CN114156215B - Automatic sintering equipment for diode element - Google Patents
Automatic sintering equipment for diode element Download PDFInfo
- Publication number
- CN114156215B CN114156215B CN202210119669.7A CN202210119669A CN114156215B CN 114156215 B CN114156215 B CN 114156215B CN 202210119669 A CN202210119669 A CN 202210119669A CN 114156215 B CN114156215 B CN 114156215B
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- Prior art keywords
- sintering
- groove
- rod
- processing
- mounting
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- 238000005245 sintering Methods 0.000 title claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 19
- 230000010354 integration Effects 0.000 claims description 6
- 210000003781 tooth socket Anatomy 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000010616 electrical installation Methods 0.000 claims description 2
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 244000309464 bull Species 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000012958 reprocessing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Furnace Details (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210119669.7A CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210119669.7A CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114156215A CN114156215A (en) | 2022-03-08 |
CN114156215B true CN114156215B (en) | 2022-04-22 |
Family
ID=80450314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210119669.7A Active CN114156215B (en) | 2022-02-09 | 2022-02-09 | Automatic sintering equipment for diode element |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114156215B (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1779928A (en) * | 2004-11-23 | 2006-05-31 | 敦南科技股份有限公司 | Semiconductor vacuum metal sintering device and manufacture flow |
CN103236408A (en) * | 2013-05-23 | 2013-08-07 | 济南晶恒电子有限责任公司 | Sintering mold and sintering method of diode with square lead |
CN103868350A (en) * | 2014-03-25 | 2014-06-18 | 宁夏日晶新能源装备股份有限公司 | Semiconductor target sintering device and method |
CN205542906U (en) * | 2016-04-19 | 2016-08-31 | 鄂尔多斯市源盛光电有限责任公司 | Sintering equipment , organic light -emitting diode be encapsulation system for device |
CN208012354U (en) * | 2017-12-29 | 2018-10-26 | 四川康明光电科技有限公司 | A kind of sintering equipment for laser diode |
CN208223152U (en) * | 2018-04-28 | 2018-12-11 | 东莞市通科电子有限公司 | A kind of chain-conveyer furnace for glass sealed diode sintering |
CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
CN111649590A (en) * | 2020-07-06 | 2020-09-11 | 中国振华集团永光电子有限公司(国营第八七三厂) | Sintering device of silicon Schottky diode and using method thereof |
CN211575880U (en) * | 2019-12-18 | 2020-09-25 | 四川蜀伦欣电子有限公司 | Chain furnace for sintering glass-sealed diode |
-
2022
- 2022-02-09 CN CN202210119669.7A patent/CN114156215B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1779928A (en) * | 2004-11-23 | 2006-05-31 | 敦南科技股份有限公司 | Semiconductor vacuum metal sintering device and manufacture flow |
CN103236408A (en) * | 2013-05-23 | 2013-08-07 | 济南晶恒电子有限责任公司 | Sintering mold and sintering method of diode with square lead |
CN103868350A (en) * | 2014-03-25 | 2014-06-18 | 宁夏日晶新能源装备股份有限公司 | Semiconductor target sintering device and method |
CN205542906U (en) * | 2016-04-19 | 2016-08-31 | 鄂尔多斯市源盛光电有限责任公司 | Sintering equipment , organic light -emitting diode be encapsulation system for device |
CN208012354U (en) * | 2017-12-29 | 2018-10-26 | 四川康明光电科技有限公司 | A kind of sintering equipment for laser diode |
CN208223152U (en) * | 2018-04-28 | 2018-12-11 | 东莞市通科电子有限公司 | A kind of chain-conveyer furnace for glass sealed diode sintering |
CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
CN211575880U (en) * | 2019-12-18 | 2020-09-25 | 四川蜀伦欣电子有限公司 | Chain furnace for sintering glass-sealed diode |
CN111649590A (en) * | 2020-07-06 | 2020-09-11 | 中国振华集团永光电子有限公司(国营第八七三厂) | Sintering device of silicon Schottky diode and using method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN114156215A (en) | 2022-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automatic sintering equipment for diode components Effective date of registration: 20220705 Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Electronic Technology Co.,Ltd. Registration number: Y2022980009843 |
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CP01 | Change in the name or title of a patent holder |
Address after: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee after: Nantong Hongjinbei Textile Technology Co.,Ltd. Address before: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee before: Nantong Hongjinbei Electronic Technology Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230630 Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Electronic Technology Co.,Ltd. Registration number: Y2022980009843 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automated sintering equipment for diode components Effective date of registration: 20230704 Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Textile Technology Co.,Ltd. Registration number: Y2023980047366 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220422 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Textile Technology Co.,Ltd. Registration number: Y2023980047366 |