CN114173487A - Circuit board protection method and circuit board assembly - Google Patents
Circuit board protection method and circuit board assembly Download PDFInfo
- Publication number
- CN114173487A CN114173487A CN202010945033.9A CN202010945033A CN114173487A CN 114173487 A CN114173487 A CN 114173487A CN 202010945033 A CN202010945033 A CN 202010945033A CN 114173487 A CN114173487 A CN 114173487A
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- circuit board
- coating
- conformal coating
- spraying
- conformal
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 157
- 239000011248 coating agent Substances 0.000 claims abstract description 156
- 238000005507 spraying Methods 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 239000002086 nanomaterial Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000741 silica gel Substances 0.000 claims description 18
- 229910002027 silica gel Inorganic materials 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 239000005871 repellent Substances 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 4
- 230000002940 repellent Effects 0.000 claims description 4
- 238000009718 spray deposition Methods 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920000052 poly(p-xylylene) Polymers 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of electric power steering and provides a protection method of a circuit board and a circuit board assembly. The protection method of the circuit board comprises the following steps: providing a circuit board, wherein at least one first surface of the circuit board is provided with an electronic component; forming a conformal coating on the first surface such that the conformal coating at least encapsulates the electronic component; and forming a waterproof coating on the surface of the conformal coating, so that the waterproof coating at least covers the conformal coating. The circuit board assembly used in the electric power steering system and the protection method of the circuit board forming the circuit board assembly realize continuous and stable anti-corrosion protection and waterproof protection of the circuit board through the conformal coating and the waterproof coating, and the manufactured circuit board assembly has a compact structure and saves cost.
Description
Technical Field
The present invention relates to the field of electric power steering technologies, and in particular, to a circuit board assembly used in an electric power steering system and a method for protecting a circuit board forming the circuit board assembly.
Background
In an Electric Power Steering (EPS), a motor is controlled by a control circuit board to realize Steering Power control. The control circuit board needs to have excellent characteristics to adapt to different driving conditions.
The existing control circuit board is generally provided with only one layer of anti-corrosion protective coating on the surface, so that the control circuit board can be prevented from losing insulation performance due to exposure to the environment. However, under special driving conditions, for example, when the vehicle passes through a water accumulation area, the protective coating is immersed under the water, and the protective effect on the control circuit board is lost.
To solve this problem, the existing designs usually achieve corrosion protection and water protection of the control circuit board through two schemes.
The first is to coat the surface of the control circuit board with Parylene (Parylene) material, but Parylene material is expensive and not suitable for mass production.
The second is to seal the control circuit board in the protective casing, which increases the volume of the control circuit board, is not favorable for compact design, and increases the packaging cost.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present invention and therefore may include information that does not constitute prior art known to a person of ordinary skill in the art.
Disclosure of Invention
In view of the above, the present invention provides a circuit board assembly used in an electric power steering system and a method for protecting a circuit board forming the circuit board assembly, which can achieve continuous and stable corrosion protection and waterproof protection of the circuit board, and the manufactured circuit board assembly has a compact structure and saves cost.
One aspect of the present invention provides a method for protecting a circuit board, including the steps of: providing a circuit board, wherein at least one first surface of the circuit board is provided with an electronic component; forming a conformal coating on the first surface such that the conformal coating at least encapsulates the electronic component; and forming a waterproof coating on the surface of the conformal coating, so that the waterproof coating at least covers the conformal coating.
In some embodiments, the conformal coating is formed using a spray of silicone material.
In some embodiments, the step of spray forming the conformal coating with a silicone material comprises: conveying the circuit board to spraying equipment; spraying the silica gel material at least on the area, corresponding to the electronic component, of the first surface through the spraying equipment; conveying the circuit board to a curing device; and curing the silicone material by the curing device to form the conformal coating.
In some embodiments, the silica gel material is sprayed to a thickness of 50 μm to 200 μm.
In some embodiments, the water-repellent coating is formed using nano-material spraying.
In some embodiments, the step of forming the waterproof coating by spraying with a nanomaterial includes: conveying the circuit board to a drying device; drying the circuit board by the drying device; conveying the circuit board to spraying equipment; and spraying the nano material at least on the area of the first surface corresponding to the conformal coating through the spraying equipment to form the waterproof coating.
In some embodiments, the nano material is sprayed with a spraying thickness of 1000 nm.
In some embodiments, the conformal coating is formed such that the conformal coating uniformly and evenly covers the first surface; and when the waterproof coating is formed, the conformal coating is uniformly and smoothly coated by the waterproof coating.
Another aspect of the present invention provides a circuit board assembly comprising: the circuit board is provided with electronic components on at least one first surface; a conformal coating formed on the first surface, the conformal coating at least covering the electronic component; and the waterproof coating is formed on the surface of the conformal coating and at least coats the conformal coating.
In some embodiments, the material of the conformal coating is a silica gel material and the material of the water-resistant coating is a nanomaterial.
In some embodiments, the conformal coating has a thickness of 50 μm to 200 μm and the water repellent coating has a thickness of 1000 nm.
In some embodiments, the conformal coating uniformly and evenly covers the first surface, and the water repellant coating uniformly and evenly coats the conformal coating.
Compared with the prior art, the invention has the beneficial effects that:
the circuit board is provided with the conformal coating at least coating the electronic component, so that the circuit board is protected from insulation, corrosion, electric leakage and the like; further, the circuit board is protected from water by a waterproof coating which coats the conformal coating; the conformal coating and the waterproof coating both have good adhesive force and play a role in continuously and stably protecting the circuit board; in addition, the manufactured circuit board assembly has a compact structure, and the cost is saved;
tests show that the circuit board assembly coated with the conformal coating and the waterproof coating can successfully pass the IPX 7-level waterproof test, and still keep large current passing when the circuit board assembly is immersed in water; the conformal coating arranged between the waterproof coating and the circuit board can also eliminate the capacitive reactance phenomenon formed by the pins of the circuit board carrying current meeting water when the circuit board assembly is immersed in water, and the reliability of the circuit board assembly is kept.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic diagram showing steps of a method for protecting a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit board according to an embodiment of the present invention;
FIG. 3 shows a schematic structural view of forming a conformal coating in an embodiment of the invention;
FIG. 4 is a schematic diagram showing the steps of spray coating a silicone material to form a conformal coating in an embodiment of the present invention;
FIG. 5 is a graph showing the curing temperature versus curing time for an embodiment of the present invention;
FIG. 6 is a schematic view showing a structure of forming a waterproof coating layer in the embodiment of the invention; and
fig. 7 is a schematic diagram illustrating a step of forming a waterproof coating by spraying a nano material in an embodiment of the present invention.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. Furthermore, the drawings are merely schematic illustrations of the invention and are not necessarily drawn to scale.
The use of "first," "second," and similar terms in the detailed description is not intended to imply any order, quantity, or importance, but rather is used to distinguish one element from another. It should be noted that features of the embodiments of the invention and of the different embodiments may be combined with each other without conflict.
Fig. 1 shows main steps of a protection method for a circuit board in an embodiment, and referring to fig. 1, the protection method for a circuit board in the embodiment mainly includes: in step S110, a circuit board is provided, and at least one first surface of the circuit board is provided with electronic components; in step S120, forming a conformal coating on the first surface, so that the conformal coating at least covers the electronic component; in step S130, a waterproof coating is formed on the surface of the conformal coating, such that the waterproof coating at least covers the conformal coating.
The circuit board is provided with a Conformal Coating (Conformal Coating) at least Coating the electronic component, so that the circuit board has the protection effects of insulation, corrosion prevention, electric leakage prevention and the like; further, a Waterproof Coating (Waterprof Coating) Coating the conformal Coating plays a Waterproof protection role on the circuit board; the conformal coating and the waterproof coating both have good adhesive force and play a role in continuously and stably protecting the circuit board; and the manufactured circuit board assembly is compact in structure, and the cost is saved. Tests show that the circuit board assembly coated with the conformal coating and the waterproof coating can successfully pass the IPX 7-level waterproof test, and still keep large current passing when the circuit board assembly is immersed in water; the conformal coating arranged between the waterproof coating and the circuit board can also eliminate the capacitive reactance phenomenon formed by the pins of the circuit board carrying current meeting water when the circuit board assembly is immersed in water, and the reliability of the circuit board assembly is kept.
The following describes a method for protecting a circuit board in detail with reference to specific examples.
Fig. 2 shows the structure of the circuit board, and referring to fig. 2, a circuit board 21 provided with electronic components 22 is first provided. The Circuit Board 21 may be a Printed Circuit Board (PCB), and the Circuit Board 21 has two opposite surfaces, namely a first surface 21a and a second surface 21 b. The electronic components 22 are functional devices disposed on the circuit board 21, and the number, position, type, and function of the electronic components 22 are determined according to specific requirements, and are disposed on the surface of the circuit board 21 by using an existing method, which is not limited in the present invention. The key point of the invention is that based on a circuit board 21 formed with electronic components 22, the circuit board 21 and the electronic components 22 are protected from corrosion and water by spraying relevant coatings.
In the embodiment shown in fig. 2, the electronic component 22 is disposed on the first surface 21a of the circuit board 21; in other embodiments, the electronic component 22 may be disposed on the second surface 21b of the circuit board 21; alternatively, the electronic component 22 may be disposed on both the first surface 21a and the second surface 21b of the circuit board 21, without being limited to the illustration in fig. 2.
Fig. 3 shows a structure of forming the conformal coating, and referring to fig. 3, for the circuit board 21 having the electronic component 22 on the first surface 21a, the conformal coating 33 is formed on the first surface 21a of the circuit board 21, and the conformal coating 33 may cover the electronic component 22, or may uniformly and flatly cover the first surface 21a to cover the electronic component 22 and cover the exposed area of the first surface 21a to form a complete protective coating.
In one embodiment, the conformal coating 33 is formed using a spray of silicone material. Specifically, the conformal coating 33 may be formed by spraying a silicone-type conformal paint on the first surface 21a of the circuit board 21. The silica gel three-proofing paint has good performances of moisture resistance, dust resistance, corrosion resistance, aging resistance, good flexibility, strong adhesive force and the like, and plays a good role in protecting electronic components 22 on the circuit board 21.
Fig. 4 shows the main steps of forming a conformal coating by spraying a silicone material, and referring to fig. 4, the process of forming the conformal coating specifically comprises: step S120-2, conveying the circuit board to spraying equipment; step S120-4, spraying a silica gel material at least on the area of the first surface corresponding to the electronic component through spraying equipment; step S120-6, conveying the circuit board to a curing device; and step S120-8, curing the silica gel material through curing equipment to form a conformal coating.
Specifically, the circuit board is first placed on a fixture that is customized to the size and shape of the circuit board. Then, the clamp is placed on a connecting table rail in front of the spraying equipment, and the clamp with the circuit board is conveyed to the spraying equipment through rail conveying. And then, automatically spraying a silica gel material on the first surface of the circuit board in spraying equipment, wherein the silica gel material can be sprayed on the area of the first surface corresponding to the electronic component and can also be completely sprayed on the whole area of the first surface. The spraying device is preset with a spraying program, and the spraying program is called to control the stroke of a nozzle according to preset parameters such as spraying area, spraying thickness, spraying position and spraying speed so as to realize the spraying of the silica gel material. After the silica gel material is sprayed, the clamp with the circuit board is conveyed to a curing furnace, a curing program is called, and the silica gel material is cured through preset curing time and curing temperature to form the conformal coating. Subsequently, the spraying quality can be checked under an ultraviolet lamp, the flatness, the coverage range and the like of the conformal coating can be checked, and the conformal coating can be ensured to at least smoothly coat the electronic component on the first surface.
In the above process, the circuit board and the clamp can be placed and conveyed manually, or an automatic mechanical arm can be used.
And when the other surface of the circuit board is also provided with the electronic component, repeating the process, and spraying the silica gel material on the other surface to form the conformal coating.
In a specific example, when the silica gel material is sprayed, the spraying thickness of the silica gel material is controlled to be 50-200 μm, so that the thickness of the formed conformal coating is in the interval of 50-200 μm.
Fig. 5 shows a graph of curing temperature (celsius) and curing time (minute) in the embodiment, and referring to fig. 5, when curing the silicone material, one set may be selected from the sets of curing temperature and curing time shown in fig. 5. For example, the sprayed silica gel material is cured under the curing conditions that the curing temperature is 100 ℃ and the curing time is 20 min; for another example, the sprayed silica gel material is cured by adopting the curing conditions that the curing temperature is 115 ℃ and the curing time is 6 min; and so on.
After the conformal coating is formed, a waterproof coating is further formed on the surface of the conformal coating.
Fig. 6 shows a structure of forming the waterproof coating, and referring to fig. 6, after the conformal coating 33 of the electronic component 22 covering at least the first surface 21a of the circuit board 21 is formed, the waterproof coating 44 is continuously formed, and the waterproof coating 44 may be formed in a region of the first surface 21a corresponding to the electronic component 22, or may be formed entirely in the entire region of the first surface 21a, and uniformly and flatly covers the conformal coating 33, so as to achieve a waterproof protection effect.
In one embodiment, the water repellent coating 44 is formed using nano-material spraying. The nano material has good waterproofness and adhesiveness, and can stably and continuously play a role in waterproof protection.
Fig. 7 shows the main steps of forming the waterproof coating by spraying the nano material, and referring to fig. 7, the process of forming the waterproof coating specifically includes: step S130-2, conveying the circuit board to a drying device; step S130-4, drying the circuit board through drying equipment; step S130-6, conveying the circuit board to spraying equipment; and S130-8, spraying the nano material at least on the area of the first surface corresponding to the conformal coating through the spraying equipment to form the waterproof coating.
Specifically, the circuit board having the conformal coating formed on the first surface thereof may be first placed on a jig, which is customized according to the size and shape of the circuit board. And then, placing the clamp with the circuit board in a drying box for drying, wherein the drying requirement is as follows: the flow rate is controlled at 15m3/h～18m3In the interval of/h, the relative humidity is controlled within the interval of less than 3 percent RH, and the temperature is controlled within the interval of 20-30 ℃. And after drying, conveying the clamp with the circuit board to spraying equipment. The spraying device is preset with a spraying program, the spraying program is called, and the nanometer material is sprayed according to preset parameters such as spraying thickness, spraying position, spraying speed and the like. Wherein, the spraying temperature can be controlled within the interval of 45 +/-2 ℃. After the nano material is sprayed to form the waterproof coating, the spraying quality of the waterproof coating can be checked through testing equipment such as a coating thickness analyzer, a contact angle tester and the like, so that the waterproof coating can be uniformly and smoothly coated with the conformal coating.
In the process of forming the waterproof coating, the circuit board and the clamp can be placed and conveyed manually or by an automatic mechanical arm. And when the other surface of the circuit board is also provided with the electronic component, continuously spraying the other surface to form a waterproof coating.
Further, in a specific example, when the nano material is sprayed, the spraying thickness of the nano material is controlled to be 1000nm, so that the thickness of the formed waterproof coating is 1000 nm.
Through the embodiment, the conformal coating and the waterproof coating at least coating the electronic component are formed on the surface of the circuit board provided with the electronic component, so that the circuit board is continuously and stably protected from corrosion and water.
The embodiment of the invention also provides a circuit board assembly which is manufactured and formed by the circuit board protection method described in any embodiment.
Referring to fig. 6, in an embodiment, the circuit board assembly specifically includes: a circuit board 21, at least one first surface 21a of the circuit board 21 is provided with an electronic component 22; a conformal coating 33 formed on the first surface 21a, the conformal coating 33 at least covering the electronic component 22; and a waterproof coating 44 formed on the surface of the conformal coating 33, wherein the waterproof coating 44 at least covers the conformal coating 33.
Further, in some embodiments, the material of the conformal coating 33 is specifically a silicone material and the material of the water resistant coating 44 is specifically a nanomaterial.
In some embodiments, the conformal coating 33 is specifically 50 μm to 200 μm thick and the water repellent coating 44 is specifically 1000nm thick.
In some embodiments, the conformal coating 33 uniformly and evenly covers the first surface 21a, and the water repellant coating 44 uniformly and evenly coats the conformal coating 33.
In some embodiments, the circuit board assembly may also have the features described in any of the method embodiments above, and the description is not repeated here.
In summary, according to the protection method for the circuit board and the circuit board assembly provided by the embodiment of the invention, the conformal coating at least covering the electronic component is arranged on the circuit board, so that the circuit board is protected from insulation, corrosion, electric leakage and the like; further, the circuit board is protected from water by a waterproof coating which coats the conformal coating; the conformal coating and the waterproof coating both have good adhesive force and can continuously and stably protect the circuit board; and the manufactured circuit board assembly is compact in structure, and the cost is saved. Tests show that the circuit board assembly coated with the conformal coating and the waterproof coating can successfully pass the IPX 7-level waterproof test, and still keep large current passing when the circuit board assembly is immersed in water; the conformal coating arranged between the waterproof coating and the circuit board can also eliminate the capacitive reactance phenomenon formed by the pins of the circuit board carrying current meeting water when the circuit board assembly is immersed in water, and the reliability of the circuit board assembly is kept.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (12)
1. A method for protecting a circuit board, comprising the steps of:
providing a circuit board, wherein at least one first surface of the circuit board is provided with an electronic component;
forming a conformal coating on the first surface such that the conformal coating at least encapsulates the electronic component; and
and forming a waterproof coating on the surface of the conformal coating, so that the waterproof coating at least covers the conformal coating.
2. The method of protecting a circuit board of claim 1, wherein the conformal coating is formed by spraying a silicone material.
3. The method of protecting a circuit board of claim 2, wherein said step of spray forming said conformal coating with a silicone material comprises:
conveying the circuit board to spraying equipment;
spraying the silica gel material at least on the area, corresponding to the electronic component, of the first surface through the spraying equipment;
conveying the circuit board to a curing device; and
and curing the silica gel material by the curing equipment to form the conformal coating.
4. The method for protecting a circuit board according to claim 3, wherein a spraying thickness of the silicone material is controlled to be 50 μm to 200 μm when the silicone material is sprayed.
5. The method for protecting a circuit board according to claim 1, wherein the waterproof coating layer is formed by spraying a nano material.
6. The method for protecting a circuit board according to claim 5, wherein the step of forming the waterproof coating layer by spraying a nanomaterial includes:
conveying the circuit board to a drying device;
drying the circuit board by the drying device;
conveying the circuit board to spraying equipment; and
and spraying the nano material at least on the area of the first surface corresponding to the conformal coating by the spraying equipment to form the waterproof coating.
7. The method for protecting a circuit board according to claim 6, wherein a thickness of the nano material sprayed is controlled to be 1000nm when the nano material is sprayed.
8. The method for protecting a circuit board according to any one of claims 1 to 7, wherein the conformal coating layer is formed so as to uniformly and evenly cover the first surface; and
and when the waterproof coating is formed, the conformal coating is uniformly and smoothly coated by the waterproof coating.
9. A circuit board assembly, comprising:
the circuit board is provided with electronic components on at least one first surface;
a conformal coating formed on the first surface, the conformal coating at least covering the electronic component; and
and the waterproof coating is formed on the surface of the conformal coating and at least coats the conformal coating.
10. The circuit board assembly of claim 9, wherein the material of the conformal coating is a silicone material and the material of the water resistant coating is a nanomaterial.
11. The circuit board assembly of claim 9, wherein the conformal coating has a thickness of 50 μ ι η to 200 μ ι η and the water repellent coating has a thickness of 1000 nm.
12. The circuit board assembly of any one of claims 9 to 11, wherein the conformal coating uniformly and evenly covers the first surface, and the water repellant coating uniformly and evenly coats the conformal coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945033.9A CN114173487A (en) | 2020-09-10 | 2020-09-10 | Circuit board protection method and circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945033.9A CN114173487A (en) | 2020-09-10 | 2020-09-10 | Circuit board protection method and circuit board assembly |
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| Publication Number | Publication Date |
|---|---|
| CN114173487A true CN114173487A (en) | 2022-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010945033.9A Pending CN114173487A (en) | 2020-09-10 | 2020-09-10 | Circuit board protection method and circuit board assembly |
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| Country | Link |
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| CN (1) | CN114173487A (en) |
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| CN103200787A (en) * | 2012-01-10 | 2013-07-10 | Hzo股份有限公司 | Systems for assembling electronic devices with internal moisture-resistant coatings |
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| CN205933724U (en) * | 2016-08-03 | 2017-02-08 | 深圳瑞趣纳米新材料有限公司 | Super -hydrophobicity structure electronic circuit board |
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| US20170367193A1 (en) * | 2016-06-17 | 2017-12-21 | Nanoshield Technology Co., Ltd. | Method for coating a device and devices having nanofilm thereon |
| CN108879000A (en) * | 2018-06-29 | 2018-11-23 | 努比亚技术有限公司 | A kind of battery protecting plate, battery and mobile terminal |
| CN110113892A (en) * | 2019-06-04 | 2019-08-09 | 山东康威通信技术股份有限公司 | A kind of MULTILAYER COMPOSITE protective layer and method applied to PCB |
| CN210518995U (en) * | 2019-07-29 | 2020-05-12 | 陈松宗 | Waterproof PCB circuit board |
-
2020
- 2020-09-10 CN CN202010945033.9A patent/CN114173487A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200787A (en) * | 2012-01-10 | 2013-07-10 | Hzo股份有限公司 | Systems for assembling electronic devices with internal moisture-resistant coatings |
| CN106686932A (en) * | 2015-11-05 | 2017-05-17 | 精能医学股份有限公司 | Waterproof structure of implantable electronic device |
| US20170367193A1 (en) * | 2016-06-17 | 2017-12-21 | Nanoshield Technology Co., Ltd. | Method for coating a device and devices having nanofilm thereon |
| CN106255309A (en) * | 2016-08-03 | 2016-12-21 | 深圳瑞趣纳米新材料有限公司 | A kind of preparation method of the circuit board with super-hydrophobic waterproof nano coating |
| CN205933724U (en) * | 2016-08-03 | 2017-02-08 | 深圳瑞趣纳米新材料有限公司 | Super -hydrophobicity structure electronic circuit board |
| CN108879000A (en) * | 2018-06-29 | 2018-11-23 | 努比亚技术有限公司 | A kind of battery protecting plate, battery and mobile terminal |
| CN110113892A (en) * | 2019-06-04 | 2019-08-09 | 山东康威通信技术股份有限公司 | A kind of MULTILAYER COMPOSITE protective layer and method applied to PCB |
| CN210518995U (en) * | 2019-07-29 | 2020-05-12 | 陈松宗 | Waterproof PCB circuit board |
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