CN114156680A - TYPEC interface, processing method thereof and electronic instrument - Google Patents

TYPEC interface, processing method thereof and electronic instrument Download PDF

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Publication number
CN114156680A
CN114156680A CN202110183260.7A CN202110183260A CN114156680A CN 114156680 A CN114156680 A CN 114156680A CN 202110183260 A CN202110183260 A CN 202110183260A CN 114156680 A CN114156680 A CN 114156680A
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China
Prior art keywords
terminal
gnd
sheet
positive plate
positive
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Granted
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CN202110183260.7A
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Chinese (zh)
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CN114156680B (en
Inventor
刘继瑞
柏立春
吴福飞
冯艳
林成
赵广展
李丐腾
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Shanghai Flyco Electrical Appliance Co Ltd
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Shanghai Flyco Electrical Appliance Co Ltd
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Priority to CN202110183260.7A priority Critical patent/CN114156680B/en
Publication of CN114156680A publication Critical patent/CN114156680A/en
Application granted granted Critical
Publication of CN114156680B publication Critical patent/CN114156680B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64—Means for preventing incorrect coupling
    • H01R13/641—Means for preventing incorrect coupling by indicating incorrect coupling; by indicating correct or full engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth pin, blade or socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6616—Structural association with built-in electrical component with built-in single component with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

The invention provides a TYPEC interface, a processing method thereof and an electronic device, relating to the technical field of charging interfaces. Through with chip resistor snap-on between GND terminal and CC terminal, PD protocol adapter output can be opened to TYPEC interface self, need not avoid complicated lead wire with the help of the PCB base plate, simple structure to, TYPEC chip structure occupation space is little, and the preparation process is simple, has improved machining efficiency, has reduced manufacturing cost.

Description

TYPEC interface, processing method thereof and electronic instrument
Technical Field
The invention relates to the technical field of charging interfaces, in particular to a TYPEC interface, a processing method thereof and an electronic device.
Background
With the advance of technology, USB (Universal Serial Bus) interfaces have been advanced into various electrical appliance fields. At present, the USB interface has three interfaces with different appearances, namely TYPE-A, TYPE-B and TYPE-C, wherein TYPE-C is an interface TYPE that can be applied to both PC (master device) and external device (slave device, such as mobile phone), and it has a much smaller volume than both TYPE-a and TYPE-B, and is the latest USB interface appearance standard.
When the TYPE-C socket is used as an output port of a PD protocol (Power Delivery protocol) adapter, the default is no voltage output, the PD protocol adapter cannot be opened by itself, a 5.1K Ω (K Ω is kilo-ohm, in terms of chip resistance unit) chip resistor must be welded to a GND terminal (GND terminal is a terminal for connection confirmation) respectively at two CC terminals (CC terminals are terminals for connection confirmation), and the PD protocol adapter can output a voltage of 5V (V is volt, in terms of voltage unit). The conventional TYPE-C socket needing to be switched is characterized in that the TYPE-C socket is welded on a PCB (printed circuit board), and then is welded to other places from a PCB substrate lead, and then 5.1 Komega chip resistors are respectively connected to GND terminals through two CC terminals so as to open a PD protocol adapter, so that the procedure is complex, the cost is high, and the size is large.
Disclosure of Invention
The invention aims to provide a TYPE AC (TYPE-embedded power electronic) interface, a processing method thereof and an electronic device, so as to solve the technical problem that the TYPE-C socket in the prior art is complex in structure.
The TYPEC interface comprises a shell and a TYPEC chip structure arranged in the shell, wherein the TYPEC chip structure comprises a GND terminal, a CC terminal, a positive terminal and a chip resistor, the GND terminal is provided with a GND lead part, the positive terminal is provided with a positive lead part, and the chip resistor is fixed between the GND terminal and the CC terminal and is respectively in contact connection with the GND terminal and the CC terminal.
Optionally, the CC terminal includes a CC terminal and a CC terminal, the CC terminal and the CC terminal are arranged in parallel and both extend along the axial direction of the housing, a first positive plate is arranged on one side of the CC terminal away from the CC terminal, a second positive plate is arranged on one side of the CC terminal away from the CC terminal, a first GND plate is arranged on one side of the first positive plate away from the CC terminal, a second GND plate is arranged on one side of the second positive plate away from the CC terminal, the first positive plate is communicated with the second positive plate, and the first GND plate is communicated with the second GND plate;
the positive electrode lead portion is arranged on the first positive electrode sheet, and the GND lead portion is arranged on the second GND sheet.
Optionally, the width of the first positive plate is greater than the width of the second positive plate, and the width of the second GND plate is greater than the width of the first GND plate.
Optionally, the position of the first positive plate where the positive lead portion is provided and the first GND plate are arranged in a staggered manner in the height direction;
the second GND sheet is arranged at a position where the GND lead part is arranged and the second positive plate are arranged in a staggered manner in the height direction.
Optionally, the first positive plate and the second positive plate are connected through a third positive plate at an end far away from the opening end of the housing, and the first positive plate, the third positive plate and the second positive plate are integrally constructed;
the first GND piece and the second GND piece are connected through a third GND piece at ends far away from the opening end of the shell, and the first GND piece, the third GND piece and the second GND piece are of an integral structure.
Optionally, the chip resistor includes a first resistor and a second resistor, the first resistor is connected between the CC terminal and any one of the first GND piece, the third GND piece and the second GND piece, and the second resistor is connected between the CC terminal and any one of the first GND piece, the third GND piece and the second GND piece.
Optionally, at the connection position of the chip resistor, the GND terminal and the positive terminal are arranged in a staggered manner in the height direction, and the CC terminal and the positive terminal are arranged in a staggered manner in the height direction.
Optionally, the chip resistor is connected to the GND terminal and the CC terminal by welding.
The invention provides a processing method of a TYPEC interface, which comprises the following steps:
assembling the TYPEC chip structure into a housing; the first GND sheet, the first positive plate, the CC one terminal, the CC two terminal, the second positive plate and the second GND sheet of the TYPEC chip structure are sequentially arranged, the two adjacent first GND sheet, the first positive plate, the CC one terminal, the CC two terminal, the second positive plate and the second GND sheet are sequentially connected into a whole through a removable connecting part, the first positive plate and one end, far away from the opening end of the shell, of the second positive plate are connected through a third positive plate, and the first GND sheet and one end, far away from the opening end of the shell, of the second GND sheet are connected through a third GND sheet;
welding a chip resistor: welding a first resistor between the CC terminal and the first GND sheet, the second GND sheet or the third GND sheet, and welding a second resistor between the CC terminal and the first GND sheet, the second GND sheet or the third GND sheet;
removing the connecting part: and removing the connecting part in the TYPEC chip structure, and enabling the first positive plate, the first CC terminal, the second positive plate and the second GND plate to be arranged at intervals between two adjacent plates in sequence.
The electronic device provided by the invention comprises the TYPEC interface provided by the invention.
The TYPEC interface comprises a shell and a TYPEC chip structure arranged in the shell, wherein the TYPEC chip structure comprises a GND terminal, a CC terminal, a positive terminal and a chip resistor, and the chip resistor is fixed between the GND terminal and the CC terminal and is respectively in contact connection with the GND terminal and the CC terminal. Through with chip resistor snap-on between GND terminal (GND terminal is equivalent to the negative terminal) and CC terminal (CC terminal also is the terminal that is used for connecting the affirmation), PD protocol adapter output can be opened to TYPEC interface self, need not be with the help of the PCB base plate, has avoided complicated lead wire, simple structure to, TYPEC chip structure occupation space is little, and preparation process is simple, has improved machining efficiency, has reduced manufacturing cost.
The processing method of the TYPEC interface provided by the invention comprises the following steps: assembling the TYPEC chip structure into a housing; the first GND sheet, the first positive sheet, the CC one terminal, the CC two terminals, the second positive sheet and the second GND sheet of the TYPEC chip structure are sequentially arranged, adjacent two of the first GND sheet, the first positive sheet, the CC one terminal, the CC two terminals, the second positive sheet and the second GND sheet are connected into a whole through a removable connecting part, the first positive sheet and one end, far away from the opening end of the shell, of the second positive sheet are connected through a third positive sheet, and the first GND sheet and one end, far away from the opening end of the shell, of the second GND sheet are connected through the third GND sheet; welding a chip resistor: welding a first resistor between the CC terminal and the first GND sheet, the second GND sheet or the third GND sheet, and welding a second resistor between the CC terminal and the first GND sheet, the second GND sheet or the third GND sheet; removing the connecting part: and removing the connecting part in the TYPEC chip structure, and arranging the adjacent two of the first positive plate, the CC terminal, the second positive plate and the second GND plate at intervals. Through with chip resistor snap-on between GND terminal (GND terminal is equivalent to the negative terminal) and CC terminal, PD protocol adapter output can be opened to TYPEC interface self, need not avoid complicated lead wire with the help of the PCB base plate, simple structure has improved machining efficiency, has reduced manufacturing cost.
The electronic device provided by the invention comprises the TYPEC interface provided by the invention, and has the same beneficial effects as the TYPEC interface provided by the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic top view of one form of TYPE-C linker provided by an embodiment of the present invention;
FIG. 2 is a right side view of FIG. 1;
FIG. 3 is a front view of FIG. 1;
FIG. 4 is a schematic diagram of a TYPE-C chip structure according to an embodiment of the present invention;
FIG. 5 is a schematic view of FIG. 4 prior to installation;
FIG. 6 is a schematic top view of another form of TYPE-C linker provided by an embodiment of the present invention;
FIG. 7 is a schematic diagram of another structure of a TYPE-C chip structure according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view B-B of FIG. 7;
FIG. 9 is a schematic diagram of the chip resistor of FIG. 7 without the chip resistor;
fig. 10 is a sectional view a-a of fig. 9.
Icon: 1-a housing; 2-a positive terminal; a 3-GND terminal; 31-first GND sheet; 32-a third GND sheet; 33-a second GND sheet; 4-a first positive plate; 5-a third positive plate; 6-a second positive plate; 7-CC terminal; 8-CC one terminal; 9-CC two terminals; 10-patch resistance; 11-a first resistance; 12-a second resistance; 13-a connecting part; 14-positive lead part; 15-GND lead part.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1 to 10, the present embodiment provides a TYPEC interface including a case 1 and a TYPEC chip structure disposed in the case 1, the TYPEC chip structure includes a GND terminal 3, a CC terminal 7, a positive terminal 2, and a chip resistor 10, the positive terminal 2 is connected to a positive lead portion 14, the GND terminal 3 is provided with a GND lead portion 15, and the chip resistor 10 is fixed between the GND terminal 3 and the CC terminal 7 and is respectively connected to the GND terminal 3 and the CC terminal 7 in a contact manner.
The GND terminal 3, the CC terminal 7 and the positive terminal 2 are conventional terms of a TYPE-C socket, and are also called pins, the GND terminal 3 is equivalent to a negative terminal for connecting to a negative terminal of a power supply, the CC terminal 7 is used for determining the insertion direction of a device, i.e., a terminal for confirming whether the device is connected, and the positive terminal 2 is used for connecting to a positive terminal of the power supply. The TYPE-C socket of the embodiment can be formed by carrying out secondary encapsulation injection molding on the TYPE chip structure and the shell 1.
This embodiment TYPEC chip architecture, through with chip resistance 10 snap-on between GND terminal 3 and CC terminal 7, PD protocol adapter output can be opened to TYPEC interface self, need not avoid complicated lead wire with the help of the PCB base plate, simple structure to, TYPEC chip architecture occupation space is little, and the preparation process is simple, provides machining efficiency, has reduced manufacturing cost.
Specifically, the CC terminal 7 includes a CC first terminal 8 and a CC second terminal 9, the CC first terminal 8 and the CC second terminal 9 are arranged in parallel and both extend along the axial direction (the up-down direction shown in fig. 1) of the housing 1, a first positive plate 4 is arranged on one side of the CC first terminal 8 away from the CC second terminal 9, a second positive plate 6 is arranged on one side of the CC second terminal 9 away from the CC first terminal 8, a first GND plate 31 is arranged on one side of the first positive plate 4 away from the CC first terminal 8, a second GND plate 33 is arranged on one side of the second positive plate 6 away from the CC second terminal 9, the first positive plate 4 is communicated with the second positive plate 6, and the first GND plate 31 is communicated with the second GND plate 33; the positive electrode lead portion 14 is provided on the first positive electrode tab 4, and the GND lead portion 15 is provided on the second GND tab 33. The first positive plate 4 and one end, far away from the opening end of the shell 1, of the second positive plate 6 are connected through a third positive plate 5, and the first positive plate 4, the third positive plate 5 and the second positive plate 6 are of an integral structure; the ends of the first GND sheet 31 and the second GND sheet 33 remote from the open end of the housing 1 are connected by a third GND sheet 32, and the first GND sheet 31, the third GND sheet 32 and the second GND sheet 33 are integrally configured. That is, the TYPEC chip structure is obtained by bending and blanking.
The chip resistor 10 includes a first resistor 11 and a second resistor 12, and the first resistor 11 and the second resistor 12 are both chip resistors of 5.1K Ω (K Ω is kilo-ohm, and the unit of the chip resistor 10). The first resistor 11 may be connected between the CC terminal 8 and the first GND piece 31, between the CC terminal 8 and the third GND piece 32, or between the CC terminal 8 and the second GND piece 33. Similarly, the second resistor 12 may be connected between the CC terminal 9 and the first GND piece 31, between the CC terminal 9 and the third GND piece 32, or between the CC terminal 9 and the second GND piece 33.
The first positive plate 4 and the second positive plate 6 are identical, and the embodiment shows that the first positive plate 4 is on the left side, and the second positive plate 6 is on the right side, and the positions of the two can be interchanged actually according to the requirement; similarly, when the positions of the first positive electrode tab 4 and the second positive electrode tab 6 are interchanged, the positions of the second GND tab 33 and the first GND tab 31 also need to be interchanged.
It is to be understood that the arrangement direction of the first resistor 11 and the second resistor 12 may be determined as needed, and specifically, the first resistor 11 from the end of the CC first terminal 8 to the end of the GND terminal 3 is disposed in parallel with the third positive electrode tab 5, or the first resistor 11 from the end of the CC first terminal 8 to the end of the GND terminal 3 is disposed perpendicular to the third positive electrode tab 5, or the first resistor 11 from the end of the CC first terminal 8 to the end of the GND terminal 3 is disposed obliquely with respect to the third positive electrode tab 5. The second resistance 12 is provided in parallel to the third positive electrode tab 5 from one end of the CC terminal 9 to one end of the GND terminal 3, or the second resistance 12 is provided perpendicularly to the third positive electrode tab 5 from one end of the CC terminal 9 to one end of the GND terminal 3, or the second resistance 12 is provided obliquely to the third positive electrode tab 5 from one end of the CC terminal 9 to one end of the GND terminal 3.
In a specific structure, the first resistor 11 and the second resistor 12 are arranged in parallel, and both are connected to the same GND piece of the GND terminal 3. For example, as shown in fig. 7, the first resistor 11 and the second resistor 12 are connected to the third GND sheet 32, and the first resistor 11 and the second resistor 12 are provided perpendicular to the third positive electrode sheet 5 from one end of the CC first terminal 8 to one end of the GND terminal 3. In another specific structure, as shown in fig. 4, the first resistor 11 and the second resistor 12 are connected to the second GND plate 33, and the first resistor 11 and the second resistor 12 are arranged in parallel with the third positive electrode plate 5 from one end of the CC one terminal 8 to one end of the GND terminal 3.
Further, the first resistor 11 may be connected to different sides of the GND terminal 3 and the CC-terminal 8, or may be disposed on the same side; the first resistor 11 and the second resistor 12 may be disposed on the same side or different sides. Here, two side surfaces of the side where the height direction is specified are arranged at intervals, that is, one side facing out of the paper surface as shown in fig. 4 or fig. 7, and the other side facing in the paper surface. Preferably, as shown in fig. 4 or fig. 7, the first resistor 11 is connected to the same side of the GND terminal 3 and the CC one-terminal 8, the second resistor 12 is connected to the same side of the GND terminal 3 and the CC two-terminal 9, and the first resistor 11 and the second resistor 12 are connected to the same side of the GND terminal 3.
It can be understood that the first resistor 11 and the second resistor 12 are disposed on the same side, so that the occupied space in the height direction is small, the structural arrangement is simple, and the processing is easy.
Further, the width of the first positive electrode tab 4 is larger than the width of the second positive electrode tab 6, and the width of the second GND tab 33 is larger than the width of the first GND tab 31.
It can be understood that, because TYPE-C is restricted by shell 1 width, so the width of TYPE-C chip structure need be less than the width of TYPE-C shell 1, establish the positive terminal 2 of TYPE-C chip structure and the plane of GND terminal 3 welding external lead to the broadside, the connection plane of the other side of positive terminal 2 and GND terminal 3 establishes to the broadside, can guarantee that TYPE-C chip structure can not interfere with TYPE-C's shell 1 cooperation, and the outward appearance is pleasing to the eye, and can make things convenient for the welding operation of lead wire.
The positive electrode lead portion 14 and the GND lead portion 15 may be disposed in a circular hole shape, the diameter h3 is about 0.5 mm, the width L1 of the first positive electrode tab 4 and the width L2 of the second GND tab 33 are 0.9 mm, and the width L3 of the second positive electrode tab 6 and the width L4 of the first GND tab 31 are 0.4 mm.
Further, the first positive electrode tab 4 is provided with the positive electrode lead portion 14 at a position displaced from the first GND tab 31 in the height direction; the second GND sheet 33 is provided with the GND lead portion 15 at a position shifted from the second positive electrode sheet 6 in the height direction.
Specifically, as shown in fig. 7, the positive electrode lead portion 14 is provided on the first positive electrode tab 4 of the positive electrode terminal 2, and the GND lead portion 15 is provided on the second GND tab 33 of the GND terminal 3. In the vicinity of the positive electrode lead portion 14, the first positive electrode tab 4 protrudes upward, and the first GND tab 31 is recessed downward; in the GND lead portion 15, the second GND sheet 33 protrudes upward, and the second positive electrode sheet 6 is recessed downward. Specifically, at the connecting position of the positive electrode lead portion 14, there is a height difference of 0.1 to 1 mm in the height direction between the positive electrode terminal 2 and the GND terminal 3, and the height difference h2 may be 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm, or 1 mm. At the connecting position of the GND lead portion 15, the positive electrode terminal 2 and the GND terminal 3 have a height difference of 0.1 to 1 mm in the height direction, and specifically, may be 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm, or 1 mm.
In the present embodiment, the height difference in the height direction between the positive electrode terminal 2 and the GND terminal 3 at the positions near the positive electrode lead portion 14 and the GND lead portion 15 is based on the surface of the same side as the positive electrode terminal 2 and the GND terminal, and is shown by the height difference h2 with reference to the upper surface, for example, as shown in fig. 8.
In a preferred form, at the position where the chip resistor 10 is provided, there is a height difference in the height direction between the positive terminal 2 and the GND terminal 3, there is a height difference in the height direction between the positive terminal 2 and the CC terminal 7, and the GND terminal 3 and the CC terminal 7 are located on the same side in the height direction of the positive terminal 2. The height difference h1 between the positive terminal 2 and the CC terminal 7 in the height direction is 0.1-1 mm; the height difference between the CC terminal 7 and the positive terminal 2 in the height direction is also 0.1-1 mm. Specifically, the thickness may be 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm, or 1 mm. The GND terminal 3 and the CC terminal 7 are arranged flush in the height direction. The side at this point designates two side surfaces arranged at intervals in the height direction, that is, one side facing out of the paper surface as shown in fig. 4 or 7 and the other side facing in the paper surface. Specifically, as shown in fig. 10, the GND terminal 3 and the CC terminal 7 are located on the left side of the positive terminal 2 and are arranged substantially in parallel, and the chip resistor 10 is more conveniently connected between the GND terminal 3 and the CC terminal 7. Further, GND terminal 3 and CC terminal 7 are parallel and level in the direction of height and are set up for chip resistor 10 can be connected on a parallel with GND terminal 3 and CC terminal 7's surface, and when welding chip resistor 10, convenient and fast, and more firm.
For example, as shown in fig. 7, the first resistor 11 and the second resistor 12 are connected between the CC terminal 7 and the third GND sheet 32, wherein the middle portion of the third positive electrode sheet 5 is recessed downward (with reference to fig. 7), the third GND sheet 32 is raised upward, and the ends of the CC first terminal 8 and the CC second terminal 9 near the third positive electrode sheet 5 are raised upward to form a height difference. For another example, as shown in fig. 4, the first resistor 11 and the second resistor 12 are connected between the CC first terminal 8 and the second GND tab 33, the middle portion of the second positive tab 6 is depressed downward (with reference to fig. 4), the second GND tab 33 is projected upward, and the CC first terminal 8 and the CC second terminal 9 are projected upward, forming a height difference.
In the present embodiment, in the vicinity of the installation position of the chip resistor 10, the height difference in the height direction between the positive electrode terminal 2 and the GND terminal 3 and the height difference in the height direction between the CC terminal 7 and the positive electrode terminal 2 are shown by a height difference h1 with reference to the surface of the same side of the positive electrode terminal 2, the GND terminal and the CC terminal, for example, as shown in fig. 10.
Further, a positive electrode lead is soldered to the positive electrode terminal 2, a GND lead is soldered to the GND terminal 3, and the chip resistor 10 is soldered to the GND terminal 3 and the CC terminal 7.
The embodiment also provides a processing method of the TYPEC interface, and the processing method of the TYPEC interface of the embodiment is used for processing the TYPEC interface provided by the embodiment. The processing method comprises the following steps:
the method comprises the following steps: assembling the TYPEC chip structure into the housing 1; the first GND sheet 31, the first positive plate 4, the first CC terminal 8, the CC terminal 9, the second positive plate 6 and the second GND sheet 33 of the TYPEC chip structure are sequentially arranged, the two adjacent first GND sheet 31, the first positive plate 4, the first CC terminal 8, the CC terminal 9, the second positive plate 6 and the second GND sheet 33 are sequentially connected into a whole through the removable connecting part 13, one ends of the first positive plate 4 and the second positive plate 6, which are far away from the opening end of the shell 1, are connected through the third positive plate 5, and one ends of the first GND sheet 31 and the second GND sheet 33, which are far away from the opening end of the shell 1, are connected through the third GND sheet 32. At this time, the structure of the TYPEC chip is shown in FIG. 5. In this step one, the specific TYPE-C chip structure can be connected to TYPE-C housing 1 by a secondary encapsulation injection molding.
Step two: welding the chip resistor 10: a first resistor 11 is soldered between the CC terminal 8 and the first GND piece 31, the second GND piece 33, or the third GND piece 32, and a second resistor 12 is soldered between the CC terminal 9 and the first GND piece 31, the second GND piece 33, or the third GND piece 32.
Step three: removing the connecting part 13: the connection portion 13 of the TYPEC chip structure is removed, and the first positive electrode tab 4, the CC first terminal 8, the CC second terminal 9, the second positive electrode tab 6, and the second GND tab 33 are sequentially disposed at intervals, in which case the TYPEC chip structure is as shown in fig. 4.
Wherein, the sequence of the first step to the third step can be adjusted.
It can be understood that, this processing mode does not need to separately assemble the GND terminal 3, the positive terminal 2 and the CC terminal 7, and the processing is convenient and is beneficial to the batch rapid production of the TYPE-C chip structure in the processing process.
The present embodiment also provides an electronic device comprising the TYPEC interface provided in the present embodiment. The electronic device can be a mobile phone, a shaver, an electric toothbrush and other electronic products needing to be charged.
The electronic device of the present embodiment has the same advantageous effects as the TYPEC interface provided by the present embodiment.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The utility model provides a TYPEC interface, its characterized in that, includes shell (1) and the TYPEC chip architecture of setting in shell (1), the TYPEC chip architecture includes GND terminal (3), CC terminal (7), positive terminal (2) and chip resistor (10), be provided with GND lead portion (15) on GND terminal (3), be provided with positive lead portion (14) on positive terminal (2), chip resistor (10) are fixed between GND terminal (3) and CC terminal (7), and respectively with GND terminal (3) and CC terminal (7) contact connection.
2. The TYPEC interface of claim 1, wherein the CC terminals (7) comprise a CC one-terminal (8) and a CC two-terminal (9), the CC one-terminal (8) and the CC two-terminal (9) being arranged in parallel, and both extend along the axial direction of the shell (1), one side of the CC terminal (8) far away from the CC terminals (9) is provided with a first positive plate (4), a second positive plate (6) is arranged on one side of the CC terminal (9) and the side far away from the CC terminal (8), a first GND sheet (31) is arranged on one side of the first positive plate (4) far away from the CC terminal (8), a second GND sheet (33) is arranged on one side of the second positive plate (6) far away from the CC terminal (9), the first positive plate (4) is communicated with the second positive plate (6), and the first GND plate (31) is communicated with the second GND plate (33);
the positive electrode lead portion (14) is provided on the first positive electrode tab (4), and the GND lead portion (15) is provided on the second GND tab (33).
3. The TYPEC interface according to claim 2, characterized in that the width of the first positive plate (4) is greater than the width of the second positive plate (6), the width of the second GND plate (33) being greater than the width of the first GND plate (31).
4. The TYPEC interface according to claim 2 or 3, characterized in that the first positive plate (4) is provided with the positive lead portion (14) at a position offset in the height direction from the first GND plate (31);
the second GND sheet (33) is provided with the GND lead portion (15) at a position offset from the second positive electrode sheet (6) in the height direction.
5. The TYPEC interface according to claim 2 or 3, characterized in that the first positive plate (4) is connected to the second positive plate (6) at the end remote from the open end of the housing (1) by a third positive plate (5), the first positive plate (4), the third positive plate (5) and the second positive plate (6) being of unitary construction;
one ends of the first GND sheet (31) and the second GND sheet (33) which are far away from the opening end of the shell (1) are connected through a third GND sheet (32), and the first GND sheet (31), the third GND sheet (32) and the second GND sheet (33) are of an integral structure.
6. The TYPEC interface according to claim 5, characterized in that the patch resistance (10) comprises a first resistance (11) and a second resistance (12), the first resistance (11) being connected between the CC one terminal (8) and any one of the first (31), third (32) and second (33) GND slices, the second resistance (12) being connected between the CC two terminal (9) and any one of the first (31), third (32) and second (33) GND slices.
7. The TYPEC interface according to claim 1, characterized in that in the connection position of the chip resistor (10), the GND terminal (3) is arranged offset in height from the positive terminal (2), and the CC terminal (7) is arranged offset in height from the positive terminal (2).
8. The TYPEC interface according to claim 1, characterized in that the chip resistance (10) is soldered connection with the GND terminal (3) and the CC terminal (7).
9. A processing method of a TYPEC interface is characterized by comprising the following steps:
assembling the TYPEC chip structure into a housing (1); the chip structure comprises a TYPEC chip structure and a shell, wherein a first GND sheet (31), a first positive plate (4), a CC first terminal (8), a CC two terminal (9), a second positive plate (6) and a second GND sheet (33) of the TYPEC chip structure are sequentially arranged, the first GND sheet (31), the first positive plate (4), the CC first terminal (8), the CC two terminal (9), the second positive plate (6) and the second GND sheet (33) which are sequentially adjacent are connected into a whole through a removable connecting part (13), one end, far away from the opening end of the shell (1), of the first positive plate (4) and the second positive plate (6) are connected through a third positive plate (5), and one end, far away from the opening end of the shell (1), of the first GND sheet (31) and the second GND sheet (33) are connected through a third GND sheet (32);
welding patch resistance (10): welding a first resistor (11) between a CC terminal (8) and the first GND sheet (31), the second GND sheet (33) or the third GND sheet (32), and welding a second resistor (12) between a CC terminal (9) and the first GND sheet (31), the second GND sheet (33) or the third GND sheet (32);
removing the connection (13): removing a connecting part (13) in the TYPEC chip structure, and enabling a first GND sheet (31), the first positive plate (4), the CC terminal (8), the CC terminal (9), the second positive plate (6) and the second GND sheet (33) to be arranged at intervals between two adjacent plates in sequence.
10. An electronic device comprising the TYPEC interface of any one of claims 1-8.
CN202110183260.7A 2021-02-09 2021-02-09 TYPEC interface, processing method thereof and electronic instrument Active CN114156680B (en)

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CN210111134U (en) * 2019-07-15 2020-02-21 深圳市奇辉精密五金制品有限公司 Plug and data line with same
CN210607710U (en) * 2019-10-22 2020-05-22 东莞市一本电子有限公司 Data transmission type-c connector
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* Cited by examiner, † Cited by third party
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CN204243263U (en) * 2014-11-14 2015-04-01 富士康(昆山)电脑接插件有限公司 Power connector assembly
CN106340736A (en) * 2015-07-08 2017-01-18 蔡周贤 Reversible electrical connector
KR20170077553A (en) * 2015-12-28 2017-07-06 한국단자공업 주식회사 Type c usb plug connector, usb plug cable and type c usb connector assembly
CN205811113U (en) * 2016-06-30 2016-12-14 广东杰思通讯股份有限公司 Electric connector
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CN107039807A (en) * 2017-01-12 2017-08-11 昆山全方位电子科技有限公司 A kind of electric connector
CN206712071U (en) * 2017-04-21 2017-12-05 东莞市霖昇精密科技有限公司 A kind of TYPE C connectors that electronic component can be directly welded on conducting terminal
CN108075283A (en) * 2017-12-25 2018-05-25 东莞市钇虹精密科技有限公司 A kind of USB TYPE-C connectors and preparation method thereof
WO2020191648A1 (en) * 2019-03-27 2020-10-01 Littelfuse Electronics (Shanghai) Co., Ltd. Usb cable with integrated overcurrent and over temperature protection
CN210111134U (en) * 2019-07-15 2020-02-21 深圳市奇辉精密五金制品有限公司 Plug and data line with same
CN210607710U (en) * 2019-10-22 2020-05-22 东莞市一本电子有限公司 Data transmission type-c connector

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