CN114120839A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN114120839A CN114120839A CN202111487664.1A CN202111487664A CN114120839A CN 114120839 A CN114120839 A CN 114120839A CN 202111487664 A CN202111487664 A CN 202111487664A CN 114120839 A CN114120839 A CN 114120839A
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- China
- Prior art keywords
- heat dissipation
- area
- display module
- bending
- protection layer
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Abstract
The invention provides a display module and a display device, wherein the display module comprises a first bending area, a second bending area and a plane area, the plane area is positioned between the first bending area and the second bending area, and the first bending area and the second bending area are oppositely arranged; the display module assembly still includes display panel, various rete and heat dissipation inoxidizing coating, wherein, the heat dissipation inoxidizing coating is located display panel keeps away from one side of various rete, is located in the plane district the material of heat dissipation inoxidizing coating is the copper alloy. According to the embodiment of the invention, the copper heat dissipation layer in the display module is replaced by the heat dissipation protective layer made of the copper alloy, so that the hardness of the heat dissipation protective layer is increased, and the impression problem caused by the soft copper of the heat dissipation layer is relieved.
Description
Technical Field
The application relates to the field of display, especially, relate to a display module assembly and display device.
Background
With the development of flexible display technology, consumers are pursuing better display effect. Recently, in order to achieve better display effect, increase screen transmittance, and reduce power consumption, a technology called a coe (color On tfe) technology, which cancels a polarizer, has been developed On an Organic Light-Emitting semiconductor (OLED) display panel.
The COE technology brings better display effect, and because of no extinction effect of the polarizer, the defects on the appearance surface of the display panel can be found more easily, and the appearance experience of the display panel in a breath screen state is poorer. Among them, after the terminals are bonded, the impression due to the soft copper of the heat dissipation layer is particularly noticeable.
Disclosure of Invention
The invention provides a display module and a display device, which are used for solving the problem of impression caused by the fact that copper of a heat dissipation layer is soft.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the invention provides a display module, which comprises a first bending area, a second bending area and a plane area, wherein the plane area is positioned between the first bending area and the second bending area, and the first bending area and the second bending area are oppositely arranged;
the display module assembly still includes display panel, various rete and heat dissipation inoxidizing coating, wherein, the heat dissipation inoxidizing coating is located display panel keeps away from one side of various rete, is located in the plane district the material of heat dissipation inoxidizing coating is the copper alloy.
Optionally, in some embodiments of the present invention, the copper alloy has a hardness greater than 150 vickers.
Optionally, in some embodiments of the present invention, the heat dissipation protection layer located in the planar area is disposed on the whole surface.
Optionally, in some embodiments of the present invention, the heat dissipation protective layer located in the first bending region and the second bending region includes a thickness-reduced region and/or a hollowed-out region.
Optionally, in some embodiments of the present invention, a minimum distance between the thickness-reduced area and/or the hollowed-out area and the planar area is greater than 0.1 mm.
Optionally, in some embodiments of the present invention, the material of the heat dissipation protection layer located in the first bending region and the second bending region is the copper alloy.
Optionally, in some embodiments of the present invention, the material of the heat dissipation protection layer located in the first bending area and the second bending area is stainless steel, the heat dissipation protection layer located in the first bending area is connected to the heat dissipation protection layer located in the planar area, and the heat dissipation protection layer located in the second bending area is connected to the heat dissipation protection layer located in the planar area.
Optionally, in some embodiments of the invention, the arrangement density of the thickness-reduced area and/or the hollow area increases with the increase of the bending curvature of the display module.
Optionally, in some embodiments of the present invention, the arrangement density of the reduced thickness areas and/or the hollow areas gradually increases in a direction away from the planar area.
Meanwhile, the invention also provides a display device which comprises the display module provided by any one embodiment of the invention.
The invention provides a display module and a display device, wherein the display module comprises a first bending area, a second bending area and a plane area, the plane area is positioned between the first bending area and the second bending area, and the first bending area and the second bending area are oppositely arranged; the display module assembly still includes display panel, various rete and heat dissipation inoxidizing coating, wherein, the heat dissipation inoxidizing coating is located display panel keeps away from one side of various rete, is located in the plane district the material of heat dissipation inoxidizing coating is the copper alloy. According to the embodiment of the invention, the copper heat dissipation layer in the display module is replaced by the heat dissipation protective layer made of the copper alloy, so that the hardness of the heat dissipation protective layer is increased, and the impression problem caused by the soft copper of the heat dissipation layer is relieved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a film stack structure of a display module according to an embodiment of the present invention;
fig. 2 (a) is a schematic diagram of a first top view structure of a heat dissipation protection layer according to an embodiment of the present invention;
fig. 2 (b) is a schematic cross-sectional view of a heat dissipation protective layer according to an embodiment of the present invention, taken along line AA' in fig. 2 (a);
fig. 3 (a) is a schematic top view illustrating a heat dissipation protection layer according to an embodiment of the present invention;
fig. 3 (b) is a schematic cross-sectional view of a heat dissipation protective layer according to an embodiment of the present invention, taken along line AA' in fig. 3 (a);
fig. 4 (a) is a schematic top view illustrating a heat dissipation protection layer according to an embodiment of the present invention;
fig. 4 (b) is a schematic cross-sectional view of a heat dissipation protective layer according to an embodiment of the present invention, taken along line AA' in fig. 4 (a);
fig. 5 is a schematic diagram illustrating a fourth top view of a heat dissipation protective layer according to an embodiment of the present invention;
fig. 6 is a schematic front view of a heat dissipation protective layer according to an embodiment of the present invention.
Detailed Description
While the embodiments and/or examples of the present invention will be described in detail and fully with reference to the specific embodiments thereof, it should be understood that the embodiments and/or examples described below are only a part of the embodiments and/or examples of the present invention and are not intended to limit the scope of the invention. All other embodiments and/or examples, which can be obtained by a person skilled in the art without making any inventive step, based on the embodiments and/or examples of the present invention, belong to the scope of protection of the present invention.
Directional terms used in the present invention, such as [ upper ], [ lower ], [ left ], [ right ], [ front ], [ rear ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terminology is used for the purpose of describing and understanding the invention and is in no way limiting. The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.
Aiming at the problem of impression caused by the soft copper of the heat dissipation layer of the conventional display device, the invention provides a display module which can solve the problem.
In an embodiment, please refer to fig. 1 to 6, in which fig. 1 shows a schematic diagram of a film lamination structure of a display module according to an embodiment of the present invention, fig. 2 to 5 respectively show four schematic diagrams of a top-view structure of a heat dissipation protective layer according to an embodiment of the present invention, and fig. 6 shows a schematic diagram of a front-view structure of the heat dissipation protective layer according to an embodiment of the present invention. As shown in fig. 1 to 6, the display module 10 according to the embodiment of the invention includes a first bending area FA1, a second bending area FA2, and a planar area PA, wherein the planar area PA is located between the first bending area FA1 and the second bending area FA2, and the first bending area FA1 and the second bending area FA2 are disposed opposite to each other;
the display module 10 further includes a display panel 11, a color film layer 12, and a heat dissipation protective layer 17, wherein the heat dissipation protective layer 17 is disposed on one side of the color film layer 12 away from the display panel 11, and the heat dissipation protective layer 17 in the plane area PA is made of copper alloy.
According to the embodiment of the invention, the copper heat dissipation layer in the display module is replaced by the heat dissipation protective layer made of the copper alloy, so that the hardness of the heat dissipation protective layer is increased, and the impression problem caused by the soft copper of the heat dissipation layer is relieved.
Specifically, referring to fig. 1, the display module 10 according to the embodiment of the present invention includes a heat dissipation protection layer 17, a foam layer 16, a grid glue layer 15, a back plate layer 14, a display panel 11, a color film layer 12, and a protection cover plate layer 13, which are sequentially stacked from bottom to top. The display module shown in fig. 1 is only an exemplary display module provided by the present invention, and the display module provided by the present invention may also be other stacked structures known to those skilled in the art, and is not limited herein.
The display panel 11 is a flexible display panel, and generally includes a flexible substrate, a driving circuit layer, and a light emitting display layer, and can withstand a certain degree of bending and folding. In the planar area PA, the display panel 11 is in a flat planar form; in the first and second bending regions FA1 and FA2, a side of the display panel 11 away from the planar region PA is bent toward a light exit side away from the display panel 11, i.e., toward the back sheet layer 14. In one embodiment, the display panel 11 positioned within the first and second bending regions FA1 and FA2 is not displayed, such that the planar region PA is a display region and the first and second bending regions FA1 and FA2 are non-display regions; in another embodiment, at least a partial area of the display screen exists in the display panel 11 located in the first bending area FA1 and the second bending area FA2, so that at least a part of the first bending area FA1, at least a part of the second bending area FA2, and the planar area PA are display areas, the display panel 11 is a curved display panel, and the display module 10 is a curved display module.
The color film layer 12 is disposed on the light emitting side of the display panel 11, and is used to replace a polarizer for reducing the reflection of the display panel 11 to the ambient light. The color film layer 12 generally includes a black matrix layer patterned to form a black matrix opening and a filter layer located in the black matrix opening, the black matrix opening corresponds to the light-emitting sub-pixels of the lower display panel 11, and the filter layer has a color corresponding to the light-emitting sub-pixels of the lower display panel 11, so as to implement a filtering function. The color film layer 12 has a light filtering function but does not have a light extinction function, and therefore, surface defects in the underlying film laminate are easily conspicuous.
The protective cover plate layer 13 is disposed on the outermost side of the light emitting direction of the display module 10, and is used for protecting each film structure in the display module 10, and the protective cover plate layer 13 is generally an organic or inorganic film layer with high hardness and strong chemical inertness, so that the display panel 11 is prevented from being damaged by external mechanical stress or corroded by chemical reagents.
The back plate layer 14 is disposed on a side of the display panel 11 facing away from the light emitting direction, and is used for supporting the display panel 11. Because the display panel 11 is a flexible display panel, the flexible display panel has poor hardness and stiffness, and needs a back panel for supporting to ensure the stability of the form of the display panel 11. Similarly, the back sheet layer may be an organic or inorganic film layer having a certain hardness, and is preferably an organic film layer such as polyethylene terephthalate or polyimide.
The grid glue layer 15, the foam layer 16 and the heat dissipation protective layer 17 are sequentially arranged on one side, away from the display panel 11, of the back plate layer 14, the grid glue layer 15, the foam layer 16 and the heat dissipation protective layer 17 jointly form a heat dissipation Composite layer, and the heat dissipation Composite layer is called a Super Composite Film (SCF) and mainly used for dissipating heat of the flexible display panel.
The heat dissipation protective layer in the planar area PA is made of a copper alloy, the copper alloy can be an alloy formed by copper and any one or more elements of nickel, zinc, lead, tin, manganese, nickel, iron, silicon and the like, and the hardness of the copper alloy is greater than 150 Vickers hardness. The heat dissipation protective layer positioned in the plane area PA is arranged on the whole surface.
In one embodiment, referring to fig. 2 to 4, the first heat dissipation protection layer 171 located in the first bending region FA1 and the second heat dissipation protection layer 172 located in the second bending region FA2 are both made of the copper alloy, and the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are symmetrically disposed.
In one embodiment, referring to fig. 2, fig. 2 (a) shows a first top view structural diagram of a heat dissipation protection layer provided in the embodiment of the present invention, and fig. 2 (b) shows a cross-sectional structural diagram of the heat dissipation protection layer provided in the embodiment of the present invention along the line AA' in fig. 2 (a). As shown in fig. 2, the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 include a hollow area 101, and the heat dissipation protection layer in the hollow area 101 is removed by an etching process, so as to reduce the modulus of the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172, and enable the display module 10 to meet the requirement of 3D bonding. The hollow-out area 101 may be set to be a plurality of rectangles at intervals as illustrated in the figure, the hollow-out area 101 may also be set to be any one or more of other shapes such as a circle, an ellipse, a trapezoid and the like, the hollow-out area 101 may also be set to be strip-shaped parallel to each other as shown by 102 in fig. 3, the hollow-out area 101 may also be set to be strip-shaped parallel to each other perpendicular to 102 in fig. 3, which is not limited herein, and all the hollow-out settings capable of reducing the modulus of the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are the contents to be protected by the embodiment of the present invention. Preferably, a first size of the hollow area 101 is larger than a second size, the first size is a size of the hollow area 101 in a direction perpendicular to a bending direction, and the second size is a size of the hollow area 101 in a direction parallel to the bending direction.
As shown in fig. 6, fig. 6 is a schematic front view illustrating a heat dissipation protection layer according to an embodiment of the present invention, and a minimum distance between the hollow area 101 and the planar area PA is greater than 0.1 mm.
Further, the arrangement density of the hollow areas 101 increases with the increase of the curvature of the display module 10. Therefore, the modulus of the heat dissipation protective layer is inversely proportional to the bending curvature, and the requirement of 3D fitting is further met. The setting density includes the number ratio of the hollow-out regions 101 with the same size in unit area, and also includes the area ratio of the hollow-out regions with different sizes in unit area.
Further, the arrangement density of the hollow areas 101 gradually increases in a direction away from the planar area PA.
In another embodiment, referring to fig. 3, fig. 3 (a) shows a second top view structural diagram of the heat dissipation protection layer provided in the embodiment of the present invention, and fig. 3 (b) shows a cross-sectional structural diagram of the heat dissipation protection layer provided in the embodiment of the present invention along the line AA' in fig. 3 (a). As shown in fig. 2, the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 include a thickness reduction region 102, and the heat dissipation protection layer in the thickness reduction region 102 is subjected to a reduction process by using an etching process, so that the modulus of the first heat dissipation protection layer 171 and the modulus of the second heat dissipation protection layer 172 are reduced, and the display module 10 meets the requirement of 3D bonding. The arrangement of the reduced thickness region 102 is similar to the arrangement of the hollow region 101 in the previous embodiment, and please refer to the previous embodiment, which is not described herein again. Likewise, the minimum distance of the reduced thickness area 102 from the planar area PA is greater than 0.1 mm.
In yet another embodiment, referring to fig. 4, fig. 4 (a) shows a second top view structural diagram of the heat dissipation protection layer provided in the embodiment of the present invention, and fig. 4 (b) shows a cross-sectional structural diagram of the heat dissipation protection layer provided in the embodiment of the present invention along the line AA' in fig. 4 (a). As shown in fig. 4, the first thermal protection layer 171 and the second thermal protection layer 172 include both the hollow-out region 101 and the reduced thickness region 102. The arrangement of the hollow-out region 101 and the thickness-reduced region 102 is similar to the arrangement of the hollow-out region 101 and the thickness-reduced region 102 in the two embodiments, and specific reference is made to the embodiments, which are not repeated herein.
In another embodiment, the materials of the first heat dissipation protection layer 171 located in the first bending area FA1 and the second heat dissipation protection layer 172 located in the second bending area FA2 are both stainless steel, the first heat dissipation protection layer 171 is connected with the heat dissipation protection layer located in the planar area PA, the second heat dissipation protection layer 172 is connected with the heat dissipation protection layer located in the planar area PA, and the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are symmetrically arranged. Similarly, the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are both provided with a hollow-out region and/or a reduced thickness region 103, and the manner of setting the hollow-out region and/or the reduced thickness region 103 is similar to that in the previous embodiment, and specific reference is made to the above embodiment, which is not repeated herein. In this embodiment, the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are made of stainless steel with higher hardness, so that the heat dissipation protection layer made of copper alloy material in the planar area PA can be more effectively protected to prevent deformation of the heat dissipation protection layer, the problem of marking caused by the soft copper of the heat dissipation layer is further solved, meanwhile, the first heat dissipation protection layer 171 and the second heat dissipation protection layer 172 are provided with a hollow area and/or a reduced thickness area, the modulus of the first heat dissipation protection layer 171 and the modulus of the second heat dissipation protection layer 172 are reduced, and the requirement of 3D lamination is met.
Meanwhile, the embodiment of the invention provides a display device which comprises any one of the display modules provided by the embodiment of the invention. Since the display device provided in this embodiment includes any one of the display modules provided in the embodiments of the present invention, the display device has the technical features and the beneficial effects of any one of the display modules provided in the embodiments of the present invention.
In summary, the embodiment of the present invention provides a display module and a display device, where the display module includes a first bending area, a second bending area, and a planar area, the planar area is located between the first bending area and the second bending area, and the first bending area and the second bending area are disposed opposite to each other; the display module assembly still includes display panel, various rete and heat dissipation inoxidizing coating, wherein, the heat dissipation inoxidizing coating is located display panel keeps away from one side of various rete, is located in the plane district the material of heat dissipation inoxidizing coating is the copper alloy. According to the embodiment of the invention, the copper heat dissipation layer in the display module is replaced by the heat dissipation protective layer made of the copper alloy, so that the hardness of the heat dissipation protective layer is increased, and the impression problem caused by the soft copper of the heat dissipation layer is relieved.
The display module and the display device provided by the embodiment of the invention are described in detail, and the principle and the embodiment of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display module is characterized by comprising a first bending area, a second bending area and a plane area, wherein the plane area is positioned between the first bending area and the second bending area, and the first bending area and the second bending area are oppositely arranged;
the display module assembly still includes display panel, various rete and heat dissipation inoxidizing coating, wherein, the heat dissipation inoxidizing coating is located display panel keeps away from one side of various rete, is located in the plane district the material of heat dissipation inoxidizing coating is the copper alloy.
2. The display module of claim 1, wherein the copper alloy has a hardness greater than 150 vickers.
3. The display module as claimed in claim 1, wherein the heat dissipation protective layer in the planar region is disposed over the entire surface.
4. The display module of claim 1, wherein the thermal protection layer in the first bending region and the second bending region comprises a reduced thickness region and/or a hollowed-out region.
5. The display module according to claim 4, wherein the minimum distance between the thinned-out area and/or the hollowed-out area and the planar area is greater than 0.1 mm.
6. The display module of claim 4, wherein the material of the thermal protection layer in the first bending region and the second bending region is the copper alloy.
7. The display module of claim 4, wherein the material of the thermal protection layer in the first bending region and the second bending region is stainless steel, the thermal protection layer in the first bending region is connected to the thermal protection layer in the planar region, and the thermal protection layer in the second bending region is connected to the thermal protection layer in the planar region.
8. The display module according to claim 5, wherein the arrangement density of the reduced thickness regions and/or the hollow-out regions increases with the increase of the curvature of the display module.
9. The display module according to claim 5, wherein the arrangement density of the reduced thickness regions and/or the hollow-out regions is gradually increased in a direction away from the planar area.
10. A display device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487664.1A CN114120839A (en) | 2021-12-08 | 2021-12-08 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487664.1A CN114120839A (en) | 2021-12-08 | 2021-12-08 | Display module and display device |
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| CN114120839A true CN114120839A (en) | 2022-03-01 |
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| CN202111487664.1A Pending CN114120839A (en) | 2021-12-08 | 2021-12-08 | Display module and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114822287A (en) * | 2022-04-06 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Display module and manufacturing method thereof |
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| CN112820198A (en) * | 2021-02-10 | 2021-05-18 | 京东方科技集团股份有限公司 | Supporting plate and display device |
| CN113178133A (en) * | 2021-05-06 | 2021-07-27 | 合肥维信诺科技有限公司 | Composite support film and display device |
| CN113185927A (en) * | 2021-02-10 | 2021-07-30 | 武汉华星光电半导体显示技术有限公司 | Composite material and display device |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN212809621U (en) * | 2020-08-25 | 2021-03-26 | Oppo广东移动通信有限公司 | Flexible screen assembly and electronic equipment with same |
| CN112165837A (en) * | 2020-10-13 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | Curved surface heat dissipation film and display module |
| CN112820198A (en) * | 2021-02-10 | 2021-05-18 | 京东方科技集团股份有限公司 | Supporting plate and display device |
| CN113185927A (en) * | 2021-02-10 | 2021-07-30 | 武汉华星光电半导体显示技术有限公司 | Composite material and display device |
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| CN114822287A (en) * | 2022-04-06 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Display module and manufacturing method thereof |
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