CN114171478A - Heat dissipation structure for POP (package on package) and construction method thereof - Google Patents

Heat dissipation structure for POP (package on package) and construction method thereof Download PDF

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Publication number
CN114171478A
CN114171478A CN202111495590.6A CN202111495590A CN114171478A CN 114171478 A CN114171478 A CN 114171478A CN 202111495590 A CN202111495590 A CN 202111495590A CN 114171478 A CN114171478 A CN 114171478A
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CN
China
Prior art keywords
substrate
heat dissipation
chip
dissipation structure
heat
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Pending
Application number
CN202111495590.6A
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Chinese (zh)
Inventor
周云燕
陈海英
陈钏
苏梅英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Center for Advanced Packaging Co Ltd
Shanghai Xianfang Semiconductor Co Ltd
Original Assignee
National Center for Advanced Packaging Co Ltd
Shanghai Xianfang Semiconductor Co Ltd
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Application filed by National Center for Advanced Packaging Co Ltd, Shanghai Xianfang Semiconductor Co Ltd filed Critical National Center for Advanced Packaging Co Ltd
Priority to CN202111495590.6A priority Critical patent/CN114171478A/en
Publication of CN114171478A publication Critical patent/CN114171478A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to the technical field of semiconductor packaging, and provides a heat dissipation structure for POP packaging and a construction method thereof. The heat dissipation structure comprises a first substrate and a second substrate; a first chip arranged on the first substrate; a second chip arranged on the second substrate; and a micro flow channel connected with the first and second chips and used for guiding out the heat generated by the operation of the first and second chips.

Description

Heat dissipation structure for POP (package on package) and construction method thereof
Technical Field
The present invention relates generally to the field of semiconductor packaging technology. In particular, the present invention relates to a heat dissipation structure for POP packages and a method of constructing the same.
Background
A Package On Package (POP) packaging process is an important one for a semiconductor System In a Package (SIP).
The conventional POP package structure generally includes an upper package and a lower package, which respectively include a first chip and a second chip, and the upper package and the lower package are supported and interconnected by a copper core ball.
However, in the conventional POP package structure, heat generated by the second chip in the lower package body during operation can only be dissipated through the lower substrate and natural convection, but the lower substrate has a low thermal conductivity, and the effect of natural convection is greatly reduced by the upper package body, so that the second chip has an undesirable heat dissipation condition and is easily failed due to the fact that the temperature of the chip exceeds the allowable temperature during operation. In addition, although the first chip in the upper package may dissipate heat through an external heat dissipation device such as a heat dissipation cover, the conventional heat dissipation device has a disadvantage in heat dissipation effect as the scale and power of the first chip are continuously increased.
Disclosure of Invention
To at least partially solve the above problems in the prior art, the present invention provides a heat dissipation structure for POP package, comprising:
a first substrate and a second substrate;
a first chip arranged on the first substrate;
a second chip arranged on the second substrate; and
micro flow channels connected with the first and second chips and used for guiding out the heat generated by the operation of the first and second chips.
In one embodiment of the invention, the heat dissipation structure for the POP package comprises one or more first chips and/or one or more second chips.
In one embodiment of the invention, the heat dissipation structure for POP packaging comprises a micro pump and a heat exchanger, wherein the micro pump and the heat exchanger are connected with the micro flow channel through pipelines.
In one embodiment of the invention, it is provided that the first substrate comprises:
a chamber housing the microchannel;
a heat conduction hole connecting the first chip and the micro flow channel; and
a first through hole for passing the conduit.
In one embodiment of the invention, the heat dissipation structure for the POP package comprises heat-conducting glue, and the heat-conducting glue is arranged at the connection part of the micro flow channel, the first substrate and the second chip.
In one embodiment of the invention, the heat dissipation structure for POP package comprises a heat dissipation cover, the heat dissipation cover is provided with a second through hole, the second through hole is used for the pipeline to pass through, the first surface of the first chip is connected with the micro-channel through the heat conduction hole, the second surface of the first chip is connected with the heat dissipation cover, and the heat conduction glue is further arranged at the connection position of the first chip and the heat dissipation cover.
In one embodiment of the invention, the heat dissipation structure for the POP package comprises a resistance container arranged on the first and second substrates.
In one embodiment of the invention, the heat dissipation structure for the POP package comprises copper core balls, and the copper core balls are used for connecting the first substrate and the second substrate.
In one embodiment of the invention, the heat dissipation structure for the POP package comprises
A ball grid array connecting the second substrate with a printed circuit board; and
a printed circuit board on which the micro pump and the heat exchanger are disposed.
The invention also provides a method for constructing the heat dissipation structure for the POP package, which comprises the following steps:
constructing a cavity, a heat conduction hole and a first through hole on a first substrate, and arranging a first capacitance resistance device, a first chip and a heat dissipation cover on the first substrate;
arranging a second resistance-capacitance device, a second chip and a copper core ball on a second substrate;
disposing a microchannel on the second chip;
disposing the first substrate on the second substrate, wherein the heat-conducting hole is connected to the micro flow channel;
arranging a ball grid array under the second substrate;
arranging a micro pump and a heat exchanger on a printed circuit board;
connecting the ball grid array and the printed circuit board; and
tubing is arranged to connect the micro-pump and the heat exchanger to the micro flow channel.
The invention has at least the following beneficial effects: the invention derives the heat generated by the first chip and the second chip during working by arranging the micro-channel in the POP packaging structure, the micro-channel and the first chip and the second chip can well solve the heat dissipation problem when the first chip and the second chip are high-power chips, and the heat dissipation efficiency and the heat dissipation uniformity of the first chip and the second chip can be ensured.
Drawings
To further clarify the advantages and features that may be present in various embodiments of the present invention, a more particular description of various embodiments of the invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.
Fig. 1 shows a schematic diagram of a heat dissipation structure for a POP package in an embodiment of the invention.
Fig. 2 is a schematic flow chart illustrating the process of constructing the heat dissipation structure according to an embodiment of the present invention.
Fig. 3-9 are schematic diagrams illustrating a process of constructing the heat dissipation structure according to an embodiment of the present invention.
Detailed Description
It should be noted that the components in the figures may be exaggerated and not necessarily to scale for illustrative purposes. In the figures, identical or functionally identical components are provided with the same reference symbols.
In the present invention, "disposed on …", "disposed over …" and "disposed over …" do not exclude the presence of an intermediate therebetween, unless otherwise specified. Further, "disposed on or above …" merely indicates the relative positional relationship between two components, and may also be converted to "disposed below or below …" and vice versa in certain cases, such as after reversing the product direction.
In the present invention, the embodiments are only intended to illustrate the aspects of the present invention, and should not be construed as limiting.
In the present invention, the terms "a" and "an" do not exclude the presence of a plurality of elements, unless otherwise specified.
It is further noted herein that in embodiments of the present invention, only a portion of the components or assemblies may be shown for clarity and simplicity, but those of ordinary skill in the art will appreciate that, given the teachings of the present invention, required components or assemblies may be added as needed in a particular scenario. Furthermore, features from different embodiments of the invention may be combined with each other, unless otherwise indicated. For example, a feature of the second embodiment may be substituted for a corresponding or functionally equivalent or similar feature of the first embodiment, and the resulting embodiments are likewise within the scope of the disclosure or recitation of the present application.
It is also noted herein that, within the scope of the present invention, the terms "same", "equal", and the like do not mean that the two values are absolutely equal, but allow some reasonable error, that is, the terms also encompass "substantially the same", "substantially equal". By analogy, in the present invention, the terms "perpendicular", "parallel" and the like in the directions of the tables also cover the meanings of "substantially perpendicular", "substantially parallel".
The numbering of the steps of the methods of the present invention does not limit the order of execution of the steps of the methods. Unless specifically stated, the method steps may be performed in a different order.
The invention is further elucidated with reference to the drawings in conjunction with the detailed description.
Fig. 1 shows a schematic diagram of a heat dissipation structure for POP package in an embodiment of the present invention, wherein the heat dissipation structure is described by taking a two-layer substrate as an example, however, it should be understood by those skilled in the art that the substrate may be two or more layers. As shown in fig. 1, the structure may include a first substrate 101, a second substrate 102, a first chip 103, a second chip 104, a micro channel 105, a micro pump 106, and a heat exchanger 107.
The first chip 103 is disposed on the first substrate 101, the second chip 102 is disposed on the second substrate 102, and the micro channel 105 may be connected to the first chip 103 and the second chip 104 and conduct heat generated by the operation of the first chip 103 and the second chip 104. The number of the first chip 103 and/or the second chip 104 may be one or more. The material of the micro flow channel can be copper, aluminum or other metal with high thermal conductivity.
The micro pump 106 and the heat exchanger 107 may be connected to the micro flow channel 105 through a pipe. The conduits may include an inlet pipe 108 and an outlet pipe 109.
Further, the first substrate 101 may include a cavity 110, a heat conduction hole 111, and a first through hole 112. The chamber 110 may accommodate the micro flow channel 105, the heat-conducting hole 111 may connect the first chip 103 with the micro flow channel 105, and the first through hole 112 may facilitate passage of the channel.
In the embodiment of the present invention, the micro flow channel 105 may be in contact with the upper surface of the second chip 104 to conduct out the heat generated by the second chip 104 during operation, and the heat generated by the first chip 103 during operation may also be conducted into the micro flow channel 105 through the heat conduction hole 111. The first through-hole 112 may guide the water outlet and inlet of the micro flow channel 105 to the outside of the package and is connected with the micro pump 106 and the heat exchanger 107. When the system is in operation, the micro pump 106 can circulate the liquid in the micro channel 105 continuously to bring the heat generated by the operation of the first chip 103 and the second chip 104 out of the package, and to carry the heat away through the heat exchanger 107. The technical scheme can well solve the heat dissipation problem of the high-power chip in the lower-layer packaging body in the traditional POP packaging structure, and the micro-channel 105 can be simultaneously connected with the first chip 103 and the second chip 104 in the embodiment of the invention, so that the heat dissipation efficiency and the heat dissipation uniformity of the high-power chip in the upper-layer packaging body and the lower-layer packaging body can be simultaneously ensured.
In addition, for the occasion of the first chip 103 requiring further heat dissipation, the heat dissipation structure may further include a heat dissipation cover 113, where the heat dissipation cover 113 has a second through hole, and the second through hole is used for the passage of the duct. Wherein the first side of the first chip 103 can be connected to the micro channel 105 through the thermal via 111, and the second side of the first chip 103 is connected to the heat sink 113 to further dissipate heat generated by the operation of the first chip 103.
The heat dissipation structure may include a thermal conductive paste 114, wherein the thermal conductive paste 114 may be disposed at a connection of the micro channel 105 and the first substrate 101 and the second chip 102, and the thermal conductive paste 114 may be disposed at a connection of the first chip 103 and the heat dissipation cover 113.
The heat dissipation structure may include a capacitance resistance device 115, copper core balls 116, a Ball Grid Array (BGA)117, and a printed circuit board 118. The capacitance resistance device 115 may be disposed on the first substrate 101 and the second substrate 102. The copper core balls 116 may connect the first substrate 101 and the second substrate 102. The ball grid array 117 may connect the second substrate 102 with the printed circuit board 118, and the micro pump 106 and the heat exchanger 107 may be disposed on the printed circuit board 118.
Fig. 2 shows a flow diagram of a method of constructing the heat dissipation structure in an embodiment of the invention. As shown in fig. 2, the method may include the following steps:
step 100: as shown in fig. 3, a first substrate 301 and a second substrate 302 are configured.
In this step, a cavity 302, a heat conduction hole 303, and a first through hole 304 may be configured on a first substrate 301, and a first resistance-capacitance element 305, a first chip 306, and a heat dissipation cover 307 are arranged on the first substrate 301; and a second capacitance resistance device 309, a second chip 310, and copper core balls 311 may be disposed on the second substrate 308.
Step 200: as shown in fig. 4, a micro flow channel 404 is disposed on the second chip 402.
In this step, micro flow channels 404 may be arranged on the second chip 403 on the second substrate 402 by a thermally conductive paste 401. In addition, the micro flow channels 404 may be disposed by welding.
Step 300: as shown in fig. 5, a first substrate 502 is disposed on a second substrate 501.
In this step, the micro flow channels may be brought into contact with the first substrate 502 by a heat conductive paste, and the heat conductive holes of the first substrate 502 are connected to the micro flow channels.
Step 400: as shown in fig. 6, ball mounting is performed on the lower package, that is, a ball grid array 602 is disposed under the second substrate 601.
Step 500: as shown in fig. 7, a micro pump 702 and a heat exchanger 703 are disposed on a printed circuit board 701.
Step 600: as shown in fig. 8, a POP package structure is soldered on the printed circuit board, wherein the ball grid array and the printed circuit board 801 are connected.
Step 700: as shown in fig. 9, pipes are arranged, including an inlet pipe 901 and an outlet pipe 902, so as to connect the micro pump 903 and the heat exchanger 904 with the micro flow channel.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention disclosed herein should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims (10)

1. A heat dissipation structure for POP packaging, comprising:
a first substrate and a second substrate;
a first chip arranged on the first substrate;
a second chip arranged on the second substrate; and
micro flow channels connected with the first and second chips and used for guiding out the heat generated by the operation of the first and second chips.
2. The heat dissipation structure for the POP package according to claim 1, wherein the heat dissipation structure comprises one or more first chips and/or one or more second chips.
3. The heat dissipation structure for a POP package of claim 1, comprising a micro pump and a heat exchanger, the micro pump and the heat exchanger being connected with the micro flow channel through a pipe.
4. The heat dissipation structure for a POP package of claim 2, wherein the first substrate comprises:
a chamber housing the microchannel;
a heat conduction hole connecting the first chip and the micro flow channel; and
a first through hole for passing the conduit.
5. The POP package heat dissipation structure of claim 4, comprising a thermal conductive adhesive disposed at a connection of the micro channel and the first and second substrates.
6. The heat dissipation structure for POP package of claim 5, comprising a heat dissipation cover having a second through hole for the passage of the pipe, wherein the first side of the first chip is connected with the micro flow channel through the heat conduction hole, and the second side of the first chip is connected with the heat dissipation cover, wherein the heat conduction glue is further disposed at the connection of the first chip and the heat dissipation cover.
7. The heat dissipation structure for a POP package of claim 1, comprising a resistance capacitance element disposed on the first and second substrates.
8. The heat dissipation structure for a POP package of claim 1, comprising copper core balls connecting the first substrate with the second substrate.
9. The heat dissipation structure for a POP package of claim 3, comprising
A ball grid array connecting the second substrate with a printed circuit board; and
a printed circuit board on which the micro pump and the heat exchanger are disposed.
10. A method of constructing a heat dissipation structure for a POP package as recited in any of claims 1-9, comprising the steps of:
constructing a cavity, a heat conduction hole and a first through hole on a first substrate, and arranging a first capacitance resistance device, a first chip and a heat dissipation cover on the first substrate;
arranging a second resistance-capacitance device, a second chip and a copper core ball on a second substrate;
disposing a microchannel on the second chip;
disposing the first substrate on the second substrate, wherein the heat-conducting hole is connected to the micro flow channel;
arranging a ball grid array under the second substrate;
arranging a micro pump and a heat exchanger on a printed circuit board;
connecting the ball grid array and the printed circuit board; and
tubing is arranged to connect the micro-pump and the heat exchanger to the micro flow channel.
CN202111495590.6A 2021-12-08 2021-12-08 Heat dissipation structure for POP (package on package) and construction method thereof Pending CN114171478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111495590.6A CN114171478A (en) 2021-12-08 2021-12-08 Heat dissipation structure for POP (package on package) and construction method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111495590.6A CN114171478A (en) 2021-12-08 2021-12-08 Heat dissipation structure for POP (package on package) and construction method thereof

Publications (1)

Publication Number Publication Date
CN114171478A true CN114171478A (en) 2022-03-11

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ID=80484695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111495590.6A Pending CN114171478A (en) 2021-12-08 2021-12-08 Heat dissipation structure for POP (package on package) and construction method thereof

Country Status (1)

Country Link
CN (1) CN114171478A (en)

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