CN114137383A - High-precision Mini-LED board electric measurement method - Google Patents
High-precision Mini-LED board electric measurement method Download PDFInfo
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- CN114137383A CN114137383A CN202210117129.5A CN202210117129A CN114137383A CN 114137383 A CN114137383 A CN 114137383A CN 202210117129 A CN202210117129 A CN 202210117129A CN 114137383 A CN114137383 A CN 114137383A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
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Abstract
The invention discloses a high-precision Mini-LED board electrical testing method, which comprises the following steps: s1.1, an adapter plate substrate; s1.2, drilling; s1.3, reducing copper on a single surface to brown; s1.4, laser: performing laser on the upper end surface of the first adapter plate substrate to form at least two first blind holes; s1.5, single-side copper deposition and electroplating: carrying out copper deposition electroplating on the upper end face of the first adapter plate substrate; s1.6, etching the base and the bonding pad: etching at least two bases on the lower end face of the first adapter plate substrate; etching at least two first bonding pads on the upper end face of the first adapter plate substrate, wherein the base and the first bonding pads are bridged through the first blind holes; s3.1, forming an adapter plate; s4, electrical measurement. The method has reasonable step design, enlarges the size of the bonding pad from 60x100 microns to 300 microns through the adapter plate, and is convenient for measurement of a common flying probe machine.
Description
Technical Field
The invention relates to the technical field of Mini-LED board electric measurement, in particular to a high-precision Mini-LED board electric measurement method.
Background
Referring to fig. 1, a wafer (4) arranged on a Mini-LED pad (301) of a high-precision Mini-LED product is small, and the wafer (4) is only 100x200 micrometers, so that the overall area of the two Mini-LED pads (301) is smaller than the size of the wafer (4), the size of the Mini-LED pad (301) is already 60x100 micrometers at present, and the size of a conventional testing needle is 150 micrometers, so that when the Mini-LED pad (301) of the Mini-LED product is measured, the difficulty is high, the cost is high, and therefore a high-precision Mini-LED board electrical testing method is needed to solve the problems.
Principle supplement and explanation:
(1) referring to fig. 1, one Mini-LED pad (301) is used as the anode, the other Mini-LED pad (301) is used as the cathode, the two pads are used as the base, and the die (4) sits on.
(2) Referring to fig. 2, the number of Mini-LED pads (301) may be 6, with 6 pads divided into 3 groups, RGB (RED/GREEN/BLUE);
(3) referring to fig. 2, the dimensional tolerance of the Mini-LED pad (301) is ± 5%;
(4) referring to FIG. 2, the gap + two Mini-LED pads (301) are 200 μm wide or less.
Disclosure of Invention
The invention aims to provide a high-precision Mini-LED board electrical testing method to solve the technical problems mentioned in the background technology.
The technical scheme of the invention provides a high-precision Mini-LED board electric testing method, which comprises the following steps:
s1.1, an adapter plate substrate: providing an adapter plate substrate, wherein the adapter plate substrate is a copper-clad plate with copper foils on the upper end surface and the lower end surface;
s1.2, drilling: the adapter plate base plate comprises a first adapter plate base plate, and positioning holes are drilled in the first adapter plate base plate;
s1.3, single-side copper reduction and browning: carrying out copper reduction and browning on the upper end surface of the first adapter plate substrate;
s1.4, laser: performing laser on the upper end surface of the first adapter plate substrate to form at least two first blind holes;
s1.5, single-side copper deposition and electroplating: carrying out copper deposition electroplating on the upper end face of the first adapter plate substrate;
s1.6, etching the base and the bonding pad: etching at least two bases on the lower end face of the first adapter plate substrate, wherein the size and the position of each base are consistent with the size and the position of a Mini-LED bonding pad of a Mini-LED plate to be tested; etching at least two first bonding pads on the upper end face of the first adapter plate substrate, wherein the base and the first bonding pads are bridged through the first blind holes;
s3.1, forming an adapter plate: the adapter plate substrate is processed through the steps to form the adapter plate;
s4, electrical measurement: and carrying out an electrifying test between the base of the adapter plate and the Mini-LED bonding pad of the Mini-LED plate to be tested.
Further, the air conditioner is provided with a fan,
in step S1.1, the interposer substrate: H-TG FR4 material was used, copper was H/H thick.
Further, the air conditioner is provided with a fan,
in step S1.3, the thickness of the copper-reduced browning on the upper end surface of the first transfer board substrate is 7 to 9 micrometers;
in step S1.4, the aperture of the first blind via for laser emission on the upper end surface of the first adapter plate substrate is controlled to be 90 ± 10 microns;
in step S1.5, the thickness of the electroplated copper on the upper end surface of the first interposer substrate is 20 micrometers, and the recess of the first blind via is controlled within 5 micrometers;
in step S1.6, the size of the base etched on the lower end face of the first adapter plate substrate is 60 micrometers in length and 10 micrometers in width; a first bonding pad etched on the upper end face of the first adapter plate substrate is a circular bonding pad with the diameter of 150 microns; the distance between the edges of the two first bonding pads is 50 microns, and the distance is consistent with the distance between the Mini-LED bonding pads of the Mini-LED board to be tested.
Further, the air conditioner is provided with a fan,
in step S1.6, a wet film or a dupont 8630 dry film is used for etching on the first interposer substrate.
Further, the air conditioner is provided with a fan,
between step S1.6 and step S3.1, the following steps are provided:
s2.1, pressing: the adapter plate substrate further comprises a second adapter plate substrate, the second adapter plate substrate is arranged on the upper end face of the first adapter plate substrate, and a prepreg is adopted for laminating the second adapter plate substrate and the first adapter plate substrate;
s2.2, drilling: drilling a positioning hole on the second adapter plate substrate;
s2.3, single-side copper reduction and browning: carrying out copper reduction and browning on the upper end surface of the second adapter plate substrate;
s2.4, single-side laser: performing laser on the upper end face of the second adapter plate substrate to form at least two second blind holes;
s2.5, copper deposition and electroplating: carrying out copper deposition electroplating on the upper end face of the second adapter plate substrate;
s2.6, single-side etching of the bonding pad: and etching at least two second bonding pads on the upper end surface of the second adapter board substrate, wherein the first bonding pad and the second bonding pad are bridged through the second blind holes.
Further, the air conditioner is provided with a fan,
in step S2.1, a 1080PP press fit is used.
Further, the air conditioner is provided with a fan,
in step S2.3, the thickness of the copper-reduced browning on the upper end surface of the second adapter plate substrate is 7 to 9 micrometers;
in step S2.4, the aperture of the second blind via that is laser-ejected on the upper end surface of the second adapter plate substrate is controlled to be 90 ± 10 microns;
in step S2.5, the thickness of the electroplated copper on the upper end surface of the second adapter plate substrate is 20 micrometers, and the recess of the second blind via is controlled within 5 micrometers;
in step S2.6, the second bonding pad (203) etched on the upper end surface of the second adapter board substrate is a circular bonding pad with a diameter of 300 μm; and the distance between the edges of the two second bonding pads is 50 micrometers, and the distance is consistent with the distance between the Mini-LED bonding pads of the Mini-LED board to be tested.
Further, the air conditioner is provided with a fan,
in step S2.6, a dry film is used in the process of etching the second bonding pad on the upper end surface of the second interposer substrate.
Further, the air conditioner is provided with a fan,
between step S3.1 and step S4, the following steps are provided: s3.2, gold melting: and carrying out gold dissolving process treatment on the adapter plate.
Further, the air conditioner is provided with a fan,
between step S3.2 and step S4, the following steps are provided:
s3.3, forming: and cutting the adapter plate into specifications with required sizes.
In summary, the technical scheme of the invention has the following beneficial effects: the step design of the invention is reasonable, (1) through setting up the adapter plate, thus while testing and testing to the Mini-LED pad, because of indirect contact, can reduce the abrasion to the Mini-LED pad, prevent the test needle from pressing the Mini-LED pad; (2) by arranging the first bonding pad, the area of the bonding pad tested by the testing needle can be increased, so that the conventional testing needle can be used for measuring, the difficulty in testing the Mini-LED bonding pad is reduced, and the electrical testing difficulty is reduced; (3) through setting up first pad, can reduce test jig density, reduce the test jig cost.
Drawings
FIG. 1 is a schematic cross-sectional view of two Mini-LED pads mated with a die of the prior art;
FIG. 2 is a schematic diagram of the distribution among six Mini-LED pads of the prior art;
FIG. 3 is a schematic cross-sectional view of the present invention;
FIG. 4 is a system flow diagram of the present invention;
description of reference numerals: 1-a first interposer substrate, 101-a first blind via, 102-a mount, 103-a first pad; 2-a second adapter plate substrate, 201-a second blind hole, 202-a second bonding pad; 3-a Mini-LED board to be tested, 301-Mini-LED bonding pads and 4-a wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, but the technical solutions in the embodiments of the present invention are not limited to the scope of the present invention.
In the present invention, for a clearer description, the following explanation is made: when an observer views the attached drawings 3, the left side of the observer is set as the left side, the right side of the observer is set as the right side, the front side of the observer is set as the front side, the rear side of the observer is set as the rear side, the upper side of the observer is set as the upper side, and the lower side of the observer is set as the lower side, it should be noted that the terms "front end", "rear end", "left side", "right side", "middle part", "upper part", "lower part" and the like in the text indicate the orientation or positional relationship set based on the attached drawings, and only for the convenience of clearly describing the present invention, but do not indicate or imply that the structure or parts indicated must have a specific orientation and be configured in a specific orientation, and thus cannot be understood as limiting the present invention. Furthermore, the terms "first," "second," "third," and "fourth" are used merely for purposes of clarity or simplicity of description and are not to be construed as indicating or implying relative importance or quantity.
Referring to fig. 3 to 4, the present embodiment provides a method for electrically testing a Mini-LED board with high precision, including the following steps:
s1.1, an adapter plate substrate: providing an adapter plate substrate, wherein the adapter plate substrate is a copper-clad plate with copper foils on the upper end surface and the lower end surface;
s1.2, drilling: the adapter plate base plate comprises a first adapter plate base plate 1, and positioning holes are drilled in the first adapter plate base plate 1; the function is as follows: since the first bonding pad and the base are manufactured by the following steps, the holes drilled in the first bonding pad and the base are positioning holes of the LDI exposure machine.
S1.3, single-side copper reduction and browning: carrying out copper reduction and browning on the upper end surface of the first adapter plate substrate 1; the copper reduction browning effect is an early preparation step of laser irradiation.
S1.4, laser: performing laser on the upper end surface of the first adapter plate substrate 1 to form at least two first blind holes 101;
s1.5, single-side copper deposition and electroplating: carrying out copper deposition electroplating on the upper end face of the first adapter plate substrate 1; it is noted that the interior of the first blind via is also plated with copper.
S1.6, etching the base and the bonding pad: etching at least two bases 102 on the lower end face of the first adapter plate substrate 1, wherein the size and the position of each base 102 are consistent with the size and the position of a Mini-LED bonding pad 301 of a Mini-LED plate 3 to be tested; at least two first bonding pads 103 are etched on the upper end face of the first adapter plate substrate 1, and the base 102 and the first bonding pads 103 are bridged through first blind holes 101; it is noted that the reason why the first blind via is chosen here to bridge the submount and the first pad is that: (1) if the first blind hole is replaced by the through hole, the first pad needs to be larger relative to the base, so that the occupied space of the through hole is too large, the influence on the aperture of the through hole is small, the base cannot be made very small, and the blind hole can be used instead of the through hole; in the blind hole filling and plating process, the dielectric layer cannot be too thick, otherwise, the hole filling efficiency and the concavity are influenced. (2) Single-side electroplating, wherein the base needs to be in direct contact fit with a Mini-LED pad, so that the requirement on flatness is high, the surface of the base needs to be directly etched and formed on copper foil, and the first pad on the upper end surface can be subjected to copper plating and etching after the first blind hole is drilled; therefore, the flatness of the base is ensured without laser from the surface of the base, and the fact that electrical measurement is all true is ensured. (3) Because of single-side electroplating, the copper thickness of two sides is not consistent, and because the base is formed by etching the base material copper, the uniformity and the evenness are better, and the yield is higher.
S3.1, forming an adapter plate: the adapter plate substrate is processed through the steps to form the adapter plate;
s4, electrical measurement: and conducting an electrifying test between the base 102 of the adapter plate and the Mini-LED bonding pad 301 of the Mini-LED plate 3 to be tested. Since the PCB aspect is only testing the power-on condition, the wafer test is performed in the next level of packaging factory.
The function is as follows: (1) by arranging the adapter plate, when the test is performed on the Mini-LED bonding pad, the wear to the Mini-LED bonding pad can be reduced due to indirect contact, and the Mini-LED bonding pad is prevented from being damaged by the test pin; (2) by arranging the first bonding pad, the area of the bonding pad tested by the testing needle can be increased, so that the conventional testing needle can be used for measuring, the difficulty in testing the Mini-LED bonding pad is reduced, and the electrical testing difficulty is reduced; (3) through setting up first pad, can reduce test jig density, reduce the test jig cost.
In particular, the amount of the solvent to be used,
in step S1.1, the interposer substrate: adopting H-TG FR4 material, wherein the temperature of the cutting and baking plate is 180 ℃, the time is 4H, and the copper thickness is H/H;
in step S1.2, a pilot hole of 0.2mm diameter is drilled in the first adapter plate substrate 1.
In particular, the amount of the solvent to be used,
in step S1.3, the thickness of the copper-reduced browning on the upper end surface of the first transfer board substrate 1 is 7 to 9 micrometers;
in step S1.4, the aperture of the first blind hole 101 for laser emission on the upper end surface of the first transfer board substrate 1 is controlled to be 90 ± 10 microns;
in step S1.5, the thickness of the electroplated copper on the upper end surface of the first interposer substrate 1 is 20 microns, and the recess of the first blind via 101 is controlled within 5 microns;
in step S1.6, the size of the pedestal 102 etched on the lower end face of the first interposer substrate 1 is 60 micrometers in length and 10 micrometers in width; the first bonding pad 103 etched on the upper end face of the first adapter board substrate 1 is a circular bonding pad with the diameter of 150 microns; the distance between the edges of the two first bonding pads 103 is 50 microns, and the distance is consistent with the distance between the Mini-LED bonding pads 301 of the Mini-LED board 3 to be tested, and functions as follows: the alignment degree of the Mini-LED bonding pads can be improved due to the consistent distance, and the alignment degree measurement of the Mini-LED bonding pads and the base is facilitated.
In particular, the amount of the solvent to be used,
in step S1.6, wet pasting, dupont 8630 dry film is used when etching is performed on the first interposer board substrate 1: the first pad pitch and the base pitch can be compensated to 35 microns at the minimum, namely, the line etching compensation is realized.
In particular, the amount of the solvent to be used,
between step S1.6 and step S3.1, the following steps are provided:
s2.1, pressing: the adapter plate substrate further comprises a second adapter plate substrate 2, the second adapter plate substrate 2 is arranged on the upper end face of the first adapter plate substrate 1, and a prepreg is adopted for laminating the second adapter plate substrate 2 and the first adapter plate substrate 1;
s2.2, drilling: drilling a positioning hole on the second adapter plate substrate 2; the function is as follows: since the second bonding pad is required to be manufactured with a circuit, the hole drilled is the positioning hole of the LDI exposure machine.
S2.3, single-side copper reduction and browning: copper reduction and brown oxidation are carried out on the upper end face of the second adapter plate substrate 2; the copper reduction browning effect is an early preparation step of laser irradiation.
S2.4, single-side laser: at least two second blind holes 201 are formed in the upper end face of the second adapter plate substrate 2 in a laser mode;
s2.5, copper deposition and electroplating: carrying out copper deposition electroplating on the upper end surface of the second adapter plate substrate 2; it is noted that the interior of the second blind via is also plated with copper.
S2.6, single-side etching of the bonding pad: at least two second bonding pads 202 are etched on the upper end face of the second adapter substrate 2, and the first bonding pad 103 and the second bonding pad 202 are bridged by a second blind hole 201.
The function is as follows: (1) the second adapter plate substrate is added, and the thickness of the whole adapter plate is mainly considered, because if only one layer of adapter plate substrate is provided, the finally obtained adapter plate is very thin and is easy to warp, all bases (the functions are equivalent to bonding pads) are not on the same plane, and thus the risk of measuring false points is caused; if the thickness of the first adapter plate substrate is simply increased, the hole filling efficiency and the concavity of the blind hole are affected, and the expansion of the tested bonding pad is not facilitated. (2) When only one adapter plate is provided, the whole thickness is thinner, as explained above, and simultaneously, in order to ensure the smoothness of the base and the electrical measurement reliability, because the area of the base is small, the blind hole cannot be moved aside by the first adapter plate, so that the best adapter plate needs to be switched twice when the area to be measured needs to be enlarged. When the second adapter board substrate is added, the bonding pad which is directly contacted and matched by the test needle is the second bonding pad.
In particular, the amount of the solvent to be used,
in step S2.1, 1080PP is adopted for pressing;
in step S2.2, the diameter of the positioning hole drilled in the second adaptor board substrate 2 is 0.2 mm.
In particular, the amount of the solvent to be used,
in step S2.3, the thickness of the copper-reduced browning on the upper end surface of the second adapter plate substrate 2 is 7 to 9 micrometers;
in step S2.4, the aperture of the second blind hole 201, which is subjected to laser emission on the upper end surface of the second adapter plate substrate 2, is controlled to be 90 ± 10 microns;
in step S2.5, the thickness of the electroplated copper on the upper end surface of the second adaptor board substrate 2 is 20 microns, and the recess of the second blind via 201 is controlled within 5 microns (the single-sided current of the rectifier is controlled to realize single-sided electroplating);
in step S2.6, the second bonding pad 202 etched on the upper end surface of the second interposer substrate 2 is a circular bonding pad with a diameter of 300 μm; the distance between the edges of the two second pads 202 is 50 microns, which is consistent with the distance between the Mini-LED pads 301 of the Mini-LED board 3 to be tested, and functions as follows: the pitch requirement of the actual second pads is less demanding than the pitch requirement of the first pads, again because of the positional relationship.
In particular, the amount of the solvent to be used,
in step S2.6, a dry film is used in the process of etching the second pad 202 on the upper end surface of the second adaptor substrate 2, and functions as: because this pad size is comparatively loose, can adopt ordinary dry film preparation, can reduce cost like this.
In particular, the amount of the solvent to be used,
the thicknesses of the first adapter plate substrate 1 and the second adapter plate substrate 2 are 0.07 mm.
In particular, the amount of the solvent to be used,
between step S3.1 and step S4, the following steps are provided:
s3.2, gold melting: carrying out gold conversion process treatment on the transfer plate; in order to improve the test times and the service life of the adapter plate, the thickness of the gold is 0.05 micron, and the thickness of the nickel is 5 microns.
In particular, the amount of the solvent to be used,
between step S3.2 and step S4, the following steps are provided:
s3.3, forming: and cutting the transfer plate into the specification with the required size, namely adopting the specific specification according to the model of the electric measuring machine.
In summary, the advantages are as follows:
1. the measuring bonding pad is increased to the size of 300 microns from 60x100 microns, so that electrical measurement is facilitated;
2. the integral thickness of the adapter plate is 0.15mm, the whole adapter plate is thin, the number of pressing times is small, and the size is stable;
3. the cost of the test needle and the test frame is reduced by 80 percent.
The innovation points are as follows: the size of the bonding pad is enlarged to 300 microns from 60x100 microns through the adapter plate, so that the common flying probe machine can conveniently measure the bonding pad, and meanwhile, a common test frame can be adopted as the test frame;
while the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A high-precision Mini-LED board electric testing method is characterized by comprising the following steps:
s1.1, an adapter plate substrate: providing an adapter plate substrate, wherein the adapter plate substrate is a copper-clad plate with copper foils on the upper end surface and the lower end surface;
s1.2, drilling: the adapter plate base plate comprises a first adapter plate base plate (1), and positioning holes are drilled in the first adapter plate base plate (1);
s1.3, single-side copper reduction and browning: carrying out copper reduction and browning on the upper end face of the first adapter plate substrate (1);
s1.4, laser: at least two first blind holes (101) are formed in the upper end face of the first adapter plate substrate (1) in a laser mode;
s1.5, single-side copper deposition and electroplating: carrying out copper deposition electroplating on the upper end face of the first adapter plate substrate (1);
s1.6, etching the base and the bonding pad: etching at least two bases (102) on the lower end face of the first adapter plate substrate (1), wherein the size and the position of each base (102) are consistent with the size and the position of a Mini-LED pad (301) of a Mini-LED plate (3) to be tested; etching at least two first bonding pads (103) on the upper end face of the first adapter plate substrate (1), wherein the base (102) is bridged with the first bonding pads (103) through the first blind holes (101);
s3.1, forming an adapter plate: the adapter plate substrate is processed through the steps to form the adapter plate;
s4, electrical measurement: and conducting a power-on test between the base (102) of the adapter plate and the Mini-LED bonding pad (301) of the Mini-LED plate (3) to be tested.
2. The electrical testing method for the high-precision Mini-LED board of claim 1, wherein in step S1.1, the interposer substrate: H-TG FR4 material was used, copper was H/H thick.
3. The method for electrically testing a high-precision Mini-LED board according to claim 1,
in step S1.3, the thickness of the copper reduction and brown oxidation of the upper end face of the first adapter plate substrate (1) is 7-9 microns;
in step S1.4, the aperture of a first blind hole (101) for laser emission on the upper end surface of the first adapter plate substrate (1) is controlled to be 90 +/-10 microns;
in step S1.5, the thickness of the electroplated copper on the upper end surface of the first adapter plate substrate (1) is 20 micrometers, and the recess of the first blind via (101) is controlled within 5 micrometers;
in step S1.6, the size of the pedestal (102) etched on the lower end face of the first adapter plate substrate (1) is 60 micrometers long and 10 micrometers wide; a first bonding pad (103) etched on the upper end face of the first adapter plate substrate (1) is a circular bonding pad with the diameter of 150 microns; the distance between the edges of the two first bonding pads (103) is 50 microns, and the distance is consistent with the distance between the Mini-LED bonding pads (301) of the Mini-LED board (3) to be tested.
4. The electrical testing method for the high-precision Mini-LED board of claim 1, wherein in step S1.6, a wet film, dupont 8630 dry film, is used for etching on the first adapter board substrate (1).
5. A method for testing a high-precision Mini-LED board according to any one of claims 1 to 4, wherein the following steps are provided between step S1.6 and step S3.1:
s2.1, pressing: the adapter plate substrate further comprises a second adapter plate substrate (2), the second adapter plate substrate (2) is arranged on the upper end face of the first adapter plate substrate (1), and a prepreg is adopted for laminating between the second adapter plate substrate (2) and the first adapter plate substrate (1);
s2.2, drilling: drilling a positioning hole on the second adapter plate substrate (2);
s2.3, single-side copper reduction and browning: carrying out copper reduction and browning on the upper end surface of the second adapter plate substrate (2);
s2.4, single-side laser: at least two second blind holes (201) are formed in the upper end face of the second adapter plate substrate (2) in a laser mode;
s2.5, copper deposition and electroplating: carrying out copper deposition electroplating on the upper end surface of the second adapter plate substrate (2);
s2.6, single-side etching of the bonding pad: at least two second bonding pads (202) are etched on the upper end face of the second adapter board substrate (2), and the first bonding pad (103) and the second bonding pad (202) are bridged through the second blind holes (201).
6. The electrical testing method for a high-precision Mini-LED board as claimed in claim 5, wherein in step S2.1, pressing with 1080PP is performed.
7. The method for electrically testing a high-precision Mini-LED board according to claim 5,
in step S2.3, the thickness of the copper-reducing browning on the upper end surface of the second adapter plate substrate (2) is 7 to 9 micrometers;
in step S2.4, the aperture of the second blind via (201) formed by laser-emitting on the upper end surface of the second adapter plate substrate (2) is controlled to be 90 ± 10 microns;
in step S2.5, the thickness of the electroplated copper on the upper end surface of the second adapter plate substrate (2) is 20 micrometers, and the recess of the second blind via (201) is controlled within 5 micrometers;
in step S2.6, the second bonding pad (202) etched on the upper end surface of the second adaptor board substrate (2) is a circular bonding pad with a diameter of 300 micrometers; the distance between the edges of the two second bonding pads (202) is 50 microns, and the distance is consistent with the distance between the Mini-LED bonding pads (301) of the Mini-LED board (3) to be tested.
8. A method for electrically testing a high-precision Mini-LED board according to claim 5, wherein in step S2.6, a dry film is used in the process of etching the second bonding pad (202) on the upper end face of the second adaptor board substrate (2).
9. The method for electrically testing a high-precision Mini-LED board according to any one of claims 1 to 4 and 6 to 8, wherein the following steps are provided between step S3.1 and step S4: s3.2, gold melting: and carrying out gold dissolving process treatment on the adapter plate.
10. The method for electrically testing a high-precision Mini-LED board according to claim 9, wherein the following steps are included between step S3.2 and step S4: s3.3, forming: and cutting the adapter plate into specifications with required sizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117129.5A CN114137383A (en) | 2022-02-08 | 2022-02-08 | High-precision Mini-LED board electric measurement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117129.5A CN114137383A (en) | 2022-02-08 | 2022-02-08 | High-precision Mini-LED board electric measurement method |
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