
Further, an electrode (not shown) may be provided on the surface of the heating element 11 so as to connect the lead wire 14. In one embodiment, conductive metal pastes are respectively provided as electrodes on the outer surfaces of both free ends of the heat-generating body 11 near the fixed base 13.
The shape and structure of the fixing base 13 are not limited as long as the heating element 11 can be fixed. In one embodiment, the fixed base 13 is a circular resin plate. The wire 14 may be a metal wire, for example, a copper-clad wire.
Fig. 7 is a schematic structural diagram of an electronic atomization device according to the present application. The electronic atomizer includes a housing 20, a power supply unit 30, and a heat generating unit 10. The power supply module 30 and the heat generating module 10 are both mounted in the housing 20, the power supply module 30 is electrically connected to the heat generating module 10, and the power supply module 30 supplies power to the heat generating module 10. The shape and material of the housing 20 are not limited, and in one embodiment, the housing 20 is an insulating hollow cylinder. In one embodiment, the power supply assembly 30 may specifically include a rechargeable lithium ion battery and a PCB circuit board. The power module 30 also includes necessary components such as a bracket and a microphone.
The heating element 10 may be the heating element 10 of any of the above embodiments, and is not described herein again.
This implementation provides an electronic atomization device, through setting up heating element 10, carries out the incombustible heating after inserting aerosol formation substrate to be convenient for the user and inhale. Wherein the heating element 11 of the heating element assembly 10 has a resistivity of 4 x 10-6Ω·m～8×10-4Omega.m, the resistance temperature coefficient of the heating element 11 is larger than 600 ppm/DEG C, the application range of the conventional heating resistor is filled up, the requirement of the electronic atomization device on the resistivity of the heating component 10 can be met, and the functions of heating and automatic temperature control can be realized.
Please refer to fig. 8, which is a flowchart illustrating a method for manufacturing a heating element according to the present disclosure. The manufacturing method of the heating element 10 specifically includes:
step S1: the metal powder, the ceramic powder and the mixing agent are mixed to obtain a mixture, wherein the mass ratio of the metal is 40-75%, and the mass ratio of the ceramic is 25-60%.
Specifically, metal powder, ceramic powder and a mixing agent are mixed in a ball milling mode.
Step S2: the mixture is compressed to form a biscuit.
In particular, the biscuit can be prepared by injection molding, extrusion or dry pressing. The injection molding method is taken as an example for explanation, namely, the mixture obtained by mixing is placed in an injection machine, heated to be changed into fluid, pressed into a mold by a plunger, cooled and demoulded to obtain a biscuit.
Step S3: and carrying out glue discharging and sintering on the biscuit.
Specifically, the formed biscuit is placed in an atmosphere furnace or a vacuum furnace for binder removal and sintering. Sintering is carried out in a vacuum furnace with a vacuum degree of 10-3Pa～10-1Pa, and the sintering temperature is 1200-1500 ℃. Wherein, in the course of binder removal, the mixture in the biscuit is consumed, so that the heating element 11 after sintering only contains metal and ceramic.
In addition, referring to fig. 9, after step S3 is completed, the following steps may be performed:
step S4: and machining and finishing the sintered heating body 11 according to the actual size so that the heating body 11 meets the actual required size and is convenient to install in an electronic atomization device.
Step S5: the lead wire 14 and the fixed base 13 are soldered to the heating element 11 in an atmosphere furnace or a vacuum furnace. The fixed base 13 is brazed to one end of the heating element 11, and the lead wire 14 is brazed to one end of the heating element 11 near the fixed base 13.
Step S6: a glaze layer is prepared on the surface of the heating element 11.
Specifically, the heating element 11 is placed in an atmosphere furnace or a vacuum furnace and sintered to prepare a glaze layer on the heating element 11, wherein the glaze layer is used for protecting the heating element 11, and the service life of the heating element 11 can be prolonged to a certain extent.
It is understood in the present embodiment that the order of the steps S5 and S6 may be switched when the heat generating component 10 is prepared. Namely, after the base fixing and the lead 14 are soldered to the heating element 11, a glaze layer can be prepared; after a glaze layer is formed on the surface of the heating element 11, the fixing base 13 and the lead 14 may be soldered to the heating element 11. Wherein, the electrodes on the surface of the heating element 11 are exposed when the glaze layer is prepared.
It is to be noted that in this example, S6 is not an essential step, and the heat-generating body 11 produced by the present invention was excellent in performance even without S6.
It is further understood that the heat-generating component 10, in which the heat-generating body 11 has a resistivity of 4X 10, is manufactured by the above-described manufacturing method-6Ω·m～8×10-4Omega.m, temperature coefficient of resistance greater than 600 ppm/DEG C.
The above-mentioned preparation method is exemplified by the following specific examples in terms of volume ratio of metal and ceramic, selected material components of metal and ceramic, particle size of metal and ceramic material, and degree of vacuum and temperature of sintering.
Example 1:
(1) the nickel powder with the particle size of 1 mu m is proportioned according to the mass percent of 40 percent, the alumina powder with the particle size of 10 mu m is proportioned according to the mass percent of 60 percent, and then proper amount of dispersant Triethanolamine (TEA) is added to wet grind in a ball mill for 30 hours to obtain the mixed powder.
(2) The mixture was dried in a vacuum oven at 60 ℃.
(3) And adding a PVB solution with the mass percentage of 5% into the dried mixture as a forming binder, and fully stirring and mixing.
(4) And pouring the mixture into a mortar for granulation.
(5) And pouring the granulated powder into a dry pressing mould, and pressing the powder into a target shape under the forming pressure of 100MPa to form a biscuit.
(6) And (3) drying the formed biscuit in a vacuum drying oven at 60 ℃ for 4 h.
(7) And (3) placing the dried biscuit in a tubular hydrogen atmosphere furnace for degumming, wherein the heating rate is 2 ℃/min, the degumming temperature is 450 ℃, and the heat preservation time is 60 min.
(8) Sintering the biscuit in a vacuum furnace with the vacuum degree of 10-2Pa, the sintering temperature is 1400 ℃, and the sintering time is 120 min.
The physical performance parameters of the metal ceramic heating element prepared by the process are as follows:
| bending strength, MPa | Resistivity, Ω · m | TCR，ppm/℃(RT-300℃) |
| 420 | 8×10-4 | 6400 |
Example 2
(1) The nickel powder with the particle size of 10 mu m is proportioned according to the mass volume percentage of 75 percent and the alumina powder with the particle size of 1 mu m is proportioned according to the mass percentage of 25 percent, then proper amount of dispersant Triethanolamine (TEA) is added, and wet milling is carried out in a ball mill for 30 hours to obtain the mixed powder.
(2) The mixture was dried in a vacuum oven at 60 ℃.
(3) And adding a PVB solution with the mass percentage of 5% into the dried mixture as a forming binder, and fully stirring and mixing.
(4) And pouring the mixture into a mortar for granulation.
(5) And pouring the granulated powder into a dry pressing mould, and pressing the powder into a target shape under the forming pressure of 100MPa to form a biscuit.
(6) And (3) drying the formed biscuit in a vacuum drying oven at 60 ℃ for 4 h.
(7) And (3) placing the dried biscuit in a tubular hydrogen atmosphere furnace for degumming, wherein the heating rate is 2 ℃/min, the degumming temperature is 450 ℃, and the heat preservation time is 60 min.
(8) Sintering the biscuit in a vacuum furnace with the vacuum degree of 10-2Pa, the sintering temperature is 1400 ℃, and the sintering time is 120 min.
The physical performance parameters of the metal ceramic heating element prepared by the process are as follows:
| bending strength, MPa | Resistivity, Ω · m | TCR，ppm/℃(RT-300℃) |
| 510 | 4×10-6 | 6500 |
Example 3
(1) The nickel powder with the particle size of 1 mu m is proportioned according to the mass percent of 40 percent and the zirconia powder with the particle size of 5 mu m is proportioned according to the mass percent of 60 percent, and then proper amount of dispersant Triethanolamine (TEA) is added to wet grind in a ball mill for 30 hours to obtain mixed powder.
(2) Putting the mixture into a vacuum drying oven at 60 ℃ for drying;
(3) adding a PVB solution with the mass percentage of 5% into the dried mixture as a forming binder, and fully stirring and mixing;
(4) pouring the mixture into a mortar for granulation;
(5) and pouring the granulated powder into a dry pressing mould, and pressing the powder into a target shape under the forming pressure of 80MPa to form a biscuit.
(6) And (3) drying the formed biscuit in a vacuum drying oven at 60 ℃ for 4 h.
(7) And (3) placing the dried biscuit in a tubular hydrogen atmosphere furnace for degumming, wherein the heating rate is 2 ℃/min, the degumming temperature is 450 ℃, and the heat preservation time is 60 min.
(8) Sintering the biscuit in a vacuum furnace with the vacuum degree of 10-2Pa, the sintering temperature is 1420 ℃, and the sintering time is 120 min.
The physical performance parameters of the metal ceramic heating element prepared by the process are as follows:
| bending strength, MPa | Resistivity, Ω · m | TCR，ppm/℃(RT-300℃) |
| 380 | 6.3×10-5 | 6320 |
Example 4
(1) The 316L stainless steel powder with the grain diameter of 10 mu m is proportioned according to the mass percent of 40 percent, the zirconia powder with the grain diameter of 1 mu m is proportioned according to the mass percent of 60 percent, then proper amount of dispersant Triethanolamine (TEA) is added, and the mixture is wet-milled in a ball mill for 40 hours to obtain mixed powder.
(2) The mixture was dried in a vacuum oven at 60 ℃.
(3) And adding a PVB solution with the mass percentage of 5.0% as a forming binder into the dried mixture, and fully stirring and mixing.
(4) And pouring the mixture into a mortar for granulation.
(5) And pouring the granulated powder into a dry pressing mould, and pressing the powder into a target shape under the forming pressure of 200MPa to form a biscuit.
(6) Drying the formed biscuit in a vacuum drying oven at 60 ℃ for 4 hours;
(7) and (3) placing the dried biscuit in a tubular hydrogen atmosphere furnace for degumming, wherein the heating rate is 2 ℃/min, the degumming temperature is 450 ℃, and the heat preservation time is 60 min.
(8) Sintering the biscuit in a vacuum furnace with the vacuum degree of 10-2Pa, the sintering temperature is 1350 ℃ and the sintering time is 120 min.
The physical performance parameters of the metal ceramic heating element prepared by the process are as follows:
| bending strength, MPa | Resistivity, Ω · m | TCR，ppm/℃(RT-300℃) |
| 400 | 3.8×10-5 | 1050 |
The metal ceramic prepared by the process meets the requirements of resistivity and TCR, and can realize the functions of heating and automatic temperature control.
Example 5
(1) 430L of stainless steel powder with the grain diameter of 10 mu m is proportioned according to the mass percent of 40 percent, and zirconia powder with the grain diameter of 1 mu m is proportioned according to the mass percent of 60 percent, and then proper amount of dispersant Triethanolamine (TEA) is added to wet-grind in a ball mill for 40 hours to obtain mixed powder.
(2) The mixture was dried in a vacuum oven at 60 ℃.
(3) And adding a PVB solution with the mass percentage of 5.0% as a forming binder into the dried mixture, and fully stirring and mixing.
(4) And pouring the mixture into a mortar for granulation.
(5) And pouring the granulated powder into a dry pressing mould, and pressing the powder into a target shape under the forming pressure of 200MPa to form a biscuit.
(6) And (3) drying the formed biscuit in a vacuum drying oven at 60 ℃ for 4 h.
(7) And (3) placing the dried biscuit in a tubular hydrogen atmosphere furnace for degumming, wherein the heating rate is 2 ℃/min, the degumming temperature is 450 ℃, and the heat preservation time is 60 min.
(8) Putting the biscuit into vacuumSintering in a furnace with a vacuum degree of 10-2Pa, the sintering temperature is 1400 ℃, and the sintering time is 120 min.
The physical performance parameters of the metal ceramic heating element prepared by the process are as follows:
| bending strength, MPa | Resistivity, Ω · m | TCR，ppm/℃(RT-300℃) |
| 250 | 3.2×10-5 | 1000 |
The following can be found in the above examples 1 to 5:
(1) the densification sintering of the heating element 11 can be realized at a relatively low degree of vacuum and sintering temperature. In the whole sintering process, the metal phase and the ceramic phase do not have chemical reaction and high-temperature chemical diffusion, so that the metal phase and the ceramic phase have the characteristics of good high-temperature chemical compatibility and high sintering activity.
(2) The raw material of the heating element 10 has wide sources and low price, so the material cost of the heating element 10 is low. And because the metal phase and the ceramic phase have high sintering activity and good processing performance, the process for preparing the heating component 10 is simple, and the manufacturing cost is low.
(3) By the above production method, the obtained heat generating component 10 can satisfy that the resistivity of the heat generating body 11 is 4 × 10-6Ω·m～8×10-4Omega.m, Temperature Coefficient of Resistance (TCR) greater than 600 ppm/DEG C, can realize the function that the heating element 10 generates heat and controls the temperature automatically.
(4) Because the mass percentage of the metal in the heating element 11 is high and the metal has high toughness, the heating element 11 has both the toughness of the metal and the high strength of the ceramic in terms of mechanical properties, so that the heating element 11 can have high bending strength.
(5) The mass ratio of the metal in the heating element 11 is high, and the resistivity of the metal is stable and is not influenced by the stoichiometric ratio and the sintering atmosphere, so that the heating element 11 has high reproducibility and high resistivity stability in preparation.
In summary, the above-described method for producing the heating element 10 can make the resistivity of the heating element 11 4 × 10-6Ω·m～8×10-4Omega.m, the resistance temperature coefficient of the heating element 11 is larger than 600 ppm/DEG C, the application range of the conventional heating resistor is filled, the requirements of some specific heating non-combustion aerosol forming devices on the resistivity of the heating component 10 can be met, and the heating and temperature self-control functions can be realized.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes that can be directly or indirectly applied to other related technologies, which are made by using the contents of the present specification and the accompanying drawings, are also included in the scope of the present application.
Claims (13)
1. A heat generating component, comprising:
the heating element is made of metal and ceramic, wherein the metal accounts for 40-75% of the heating element by mass, and the ceramic accounts for 25-60% of the heating element by mass.
2. The heat-generating component of claim 1, wherein the metal comprises at least one of nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel.
3. The heating element of claim 1 wherein the ceramic comprises at least one of alumina, zirconia, silica, yttria, lanthana, ceria, and magnesia.
4. The heating element of claim 1 wherein the ceramic is a doped ceramic, the elements doped in the ceramic to improve the stability and toughness of the ceramic phase.
5. The heat generating component as claimed in claim 1, wherein the heat generating body has a resistivity of 4 x 10-6Ω·m～8×10-4Ω·m。
6. The heat generating component as claimed in claim 1, wherein the heat generating body has a temperature coefficient of resistance of more than 600ppm/° c.
7. The heating element as claimed in claim 1, wherein the heating element has an open slot, the open slot is opened on the heating element along the length direction of the heating element, and the length of the open slot along the length direction of the heating element is 50-95% of the length of the heating element.
8. The heat-generating body as claimed in claim 7, wherein the heat-generating body is in a flat plate shape, and the heat-generating body includes a tip portion having two opposing surfaces in a sheet shape and in an isosceles triangle shape, and a main body portion having two opposing surfaces in a rectangular shape and connected to a bottom edge of the tip portion.
9. The heat generating component as claimed in claim 7, wherein the heat generating body has a columnar shape, and the heat generating body includes a tapered tip portion and a columnar body portion connected to a bottom surface of the tip portion.
10. The heating element as claimed in claim 7, further comprising a filler filled in the open slot, wherein the filler has a resistivity greater than 8 x 10-3Ω。
11. The heat-generating component of claim 7, further comprising:
the fixed base is arranged at one end of the heating body;
and the wire is connected to one end, provided with the fixed base, of the heating body and used for being electrically connected with the power supply assembly so as to supply power to the heating body.
12. The heat generating assembly as claimed in claim 11, wherein the fixing base is disposed at an open end of the open slot.
13. An electronic atomization device, comprising:
a housing;
the power supply assembly is arranged in the shell;
the heating component is arranged in the shell and connected with the power supply component, and the power supply component supplies power to the heating component; wherein the heat generating component is the heat generating component according to any one of claims 1 to 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111337607.5A CN114176263A (en) | 2021-11-09 | 2021-11-09 | Heating assembly, preparation method of heating assembly and electronic atomization device |
| PCT/CN2022/128056 WO2023083016A1 (en) | 2021-11-09 | 2022-10-27 | Heating assembly, preparation method for heating assembly, and electronic atomization apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111337607.5A CN114176263A (en) | 2021-11-09 | 2021-11-09 | Heating assembly, preparation method of heating assembly and electronic atomization device |
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| CN114176263A true CN114176263A (en) | 2022-03-15 |
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|---|---|---|---|
| CN202111337607.5A Pending CN114176263A (en) | 2021-11-09 | 2021-11-09 | Heating assembly, preparation method of heating assembly and electronic atomization device |
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| Country | Link |
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| CN (1) | CN114176263A (en) |
| WO (1) | WO2023083016A1 (en) |
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| WO2023083016A1 (en) * | 2021-11-09 | 2023-05-19 | 深圳麦克韦尔科技有限公司 | Heating assembly, preparation method for heating assembly, and electronic atomization apparatus |
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Also Published As
| Publication number | Publication date |
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| WO2023083016A1 (en) | 2023-05-19 |
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