CN114141938A - LED lamp bead packaging method and LED lamp bead - Google Patents
LED lamp bead packaging method and LED lamp bead Download PDFInfo
- Publication number
- CN114141938A CN114141938A CN202111372348.XA CN202111372348A CN114141938A CN 114141938 A CN114141938 A CN 114141938A CN 202111372348 A CN202111372348 A CN 202111372348A CN 114141938 A CN114141938 A CN 114141938A
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- Prior art keywords
- led lamp
- lamp bead
- support
- chip
- pad
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- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000741 silica gel Substances 0.000 claims abstract description 32
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 239000000084 colloidal system Substances 0.000 claims abstract description 10
- 238000012858 packaging process Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp bead packaging method and an LED lamp bead, wherein the packaging process comprises the following steps: step one, cleaning a bracket; step two, fixing the chip; step three, baking to solidify the silver colloid; step four, carrying out plasma cleaning on the bracket; welding a bonding wire to enable the bonding wire to be communicated with the anode and the cathode of the chip; step six, spraying a bridging agent on the surface of the bracket; step seven, injecting silica gel on the bracket; and step eight, baking. Compared with the prior art, the LED packaging process can provide great guarantee for the product quality of the LED lamp beads, and meanwhile, the operability of the production process is optimized.
Description
Technical Field
The invention relates to the field of packaging of LED lamp beads, in particular to a packaging method of an LED lamp bead and the LED lamp bead.
Background
At the present stage, the LED industry is rapidly developed in China, and the traditional packaging process of the LED in the prior art mainly includes die bonding, short baking, wire bonding, glue pouring, long baking and the like, however, as the requirements of people on the LED lamp are higher and higher, especially the service life of the LED lamp, the demand degree in the aspect of the light emitting angle and the like is higher and higher, but the existing process is rough, and although the LED lamp can be applied to the LED lamp with lower requirements, the LED lamp manufactured according to the existing production process has poor quality, short service life, poor consistency of the light emitting angle, small light emitting angle and high light refraction loss, and is difficult to meet the requirements of users.
Disclosure of Invention
The invention provides an LED lamp bead packaging method and an LED lamp bead, and solves the technical problems that the quality of the LED lamp bead produced by an LED lamp bead packaging process in the prior art is poor, the service life is short and the like.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the packaging method of the LED lamp bead is characterized in that the packaging process comprises the following steps:
cleaning a bracket to remove moisture and dirt on the surface of the bracket;
secondly, fixing the chip, namely putting the silver colloid into the center of the cup groove of the bracket, and putting the chip into the center of the cup groove;
step three, baking to solidify the silver colloid;
step four, carrying out plasma cleaning on the bracket;
welding a bonding wire to enable the bonding wire to be communicated with the anode and the cathode of the chip;
step six, spraying a bridging agent on the surface of the support provided with the chip;
seventhly, injecting silica gel on the surface of the support provided with the chip, baking after the silica gel is injected, and taking down the mold after the silica gel is shaped;
and step eight, baking to solidify the silica gel to obtain the LED lamp bead.
Further, in the step 1, the smudging on the surface of the bracket is removed by adopting a plasma cleaning mode.
Further, the support comprises a bonding pad used for being welded with the chip, and the bonding pad is made of red copper.
Furthermore, the bonding pad comprises a cathode bonding pad and an anode bonding pad which are exposed out of the surface of the support, the anode bonding pad is directly electrically connected with the chip through silver paste, and the cathode bonding pad is electrically connected with the chip through the fifth step.
Further, the method also comprises the following steps between the fifth step and the sixth step: and cleaning the bracket to remove moisture and dirt on the surface of the bracket.
Further, the packaging process further comprises: and step nine, testing the luminous and reflection effects of the LED lamp beads.
Further, the shape of silica gel is the hemisphere, just silica gel with the junction between the support is equipped with the fillet.
Further, the radian of the silica gel is 120-140 degrees, and the height from the surface of the support is 0.9-1 mm.
An LED lamp bead is manufactured by adopting the packaging method of the LED lamp bead.
Further, the support comprises an anode bonding pad, the anode bonding pad comprises a first bonding pad surface and a second bonding pad surface which are exposed out of the support and opposite to the outer surface of the chip, the first bonding pad surface and the second bonding pad surface are separated by the support, and the first bonding pad surface is arranged in the middle of the support.
Has the advantages that: compared with the prior art, the LED packaging process can provide great guarantee for the product quality of the LED lamp beads, and meanwhile, the operability of the production process is optimized; and the chip is more stable in electrical connection with the bonding pad, the cost is relatively low, the problems of poor heat dissipation, short service life, poor consistency of light emitting angles and the like of a common LED are solved, and the high-quality LED lamp bead is produced by the process flow with the best cost performance.
Drawings
Fig. 1 is a schematic view of a flow structure of a packaging method of an LED lamp bead according to the present invention.
Fig. 2 is a schematic side structure diagram of an LED lamp bead according to the present invention.
Fig. 3 is a schematic view of the bottom surface structure of the LED lamp bead of the present invention.
Wherein, the main reference signs in the invention are:
1. a support; 2. silica gel; 3. a cathode pad; 41. a first solder pad surface; 42. and a second pad surface.
Detailed Description
It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The invention provides a packaging method of an LED lamp bead, as shown in figure 1, the packaging process provided by the application comprises the following steps:
cleaning a bracket to remove moisture and dirt on the surface of the bracket; in the step, firstly, the bracket module is dehumidified, moisture on the surface of the bracket module is removed, then the bracket module is subjected to plasma cleaning, and the surface of the bracket is cleaned through plasma to remove dirt on the surface of the bracket, so that the later treatment is facilitated.
And secondly, fixing the chip, integrating a plurality of supports which are arranged together in an array manner into a support module, arranging a cup groove (also called a bowl groove) in the middle of each support, firstly putting the silver colloid into the middle point of the cup groove, enabling the silver colloid to be in contact with an anode pad at the bottom of the cup groove, putting the chip into the central position of the cup groove through a machine, and enabling the chip to be in contact with the anode pad at the moment and conduct electricity.
Step three, baking to solidify the silver colloid, adhering and fixing the chip to the middle part of the cup groove, and meanwhile conducting the chip and the anode pad, wherein the surface of the bracket is very clean because the bracket is subjected to plasma cleaning before the silver colloid is dripped, and in addition, under the action of plasma, the adhesion degree between the bracket and the silver colloid is better, so that a stable connection effect is formed between the chip and the anode pad, the quality of a product is ensured, and the service life of the product is prolonged; in a preferred embodiment, the baking temperature is 130 ℃ to 160 ℃, and the baking time is 80 to 160 minutes.
And fourthly, carrying out plasma cleaning on the support again, wherein the flow rate of the plasma is 7-9 ml/min, and the primary cleaning time is 80-120 min.
Step five, the bonding wire is welded, the support is simultaneously provided with the cathode bonding pad, the bonding wire is connected with the chip and the cathode bonding pad, the bonding wire is stably connected with the chip and the cathode bonding pad in a welding mode, the residual coating on the surfaces of the chip and the cathode bonding pad can be removed through plasma cleaning in the step four, a stable grinding layer is formed, the welding effect is greatly improved due to the existence of the grinding layer, and meanwhile, the treatment and other treatment modes have the advantages of being simple in step, good in effect and the like.
Step six, after welding, uniformly spraying a layer of bridging agent on the surfaces of the bracket and the chip, naturally cleaning the bracket before the step six, removing moisture of the bracket and dirt on the surface of the bracket, further improving the quality of the product, adding the bridging agent between the bracket and the silica gel, wherein the bridging agent can be used as a bonding layer, so that the bracket and the silica gel can be bonded more firmly, and the air tightness is better.
Seventhly, performing injection molding on the surface, provided with the chip, of the support by adopting the existing molding process to form silica gel, placing a mold on a cup groove, injecting the silica gel into the mold, starting baking and heating after injecting the silica gel into the mold, controlling the baking temperature to be between 20 and 40 ℃, baking for 3 to 5min, taking down the mold after baking until the silica gel is shaped, and spraying a bridging agent to ensure that the adhesion between the support and the silica gel is firmer; wherein, the silica gel is provided with a certain proportion of fluorescent powder.
Step eight, continuing baking, controlling the baking temperature to be 100-120 ℃ at the moment, controlling the baking time to be 10-30 min, and completely curing the silica gel to obtain a finished product of the LED lamp bead, wherein the silica gel is uniform in shape and better in air tightness in the step seven-step eight through the silica gel shaping mode, and further the light-emitting angles of the throw pillow silica gel are uniform and consistent; however, in the actual production and processing, all the supports on the support module are processed synchronously, and after the finished product of the LED lamp beads is obtained, the supports are cut off in a laser cutting mode to collect the finished product of the LED lamp beads.
And step nine, testing the luminous and reflection effects of the LED lamp beads, and screening and grading and classifying the LED lamp beads according to the brightness of the LED lamp beads.
Finally, the collected LED lamps are automatically braided and packaged, and one set of production flow is completed.
The packaging method of the LED lamp bead provided by the application can provide great guarantee for the product quality of the LED lamp bead, the production flow is simple, especially in the seventh step, a precise mold is adopted to ensure that the shape of the silica gel after being molded is kept to be uniform and semi-spherical, a fillet is arranged at the joint between the silica gel and the support, and the radius of the fillet is 0.25mm, so that the light type is uniform, the light breakage is small, the surface of the silica gel is uniform and has no bubbles inside, the arrangement is convenient for demolding on one hand, on the other hand, the contact area between the silica gel and the support can be increased, the service life of the product is ensured, and the uniformity of the light emission can be ensured; the LED lamp manufactured by the process has the advantages of higher product quality, more stable electrical connection between the chip and the bonding pad and relatively lower cost.
Preferably, the radian of the silicone gel in the present application is set to 120 ° to 140 °, preferably 135 °, and the height of the silicone gel from the surface of the support is 0.9mm to 1mm, preferably 0.95mm, which can ensure that the light-emitting angle of the chip is maintained at 150 ° and the light-emitting angle is maintained in the range of 150 ° ± 3 °.
Preferably, the material of the support in this application is EMC, and it has high temperature resistant, advantage that the gas tightness is good to it, and the material of the pad (positive pole pad and negative pole pad) in this application is red copper material, and red copper's coefficient of thermal conductivity is 386.4w/(m.k), and it has good thermal diffusivity.
The application further discloses an LED lamp bead which is manufactured by the packaging process provided by the application.
Further, as shown in fig. 2 and 3, the support 1 includes an anode pad and a cathode pad 3, the anode pad and the cathode pad 3 are exposed out of the surface of the support 1, the anode pad includes a first pad surface 41 and a second pad surface 42 exposed out of the support 1 and opposite to the outer surface of the chip, the first pad surface 41 and the second pad surface 42 are separated by the support 1, the first pad surface 41 is located in the middle of the support 1, and the area of the first pad surface 41 is 2.7mm2The overall layout of the bottom of the support 1 is: the cathode pad 3 that exposes on the surface of support 1 is the top, the middle first welding disk face 41 that is the positive pole pad that exposes on the surface of support 1, the second welding disk face 42 that exposes on the positive pole pad on the surface of support 1 is the lower extreme, the effect that lies in first welding disk face 41 of the middle through such design is mainly used for the heat dissipation, the thermal diffusivity of the whole LED lamp of design just obtains fine guarantee like this, and adopt support 1 to support and separate the positive pole pad, can also guarantee the structural strength of whole support 1.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The packaging method of the LED lamp bead is characterized in that the packaging process comprises the following steps:
cleaning a bracket to remove moisture and dirt on the surface of the bracket;
secondly, fixing the chip, namely putting the silver colloid into the center of the cup groove of the bracket, and putting the chip into the center of the cup groove;
step three, baking to solidify the silver colloid;
step four, carrying out plasma cleaning on the bracket;
welding a bonding wire to enable the bonding wire to be communicated with the anode and the cathode of the chip;
step six, spraying a bridging agent on the surface of the support provided with the chip;
seventhly, injecting silica gel on the surface of the support provided with the chip, baking after the silica gel is injected, and taking down the mold after the silica gel is shaped;
and step eight, baking to solidify the silica gel to obtain the LED lamp bead.
2. The method for packaging an LED lamp bead according to claim 1, wherein in the step 1, the surface of the support is cleaned by plasma cleaning.
3. The packaging method of the LED lamp bead according to claim 1, wherein the support includes a bonding pad for being soldered to the chip, and the bonding pad is made of red copper.
4. The packaging method of the LED lamp bead according to claim 3, wherein the bonding pads include a cathode bonding pad and an anode bonding pad exposed out of the surface of the support, the anode bonding pad is directly electrically connected with the chip through silver paste, and the cathode bonding pad is electrically connected with the chip through the fifth step.
5. The packaging method of the LED lamp bead according to claim 1, further comprising the steps between the fifth step and the sixth step of: and cleaning the bracket to remove moisture and dirt on the surface of the bracket.
6. The method for encapsulating the LED lamp bead according to claim 1, wherein the encapsulating process further comprises: and step nine, testing the luminous and reflection effects of the LED lamp beads.
7. The method for packaging the LED lamp bead according to claim 1, wherein the silica gel is hemispherical, and a fillet is provided at a joint between the silica gel and the support.
8. The packaging method of the LED lamp bead according to claim 7, wherein the radian of the silica gel is 120 ° to 140 °, and the height from the surface of the support is 0.9mm to 1 mm.
9. An LED lamp bead, characterized in that, the lamp bead is made by the method for packaging the LED lamp bead according to any one of claims 1 to 8.
10. The LED lamp bead according to claim 9, wherein the support includes an anode pad, the anode pad includes a first pad surface and a second pad surface exposed to the outer surface of the support opposite to the chip, the first pad surface and the second pad surface are separated by the support, and the first pad surface is disposed in the middle of the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111372348.XA CN114141938A (en) | 2021-11-18 | 2021-11-18 | LED lamp bead packaging method and LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111372348.XA CN114141938A (en) | 2021-11-18 | 2021-11-18 | LED lamp bead packaging method and LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114141938A true CN114141938A (en) | 2022-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111372348.XA Pending CN114141938A (en) | 2021-11-18 | 2021-11-18 | LED lamp bead packaging method and LED lamp bead |
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| CN (1) | CN114141938A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN201318574Y (en) * | 2008-12-02 | 2009-09-30 | 东莞市邦臣光电有限公司 | High-power light-emitting diode |
| CN102544260A (en) * | 2011-12-31 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
| CN204167363U (en) * | 2014-10-14 | 2015-02-18 | 深圳市汇大光电科技有限公司 | A kind of SMD light emitting diode construction |
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN109216532A (en) * | 2018-11-01 | 2019-01-15 | 上海悦威电子设备有限公司 | A kind of ultraviolet LED quartz lens assembling structure and method |
| CN112563391A (en) * | 2020-12-29 | 2021-03-26 | 浙江金缘光电有限公司 | LED packaging process |
| CN113471185A (en) * | 2020-03-31 | 2021-10-01 | 光宝光电(常州)有限公司 | Packaging structure |
-
2021
- 2021-11-18 CN CN202111372348.XA patent/CN114141938A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN201318574Y (en) * | 2008-12-02 | 2009-09-30 | 东莞市邦臣光电有限公司 | High-power light-emitting diode |
| CN102544260A (en) * | 2011-12-31 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
| CN204167363U (en) * | 2014-10-14 | 2015-02-18 | 深圳市汇大光电科技有限公司 | A kind of SMD light emitting diode construction |
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN109216532A (en) * | 2018-11-01 | 2019-01-15 | 上海悦威电子设备有限公司 | A kind of ultraviolet LED quartz lens assembling structure and method |
| CN113471185A (en) * | 2020-03-31 | 2021-10-01 | 光宝光电(常州)有限公司 | Packaging structure |
| CN112563391A (en) * | 2020-12-29 | 2021-03-26 | 浙江金缘光电有限公司 | LED packaging process |
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