CN114133897A - High-temperature-resistant acrylic glue and use method and application thereof - Google Patents
High-temperature-resistant acrylic glue and use method and application thereof Download PDFInfo
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- CN114133897A CN114133897A CN202111586973.4A CN202111586973A CN114133897A CN 114133897 A CN114133897 A CN 114133897A CN 202111586973 A CN202111586973 A CN 202111586973A CN 114133897 A CN114133897 A CN 114133897A
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 239000003292 glue Substances 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 41
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims abstract description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 10
- 150000003254 radicals Chemical class 0.000 claims abstract description 8
- 239000012986 chain transfer agent Substances 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 33
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 24
- 238000002156 mixing Methods 0.000 claims description 23
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 22
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 16
- 239000002994 raw material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 10
- 239000012452 mother liquor Substances 0.000 claims description 10
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 claims description 8
- 239000012948 isocyanate Substances 0.000 claims description 7
- 150000002513 isocyanates Chemical class 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 claims description 3
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 239000010413 mother solution Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 22
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- MTLWTRLYHAQCAM-UHFFFAOYSA-N 2-[(1-cyano-2-methylpropyl)diazenyl]-3-methylbutanenitrile Chemical compound CC(C)C(C#N)N=NC(C#N)C(C)C MTLWTRLYHAQCAM-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides high-temperature-resistant acrylic glue and a use method and application thereof, wherein the high-temperature-resistant acrylic glue comprises a component A and a component B, the component A comprises a combination of acrylate monomers, alpha-methyl styrene monomers, a free radical initiator, a chain transfer agent and tackifying resin in specific parts, the component B is a curing agent, and the component A is prepared by selecting the acrylate monomers, the alpha-methyl styrene monomers and the tackifying resin in specific parts to match with each other, so that the finally obtained acrylic glue still has high peeling force at 80 ℃, meanwhile, the cohesion of the high-temperature-resistant acrylic glue is improved, the high-temperature-resistant acrylic glue is not easy to have residual glue at high temperature, and the high-temperature-resistant acrylic glue is suitable for being used in electronic products.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to high-temperature-resistant acrylic glue and a using method and application thereof.
Background
The solvent type acrylate (pressure sensitive adhesive) occupies an important position in the field of electronic industrial adhesive tapes, the pressure sensitive adhesive is a high molecular substance with viscosity and high elasticity, and the modulus of the pressure sensitive adhesive is generally required to be less than 10-5Mpa has viscosity at normal temperature, and the peeling force of the pressure sensitive adhesive is low at high temperature just because the modulus is low, for example, many glues with the adhesive force of more than 2000gf/25mm at normal temperature and only 600gf/25mm at 80 ℃ greatly limit the use of the pressure sensitive adhesive tape at high temperature. The electronic product moduleThe shading sticky tape of using can lead to the heat can not in time distribute away because of the heat accumulation in the use to lead to some electronic components's temperature to constantly rise, can rise to 50 ~ 100 ℃ in summer, the viscidity of pressure sensitive adhesive drops sharply under this temperature, leads to the phenomenon that the module that attaches in advance pops open to appear easily, thereby causes scrapping of complete machine.
In order to improve the problem of low adhesion of pressure-sensitive adhesives at high temperatures, a common technique is to add some heat-resistant inorganic fillers, such as boron carbide or silicon carbide, into the adhesives to improve the peeling strength of the adhesives at high temperatures. CN107384260A discloses a high-temperature-resistant emulsion type acrylate adhesive, which comprises the following components in parts by weight: 20-33 parts of soft monomer, 15-35 parts of hard monomer, 8-16 parts of functional monomer, 3-8 parts of modified filler, 1-5 parts of talcum powder, 0.03-0.2 part of defoaming agent, 0.5-1 part of emulsifier, 0.1-0.4 part of initiator, 0.01-0.05 part of thickener, 0.5-1 part of dispersing agent and 15-28 parts of deionized water. The acrylate adhesive disclosed by the invention has the advantages of good stability, excellent bonding property, good mechanical property, high temperature resistance and low preparation cost. CN110330867A discloses an epoxy modified acrylic resin composition and a processing method applied to a metal substrate, wherein the resin composition comprises the following components in parts by weight: 40-60 parts by weight of epoxy modified acrylic resin prepolymer; 5-15 parts of reactive diluent; 0.01-0.05 part by weight of an ultraviolet initiator; 2-5 parts by weight of a crosslinking agent; 0.05-0.1 part by weight of a polymerization inhibitor; 0.5-2 parts of an auxiliary agent; 20-40 parts by weight of a filler; the components are mixed according to the proportion, dispersed and mixed by adopting high-speed shearing and stirring, and the required epoxy modified acrylate resin composition is prepared by standing and defoaming treatment. After the composition containing the epoxy modified acrylate resin is cured by UV light, the hardness, acid and alkali etching resistance, high temperature resistance and adhesion with the surface of a metal substrate of a cured product are all superior to those of a traditional protective film, the risk of scratching can be reduced, and meanwhile, the bonding force between an epoxy layer and a metal surface is improved, so that the epoxy layer and the metal surface are tightly bonded. CN105349072A discloses a high-temperature resistant shading adhesive composition, which comprises the following components in parts by weight: 100 parts of acrylic acid adhesive, 0.5-1.0 part of isocyanate crosslinking agent, 45-70 parts of heat conducting particles, 0.5-1.5 parts of black paste and 0.5-1.0 part of silane coupling agent; also relates to a preparation method of the adhesive composition, an adhesive tape using the adhesive composition and a preparation method of the adhesive tape. According to the invention, by adding the heat-conducting particles, the black paste, the isocyanate crosslinking agent and the silane coupling agent, the heat conductivity coefficient of the acrylic adhesive is improved, the heat conductivity of the adhesive tape is improved, the thermal stress of the adhesive tape is reduced, and the high-temperature-resistant shading adhesive composition with excellent high-temperature resistance and good thermal stability and the high-temperature-resistant shading adhesive tape using the high-temperature-resistant shading adhesive composition are prepared.
Although the peeling force of the glue provided by the prior art at high temperature is improved, the adopted physical modification only enables the filler to have a simple filling effect in a glue matrix, and the filler cannot be organically combined with acrylic resin after being added, so that the cohesive deformation of the glue is caused, and the residual glue is easy to exist at high temperature.
Therefore, the development of a high temperature resistant acrylic glue with high peeling force and cohesion at high temperature is a technical problem which needs to be solved urgently in the field.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide high-temperature-resistant acrylic glue and a using method and application thereof, wherein the high-temperature-resistant acrylic glue comprises a component A and a component B, the preparation raw material of the component A comprises the combination of acrylate monomers, alpha-methyl styrene monomers, free radical initiators, chain transfer agents and tackifying resins in specific parts, and the component B is a curing agent; the acrylic glue with high peeling force and cohesion at high temperature is obtained by selecting the acrylate monomer and the alpha-methyl styrene monomer in the component A for matching.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides high-temperature-resistant acrylic glue, which comprises a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the component B is a curing agent.
Wherein the acrylate monomer may be 7 parts by weight, 9 parts by weight, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight or 28 parts by weight, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive.
The α -methylstyrene monomer can be 15, 20, 25, 30, 35, 40, or 45 parts by weight, and specific values therebetween are not exhaustive for the purpose of brevity and clarity.
The free radical initiator may be present in an amount of 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, or 4.5 parts by weight, and specific values therebetween, not exhaustive of the specific values included in the ranges, limited to space and for brevity.
The chain transfer agent may be 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, or 4.5 parts by weight, and specific points therebetween, not exhaustive list of the specific points included in the range for brevity and clarity.
The tackifying resin may be 2 parts by weight, 4 parts by weight, 6 parts by weight, 8 parts by weight, 10 parts by weight, 12 parts by weight, 14 parts by weight, 16 parts by weight, or 18 parts by weight, and specific points therebetween, are not exhaustive for the invention and are included for brevity.
In the invention, the acrylate monomer and the alpha-methyl styrene monomer are adopted as main components of the component A in the high-temperature resistant acrylic glue, the acrylate monomer and the alpha-methyl styrene monomer are matched with each other, and the tackifying resin with a specific part is added, so that the finally obtained glue has higher cohesive force and stripping force at high temperature, and residual glue is not easy to generate at high temperature.
It should be noted that the high temperature resistant acrylic glue of the present invention refers to an acrylic glue having an adhesion of not less than 1200gf/25mm at 80 ℃.
Preferably, the acrylate monomer comprises any one of methyl methacrylate, isopropyl methacrylate or 2-hydroxypropyl methacrylate or a combination of at least two thereof.
Preferably, the free radical initiator comprises any one of azobisisobutyronitrile, azobisisovaleronitrile or dimethyl azobisisobutyrate or a combination of at least two of these.
Preferably, the chain transfer agent comprises dodecyl mercaptan.
Preferably, the curing agent comprises an isocyanate-based curing agent.
Preferably, the curing agent is contained in the high temperature resistant acrylic glue in an amount of 0.1 to 10 parts by weight, for example, 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight or 9 parts by weight, and specific values therebetween are not exhaustive, and for brevity and clarity, the specific values included in the range are not limited.
Preferably, the preparation raw materials of the A component also comprise a solvent.
Preferably, the solvent comprises a combination of toluene, methyl ethyl ketone and methyl acrylate.
Preferably, the mass percentage of toluene in the raw material for preparing the component a is 10 to 30 parts by weight, for example, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight or 28 parts by weight, and specific values therebetween are not limited to space and for brevity, and the invention is not exhaustive.
Preferably, the mass percentage of the butanone in the raw material for preparing the component a is 10-30 parts by weight, such as 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight or 28 parts by weight, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive.
Preferably, the amount of the methyl acrylate in the raw material for preparing the a component is 30 to 50 parts by weight, for example, 33 parts by weight, 36 parts by weight, 39 parts by weight, 42 parts by weight, 45 parts by weight, 48 parts by weight, 51 parts by weight, 54 parts by weight or 57 parts by weight, and specific values therebetween are not exhaustive, and the invention is not limited to the specific values included in the ranges for brevity.
Preferably, the component A is prepared by the following method, and the method comprises the following steps:
(1) mixing an acrylate monomer and a solvent to obtain an acrylic acid mother solution;
(2) and (2) reacting the acrylic acid mother liquor obtained in the step (1), an alpha-methyl styrene monomer, a free radical initiator, a chain transfer agent and tackifying resin to obtain the component A.
Preferably, the mixing in step (1) specifically comprises: and mixing acrylate monomers, toluene and butanone, and then adding methyl acrylate for mixing to obtain the acrylic acid mother liquor.
Preferably, the mixing time of the acrylic monomer, toluene and butanone is 1 to 3 hours, such as 1.2 hours, 1.4 hours, 1.6 hours, 1.8 hours, 2 hours, 2.2 hours, 2.4 hours, 2.6 hours or 2.8 hours, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive of the specific values included in the range.
Preferably, the mixing time for the additional addition of methyl acrylate for mixing is 1 to 3 hours, such as 1.2 hours, 1.4 hours, 1.6 hours, 1.8 hours, 2 hours, 2.2 hours, 2.4 hours, 2.6 hours or 2.8 hours, and the specific values therebetween are not exhaustive, and for the sake of brevity and clarity, the invention is not intended to be exhaustive.
Preferably, the reaction temperature in step (2) is 70-90 ℃, such as 72 ℃, 74 ℃, 76 ℃, 78 ℃, 80 ℃, 82 ℃, 84 ℃, 86 ℃ or 88 ℃, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive of the specific values included in the range.
Preferably, the reaction time in step (2) is 3-5 h, such as 3.2h, 3.4h, 3.6h, 3.8h, 4h, 4.2h, 4.4h, 4.6h or 4.8h, and the specific values therebetween are not exhaustive, and for brevity and clarity, the invention is not intended to be limited to the specific values included in the range.
In a second aspect, the present invention provides a method for using the high temperature resistant acrylic glue according to the first aspect, wherein the method comprises: and mixing the component A and the component B, directly coating the mixture on the surface of the matrix, and curing to obtain the matrix with the high-temperature-resistant acrylic glue coating.
In a third aspect, the present invention provides a use of the high temperature resistant acrylic glue according to the first aspect in the electronic industry.
Compared with the prior art, the invention has the following beneficial effects:
the high-temperature-resistant acrylic glue provided by the invention comprises a component A and a component B, wherein the component A comprises a combination of acrylate monomers, alpha-methylstyrene monomers, a free radical initiator, a chain transfer agent and tackifying resin in specific parts, the component B is a curing agent, and the component A is prepared by selecting the acrylate monomers, the alpha-methylstyrene monomers and the tackifying resin in specific parts to be matched with each other, so that the finally obtained acrylic glue still has high peeling force at high temperature (80 ℃), specifically, the adhesive force of the acrylic glue provided by the invention at 23 ℃ is 1300-2000 gf/25mm, the adhesive force at 80 ℃ is 1250-1500 gf/25mm, the holding power is 0.1-0.5 mm, the initial adhesive force is 6-12, and the constant load is 0.5-20 mm; the three components are combined together, so that the cohesive force of the acrylic acid glue is improved, the acrylic acid glue is not prone to residual glue at high temperature, and the acrylic acid glue is suitable for being used in electronic products.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The high-temperature-resistant acrylic glue comprises a component A and a component B;
the component A comprises the following raw materials in parts by weight:
the preparation method of the component A comprises the following steps:
(1) mixing isopropyl methacrylate, toluene and butanone for 2 hours under the condition of stirring, adding methyl acrylate, and mixing for 2 hours under the condition of stirring to obtain the acrylic mother liquor;
(2) and (2) reacting the acrylic acid mother liquor obtained in the step (1), alpha-methyl styrene monomer (Kreviley, W-85), azobisisobutyronitrile, dodecyl mercaptan and tackifying resin (Tayilai, FTR6100) at 80 ℃ for 4 hours to obtain the component A.
The component B is isocyanate (Bayer, L-45).
Example 2
The high-temperature-resistant acrylic glue is different from the acrylic glue in the example 1 only in that the addition amount of the alpha-methyl styrene monomer in the component A is 20 parts by weight, and other components, the use amount and the preparation method are the same as those in the example 1.
Example 3
The high-temperature-resistant acrylic glue is different from the high-temperature-resistant acrylic glue in example 1 only in that the addition amount of the alpha-methyl styrene monomer in the component A is 30 parts by weight, and other components, the use amount and the preparation method are the same as those in example 1.
Example 4
The high-temperature-resistant acrylic glue is different from the acrylic glue in the example 1 only in that the addition amount of the alpha-methyl styrene monomer in the component A is 40 parts by weight, and other components, the use amount and the preparation method are the same as those in the example 1.
Example 5
The high-temperature-resistant acrylic glue comprises a component A and a component B;
the component A comprises the following raw materials in parts by weight:
the preparation method of the component A comprises the following steps:
(1) mixing isopropyl methacrylate, toluene and butanone for 3 hours under the condition of stirring, adding methyl acrylate, and mixing for 1 hour under the condition of stirring to obtain the acrylic acid mother liquor;
(2) and (2) reacting the acrylic acid mother liquor obtained in the step (1), alpha-methyl styrene monomer (Kreviley, W-85), azodiisovaleronitrile, dodecyl mercaptan and tackifying resin (Tayilai, FTR6100) at 70 ℃ for 5 hours to obtain the component A.
The component B is isocyanate (Bayer, L-45).
Example 6
The high-temperature-resistant acrylic glue comprises a component A and a component B;
the component A comprises the following raw materials in parts by weight:
the preparation method of the component A comprises the following steps:
(1) mixing isopropyl methacrylate, toluene and butanone for 1h under the condition of stirring, adding methyl acrylate, and mixing for 3h under the condition of stirring to obtain the acrylic acid mother liquor;
(2) and (2) reacting the acrylic acid mother liquor obtained in the step (1), alpha-methyl styrene monomer (Krevili, W-85), dimethyl azodiisobutyrate, dodecyl mercaptan and tackifying resin (Tayilai, FTR6100) at 90 ℃ for 3 hours to obtain the component A.
The component B is isocyanate (Bayer, L-45).
Comparative example 1
An acrylic glue is different from the acrylic glue in example 1 only in that no alpha-methyl styrene monomer is added in the component A, the addition amount of isopropyl methacrylate is 30 parts by weight, and other components, the use amount and the preparation method are the same as those in example 1.
Comparative example 2
An acrylic glue is different from the acrylic glue in example 1 only in that isopropyl methacrylate is not added in the component A, the addition amount of an alpha-methyl styrene monomer is 30 parts by weight, and other components, the use amount and the preparation method are the same as those in example 1.
Comparative example 3
An acrylic glue which is different from the acrylic glue in the embodiment 1 only in that no tackifying resin is added in the component A, the addition amount of isopropyl methacrylate is 22 parts by weight, the addition amount of alpha-methyl styrene monomer is 11 parts by weight, and other components, the use amount and the preparation method are the same as those in the embodiment 1.
And (3) performance testing:
uniformly mixing the component A and the component B of the prepared acrylic acid glue according to the liquid-liquid ratio of 100:1, and then coating a layer of glue layer of 25 +/-2 mu m on a transparent PET substrate of 25 mu m to prepare a tape test piece;
(1) adhesive force: testing according to a testing method provided by GB/T2792;
(2) initial adhesion: the test was carried out according to the test method provided in GB/T4852.
The acrylic acid glues provided in examples 1 to 6 and comparative examples 1 to 3 were tested according to the above test method, and the test results are shown in table 1:
TABLE 1
As can be seen from the data in table 1: the acrylic acid glue provided by the invention has excellent stripping force and higher adhesive force; specifically, the acrylic adhesives provided in examples 1 to 6 have an adhesive force of 1300 to 2000gf/25mm at 23 ℃, an adhesive force of 1250 to 1500gf/25mm at 80 ℃, and an initial adhesive force of 6 to 12 #.
Comparing example 1 with comparative example 1, it can be found that the acrylic glue obtained without adding alpha-methyl styrene monomer to component A has an adhesive force of only 500gf/25mm at 80 deg.C, indicating that its high temperature resistance is poor; and the initial adhesion is also greatly reduced compared with example 1.
Comparing example 1 with comparative example 2, it can be seen that the adhesion force of the acrylic glue obtained without adding the acrylic ester monomer in the component A at 80 ℃ is only 600gf/25mm, which indicates that the high temperature resistance is poor; and the initial adhesion is also greatly reduced compared with example 1.
Comparing example 1 with comparative example 3, it can be seen that the initial adhesion and the adhesion of the acrylic glue obtained without adding the tackifying resin to the component A are reduced compared to example 1.
The applicant states that the present invention is illustrated by the above examples to show a high temperature resistant acrylic glue and its application method and application, but the present invention is not limited to the above examples, i.e. it does not mean that the present invention must rely on the above examples to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The high-temperature-resistant acrylic glue is characterized by comprising a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the component B is a curing agent.
2. The high-temperature-resistant acrylic glue according to claim 1, wherein the acrylate monomer comprises any one or a combination of at least two of methyl methacrylate, isopropyl methacrylate and 2-hydroxypropyl methacrylate.
3. The high-temperature-resistant acrylic glue according to claim 1 or 2, wherein the radical initiator comprises any one of azodiisobutyronitrile, azodiisovaleronitrile or dimethyl azodiisobutyrate or a combination of at least two of the azodiisobutyronitrile and the azodiisovaleronitrile;
preferably, the chain transfer agent comprises dodecyl mercaptan.
4. The high-temperature-resistant acrylic glue according to any one of claims 1 to 3, wherein the curing agent comprises an isocyanate curing agent;
preferably, the content of the curing agent in the high-temperature-resistant acrylic glue is 0.1-10 parts by weight.
5. The high-temperature-resistant acrylic glue according to any one of claims 1 to 4, wherein a solvent is further included in the raw materials for preparing the component A;
preferably, the solvent comprises a combination of toluene, methyl ethyl ketone, and methyl acrylate;
preferably, the mass percentage of the toluene in the raw materials for preparing the component A is 10-30 parts;
preferably, the mass percentage of the butanone in the raw materials for preparing the component A is 10-30 parts;
preferably, the content of the methyl acrylate in the raw materials for preparing the component A is 30-50 parts by weight.
6. The high-temperature-resistant acrylic glue according to any one of claims 1 to 5, wherein the component A is prepared by a method comprising the following steps:
(1) mixing an acrylate monomer and a solvent to obtain an acrylic acid mother solution;
(2) and (2) reacting the acrylic acid mother liquor obtained in the step (1), an alpha-methyl styrene monomer, a free radical initiator, a chain transfer agent and tackifying resin to obtain the component A.
7. The high-temperature-resistant acrylic glue according to claim 6, wherein the mixing in step (1) specifically comprises: mixing acrylate monomers, toluene and butanone, and then adding methyl acrylate for mixing to obtain the acrylic acid mother liquor;
preferably, the mixing time of the acrylic monomer, the toluene and the butanone is 1-3 h;
preferably, the mixing time for adding and mixing the methyl acrylate is 1-3 h.
8. The high-temperature-resistant acrylic glue according to claim 6 or 7, wherein the reaction temperature in the step (2) is 70-90 ℃;
preferably, the reaction time in the step (2) is 3-5 h.
9. The use method of the high-temperature-resistant acrylic glue according to any one of claims 1 to 8, wherein the use method comprises the following steps: and mixing the component A and the component B, directly coating the mixture on the surface of the matrix, and curing to obtain the matrix with the high-temperature-resistant acrylic glue coating.
10. The use of the high-temperature resistant acrylic glue according to any one of claims 1 to 8 in the electronic industry.
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| CN113372856A (en) * | 2021-04-29 | 2021-09-10 | 江苏斯瑞达材料技术股份有限公司 | High-temperature-resistant acrylic acid glue and preparation method thereof |
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| CN110591610A (en) * | 2019-10-14 | 2019-12-20 | 上海固柯胶带科技有限公司 | Pressure-sensitive adhesive |
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