CN114127606A - Optical element holder and optical component - Google Patents
Optical element holder and optical component Download PDFInfo
- Publication number
- CN114127606A CN114127606A CN202080049061.0A CN202080049061A CN114127606A CN 114127606 A CN114127606 A CN 114127606A CN 202080049061 A CN202080049061 A CN 202080049061A CN 114127606 A CN114127606 A CN 114127606A
- Authority
- CN
- China
- Prior art keywords
- optical element
- element holder
- resin composition
- optical
- range
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 223
- 239000011342 resin composition Substances 0.000 claims abstract description 54
- 230000004927 fusion Effects 0.000 claims abstract description 38
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 35
- 238000002844 melting Methods 0.000 claims abstract description 30
- 230000008018 melting Effects 0.000 claims abstract description 30
- 238000000113 differential scanning calorimetry Methods 0.000 claims abstract description 13
- 238000004132 cross linking Methods 0.000 description 28
- 238000000465 moulding Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 13
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 8
- 229910003475 inorganic filler Inorganic materials 0.000 description 8
- 239000004952 Polyamide Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- 229920003189 Nylon 4,6 Polymers 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 229920000299 Nylon 12 Polymers 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 240000000797 Hibiscus cannabinus Species 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- VVYDVQWJZWRVPE-UHFFFAOYSA-L dimethyltin(2+);diiodide Chemical compound C[Sn](C)(I)I VVYDVQWJZWRVPE-UHFFFAOYSA-L 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DZCCLNYLUGNUKQ-UHFFFAOYSA-N n-(4-nitrosophenyl)hydroxylamine Chemical compound ONC1=CC=C(N=O)C=C1 DZCCLNYLUGNUKQ-UHFFFAOYSA-N 0.000 description 1
- DDLUSQPEQUJVOY-UHFFFAOYSA-N nonane-1,1-diamine Chemical compound CCCCCCCCC(N)N DDLUSQPEQUJVOY-UHFFFAOYSA-N 0.000 description 1
- 229920006119 nylon 10T Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- -1 polypropylene, ethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00038—Production of contact lenses
- B29D11/00048—Production of contact lenses composed of parts with dissimilar composition
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
Abstract
An optical element holder according to the present invention is an optical element holder for holding an optical element, the optical element holder being composed of a resin composition for an optical element holder, the resin composition for an optical element holder containing a thermoplastic resin as a main component, the resin composition for an optical element holder having a melting curve obtained by differential scanning calorimetry analysis at a temperature increase rate of 10 ℃/min having 2 peaks in a range of 160 ℃ to 230 ℃ and a range of 260 ℃ to 320 ℃, and a ratio of a heat of fusion in the range of 160 ℃ to 230 ℃ to a total heat of fusion being 20% to 80%.
Description
Technical Field
The invention relates to an optical element holder and an optical component.
The priority of japanese application No. 2019-135671, filed on 23/7/2019, is incorporated by reference in its entirety.
Background
In recent years, optical fibers have been widely used in various electronic devices having communication units. An optical connector for connecting the optical fibers has an optical component having a lens and an optical element holder for holding the lens and inserting and removing the optical fibers. Conventionally, a method has been employed in which an optical element holder is formed of a material different from that of a lens, and the lens and the optical element holder are assembled by using an ultraviolet curing adhesive or the like after active alignment.
However, this assembly requires high precision and therefore is costly, and the adhesiveness between the optical element holder and the optical element in two-color molding is insufficient, and the lens and the optical element holder may be displaced or peeled off under the influence of the environment, thereby impairing the optical characteristics. Therefore, in order to mass-produce an optical component including an optical element and a holder made of different materials with excellent positional accuracy and improve adhesion, a method of crosslinking the optical element and the holder after two-color molding has been proposed. According to this method, the optical element and the optical element holder are assembled at the time of molding the other, and an adhesive agent and an assembling step are not required. Further, if a mold having good precision is used, a composite of an optical element and an optical element holder having high positional precision can be mass-produced with excellent productivity (see japanese patent application laid-open No. 2007-141416).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2007-141416.
Disclosure of Invention
An optical element holder of the present invention is an optical element holder for holding an optical element, which is composed of a resin composition for an optical element holder, wherein the resin composition for an optical element holder contains a thermoplastic resin as a main component, a melting curve of the resin composition for an optical element holder obtained by differential scanning calorimetry at a temperature rise rate of 10 ℃/min has 2 peaks in a range of 160 ℃ to 230 ℃ and a range of 260 ℃ to 320 ℃, and a ratio of a heat of fusion in the range of 160 ℃ to 230 ℃ to a total heat of fusion is 20% to 80%.
An optical member of the present invention includes an optical element and an optical element holder for holding the optical element by heat fusion, wherein the optical element holder is composed of a resin composition for an optical element holder, the resin composition for an optical element holder contains a thermoplastic resin as a main component, a melting curve of the resin composition for an optical element holder obtained by differential scanning calorimetry of a temperature rise rate of 10 ℃/min has 2 peaks in a range of 160 ℃ to 230 ℃ and a range of 260 ℃ to 320 ℃, and a ratio of a heat of fusion in a range of 160 ℃ to 230 ℃ to a total heat of fusion is 20% to 80%.
Drawings
Fig. 1 is a diagram showing an example of a melting curve obtained by differential scanning calorimetry in an example.
Detailed Description
[ problems to be solved by the invention ]
In recent years, as surface mounting of electronic components has been carried out, a reflow soldering method has been adopted in which solder paste is printed on a joint portion of a printed circuit board, the electronic component is mounted thereon, and the printed circuit board is sent to a reflow soldering furnace to be melted and joined. The optical component is mounted on various electronic devices by a reflow soldering method. In this reflow soldering method, a lead-free solder having a high melting point is used from the viewpoint of environmental protection. As a result, the demand for heat resistance has become higher, and even for the optical element holder and the optical element, heat resistance that maintains high rigidity at a temperature of about 260 ℃ in the reflow furnace, that is, heat resistance for the reflow furnace has been demanded.
Therefore, a resin having a high melting point and a high softening point is used for the optical element holder and the optical element. However, when the two-color molding is performed using a thermoplastic resin having a large difference in melting point and softening point as the resin used for the optical element holder and the optical element, the adhesion between the optical element such as a lens or a mirror and the optical element holder tends to be insufficient, and particularly, a gap may easily occur between the lens and the optical element holder, and the lens may easily peel off.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical element holder which can improve adhesiveness when two-color molding is performed between the optical element holder and an optical element, and which has high heat resistance that can be compatible with a reflow furnace.
[ Effect of the invention ]
According to the present invention, it is possible to provide an optical element holder which can improve adhesiveness when two-color molding is performed between the optical element holder and an optical element and which has high heat resistance that can be compatible with a reflow furnace.
[ description of embodiments of the invention ]
First, the embodiments of the present invention will be described below.
An optical element holder of the present invention is an optical element holder for holding an optical element, and is composed of a resin composition for an optical element holder, wherein the resin composition for an optical element holder contains a thermoplastic resin as a main component, a melting curve of the resin composition for an optical element holder obtained by differential scanning calorimetry analysis at a temperature rise rate of 10 ℃/min has 2 peaks in a range of 160 ℃ to 230 ℃ and a range of 260 ℃ to 320 ℃, and a ratio of a heat of fusion in the range of 160 ℃ to 230 ℃ to a total heat of fusion is 20% to 80%.
The optical element holder is composed of a resin composition for an optical element holder, wherein the resin composition for an optical element holder has a melting curve obtained by differential scanning calorimetry analysis at a temperature rise rate of 10 ℃/min having 2 peaks in the temperature range, and a ratio of a heat of fusion in a range of 160 ℃ to 230 ℃ to a total heat of fusion is in the range, and when two-color molding is performed between the optical element holder and the optical element, only the surface of the optical element holder is melted at a contact surface between the optical element holder and the optical element. Therefore, the optical element holder and the optical element are thermally welded while maintaining the shape while having good adhesion. Further, the solder paste has high heat resistance that can be applied to a reflow furnace. The "resin composition for an optical element holder" in the present invention means a material constituting the molded optical element holder. Here, the "peak temperature" refers to a temperature indicating an endothermic peak caused by melting of the resin in a melting curve measured by a Differential Scanning Calorimeter (DSC). "principal component" means the component in the largest amount. The "total heat of fusion" is the sum of the values of the heat of fusion obtained from the areas of the peaks. "thermal welding" refers to a technique of joining thermoplastic resins to each other, and ultrasonic welding, high-frequency welding, and the like are also included in thermal welding in a broad sense.
The optical member of the present invention includes an optical element and an optical element holder for holding the optical element by heat fusion, wherein the optical element holder is composed of a resin composition for an optical element holder, the resin composition for an optical element holder contains a thermoplastic resin as a main component, a melting curve of the resin composition for an optical element holder obtained by differential scanning calorimetry of a temperature rise rate of 10 ℃/min has 2 peaks in a range of 160 ℃ to 230 ℃ inclusive and a range of 260 ℃ to 320 ℃ inclusive, and a ratio of a heat of fusion in a range of 160 ℃ to 230 ℃ inclusive to a total heat of fusion is 20% to 80% inclusive.
The optical component comprises an optical element and an optical element holder for holding the optical element by heat fusion, wherein the optical element holder is composed of a resin composition for an optical element holder, a melting curve of the resin composition for an optical element holder obtained by differential scanning calorimetry analysis with a temperature rise rate of 10 ℃/min has 2 peaks in the temperature range, and the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ is in the range, whereby the optical element holder and the optical element can be heat fused while maintaining the shape and having good adhesion. Further, the solder paste has high heat resistance that can be applied to a reflow furnace.
[ details of embodiments of the present invention ]
Hereinafter, the optical element holder and the optical member according to the embodiment of the present invention will be described in detail with reference to the drawings.
< optical element holder >
The optical element holder is a holder for holding an optical element such as a lens or a mirror made of resin. The optical element holder is composed of a resin composition for an optical element holder.
(resin composition for optical element holder)
The resin composition for an optical element holder contains a thermoplastic resin as a main component. The resin composition for an optical element holder has 2 peaks in a melting curve obtained by differential scanning calorimetry at a temperature rise rate of 10 ℃/min in a range of 160 ℃ to 230 ℃ inclusive and in a range of 260 ℃ to 320 ℃ inclusive. The melting curve was determined by differential scanning calorimetry under the following conditions. Using a differential scanning calorimeter, 8mg of the sample was heated from-50 ℃ to 350 ℃ at a heating rate of 10 ℃ per minute in a nitrogen atmosphere. The heat of fusion was determined by calculating the area of each of the 2 peaks. When the peak is a plurality of peaks, the heat of solution is determined by calculating the area of all the peaks.
The lower limit of the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ of the resin composition for an optical element holder to the total heat of fusion is 20%, preferably 30%. The upper limit of the proportion of the heat of fusion in the range of 160 ℃ to 230 ℃ to the total heat of fusion is 80%, preferably 70%. When the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ is within the above range to the total heat of fusion, only the surface of the optical element holder melts at the contact surface between the optical element holder and the optical element when two-color molding is performed between the optical element holder and the optical element. The optical element holder and the optical element can be thermally welded while maintaining the shape while having good adhesion. Further, the solder paste has high heat resistance that can be applied to a reflow furnace.
< thermoplastic resin >
The resin composition for an optical element holder contains a thermoplastic resin as a main component. The thermoplastic resin preferably contains a thermoplastic resin having a melting curve having a peak in a range of 160 ℃ to 230 ℃ inclusive and a thermoplastic resin having a peak in a range of 260 ℃ to 320 ℃ inclusive, as determined by differential scanning calorimetry at a temperature increase rate of 10 ℃/min.
Examples of the thermoplastic resin having a peak in the range of 160 ℃ to 230 ℃ include, for example, a polyamide (melting point: 176 ℃) obtained by ring-opening polycondensation of lauryllactam and sold under the trade name of nylon 12, a polyamide (melting point: 187 ℃) obtained by ring-opening polycondensation of undecyllactam and sold under the trade name of nylon 11, and the like.
Examples of the thermoplastic resin having a peak in the range of 260 ℃ to 320 ℃ include polyamide mainly composed of nonanediamine and terephthalic acid (melting point: 308 ℃) commercially available under the trade name of nylon 9T or the like, polyamide mainly composed of butanediamine and adipic acid (melting point: 290 ℃) commercially available under the trade name of nylon 46 or the like, polyamide mainly composed of decanediamine and terephthalic acid (melting point: 285 ℃) commercially available under the trade name of nylon 10T or the like.
The lower limit of the content of the thermoplastic resin having a peak in the range of 160 ℃ to 230 ℃ in the thermoplastic resin is preferably 20% by mass, and more preferably 30% by mass. On the other hand, the upper limit of the content of the thermoplastic resin having a peak in the range of 160 ℃ to 230 ℃ is preferably 80% by mass, and more preferably 70% by mass.
The lower limit of the content of the thermoplastic resin in the resin composition for an optical element holder is preferably 30% by mass, and more preferably 40% by mass. On the other hand, the upper limit of the content of the thermoplastic resin is, for example, 99 mass%. However, the content of the thermoplastic resin may be 100% by mass. When the content of the thermoplastic resin is less than the lower limit, the dimensional stability of the optical element holder may be insufficient.
The resin composition for an optical element holder is preferably crosslinked. By crosslinking the resin composition for an optical element holder, the heat resistance and mechanical strength of the optical element holder can be improved.
(additives)
The resin composition for an optical element holder preferably contains a filler and a crosslinking assistant as additives. The resin composition for an optical element holder can improve the dimensional stability of the optical element holder to which the optical element is bonded in a reflow furnace by containing the filler. The resin composition for an optical element holder can promote crosslinking by containing a crosslinking assistant.
Examples of the filler include: inorganic whiskers such as glass fibers, basic magnesium sulfate whiskers, zinc oxide whiskers, potassium titanate whiskers, and the like; inorganic fillers such as montmorillonite, synthetic montmorillonite, alumina, carbon fiber and the like; organic materials such as cellulose, kenaf, and aramid fibers; organoclays, and the like. Among these, glass fiber is preferable from the viewpoint of improving the dimensional stability of the optical element holder to which the optical element is joined in the reflow furnace.
When the resin composition for an optical element holder contains an inorganic filler, the lower limit of the content of the inorganic filler is preferably 10 parts by mass, and more preferably 20 parts by mass, based on 100 parts by mass of the thermoplastic resin. On the other hand, the upper limit of the content of the inorganic filler is preferably 100 parts by mass, and more preferably 80 parts by mass, relative to 100 parts by mass of the thermoplastic resin. When the content of the inorganic filler is less than the lower limit, the dimensional stability of the optical element holder to which the optical element is joined in the reflow furnace may be insufficient. Conversely, when the content of the inorganic filler exceeds the above upper limit, the optical element holder may not be easily molded.
Examples of the crosslinking assistant include: oximes such as p-benzoquinone dioxime, p' -dibenzoyl-p-quinone dioxime, and the like;
acrylic esters or methacrylic esters such as ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate, cyclohexyl methacrylate, acrylic acid/zinc oxide mixture, allyl methacrylate, etc.;
vinyl monomers such as divinylbenzene;
allyl compounds such as hexamethylenediallylnadiimide (hexamethylene bis allyl nadiimide), diallyl itaconate, diallyl phthalate, diallyl isophthalate, diallyl monoglycidyl isocyanurate (DA-MGIC), triallyl cyanurate, triallyl isocyanurate (TAIC), and the like;
maleimide compounds such as N, N ' -m-phenylene bismaleimide and N, N ' - (4,4 ' -methylenediphenylene) bismaleimide. From the viewpoint of effectively accelerating the crosslinking reaction, TMPTA, DA-MGIC and TAIC are preferable as the crosslinking assistant.
When the resin composition for an optical element holder contains the crosslinking assistant, the lower limit of the content of the crosslinking assistant is preferably 1 part by mass, and more preferably 3 parts by mass, based on 100 parts by mass of the thermoplastic resin. On the other hand, the upper limit of the content of the crosslinking assistant is preferably 15 parts by mass, and more preferably 10 parts by mass, based on 100 parts by mass of the thermoplastic resin. When the content of the crosslinking assistant is less than the lower limit, the crosslinking density of the optical element holder may decrease, and sufficient dimensional stability may not be obtained. On the other hand, when the content of the crosslinking assistant exceeds the upper limit, there is a possibility that a further accelerating effect of the crosslinking reaction cannot be obtained.
The resin composition for an optical element holder may contain other additive components than the inorganic filler and the crosslinking assistant, for example, an antioxidant, an ultraviolet absorber, a visible light absorber, a weather-resistant stabilizer, a copper inhibitor, a flame retardant, a lubricant, a conductive agent, a plating agent, a colorant, and the like, within a range not to impair the effects of the present invention.
When the resin composition for an optical element holder contains other additives other than the inorganic filler and the crosslinking assistant, the total content of the other additives may be, for example, more than 0 part by mass and 10 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin.
[ method for manufacturing optical element holder ]
The method of manufacturing the optical element holder preferably includes the steps of: molding a molding resin composition containing the thermoplastic resin and optional additives such as a filler and a crosslinking assistant; and a step of crosslinking the molded resin composition. Hereinafter, various steps will be described.
(Process for Molding)
In this step, a molding resin composition containing the thermoplastic resin and optional additives such as a filler and a crosslinking assistant is molded. The resin composition for an optical element holder can be produced by premixing the thermoplastic resin and optional components added as needed using a super mixer or the like, and then melt-kneading the premixed material using a single-shaft mixer, a twin-shaft mixer or the like. The specific temperature for the melt kneading is, for example, 180 ℃ to 360 ℃.
The method for molding the resin composition for an optical element holder is not particularly limited, and examples thereof include injection molding, extrusion molding, compression molding, and the like, and among these, injection molding is preferred. In the case where the resin composition for an optical element holder is molded by an injection molding method, the molding conditions can be set as examplesIf the cylinder temperature is 200 ℃ or more and 300 ℃ or less and the injection pressure is 20kg/cm2Above 3000kg/cm2The dwell time is 3 to 30 seconds inclusive, and the mold temperature is 30 to 100 ℃ inclusive.
(step of crosslinking)
In this step, the resin composition for an optical element holder is crosslinked. Examples of the crosslinking method include electron beam crosslinking by electron beam irradiation, thermal crosslinking by heating, and the like. Crosslinking by electron beam irradiation is preferable because crosslinking is easy to control without being limited by temperature and fluidity at the time of molding. From the viewpoint of obtaining heat resistance, the irradiation dose of the electron beam can be set to, for example, 10kGy or more and 1000kGy or less.
According to the optical element holder, adhesiveness between the optical element holder and the optical element at the time of two-color molding can be improved, and high heat resistance that can be compatible with a reflow furnace is provided.
< optical component >
The optical component includes an optical element and an optical element holder for holding the optical element by heat fusion.
The optical component is suitably used as an optical connector for connecting optical cables. The optical member is suitably used as optical elements such as light emitting elements and light emitting elements of devices such as optical communication devices, optical pickups in optical recording and reproducing devices, light emitting elements such as LED (light emitting diode) lens packages, and light receiving elements, in various electronic devices such as car navigators, CDs, MDs, DVDs, image sensors, camera modules, IR sensors, motion sensors, and remote controllers.
[ optical element ]
Examples of the optical element include a lens and a mirror. The lens and the mirror used for the optical member are required to have transparency. In the case of sensors and communication applications, the transmittance of light emitted from light emitting elements having a wavelength of 650nm, 850nm, 1300nm, or the like, VCSEL (vertical cavity surface emitting laser), other lasers, silicon photons, or the like, at a thickness of 1mm, needs to be 80% or more. In addition, for imaging and monitoring purposes, it is necessary to have a transmittance of 80% or more in the entire visible light region. Therefore, the resin forming the optical element is preferably selected from transparent resins capable of achieving the transmittance. The transmittance is an index indicating transparency, and the measurement is performed by a measurement method specified in JIS-K7361(1997), and the transmittance is a value expressed as a percentage of the ratio of the amount of incident light to the total amount of light passing through the test piece for light of a predetermined wavelength.
As the resin forming the optical element, for example, polyetherimide, thermoplastic polyimide, transparent polyamide, cyclic polyolefin, transparent fluororesin, transparent polyester, polycarbonate, polystyrene, acrylic resin, transparent polypropylene, ethylene ionomer, fluorine ionomer, and the like are preferable.
[ optical element holder ]
The optical element holder holds the optical element by heat fusion. The specific structure of the optical element holder is as described above, and therefore, the description thereof will be omitted. The shape of the optical element holder is not particularly limited, and can be appropriately changed according to the electronic device to be mounted.
[ method for producing optical Member ]
The optical member is manufactured by two-color molding. The two-color molding is a molding method in which two kinds of resins are thermally fused in one molding machine, and stable product quality can be obtained. In two-color molding, two materials having different materials are generally molded by one mold. For example, after obtaining an optical element holder of either one of the optical element and the optical element holder, the optical element holder is mounted in a mold, and a resin constituting the other is melted in a space (cavity) of the mold and injection-molded, and then cooled and solidified, or the like, thereby obtaining a composite of the optical element and the optical element holder. In the optical component, it is preferable that the optical element holder and the optical element are thermally welded to each other by two-color molding, and then the optical element holder integrated with each other is irradiated with an electron beam to integrally crosslink the resin.
According to the optical component, by providing the optical element holder, the optical element holder and the optical element have good adhesion, and have high heat resistance that can be applied to a reflow furnace.
[ other embodiments ]
The embodiments disclosed herein are considered to be illustrative in all respects and not restrictive. The scope of the present invention is not limited to the configuration of the above-described embodiments, but is defined by the scope of the claims, and includes all modifications equivalent to the scope of the claims and within the scope.
Examples
The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.
[ test Nos. 1 to 10]
(1) Fabrication of optical element holder
A resin composition for an optical element holder was prepared by adding 5 parts by mass of a crosslinking assistant and 30 parts by mass of a glass fiber to 100 parts by mass of a thermoplastic resin prepared according to the formulation shown in Table 1. Next, the resin composition for an optical element holder was injection-molded to form a cylindrical optical element holder having an outer diameter of 10mm and an inner diameter of 6 mm.
The thermoplastic resin and the crosslinking assistant used in the resin composition for an optical element holder are as follows.
Nylon 9T: genestar G1300A (KURARAAY CO., LTD, Polyamide 9T, melting Point: 308 ℃ C.)
Nylon 46: stanyl TW241 manufactured by DSM corporation, polyamide 46, melting point: 290 deg.C)
Nylon 12: UBE Nylon 3024U (manufactured by Yu Xing Kabushiki Kaisha, Polyamide 12, melting point: 176 ℃ C.)
Triallyl isocyanurate (manufactured by Nippon Kabushiki Kaisha)
In table 1, "-" indicates the case where each material was not used.
(2) Production of optical component (two-color molding)
After the optical element holder was produced, the mold was heated to about 80 ℃ and the thermoplastic resin composition transparent polyamide for a lens was injected into the space in the mold. Then, the resultant was cooled to obtain an optical member in which a lens having an outer diameter of 6mm and a thickness of 1mm at the center was integrated with the optical element holder. The thus-obtained optical member was irradiated with 600kGy of electron beam and crosslinked to prepare an optical member.
[ evaluation ]
The optical members of test nos. 1 to 10 thus obtained were evaluated by the following methods. The results are shown in table 1.
(measurement of Heat of fusion)
The melting temperature and the heat of fusion were determined by DSC measurement under the following conditions.
8mg of the sample was heated from-50 ℃ to 350 ℃ at a heating rate of 10 ℃ per minute in a nitrogen atmosphere using a differential scanning calorimeter (trade name: DSC8500, manufactured by Perkin Elmer, Inc.). The melting temperature was determined as the temperature at which 2 endothermic peaks observed at the time of temperature increase appeared. The heat of fusion was determined by calculating the area of each of the 2 peaks. In the case where the peak is a plurality of peaks, the heat of fusion is determined by calculating the area of all the peaks. FIG. 1 shows an example of the melting curve of test No. 2.
(adhesiveness)
The interface between the lens and the optical element holder was visually observed, and whether or not the lens and the optical element holder were peeled off was determined to determine the adhesiveness between the lens and the optical element holder.
(surface Property of adhesive surface)
The interface between the lens and the bonding surface of the optical element holder was visually observed, and the surface quality of the bonding surface of the optical element holder was determined by the presence or absence of deformation of the interface of the optical element holder.
(Heat resistance)
The optical element holder was left in a reflow furnace at 260 ℃ for 10 minutes, and the heat resistance of the optical element holder was judged by the presence or absence of deformation of the optical element holder.
[ Table 1]
As shown in table 1, the optical element holders of test nos. 1 to 6 were excellent in adhesion, surface properties of the adhesion surface, and heat resistance, and in the optical element holders of test nos. 1 to 6, the resin compositions for optical element holders had 2 peaks in the melting curve measured by DSC in the range of 160 ℃ to 230 ℃ and in the range of 260 ℃ to 320 ℃, and the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ to the total heat of fusion was 20% to 80%. On the other hand, the optical element holders of test nos. 7 to 10, which did not satisfy the above requirements, were inferior in all of adhesiveness, surface properties of the adhesive surface, and heat resistance.
From the above results, it was shown that the optical element holder can improve the adhesiveness when performing two-color molding between the optical element holder and the optical element, and has high heat resistance that can correspond to a reflow furnace.
Claims (2)
1. An optical element holder which holds an optical element,
the optical element holder is composed of a resin composition for an optical element holder,
the resin composition for an optical element holder comprises a thermoplastic resin as a main component,
the resin composition for an optical element holder has a melting curve having 2 peaks in the range of 160 ℃ to 230 ℃ inclusive and in the range of 260 ℃ to 320 ℃ inclusive as determined by differential scanning calorimetry at a temperature rise rate of 10 ℃/min, and the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ inclusive to the total heat of fusion is 20% to 80%.
2. An optical member having an optical element and an optical element holder that holds the optical element by heat fusion,
the optical element holder is composed of a resin composition for an optical element holder,
the resin composition for an optical element holder comprises a thermoplastic resin as a main component,
the resin composition for an optical element holder has a melting curve having 2 peaks in the range of 160 ℃ to 230 ℃ inclusive and in the range of 260 ℃ to 320 ℃ inclusive as determined by differential scanning calorimetry at a temperature rise rate of 10 ℃/min, and the ratio of the heat of fusion in the range of 160 ℃ to 230 ℃ inclusive to the total heat of fusion is 20% to 80%.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-135671 | 2019-07-23 | ||
| JP2019135671 | 2019-07-23 | ||
| PCT/JP2020/021226 WO2021014756A1 (en) | 2019-07-23 | 2020-05-28 | Optical element holder and optical component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114127606A true CN114127606A (en) | 2022-03-01 |
Family
ID=74194151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080049061.0A Pending CN114127606A (en) | 2019-07-23 | 2020-05-28 | Optical element holder and optical component |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220221681A1 (en) |
| JP (1) | JPWO2021014756A1 (en) |
| CN (1) | CN114127606A (en) |
| DE (1) | DE112020003497T5 (en) |
| WO (1) | WO2021014756A1 (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08220407A (en) * | 1995-02-17 | 1996-08-30 | Toray Ind Inc | Optical pickup lens holder |
| CN1649956A (en) * | 2002-02-26 | 2005-08-03 | 可乐丽股份有限公司 | Resin composition and multi-layer structures |
| TW201404820A (en) * | 2012-06-08 | 2014-02-01 | Kuraray Co | Thermoplastic resin composition and molded article thereof |
| CN103597037A (en) * | 2012-03-23 | 2014-02-19 | 三菱工程塑料株式会社 | Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer |
| JP2014126787A (en) * | 2012-12-27 | 2014-07-07 | Sumitomo Electric Fine Polymer Inc | Optical component |
| CN104024330A (en) * | 2012-01-11 | 2014-09-03 | 株式会社可乐丽 | Thermoplastic polymer composition and molded article |
| CN104275764A (en) * | 2013-07-08 | 2015-01-14 | 株式会社Jsp | Method for producing skin-covered polyolefin resin foamed molded article |
| US20160326289A1 (en) * | 2013-12-27 | 2016-11-10 | Kaneka Corporation | Optical thermoplastic resin and formed body |
| CN106461824A (en) * | 2014-06-30 | 2017-02-22 | 三井化学株式会社 | Resin composition for reflective material, and reflective panel including same |
| CN106661298A (en) * | 2014-08-28 | 2017-05-10 | 株式会社可乐丽 | Resin composition including ethylene-vinyl alcohol copolymer, molded article, and multilayered structure |
| WO2017131018A1 (en) * | 2016-01-29 | 2017-08-03 | 株式会社クラレ | Molded article and method for production thereof |
| CN107229185A (en) * | 2016-03-25 | 2017-10-03 | 东京应化工业株式会社 | The manufacture method of energy sensitivities composition, solidfied material and solidfied material |
| TW201833219A (en) * | 2016-12-05 | 2018-09-16 | 日商積水化成品工業股份有限公司 | Thermoplastic polyester resin foam sheet and thermoplastic polyester resin foam container |
| CN108779282A (en) * | 2016-03-31 | 2018-11-09 | 东丽株式会社 | Polyolefin micro porous polyolefin membrane and its manufacturing method, battery separator and battery |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6833183B2 (en) | 2019-04-23 | 2021-02-24 | 株式会社湯山製作所 | Powder dispensing business support system |
-
2020
- 2020-05-28 US US17/607,764 patent/US20220221681A1/en active Pending
- 2020-05-28 CN CN202080049061.0A patent/CN114127606A/en active Pending
- 2020-05-28 WO PCT/JP2020/021226 patent/WO2021014756A1/en active Application Filing
- 2020-05-28 DE DE112020003497.6T patent/DE112020003497T5/en active Pending
- 2020-05-28 JP JP2021534571A patent/JPWO2021014756A1/ja active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08220407A (en) * | 1995-02-17 | 1996-08-30 | Toray Ind Inc | Optical pickup lens holder |
| CN1649956A (en) * | 2002-02-26 | 2005-08-03 | 可乐丽股份有限公司 | Resin composition and multi-layer structures |
| CN104024330A (en) * | 2012-01-11 | 2014-09-03 | 株式会社可乐丽 | Thermoplastic polymer composition and molded article |
| CN103597037A (en) * | 2012-03-23 | 2014-02-19 | 三菱工程塑料株式会社 | Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer |
| TW201404820A (en) * | 2012-06-08 | 2014-02-01 | Kuraray Co | Thermoplastic resin composition and molded article thereof |
| JP2014126787A (en) * | 2012-12-27 | 2014-07-07 | Sumitomo Electric Fine Polymer Inc | Optical component |
| CN104275764A (en) * | 2013-07-08 | 2015-01-14 | 株式会社Jsp | Method for producing skin-covered polyolefin resin foamed molded article |
| US20160326289A1 (en) * | 2013-12-27 | 2016-11-10 | Kaneka Corporation | Optical thermoplastic resin and formed body |
| CN106461824A (en) * | 2014-06-30 | 2017-02-22 | 三井化学株式会社 | Resin composition for reflective material, and reflective panel including same |
| CN106661298A (en) * | 2014-08-28 | 2017-05-10 | 株式会社可乐丽 | Resin composition including ethylene-vinyl alcohol copolymer, molded article, and multilayered structure |
| WO2017131018A1 (en) * | 2016-01-29 | 2017-08-03 | 株式会社クラレ | Molded article and method for production thereof |
| CN107229185A (en) * | 2016-03-25 | 2017-10-03 | 东京应化工业株式会社 | The manufacture method of energy sensitivities composition, solidfied material and solidfied material |
| CN108779282A (en) * | 2016-03-31 | 2018-11-09 | 东丽株式会社 | Polyolefin micro porous polyolefin membrane and its manufacturing method, battery separator and battery |
| TW201833219A (en) * | 2016-12-05 | 2018-09-16 | 日商積水化成品工業股份有限公司 | Thermoplastic polyester resin foam sheet and thermoplastic polyester resin foam container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021014756A1 (en) | 2021-01-28 |
| WO2021014756A1 (en) | 2021-01-28 |
| US20220221681A1 (en) | 2022-07-14 |
| DE112020003497T5 (en) | 2022-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5725431B2 (en) | Optical lens-holder complex | |
| JP6197933B2 (en) | Electron beam curable resin composition, resin frame for reflector, reflector, semiconductor light emitting device, and method for producing molded article | |
| KR101933236B1 (en) | Composite molded body and method for producing same | |
| EP1939254B1 (en) | Material for laser fusion bonding | |
| CN101519498B (en) | Resin molded article and method for producing the same | |
| JP2009202567A (en) | Manufacturing method of composite comprising resin-made member and metallic member, substrate for mounting led and reflector for mounting led | |
| CN101162287B (en) | lens barrel assembly of camera module | |
| US9435966B2 (en) | Lens device attachment to printed circuit board | |
| GB2419684A (en) | Through transmission laser welded electro optical subassembly and lens | |
| US20060108064A1 (en) | Laser weldable thermoplastic polymer composition and process for laser welding | |
| JP2002018961A (en) | Method for bonding resin molded articles | |
| WO2016102217A1 (en) | Laser weldable composition and method using the same | |
| JP2005336229A (en) | Polyarylene sulfide resin composition for laser welding and molding | |
| CN114127606A (en) | Optical element holder and optical component | |
| JP2014112227A (en) | Method for manufacturing optical lens-holder composite, and optical lens-holder composite | |
| JP2014126787A (en) | Optical component | |
| JP2010037475A (en) | Transparent resin molded product and optical lens | |
| JP2020070419A (en) | Polyamide resin composition, molding, kit and method for manufacturing molding | |
| KR20140013017A (en) | Laser-transparent polyester comprising carboxylic acid salts | |
| KR20230016166A (en) | Light-transmissive resin composition for laser welding, molded article, kit, and method for manufacturing molded article | |
| JP2009298947A (en) | Polyester resin composition for laser welding, and laser welding method | |
| CN115209334B (en) | Casing of sound generating device, sound generating device and electronic equipment | |
| Sano et al. | Injection molded optical lens using a heat resistant thermoplastic resin with electron beam cross-linking | |
| KR20140013016A (en) | Laser-transparent polyester comprising inorganic salts | |
| KR101968356B1 (en) | Laser-transparent polyesters |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |