CN114114973A - Display panel double-piece production control method and related equipment - Google Patents
Display panel double-piece production control method and related equipment Download PDFInfo
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Abstract
The present disclosure provides a display panel double-sheet production control method and related equipment, including: receiving a double-sheet production request sent by production equipment; determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request; if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information; after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container. The display panel double-piece production control method and the related equipment can solve the problem of double-piece production to a certain extent.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a method for controlling the dual-panel production of a display panel and related devices.
Background
The operation mode of the traditional display panel production equipment only supports single-chip operation, namely, only a single-chip display panel can be put into the equipment for processing and production. However, this production mode is inefficient, and although the production of the product can be guaranteed, the order with a large delivery amount and a short delivery cycle will expose the problem that the production cannot keep up with the demand, and thus the product cannot be delivered to the customer on time.
Although some display panel production equipment has the function of a double-piece operation mode, namely, two display panels are processed at one time, the corresponding control system and the production equipment are not well matched, and particularly when a loading container for double-piece production is in a single-piece state, system failure is caused, and the production equipment cannot normally operate.
Disclosure of Invention
In view of the above, an objective of the present disclosure is to provide a method and related apparatus for controlling dual-panel production of a display panel, so as to solve the above problems to some extent.
In view of the above, a first aspect of the embodiments of the present disclosure provides a display panel two-sheet production control method, including:
receiving a double-sheet production request sent by production equipment;
determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request; wherein, the loading container is used for placing a display substrate to be processed;
if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information;
after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
Optionally, the display panel double-sheet production control method further includes:
in an initial state, giving a unique identifier to each display substrate to be processed;
recording the placing position and the unique identification of each display substrate to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises:
determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded;
determining the current loading information of the loading container to be loaded according to the unique identifier;
determining the film missing information of the loading container to be loaded according to the current loading information and the initial loading information;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
Optionally, determining whether a patch operation needs to be performed on the loading container to be loaded comprises:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
Optionally, the loading container includes two rows of placing containers arranged in parallel, the placing container includes a plurality of placing cavities arranged in a stacked manner, and the placing cavities are used for placing the display substrates to be processed;
determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded, wherein the method comprises the following steps:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is placed with the display substrate to be processed, and the other placing cavity is not placed with the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
and if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule.
Optionally, the preset patch rule includes:
at least one of a same-container patch, a different-container patch and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavities in the single-sheet state and placing the display substrate in the lacking position of the other layer of placing cavities in the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
Optionally, the preset patch rule includes:
if at least two single-chip states exist in the same loading container to be loaded, carrying out same-container patching;
if the loading container to be loaded has a single-chip state after the same container patching is finished, carrying out different container patching;
and if the loading container to be loaded has a single-chip state after the steps are finished, carrying out idle loading container patching.
Optionally, controlling the production apparatus to load the loading container and perform a double-sheet production on the display substrate placed therein includes: controlling the production equipment to load the loading container and carry out double-wafer production on the display substrate placed in the loading container by using a double-manipulator;
the display panel double-piece production control method further comprises the following steps:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
In a second aspect of the embodiments of the present disclosure, there is provided a display panel dual sheet production system, including:
at least one loading container configured to: placing a display substrate to be processed;
at least one production device configured to: sending a double-chip production request; receiving a double-piece production control instruction and carrying out double-piece production; receiving a patch operation instruction and carrying out patch operation;
a control system configured to:
receiving a double-piece production request sent by the production equipment;
determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request;
if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information;
after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
Optionally, the control system is configured to: in an initial state, giving a unique identifier to each display substrate to be processed; recording the placing position and the unique identification of each display panel to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises: determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded; determining the current device information of the loading container to be loaded according to the unique identifier; determining the film missing information of the loading container to be loaded according to the current loading information and the initial loading information; and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
Optionally, the production device is configured to: loading image acquisition equipment and acquiring an image of the loading container to be loaded by utilizing the image acquisition equipment;
the control system configured to:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
Optionally, the loading container includes two rows of placing containers arranged in parallel, the placing container includes a plurality of placing cavities arranged in a stacked manner, and the placing cavities are used for placing the display substrates to be processed;
the control system configured to:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is used for placing the display substrate to be processed, and the other placing cavity is used for placing the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
and if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule.
Optionally, the preset patch rule includes:
at least one of a same-container patch, a different-container patch and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavities in the single-sheet state and placing the display substrate in the lacking position of the other layer of placing cavities in the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
Optionally, the preset patch rule includes:
if at least two single-chip states exist in the same loading container to be loaded, carrying out same-container patching;
if the loading container to be loaded has a single-chip state after the same container patching is finished, carrying out different container patching;
and if the loading container to be loaded has a single-chip state after the steps are finished, carrying out idle loading container patching.
Optionally, the production device is configured to: loading double mechanical arms, and carrying out double-piece production by using the double mechanical arms;
the control system configured to:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
Optionally, the control system comprises:
a device automation system configured to: respectively carrying out data interaction with the production equipment and the manufacturing execution system; converting the control instruction generated by the manufacturing execution system into an instruction which can be identified by the production equipment and sending the instruction to the production equipment;
a manufacturing execution system configured to: generating a corresponding control instruction according to the information reported by the equipment automatic system;
and the equipment automatic system and the manufacturing execution system adopt a preset message format to realize communication through message middleware.
In a third aspect of the embodiments of the present disclosure, an electronic device is provided, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the method when executing the program.
In a fourth aspect of the disclosed embodiments, there is provided a non-transitory computer-readable storage medium storing computer instructions for causing the computer to perform the method.
As can be seen from the foregoing, the display panel double-sheet production control method and the related device provided in the embodiments of the present disclosure ensure that the loading container can adapt to double-sheet production and further ensure that double-sheet production can be performed normally by determining whether a patching operation needs to be performed on the loading container to be loaded, performing double-sheet production if the patching operation does not need to be performed, and performing the patching operation according to a preset patching rule if the patching operation needs to be performed.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description relate only to some embodiments of the present disclosure and are not limiting to the present disclosure.
Fig. 1 is a schematic flow chart of an embodiment of a method for controlling the dual-sheet production of a display panel according to an embodiment of the present disclosure;
FIG. 2A is a schematic structural view of a loading container according to an embodiment of the disclosure;
FIG. 2B is a schematic flow chart illustrating the production of a bi-sheet in an embodiment of the present disclosure;
FIG. 2C is a schematic view of a co-container patch according to an embodiment of the present disclosure;
FIG. 2D is another schematic view of a co-container patch according to an embodiment of the present disclosure;
FIG. 2E is a schematic view of a iso-container patch of an embodiment of the present disclosure;
FIG. 2F is another schematic view of a iso-container patch of an embodiment of the present disclosure;
FIG. 2G is a schematic illustration of a patch completed with an empty load container according to an embodiment of the present disclosure;
FIG. 2H is another schematic illustration of an embodiment of the present disclosure utilizing an empty load container to complete a patch;
FIG. 2I is yet another schematic illustration of a patch completed with an empty load container according to an embodiment of the present disclosure;
FIG. 2J is yet another schematic illustration of a patch completed with an empty load container according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an embodiment of a display panel dual-sheet production system according to an embodiment of the present disclosure;
fig. 4 is a schematic overall system implementation flow diagram of a display panel dual-sheet production system provided in the embodiment of the present disclosure;
fig. 5 is a more specific hardware structure diagram of an electronic device according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
A first aspect of the embodiments of the present disclosure provides a method for controlling dual-chip production of a display panel, which can solve a system failure problem in a single-chip state to some extent.
The display panel double-piece production control method comprises the following steps:
receiving a double-sheet production request sent by production equipment;
determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request; wherein, the loading container is used for placing a display substrate to be processed;
if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information; optionally, the missing piece information may include, for example, the following information: information on a missing piece position in the loading container (i.e., where the loading container has a missing display substrate), information on the loading container in which a missing piece condition exists (e.g., an identifier of the loading container, an identifier of a display substrate placed in the loading container in an initial state), and the like;
after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
It can be seen from the foregoing embodiment that, in the display panel double-sheet production control method provided in the embodiment of the present disclosure, it is determined whether a patch operation needs to be performed on a loading container to be loaded, if not, double-sheet production is performed, and if so, the patch operation is performed according to a preset patch rule, so that it is ensured that the loading container can adapt to the double-sheet production, and further, the double-sheet production can be performed normally.
In this embodiment, the two-sheet production requires that two display panels to be processed can be extracted from the loading container in one processing step, so that two display substrates can be processed simultaneously. However, in general, one production line of the display panel includes a plurality of processes respectively performed by a plurality of production apparatuses, and after different processes are performed by different production apparatuses, defective products may occur, and when the defective products are cleaned, the loading container may have a defective position (i.e., the position where the original display substrate is cleaned is left empty). Therefore, if the position of the display substrate is missing, two display substrates to be processed may not be extracted at a time, and further, a system failure may occur, resulting in abnormal operation of the production equipment. The normal double-piece production can not be influenced by the chip missing condition through the operation of the patch, and the double-piece production of the display panel is very important to realize. The patching operation described in this embodiment generally refers to supplementing the display substrate to the chipped position to solve the problem that the chipped condition affects normal two-piece production. The specific patch rules can refer to the relevant description in the subsequent embodiments.
It should be further noted that, in one or more embodiments of the present disclosure, the display substrate refers to a semi-finished product or a finished product of a display panel, for example, the display substrate may be a substrate of only glass, an intermediate product that has been manufactured with some devices, and in some cases, a display panel that has been manufactured. Generally, in the production process flow of the display panel, before the final display panel product is formed, the semi-finished product formed at each stage can be referred to as a display substrate.
In addition, a chip missing situation may occur after each process of each production facility is completed, and therefore, each production facility may need to check the chip missing situation of the loading container and complete the patch in time before loading the loading container.
The embodiment of the disclosure provides an embodiment of a display panel double-sheet production control method, which can solve the problem of system faults in a single-sheet state to a certain extent. Fig. 1 is a schematic flow chart illustrating an embodiment of a method for controlling the dual-sheet production of a display panel according to an embodiment of the present disclosure.
As shown in fig. 1, the method for controlling the two-piece production of the display panel includes:
step 102: and receiving a double-sheet production request sent by the production equipment.
In this step, generally, before the production equipment enters the production state, a two-piece production request is sent to the control system for starting the current production process. In this step, the two-piece production request refers to a request for processing two display substrates at the same time.
Generally, the production apparatus may be many in a two-sheet production line of display panels. For example, a production apparatus for performing an evaporation process, a production apparatus for performing photoresist coating, a production apparatus for performing exposure/development processing, and the like. When the production equipment corresponding to a certain process is ready, a double-sheet production request can be sent to the control system for starting the current production process.
Step 104: determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request; wherein the loading container is placed with a display substrate to be processed.
In this step, after the control system receives the double-sheet production request, it is first determined whether a patch operation needs to be performed on the loading container to be loaded by the production equipment. The patch operation refers to patch the missing piece position which can affect the normal double piece production in the loading container.
As an alternative embodiment, as shown in fig. 2A, the loading container 20 includes two columns of placing containers 21/22 arranged side by side, the placing container 21/22 includes a plurality of placing cavities 211/221 arranged in a stack, and the placing cavity 211/221 is used for placing the display substrates 30 to be processed.
As an alternative embodiment, the method for controlling the two-piece production of the display panel may further include the steps of:
in an initial state, giving a unique identifier to each display substrate to be processed; alternatively, the unique identifier may be a common identifier (e.g., a common label identified by human eyes), or may be an identifier that can be read by a reading device, such as a two-dimensional code, a barcode, or the like; optionally, the unique identifier may be disposed at a position of one of four corners of the display substrate, so as to facilitate reading or recognition, and at the same time, the manufacturing of the normal structure of the display substrate is not affected;
recording the placing position and the unique identification of each display substrate to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information; optionally, before the whole production flow starts, display substrates to be processed (which may be only substrate substrates, usually glass, at the beginning) need to be placed in each placing cavity of the loading container first, at this time, the position of the placing cavity in which each display substrate is placed in the loading container is recorded, and at the same time, a corresponding unique identifier is recorded, so that the unique identifiers can be in one-to-one correspondence with the placing positions;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises:
determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded; optionally, after the display substrate is processed in a certain production process, before the display substrate is placed in the corresponding loading container, the unique identifier of the display substrate is identified and correspondingly placed in the corresponding position of the initial loading container;
determining the current loading information of the loading container to be loaded according to the unique identifier; optionally, after obtaining the unique identifier of each display substrate of the loading container to be loaded, the current loading information of the loading container to be loaded, that is, the positions where the display substrates are placed and the unique identifiers of the display substrates, can be obtained through statistics;
determining the film missing information in the loading container to be loaded according to the current loading information and the initial loading information; optionally, because the unique identifier of the display substrate placed in the loading container is counted in the previous step, the unique identifier collected before processing is compared with the list by taking the loading information recorded with each unique identifier of the display substrate originally placed in the loading container, and the chip missing information in the loading container is counted, wherein the chip missing information includes the chip missing position; optionally, in some cases, for example, the current loading container has no missing piece after the previous processes, and after the current process is finished, the current loading container has a missing piece (that is, the missing piece occurs for the first time), the current loading information may be compared with the initial loading information to determine the missing piece information; in other cases, for example, if a defect occurs in a previous process, the current loading information needs to be compared with the loading information obtained after the previous process is finished to determine the defect information;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
By adopting the embodiment, each placing cavity of the loading container is in one-to-one correspondence with the unique identifier by marking the unique identifier on the display substrate, so that after a certain process is finished, the newly-added wafer missing position after the process is finished can be known by comparing the unique identifier list formed after the previous process is finished.
Of course, it can be known that, after each process is completed, if the loading container has a situation of missing pieces and patches, the list of unique identifiers needs to be updated based on the situation of missing pieces and patches. For example, when a display substrate of a certain placing cavity is cleaned and supplemented with a new display panel, the unique identifier corresponding to the placing cavity needs to be updated. For another example, after the patch is completed, if two placement cavities of a certain layer of the loading container are both empty, the unique identifier corresponding to the position in the list needs to be updated to be empty or "0".
As another alternative, determining whether a patch operation is required for a load container to be loaded may include the steps of:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology; for example, the image is the image of the side shown in fig. 2A (here, the side of the loading container should be generally transparent so that the image can reflect the placement of the display substrate therein), when the image is compared with the original image, the position of the defect in the loading container can be determined;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
By adopting the embodiment, the position of the chip lack in the loading container can be known through the image recognition technology, the realization is more convenient, and the manual participation is not needed.
In addition, as an optional embodiment, the step of determining whether to perform the patch operation on the loading container to be loaded may be performed manually, that is, an Operator on the production line is used to check each loading container, and determine whether to perform the patch according to a check result, and enter patch information into an operating system through an Operator Interface Client (OIC for short), so that the operating system may determine whether to perform the patch operation on the loading container to be loaded according to the patch information, and send a corresponding control instruction.
Optionally, step 106: and if the patch operation is not required to be carried out on the loading container to be loaded, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
In this step, if there is no defect in the apparatus container or there is a defect, but the defect does not affect the double-sheet production (for example, two placing cavities of one layer are both empty), the patch operation may not be performed, and the production equipment is further controlled to load the loading container and perform the double-sheet production on the display substrate placed therein, as shown in fig. 2B.
Step 108: and if the patch operation needs to be carried out on the loading container to be loaded, determining the patch missing information of the loading container, and controlling the production equipment to carry out the patch operation on the loading container according to a preset patch rule and the patch missing information.
In this step, if there is a chip missing situation that may affect normal double-chip production in the loading container to be loaded, a chip needs to be patched, and patching can be completed according to a preset patch rule.
As an alternative embodiment, determining whether a patch operation needs to be performed on the loading container to be loaded according to the missing piece information in the loading container to be loaded includes:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is placed with the display substrate to be processed, and the other placing cavity is not placed with the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule;
optionally, if there is no monolithic state in the loading container to be loaded, there is no need to perform a patch operation on the loading container to be loaded.
In this embodiment, the single-chip state refers to that only one of the two placing cavities on the same layer is used for placing a display substrate to be processed (refer to the layer with the chip missing position in the left half portion of fig. 2C to 2J), and the production equipment can only perform double-chip production, and the double-chip production can only take out two display substrates from the same layer placing cavity to perform double-chip production.
Optionally, the preset patch rule includes at least one of a same container patch, a different container patch, and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavities in the single-sheet state and placing the display substrate in the lacking position of the other layer of placing cavities in the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
It can be known that the patching operation of the present disclosure is mainly to perform the patching operation on the single-chip state, and the purpose is to compensate the single-chip state to ensure the double-chip production, therefore, the specific patching mode can be selected as required, and is not limited specifically herein.
As an optional embodiment, the preset patch rule includes:
rule one is as follows: if there are at least two said monolithic states in the same load container to be loaded, then a co-container patch (onecontainerstarting) is performed.
Onecsporting: the display substrate is positionally adjusted in a single loading Container (CST), as shown in fig. 2C and 2D, the left half is a loading container before the patch, and the right half is a loading container after the patch.
Rule two: if a single chip state still exists in the loading container to be loaded after the same-container patching is finished, performing different-container patching (TwoCSTStarting).
TwoCSTStarting: the positions of the display substrates are adjusted to each other between the two loading Containers (CST), and fig. 2E and 2F illustrate a schematic view of supplementing the display substrates of the right loading container into the left loading container.
It should be noted that, when there are more than two loading containers in a single state, the loading containers may be divided into two groups (which may be grouped in order after being sorted according to the labels of the loading containers), and then the loading containers in the same group are subjected to patching, so that the patching operation is regular and can not be repeated, and thus, a situation that a patching error or a patching is repeated does not occur.
Rule three: and if the loading container to be loaded still has a single chip state after the steps are finished, performing idle loading container patching, namely extracting the display substrate to be processed from the idle loading container and placing the display substrate in the chip missing position of the loading container to be loaded. The spare loading container is a loading container specially used for finishing the patching, the display substrate is only used for satisfying the patching of the loading container, so that the loading container does not have a single-chip state, further the double-chip production can be normally carried out, and after the display substrate in the spare loading container is supplemented into the normal loading container, the product formed after the whole procedure is not qualified. Fig. 2G to 2J are schematic views showing that the display substrate is extracted from the empty load container on the right side and is replenished into the load container on the left side.
After the preset patching rule is adopted, patching can be completed on all loading containers with single-piece states, so that double-piece production can be normally carried out.
In some cases, the two columns of placing containers arranged side by side of the loading container are a first column of placing containers and a second column of placing containers, respectively, and the display substrates placed in the two columns of placing containers are not confused with each other, and therefore, as an alternative embodiment, the preset patch rule further includes:
if the placing cavities in the first row of placing containers need the patches, only the display substrates to be processed can be extracted from the first row of placing containers of the loading container to complete the patches;
if a placement cavity in the second column of placement containers requires a patch, then only the display substrate to be processed can be extracted from the second column of placement containers of the loading container to complete the patch.
As shown in fig. 2I, after the same container patch and the different container patch are passed, there may be more than one single sheet in the second row of the placement container of one or some loading containers, and at this time, in the case of strictly distinguishing the first row from the second row, the display substrate cannot be extracted from the first row to perform the patch for the second row, and therefore, only the display substrate belonging to the second row can be extracted from the empty loading container to perform the patch.
Alternatively, the empty load container may place the display substrate only in the first column or the second column of placement containers, so that the empty load container can be selected in a targeted manner at the time of patching without causing confusion. Optionally, the production equipment corresponding to each process is equipped with a corresponding empty loading container, and when the empty loading container equipped by the production equipment is consumed, the empty loading container equipped by the production equipment of other processes can be called.
Step 110: after the patch is completed, the manufacturing apparatus is controlled to load the loading container and perform a double-sheet manufacturing of the display substrate placed therein, as shown with reference to fig. 2B.
It can be seen from the foregoing embodiment that, in the display panel double-sheet production control method provided in the embodiment of the present disclosure, it is determined whether a patch operation needs to be performed on a loading container to be loaded, if not, double-sheet production is performed, if so, the patch operation is performed according to a preset patch rule, and after the patch is completed, double-sheet production is performed, so that it is ensured that the loading container can adapt to the double-sheet production, and further the double-sheet production can be performed normally.
In one or more embodiments of the present disclosure, controlling the production apparatus to load the loading container and perform a dual-sheet production of the display substrate placed therein includes: controlling the production equipment to load the loading container and carry out double-wafer production on the display substrate placed in the loading container by using a double-manipulator;
the display panel double-piece production control method further comprises the following steps:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
In this embodiment, the single-chip production corresponds to the double-chip production, that is, the production equipment performs the production on only one display substrate, rather than two display substrates at the same time.
By adopting the embodiment, when one mechanical arm in the double mechanical arms has a fault, the double-piece production is switched to the single-piece production by controlling the production equipment, so that the production mode of the production equipment is changed in time when the double-piece production condition is not met, and the normal operation of the production line is further ensured. Optionally, the display panel double-sheet production control method further includes:
and if the product inlet of the production equipment is occupied, controlling one mechanical arm of the double mechanical arms to grab an occupied object, and controlling the other mechanical arm of the double mechanical arms to place the display substrate to be processed.
By adopting the embodiment, when the product inlet of the production equipment is occupied, the occupied objects can be cleaned and the products can be placed by utilizing the double mechanical arms, so that the production flow is ensured to be smoothly carried out, and the production efficiency is improved.
The embodiment of the disclosure also provides an embodiment of a display panel double-sheet production system, which can solve the problem of system faults in a single-sheet state to a certain extent. Fig. 3 shows a schematic structural diagram of an embodiment of a display panel dual-sheet production system provided by an embodiment of the present disclosure.
As shown in fig. 3, the display panel dual sheet production system includes:
at least one loading container 20 configured to: placing a display substrate 30 to be processed; optionally, the Display substrate may be an Organic electroluminescent Display (OLED) Display panel or a Liquid Crystal Display (LCD), which is not limited herein;
at least one production facility 40 configured to: sending a double-chip production request; receiving a double-piece production control instruction and carrying out double-piece production; receiving a patch operation instruction and carrying out patch operation;
a control system 50 configured to:
receiving a double-sheet production request sent by the production equipment 40;
determining whether a patch operation needs to be performed on the loading container 20 to be loaded according to the double-sheet production request;
alternatively, if the patch operation on the loading container 20 to be loaded is not required, the production apparatus 40 is controlled to load the loading container 20 and perform the double-sheet production on the display substrate 30 placed therein;
if the patch operation needs to be carried out on the loading container 20 to be loaded, determining the missing piece information of the loading container 20, and controlling the production equipment 40 to carry out the patch operation on the loading container 20 according to a preset patch rule and the missing piece information;
after the patch is completed, the production apparatus 40 is controlled to load the loading container 20 and perform a double-sheet production of the display substrate 30 placed therein.
It can be seen from the above embodiments that, in the display panel double-sheet production system provided by the embodiment of the present disclosure, by determining whether patch operation needs to be performed on a loading container to be loaded, if not, double-sheet production is performed, if so, patch operation is performed according to a preset patch rule, and double-sheet production is performed after patch completion, so that it is ensured that the loading container can adapt to double-sheet production, and further, double-sheet production can be performed normally.
Generally, in a front end of display panel manufacturing (FAB), there may be a plurality of manufacturing apparatuses corresponding to a plurality of manufacturing processes, and meanwhile, when the display panels are manufactured in a batch, there may be many display substrates to be processed in one manufacturing LOT (LOT), so that a plurality of loading containers 20 may be required to place the display substrates to be processed, and the manufacturing apparatuses load the loading containers 20 in sequence and perform the manufacturing in the corresponding processes when performing the manufacturing.
The display panel production Equipment firstly has a function of a double-piece operation mode, that is, the capability of processing two display panels at a time, but the interface between the existing Manufacturing Execution System (MES) and the Equipment Automation System (EAS) is not defined for double-piece operation, and meanwhile, the MES cannot process messages (messages) reported by the production Equipment, so that the MES cannot meet the online (online) double-piece operation mode.
To solve this problem, as an embodiment of the present disclosure, the control system includes:
a device automation system (EAS) configured to: respectively carrying out data interaction with the production equipment and the manufacturing execution system; converting the control instruction generated by the manufacturing execution system into an instruction which can be identified by the production equipment and sending the instruction to the production equipment;
a Manufacturing Execution System (MES) configured to: generating a corresponding control instruction according to the information reported by the equipment automatic system;
and the equipment automatic system and the manufacturing execution system adopt a preset message format to realize communication through message middleware. For example, the message middleware may be implemented using the TIBCO message middleware of TIBCO software corporation.
By adopting the embodiment, the MES and the EAS are butted, the message format agreed by the two parties is established, the message middleware is utilized to realize communication, so that the double-piece operation is realized, the double-piece operation mode can effectively improve the production efficiency, and the method is greatly helpful for large orders and orders with short delivery cycle. The adoption of the message middleware can effectively ensure the stable communication of the systems of both parties, and can not cause production accidents due to communication problems.
As an alternative embodiment, the step of determining whether to perform the patch operation on the loading container to be loaded may be performed manually, that is, an operator on the production line is used to inspect each loading container, and determine whether to perform the patch operation according to the inspection result, and enter the patch information into the operating system through an operation client (OIC), so that the operating system may determine whether to perform the patch operation on the loading container to be loaded according to the patch information, and issue a corresponding control instruction.
In the production process of the display panel, the FAB section is a production mode in which two display substrates are loaded one by one in one loading container, and twice the number of display substrates corresponds to how many layers of one loading container are. However, sometimes the loading containers cannot be filled, for example, one loading container normally has 20 layers and can contain 40 display substrates (two display substrates one layer), but due to an abnormal condition (a display panel is scrapped in the production process, etc.), some layers in one loading container contain only one display substrate or no display substrate (empty layer), that is, are not filled with 40 sheets, and thus empty positions appear. If some layers of the loading container have single-sheet states and can not be automatically patched due to the occurrence of vacant positions, the utilization rate of the loading container is reduced, the overall production rhythm efficiency is low, and the equipment and the system can not be automatically patched.
To solve this problem, in this embodiment, the patch is performed by manually controlling the production equipment, for example, as shown in fig. 4, a flowchart is implemented for the whole system. The display panel two-piece production system comprises EAS, MES and OIC. The user sends the patching reservation information to the MES through an operation client (OIC), and the patching reservation information is processed by a first server or a first server cluster CNXsvr of the MES and is stored in a database DB. After loading the loading container CST, the production equipment sends a Message (Message) of a double-piece production request (lotInfoDownLoadReuqest) to the EAS, the Message is analyzed by the EAS and then sent to a second server or a second server cluster PEXsvr of the MES, the second server or the second server cluster PEXsvr of the MES processes according to the Message, whether the patch reservation information of the loading container exists or not is searched in a database, data is integrated according to the query result, the Message is assembled into a Message according to a preset communication protocol, then the Message is sent to the EAS, the Message is converted into a Message which can be identified by the production equipment after the EAS analyzes, and the Message is sent to the production equipment. After patching, a user needs to carry out account patching operation (patching information input) on the MES through the OIC, and the consistency of a real object and information is ensured. Furthermore, if no suitable display substrate is patched, the process may continue in an unsatisfactory condition.
As an alternative embodiment, in the MES and EAS agreement Message, the MES may perform Message creation for two-piece operation. When the production equipment is in a normal double-chip production mode, the Message content does not need to contain the information of the destination and the like of the display substrate; when the production equipment is in the patch mode, the patch mode requires a production equipment engineer to manually switch the production equipment on the equipment, and the Message includes information such as the destination of the display substrate. Under normal conditions, the display substrate in the loading container is full, a patch is not needed, and only information interaction is normally carried out according to interfaces defined by EAS (electronic article surveillance system) and MES (manufacturing execution system); in the patch mode, the reserved information (for example, the position where the display substrate will arrive, the identifier of the loading container, and the product inlet (port) information of the device) needs to be called to ensure that the display substrate is accurately patched to the target position, so that the EAS can analyze the information to accurately take the display substrate and issue the information to the production device for patch according to the Message, thereby ensuring the double-patch operation.
Optionally, the MES and EAS docking Message is in an xml format, the Message body contains main information such as the destination of the display substrate, and the goal is that the production equipment can accurately take and produce the Message after recognizing the Message.
Alternatively, the MES system needs to develop a reservation function capable of performing a two-piece operation, including at least one of an on-container patch, an off-container patch, and an empty load container patch, in order to implement a patch when a load container requires a patch, by which a target position to which a display substrate needs to be moved is specified. The in-container patch refers to a position movement of a display substrate in one CST, the out-container patch refers to a designated layer of two different CSTs from one to the other, and the empty load container patch refers to a display substrate extracted from an empty load container and placed in a slice-missing position of the load container, thereby ensuring a target CST two-slice operation. If the reservation is not needed, the MES sends information to the EAS according to the normal double-piece mode, and the EAS receives the information, analyzes the information and sends the information to the production equipment for production.
Optionally, the database DB creates a reservation table for reservation, stores data including the reservation table and a reservation history table, stores reserved data after reservation, records a current reservation state, changes the field information to a processed field after the device is processed, and then performs reservation processing again.
According to the embodiment, detailed analysis is carried out according to the equipment double-piece operation mode, data are extracted, system modeling is carried out, deep excavation is carried out on an original MES system, the MES system meeting double-piece operation is developed, the problem of online double-piece operation is solved, and the problems of capacity and production efficiency in the production process are solved by matching with process equipment.
As an alternative embodiment, as shown in fig. 2A, the loading container 20 includes two columns of placing containers 21/22 arranged side by side, the placing container 21/22 includes a plurality of placing cavities 211/221 arranged in a stack, and the placing cavity 211/221 is used for placing the display panel 30 to be processed.
As an alternative embodiment, the control system 50 is configured to: in an initial state, giving a unique identifier to each display substrate to be processed; recording the placing position and the unique identification of each display panel to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises: determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded; determining the current device information of the loading container to be loaded according to the unique identifier; determining the film missing information of the loading container to be loaded according to the current loading information and the initial loading information; and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
By adopting the embodiment, each placing cavity of the loading container is in one-to-one correspondence with the unique identifier by marking the unique identifier on the display substrate, so that after a certain process is finished, the newly-added wafer missing position after the process is finished can be known by comparing the unique identifier list formed after the previous process is finished.
Of course, it can be known that, after each process is completed, if the loading container has a situation of missing pieces and patches, the list of unique identifiers needs to be updated based on the situation of missing pieces and patches. For example, when a display substrate of a certain placing cavity is cleaned and supplemented with a new display substrate, the unique identifier corresponding to the placing cavity needs to be updated. For another example, after the patch is completed, if two placement cavities of a certain layer of the loading container are both empty, the unique identifier corresponding to the position in the list needs to be updated to be empty or "0".
As another alternative embodiment, the production device 40 is configured to: loading image acquisition equipment and acquiring an image of the loading container to be loaded by utilizing the image acquisition equipment; wherein, the image shows the position of the chip in the loading container to be loaded;
the control system 50 configured to:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
By adopting the embodiment, the information of the film lack in the loading container can be known through the image recognition technology, the realization is more convenient, and the manual participation is not needed.
As an alternative embodiment, the control system is configured to:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is placed with the display substrate to be processed, and the other placing cavity is not placed with the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule;
optionally, if there is no monolithic state in the loading container to be loaded, there is no need to perform a patch operation on the loading container to be loaded.
In this embodiment, the single-chip state refers to that only one of the two placing cavities on the same layer is used for placing a display substrate to be processed (refer to the layer with the chip missing position in the left half portion of fig. 2C to 2J), and the production equipment can only perform double-chip production, and the double-chip production can only take out two display substrates from the same layer placing cavity to perform double-chip production.
Optionally, the preset patch rule includes:
at least one of a same-container patch, a different-container patch and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavities in the single-sheet state and placing the display substrate in the lacking position of the other layer of placing cavities in the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
As an alternative embodiment, the preset patch rule includes:
rule one is as follows: if at least two single-chip states exist in the same loading container to be loaded, performing same-container patching (onecontainerizing);
rule two: if the loading container to be loaded still has a single chip state after the same container patching is finished, carrying out different container patching;
rule three: and if the loading container to be loaded still has a single chip state after the steps are finished, extracting the display substrate to be processed from the idle loading container and placing the display substrate in the chip lacking position of the loading container to be loaded.
After the preset patching rule is adopted, patching can be completed on all loading containers with single-piece states, so that double-piece production can be normally carried out.
In some cases, the two columns of placing containers arranged side by side of the loading container are a first column of placing containers and a second column of placing containers, respectively, and the display substrates placed in the two columns of placing containers are not confused with each other, and therefore, as an alternative embodiment, the preset patch rule further includes:
if the placing cavities in the first row of placing containers need the patches, only the display substrates to be processed can be extracted from the first row of placing containers of the loading container to complete the patches;
if a placement cavity in the second column of placement containers requires a patch, then only the display substrate to be processed can be extracted from the second column of placement containers of the loading container to complete the patch.
As shown in fig. 2F, after the same container patch and the different container patch are passed, there may be more than one single sheet in the second row of the placement container of one or some loading containers, and at this time, in the case of strictly distinguishing the first row from the second row, the display panel cannot be extracted from the first row to perform the patch for the second row, and therefore, only the display substrate belonging to the second row can be extracted from the empty loading container to perform the patch.
Alternatively, the empty load container may place the display substrate only in the first column or the second column of placement containers, so that the empty load container can be selected in a targeted manner at the time of patching without causing confusion. Optionally, the production equipment corresponding to each process is equipped with a corresponding empty loading container, and when the empty loading container equipped by the production equipment is consumed, the empty loading container equipped by the production equipment of other processes can be called.
In one or more embodiments of the present disclosure, the production apparatus 40 is configured to: and loading the double mechanical arms, and carrying out double-piece production by using the double mechanical arms.
According to the embodiment, the MES is in butt joint with the EAS interface, the double mechanical arms are arranged, and the support of hardware of a loading container (2 pieces of Panel are loaded on one layer) is provided, so that the online double-piece production operation can be realized, and the production rhythm is accelerated. The working principle of the double mechanical arms is that for online equipment, the actions of taking a film from CST and putting the film into the equipment by the double mechanical arms can be realized. The mechanical arm with the double-sheet operation mode can take two pieces of Panel at one time, so that production materials can be effectively utilized, and the production efficiency can be improved.
Optionally, the control system 50 is configured to:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
By adopting the embodiment, when one mechanical arm in the double mechanical arms has a fault, the double-piece production is switched to the single-piece production by controlling the production equipment, so that the production mode of the production equipment is changed in time when the double-piece production condition is not met, and the normal operation of the production line is further ensured.
Optionally, the control system 50 is configured to:
and if the product inlet of the production equipment is occupied, controlling one mechanical arm of the double mechanical arms to grab an occupied object, and controlling the other mechanical arm of the double mechanical arms to place the display substrate to be processed.
In the equipment course of working, if Robot (Robot) is single mechanical arm equipment, 1 display substrate of Cassette one deck can only be taken once, when equipment port mouth business turn over was same port mouth, Robot can take out the display substrate of port mouth with priority this moment and put the CST, then gets piece input equipment from the CST again, and processing cycle is long on such an LOT is whole, and production efficiency is lower. Therefore, under the condition that the port of the production equipment is shared by the inlet and the outlet, if the double mechanical arms input the display panel into the production equipment, the process of the display substrate happens to be finished by the port of the equipment at the moment, the port is occupied, and the robot cannot continue to input the display panel, at the moment, one mechanical arm can take down the display substrate from the port of the equipment, and the other mechanical arm grabs the display substrate to be processed and places the display substrate at the port of the equipment, so that the taking-out and inputting actions are completed, and the working efficiency of the equipment is improved.
Optionally, the dual robots need two modes to effectively implement the dual-slice operation scenario.
Mode 1: in the normal production mode, two display substrates can be taken out from CST according to Robot for one time of double-sheet operation, and are put into equipment for technological production, so that the production efficiency can be effectively improved.
Mode 2: when the CST is single-chip (one layer of the CST only has one display substrate), the patch needs to be carried out, and the patch mode can be that the patch is carried out from other CST (TwoCSTStarting) or the patch is adjusted from the CST (OneCSTRT).
And the control instruction of the patch on the whole is issued by the MES, the instruction is transmitted to the EAS, the EAS analyzes the instruction, and then the analyzed instruction is forwarded to the production equipment, so that the production equipment carries out the patch operation according to the instruction.
Alternatively, when the production equipment is in idle state (equipment is in idle state and no production is performed), the patch mode (oneCSTRORING or twoCSTStarting) is automatically switched to after the specified time in the field.
And after switching to the patch mode, the production equipment reports a loading container command (loadRequestCST) to the MES, the MES analyzes according to the reported command to obtain the working mode of the current equipment and judges whether the current equipment is in the patch mode, and if the current equipment is in the patch mode, CST lacking single sheets is searched in storage (stock) equipment and is transported to the production equipment for patch operation.
After the CST without the single chip is conveyed to the production equipment, the production equipment sends a loading completion message (loadComplete) and a production information downloading message (lotInfoDownLoadRequest) to the MES, the MES obtains the messages and analyzes the messages to obtain the placing cavity map information (slotMap) of the CST in the messages, the information refers to which placing cavity in the CST has the display substrate and which placing cavity in the CST does not have the display substrate, and the information can be compared with the information of the display substrate stored in the MES.
And developing a judgment algorithm in MES, checking the position information mode of the display substrate in CST in a circulating traversal mode to judge, judging whether the CST can adjust a patch (oneCSTRport) by self, and if so, adopting an oneCSTRport mode to perform the patch. In the patching process, the MES performs automatic matching according to slotMap information of CST, the single piece information is supplemented to the missing piece target position, then the information is stored in the MES DB, meanwhile, the Message of the patching is assembled and contains the destination information (the target CST, the target position and the target Port information) of the display substrate, after the Message is assembled, the MES sends the Message to production equipment, and the equipment performs patching operation according to the Message information, so that the patching operation flow is completed.
When a judgment algorithm is developed in MES, a circulating traversal mode is adopted, a mode of viewing the position information of the display substrate in CST is used for judgment, and a twoCSTStarting mode is adopted when the patch needs to be carried out from other CST. At the moment, the matched LOT of mass production is found according to the information (LOT information, ProductSpec) of the target CST, the LOT is transported to the production equipment for patching, after the original CST is transported to the production equipment, a load completion Message (loadComplete) and a production information download Message (lotInfoDownLoadRequest) are reported to the MES, then the MES stores the information of the display panel which can be supplemented to the target CST according to the display panel information in the CST, meanwhile, the Message of the patching is assembled, the Message is issued to a loading container to complete patching operation, and if the CST which can be patched cannot be found, the patching is carried out by searching for CST of a free (dummy) type.
And after the patch is finished, the production equipment reports unloading information (unloadRequest) to the MES, the MES replies to the production equipment after receiving the information, and the CST automatically conveys the information to the stock equipment to prepare for production.
Optionally, after loading the CST entity on the device port is finished, the CST entity sends a Message to the MES through the TIBCO Message middleware, the MES receives the Message and then analyzes the Message, and issues a Message according to the current state of the device (the Message is defined by the previous two systems), and the EAS receives the Message and then analyzes the Message, and sends the piece-taking action to the device for processing. And the double-mechanical-arm equipment of the production equipment carries out film taking action in sequence, and then the display panel is put into the production equipment or carries out patching operation.
Fig. 5 is a schematic diagram illustrating a more specific hardware structure of an electronic device according to this embodiment, where the electronic device may include: a processor 501, a memory 502, an input/output interface 503, a communication interface 504, and a bus 505. Wherein the processor 501, the memory 502, the input/output interface 503 and the communication interface 504 are communicatively connected to each other within the device via a bus 505.
The processor 501 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an Application Specific Integrated Circuit (ASIC), or one or more Integrated circuits, and is configured to execute related programs to implement the technical solutions provided in the embodiments of the present specification.
The Memory 502 may be implemented in the form of a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, or the like. The memory 502 may store an operating system and other application programs, and when the technical solution provided by the embodiments of the present specification is implemented by software or firmware, the relevant program codes are stored in the memory 502 and called to be executed by the processor 501.
The input/output interface 503 is used for connecting an input/output module to realize information input and output. The i/o module may be configured as a component in a device (not shown) or may be external to the device to provide a corresponding function. The input devices may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output devices may include a display, a speaker, a vibrator, an indicator light, etc.
The communication interface 504 is used for connecting a communication module (not shown in the figure) to realize communication interaction between the device and other devices. The communication module can realize communication in a wired mode (such as USB, network cable and the like) and also can realize communication in a wireless mode (such as mobile network, WIFI, Bluetooth and the like).
It should be noted that although the above-mentioned device only shows the processor 501, the memory 502, the input/output interface 503, the communication interface 504 and the bus 505, in a specific implementation, the device may also include other components necessary for normal operation. In addition, those skilled in the art will appreciate that the above-described apparatus may also include only those components necessary to implement the embodiments of the present description, and not necessarily all of the components shown in the figures.
Computer-readable media of the present embodiments, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device.
Finally, it should be noted that, as will be understood by those skilled in the art, all or part of the processes in the methods of the above embodiments may be implemented by a computer program that can be stored in a computer-readable storage medium and that, when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like. The technical effect of the embodiment of the computer program is the same as or similar to that of any of the method embodiments described above.
Furthermore, the apparatuses, devices, etc. described in the present disclosure may be various electronic terminal devices, such as a mobile phone, a Personal Digital Assistant (PDA), a tablet computer (PAD), a smart television, etc., and may also be large terminal devices, such as a server, etc., and therefore the scope of protection of the present disclosure should not be limited to a specific type of apparatus, device. The client disclosed by the present disclosure may be applied to any one of the above electronic terminal devices in the form of electronic hardware, computer software, or a combination of both.
Furthermore, the method according to the present disclosure may also be implemented as a computer program executed by a CPU, which may be stored in a computer-readable storage medium. The computer program, when executed by the CPU, performs the above-described functions defined in the method of the present disclosure.
Further, the above method steps and system elements may also be implemented using a controller and a computer readable storage medium for storing a computer program for causing the controller to implement the functions of the above steps or elements.
Further, it should be appreciated that the computer-readable storage media (e.g., memory) described herein can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory. By way of example, and not limitation, nonvolatile memory can include Read Only Memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM), which can act as external cache memory. By way of example and not limitation, RAM is available in a variety of forms such as synchronous RAM (DRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The storage devices of the disclosed aspects are intended to comprise, without being limited to, these and other suitable types of memory.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
The various illustrative logical blocks, modules, and circuits described in connection with the disclosure herein may be implemented or performed with the following components designed to perform the functions described herein: a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
The steps of a method or algorithm described in connection with the disclosure herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.
In one or more exemplary designs, the functions may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a general-purpose or special-purpose computer, or a general-purpose or special-purpose processor. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, includes Compact Disc (CD), laser disc, optical disc, Digital Versatile Disc (DVD), floppy disk, blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
Disclosed exemplary embodiments should be noted, however, that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a," "an," "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The above-mentioned serial numbers of the embodiments of the present disclosure are merely for description and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of embodiments of the present disclosure, also technical features in the above embodiments or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the disclosed embodiments are intended to be included within the scope of the disclosed embodiments.
Claims (17)
1. A display panel double-piece production control method comprises the following steps:
receiving a double-sheet production request sent by production equipment;
determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request; wherein, the loading container is used for placing a display substrate to be processed;
if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information;
after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
2. The method of claim 1, wherein the display panel two-sheet production control method further comprises:
in an initial state, giving a unique identifier to each display substrate to be processed;
recording the placing position and the unique identification of each display substrate to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises:
determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded;
determining the current loading information of the loading container to be loaded according to the unique identifier;
determining the film missing information of the loading container to be loaded according to the current loading information and the initial loading information;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
3. The method of claim 1, wherein determining whether a patch operation is required for a loading container to be loaded comprises:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
4. The method according to claim 2 or 3, wherein the loading container comprises two columns of placing containers arranged side by side, the placing container comprises a plurality of placing cavities arranged in a stack, and the placing cavities are used for placing the display substrates to be processed;
determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded, wherein the method comprises the following steps:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is placed with the display substrate to be processed, and the other placing cavity is not placed with the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
and if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule.
5. The method of claim 4, wherein the preset patch rule comprises:
at least one of a same-container patch, a different-container patch and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavity with the single-sheet state and placing the display substrate in the sheet-lacking position of the other layer of placing cavity with the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
6. The method of claim 5, wherein the preset patch rule comprises:
if at least two single-chip states exist in the same loading container to be loaded, carrying out same-container patching;
if the loading container to be loaded has a single-chip state after the same container patching is finished, carrying out different container patching;
and if the loading container to be loaded has a single-chip state after the steps are finished, carrying out idle loading container patching.
7. The method of claim 1, wherein controlling the production equipment to load the loading container and perform a two-sheet production of the display substrate placed therein comprises: controlling the production equipment to load the loading container and carry out double-wafer production on the display substrate placed in the loading container by using a double-manipulator;
the display panel double-piece production control method further comprises the following steps:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
8. A display panel bi-sheet production system comprising:
at least one loading container configured to: placing a display substrate to be processed;
at least one production device configured to: sending a double-chip production request; receiving a double-piece production control instruction and carrying out double-piece production; receiving a patch operation instruction and carrying out patch operation;
a control system configured to:
receiving a double-piece production request sent by the production equipment;
determining whether a loading container to be loaded needs to be subjected to patching operation according to the double-piece production request;
if the loading container to be loaded needs to be subjected to patching operation, determining the missing piece information of the loading container, and controlling the production equipment to carry out patching operation on the loading container according to a preset patching rule and the missing piece information;
after the patching is finished, controlling the production equipment to load the loading container and carry out double-sheet production on the display substrate placed in the loading container.
9. The system of claim 8, wherein the control system is configured to: in an initial state, giving a unique identifier to each display substrate to be processed; recording the placing position and the unique identification of each display panel to be processed placed in the loading container in an initial state, and packaging the placing position and the unique identification of each display substrate to be processed into initial loading information;
the determining whether a patch operation needs to be performed on the loading container to be loaded comprises: determining the unique identifier of each display substrate to be processed placed in the loading container to be loaded; determining the current device information of the loading container to be loaded according to the unique identifier; determining the film missing information of the loading container to be loaded according to the current loading information and the initial loading information; and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
10. The system of claim 8, wherein the production device is configured to: loading image acquisition equipment and acquiring an image of the loading container to be loaded by utilizing the image acquisition equipment;
the control system configured to:
acquiring an image of the loading container to be loaded;
identifying the image to determine the information of the missing pieces in the loading container to be loaded by utilizing an image identification technology;
and determining whether the loading container to be loaded needs to be subjected to patching operation according to the missing piece information in the loading container to be loaded.
11. The system according to claim 9 or 10, wherein the loading container comprises two columns of placing containers arranged side by side, the placing container comprises a plurality of placing cavities arranged in a stack, and the placing cavities are used for placing the display substrates to be processed;
the control system configured to:
determining whether a single chip state exists in the loading container to be loaded or not according to the chip missing information in the loading container to be loaded; the single-chip state means that only one of the two placing cavities on the same layer is placed with the display substrate to be processed, and the other placing cavity is not placed with the display substrate to be processed; the position, where the display substrate to be processed is not placed, in the placing cavity is the chip-lacking position;
and if the loading container to be loaded has a single chip state, performing patching operation on the loading container to be loaded according to the preset patching rule.
12. The system of claim 11, wherein the preset patch rule comprises:
at least one of a same-container patch, a different-container patch and an idle loading container patch;
wherein, the same-container patch is used for extracting the display substrate to be processed from one layer of placing cavities in the single-sheet state and placing the display substrate in the lacking position of the other layer of placing cavities in the single-sheet state;
the different container patch is used for extracting the display substrate to be processed from the layer of placing cavity of the loading container to be loaded with the single-piece state, wherein the layer of placing cavity is provided with the chip missing position, and placing the display substrate to be processed in the chip missing position of the other loading container to be loaded with the single-piece state;
the spare loading container patch is used for extracting the display substrate to be processed from a spare loading container and placing the display substrate to be processed in the fragment missing position of the loading container to be loaded.
13. The system of claim 12, wherein the preset patch rule comprises:
if at least two single-chip states exist in the same loading container to be loaded, carrying out same-container patching;
if the loading container to be loaded has a single-chip state after the same container patching is finished, carrying out different container patching;
and if the loading container to be loaded has a single-chip state after the steps are finished, carrying out idle loading container patching.
14. The system of claim 8, wherein the production device is configured to: loading double mechanical arms, and carrying out double-piece production by using the double mechanical arms;
the control system configured to:
and if one mechanical arm of the double mechanical arms of the production equipment breaks down, controlling the production equipment to be switched from double-piece production to single-piece production.
15. The system of claim 8, wherein the control system comprises:
a device automation system configured to: respectively carrying out data interaction with the production equipment and the manufacturing execution system; converting the control instruction generated by the manufacturing execution system into an instruction which can be identified by the production equipment and sending the instruction to the production equipment;
a manufacturing execution system configured to: generating a corresponding control instruction according to the information reported by the equipment automatic system;
and the equipment automatic system and the manufacturing execution system adopt a preset message format to realize communication through message middleware.
16. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the method of any one of claims 1 to 7 when executing the program.
17. A non-transitory computer readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 1 to 7.
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