CN114107916B - Plating method for keeping blade air film cooling hole smooth - Google Patents
Plating method for keeping blade air film cooling hole smooth Download PDFInfo
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- CN114107916B CN114107916B CN202210088536.8A CN202210088536A CN114107916B CN 114107916 B CN114107916 B CN 114107916B CN 202210088536 A CN202210088536 A CN 202210088536A CN 114107916 B CN114107916 B CN 114107916B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
Abstract
The invention discloses a plating method for keeping a blade air film cooling hole unobstructed, which comprises the following steps of; classifying the film cooling holes according to the shape of the blade and the relative position relation with the plasma jet, wherein the film cooling holes comprise a first film cooling hole positioned at the blade body of the blade, a second film cooling hole positioned at the air inlet edge of the blade and a third film cooling hole positioned at the air outlet edge of the blade; the method comprises the following steps of (1) carrying out thermal barrier coating plating on the blade by adopting a plasma physical vapor deposition method, adopting a method of blocking a cold air channel or charging heating gas with reasonable parameters for a first air film cooling hole during plating, and respectively arranging a physical shielding device on one side of an air inlet edge and one side of an air outlet edge of the blade; the blade deposited by the invention has the advantages that the smoothness is kept after the coating is plated on the air film cooling hole, the shrinkage rate is within 15 percent, the method is simple, and the blade is suitable for batch industrial production.
Description
Technical Field
The invention belongs to the technical field of plasma physical vapor deposition preparation of thermal barrier coatings, and particularly relates to a plating method for keeping a blade air film cooling hole smooth.
Background
The Gas Turbine is an internal combustion type power machine which takes continuously flowing Gas as a working medium to drive an impeller to rotate at a high speed and converts the energy of fuel into useful work. The method has wide application in aviation, ships, power stations and the like. With the development of gas turbines to high output power, the temperature in front of the turbine is continuously increased and reaches more than 1500 ℃ at present, which far exceeds the melting point (1300 ℃) of the existing high-temperature alloy. In order to meet the requirement of high-temperature operation, various means such as film cooling and thermal barrier coating are required to increase the service temperature of the blade of the gas turbine.
The working principle of the blade air film cooling hole is that when the blade works, a certain flow of cold air is introduced to keep the surface temperature of the blade not to exceed the highest temperature bearing temperature of the high-temperature alloy. In order to achieve an optimized cooling effect, the film cooling hole needs to have a certain design shape and a certain angle, and meanwhile, in practical application, whether the smoothness of the film cooling hole seriously affects the cooling effect is found. Meanwhile, in order to meet the requirement of high-temperature work, the blade needs to be plated with a thermal barrier coating for further heat insulation, and the coating can influence the smoothness of the air film cooling hole in the plating process, so that the problem of ensuring the smoothness of the air film cooling hole of the blade after plating is a very critical problem.
In 1993, Martus et al proposed a method of plating a thermal barrier coating and then drilling holes by laser to solve the problem of air film cooling hole patency, but the subsequent research found that cracks in the diameter of the thermal barrier coating and a substrate can be caused during the laser drilling process, which leads to premature spalling failure during the service process of the thermal barrier coating, so that until now, the process of plating the thermal barrier coating first and then drilling holes is not applied to the actual production process.
The patent US20210047718A1, US9206499B2 propose to put in the plug in the film cooling hole, the method that the plug is removed after spraying in order to guarantee the unobstructed film cooling hole after coating, when the above-mentioned method is problematic in that the cooling hole diameter of the blade is very small 0.5-1mm, the work load and difficulty of putting in the plug are both large, and the temperature of the substrate is high (800-. Plugging the film cooling holes is therefore not suitable for processes for forming vapor deposited thermal barrier coatings, such as: electron beam physical deposition process (EB-PVD) and plasma physical vapor deposition process (PS-PVD).
Patent CN102443752A proposes that during the process of coating thermal barrier coating, the deposition of thermal barrier coating in the hole can be blocked by passing a certain flow rate of gas from the gas film cooling hole. Rousseau et al, when spraying blades, have used this technique to find that it is true that, during Atmospheric Plasma (APS) spraying, the gas film pores can be partially prevented from becoming clogged after aeration of the gas film pores, but in practice it has been found that liquid phase components in the plasma jet still enter the gas pore membranes and are deposited in the pores.
In patent CN108559958A, it is proposed that during the process of coating thermal barrier coating by plasma physical vapor deposition, the plasma jet is kept at a certain specific angle with the direction of the hole, and the smooth transition of the film hole coating can be controlled. However, when the blade is actually sprayed, it is difficult to maintain a certain angle for spraying the blade, and during the actual spraying process, the blade needs to maintain rotation to control the temperature and thickness uniformity of the substrate, so the method of spraying the blade with the maintained angle is difficult to be applied in engineering.
Disclosure of Invention
Based on the defects of the prior art, the invention provides a plating method for keeping the air film cooling hole of the blade smooth.
The complete technical scheme of the invention comprises the following steps:
a plating method for keeping blade air film cooling holes unobstructed comprises the following steps:
classifying the film cooling holes according to the shape of the blade and the relative position relation with the plasma jet, wherein the film cooling holes comprise a first film cooling hole 1 positioned at the blade body position of the blade, a second film cooling hole 2 positioned at the air inlet edge of the blade and a third film cooling hole 3 positioned at the air outlet edge of the blade;
the thermal barrier coating is plated on the blade by adopting a plasma physical vapor deposition method, and a first high-temperature-resistant material is adopted to block a cold air channel 4 for ventilating the air film cooling hole during plating, so that the air film cooling hole becomes a blind hole;
and a physical shielding device is respectively arranged on one side of the air inlet edge and one side of the air outlet edge of each blade.
A plating method for keeping blade air film cooling holes unobstructed comprises the following steps:
classifying the film cooling holes according to the shape of the blade and the relative position relation with the plasma jet, wherein the film cooling holes comprise a first film cooling hole 1 positioned at the blade body position of the blade, a second film cooling hole 2 positioned at the air inlet edge of the blade and a third film cooling hole 3 positioned at the air outlet edge of the blade;
carrying out thermal barrier coating plating on the blade by adopting a plasma physical vapor deposition method, wherein the blade is communicated with a tool for conveying inert gas during plating, and the tool is connected with a cold air channel of the blade and conveys the inert gas to a blade air film cooling hole to ensure that the air film cooling hole has certain pressure;
the temperature of the inert gas is higher than 500 ℃;
and a physical shielding device is respectively arranged on one side of the air inlet edge and one side of the air outlet edge of each blade.
The physical shielding device is made of a second high-temperature-resistant material.
The second high-temperature resistant material is graphite or high-temperature alloy.
The physical shielding device is a flat plate-shaped air inlet side speed reducing baffle 5 and an air exhaust side speed reducing baffle 6.
The width of the air inlet side speed reduction baffle 5 and the width of the air exhaust side speed reduction baffle 6 are 5cm, and the distance between the air inlet side speed reduction baffle and the air exhaust side speed reduction baffle is 1-10 cm.
And the distance between the air inlet side deceleration baffle 5 and the air exhaust side deceleration baffle 6 and the distance between the air inlet side and the air exhaust side are 2 cm.
The pressure of inert gas in the gas film cooling holes is 0.01-1 MPa.
And the pressure of inert gas in the gas film cooling holes is 0.1 MPa.
The first high-temperature resistant material is graphite or alumina.
Compared with the prior art, the invention has the following advantages:
according to the invention, the structure of the blade and the actual deposition condition are researched, the air film cooling holes are analyzed and classified, main factors influencing deposition are found, a method of blocking a cold air channel or filling heating air with reasonable parameters is adopted for most of the air film cooling holes on the blade in a targeted manner, physical shielding is added to the air film cooling holes on the air inlet and outlet sides so as to reduce gas-phase and liquid-phase components from entering the air film cooling holes, and the adopted plasma physical vapor deposition blade keeps the air film cooling holes smooth after being coated with a coating. The method adopted by the invention is simple and is suitable for batch industrial production.
Drawings
FIG. 1 is a schematic view of a gas turbine blade and film cooling hole classification.
Fig. 2 is a schematic view of the solution of the invention with a deceleration baffle.
FIG. 3 is a cross-sectional schematic view of a turbine blade according to the present invention.
In the figure: 1-first air film cooling hole, 2-second air film cooling hole, 3-third air film cooling hole, 4-cold air channel, 5-air inlet side speed reducing baffle plate and 6-air outlet side speed reducing baffle plate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only illustrative and are not intended to limit the present application.
The thermal barrier coating of the gas turbine blade prepared by the embodiment is prepared by adopting a plasma physical vapor deposition (PS-PVD) method, the method has the advantages of high heat insulation performance of traditional atmospheric plasma spraying, long service life of electron beam physical vapor deposition and the like, and also has the advantages of non-line-of-sight deposition and the like which are not possessed by the traditional technology, and the method is a more advanced thermal barrier coating preparation process.
Firstly, according to the blade dissection analysis after plasma physical vapor deposition, the film cooling holes are analyzed and classified, as shown in fig. 1, in a typical gas turbine blade structure, according to different positions of the blade shape and the relative position relation with plasma jet, most of the film cooling holes on the blade are positioned at the blade body position with smaller curvature, in the embodiment, the film cooling holes are called as first film cooling holes 1, the film cooling holes are not directly opposite to the plasma jet during deposition, or the time is very short, the proportion of coating components in the plasma jet entering the film cooling holes is relatively low, and most of the coating components are deposited at the edge of the film cooling holes, so that the aperture of the film cooling holes is reduced. The air film cooling holes on the air inlet edge of the blade and the air film cooling holes on the air outlet edge of the blade are arranged at two ends of the blade, the air film cooling holes on the air inlet edge of the blade are called second air film cooling holes 2, the air film cooling holes on the air outlet edge of the blade are called third air film cooling holes 3, the second air film cooling holes 2 and the third air film cooling holes 3 are arranged at two ends of the blade, plasma jet flow can be directly aligned during spraying, besides gas phase, certain liquid phase components can enter the holes, and then coatings are deposited in the holes, so that the hole diameter is reduced and even blocked.
In order to solve the problem that the air film cooling hole is easy to block and unsmooth after the thermal barrier coating is plated, the implementation mode firstly adopts the following method: according to the research of a plasma physical vapor deposition model, high-speed jet flow reaches the surface of a workpiece, a very thin boundary layer is arranged on the surface of the workpiece, and the flow velocity of gas in the boundary layer is not high, so that for most of first air film cooling holes 1 of a blade body, high-temperature resistant materials such as graphite, aluminum oxide and the like are adopted to block a cold air channel 4 communicated with the air film cooling holes during plating, the air film cooling holes become blind holes, the mode greatly reduces the mobility of the plasma jet flow in the air film cooling holes and the cold air channel 4 of the blade, enables plating air flow to flow only in the thin boundary layer on the surface of the workpiece and cannot enter the air film holes, and the problem of hole blocking caused by deposition in the holes during coating plating is reduced.
For most of the first film cooling holes 1 of the blade body, the embodiment also discloses another solution, namely a method for controlling the gas pressure in the film holes is adopted, so that the plating gas flow cannot enter the film holes, and the problem of hole blockage caused by deposition of a coating in the holes is reduced. Specifically, a tool communicated with inert gas is connected to a cold gas channel, and argon, nitrogen, helium and the like are introduced, preferably argon. Because the PS-PVD ceramic coating layer requires a relatively high substrate temperature, the introduced gas, if nitrogen is used, may react with the metal to cause nitridation, which affects the stability of the substrate alloy, and thus Ar gas is preferred in this embodiment. In the process, a further optimization scheme is provided, namely, the introduced gas has a cooling effect on the substrate, and the substrate temperature has important significance on the growth of the vapor deposition coating. At lower substrate temperatures, gas phase atoms condense directly into particles that accumulate on the substrate surface, resulting in a low bond strength between the coating and the substrate. Therefore, the proper pressure needs to be controlled to be matched with the plasma jet heating capacity to obtain the proper substrate temperature, so that the introduced gas is ensured not to influence the performance of the thermal barrier coating, and in order to solve the problem, the scheme adopted by the embodiment is as follows: under the condition of 30L/min Ar +60L/min Ar, plasma with the temperature range of 13000K-15000K can be generated by adopting 1800 ion-2000A current and the voltage of 45-54V, the preparation of a plasma physical vapor deposition ceramic layer is carried out within the spraying distance of 0.6-1.2m, through infrared temperature measurement, Ar gas is introduced under the pressure of 0.01MPa-0.1MPa to measure the surface temperature of different blades, different plasma spraying processes are matched, the effect of keeping the air film holes smooth is better under the condition of the pressure of 0.1MPa, the temperature of the introduced Ar gas is preferably selected at the moment, and the temperature of the blades can be ensured to reach 600 ion-800 ℃ usually by needing to be above 500 ℃. If the temperature of Ar gas is lower than 600 ℃, the temperature of the substrate is lower than 600 ℃, the binding force of the plated thermal barrier coating is very poor, and the peeling phenomenon is easy to occur in the early stage of the service environment.
As described above, the method can effectively solve the problem that the first air film cooling hole 1 is easy to block and unsmooth after being coated with the thermal barrier coating, and for the second air film cooling hole 2 and the third air film cooling hole 3 which are positioned at two ends of the blade, as the plasma jet flow is just aligned during spraying, the liquid phase can enter the hole and then the coating is deposited from the hole, so that the hole diameter is reduced and even the hole is blocked. Thus, for the second film cooling hole 2 and the third film cooling hole 3 which are in a small number, the impact of the plasma jet on the insides of the film holes is slowed down in a physical shielding mode, and therefore the deposition of the coating in the holes is reduced. The adopted physical shielding material is a high-temperature resistant material, such as graphite, high-temperature alloy and the like, and the preferred graphite is selected. In a specific operation example, the intake side and the exhaust side are shielded by the intake side decelerating barrier 5 and the exhaust side decelerating barrier 6, respectively, which are flat plates, as shown in fig. 2.
In the aspect of the shielding range selection, researches show that the second film cooling hole 2 and the third film cooling hole 3 are easy to enter and deposit by the liquid phase, and are related to the curvature of the blade part where the second film cooling hole is located, when parts with different curvatures face the plasma jet, the flowing condition of the formed boundary layer is changed, and meanwhile, the angles of the film cooling holes and the jet are different, so that the parts with larger curvatures are easier to enter and deposit by the liquid phase.
As shown in fig. 3, the maximum radius of curvature at the blade body is R1, the radius of curvature at the blade with the inlet side is R2, and the radius of curvature at the blade with the outlet side is R3, in this embodiment, the curvature at each position of the cross section of the blade is studied, and the maximum radius of curvature at the blade body is 2132.4mm, and the ranges of the radii of curvature R2 and R3 at the inlet and outlet sides are 1.6-25.2 mm, so at least the part of the blade with the radius of curvature less than 0.012R1 is designed to be shielded, in a specific operation example, the width of the inlet side decelerating barrier 5 and the outlet side decelerating barrier 6 is 5cm, and the shielding position is 1-10cm, preferably 2cm, from the inlet side and the outlet side, respectively.
The following further describes, by way of specific examples, a method for ensuring the smoothness of the air film cooling hole after plating a thermal barrier coating on the gas turbine blade in this embodiment:
example 1
A150-micron YSZ thermal barrier coating is plated on a high-pressure turbine guide vane of a certain gas turbine by using a plasma physical vapor deposition method, the pore diameter is measured by using a plug gauge, the pore diameter of a gas film cooling hole before plating is 0.5mm, a graphite block is adopted to block a cold air channel, and after physical shielding is adopted on an air inlet edge and an air outlet edge, the pore diameter of a gas film cooling hole is compared as shown in Table 1:
TABLE 1 comparison of film cooling hole patency and hole diameter variation after conventional spray coating and the modification of this example
| Numbering | Original aperture (mm) | Plugging hole after conventional spraying | Conventional spray coating rear aperture (mm) | Hole blocking after spraying of this scheme of adoption | Aperture (mm) after spraying this scheme of |
| 1 | 0.50 | Is free of | 0.38 | Is free of | 0.42 |
| 2 | 0.50 | Is provided with | 0.20 | Is free of | 0.41 |
| 3 | 0.50 | Is provided with | 0.25 | Is free of | 0.41 |
As can be seen from the table above, the coating layer plated by the invention keeps smooth, and the shrinkage rate is within 20 percent.
Example 2
A YSZ thermal barrier coating with the diameter of 120 microns is plated on a low-pressure turbine guide vane of a certain gas turbine by using a plasma physical vapor deposition method, the pore diameter is measured by using a plug gauge, the pore diameter of a gas film cooling hole before plating is 0.6mm, Ar gas with the temperature of 500 ℃ and the pressure of 0.1MPa is introduced from a cold air channel, and the pore diameter of a gas film cold air hole is compared and shown in a table 1 after physical shielding is adopted on an air inlet edge and an air outlet edge:
TABLE 2 comparison of film cooling hole patency and hole diameter variation after conventional spray coating and the modification of this example
| Numbering | Original aperture (mm) | Plugging hole after conventional spraying | Conventional spray coating rear aperture (mm) | Hole blocking after spraying of this scheme of adoption | Aperture (mm) behind this scheme of adoption spraying） |
| 1 | 0.60 | Is free of | 0.50 | Is free of | 0.52 |
| 2 | 0.60 | Is provided with | 0.45 | Is free of | 0.51 |
| 3 | 0.60 | Is provided with | 0.47 | Is free of | 0.51 |
After the invention is adopted, the coating can keep smooth after being plated, and the shrinkage rate is within 15 percent.
The above applications are only some embodiments of the present application. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept herein, and it is intended to cover all such modifications and variations as fall within the scope of the invention.
Claims (8)
1. A plating method for keeping a blade air film cooling hole unobstructed is characterized by comprising the following steps:
classifying the film cooling holes according to the shape of the blade and the relative position relation with the plasma jet, wherein the film cooling holes comprise a first film cooling hole (1) positioned at the blade body position of the blade, a second film cooling hole (2) positioned at the air inlet edge of the blade and a third film cooling hole (3) positioned at the air outlet edge of the blade;
the thermal barrier coating is plated on the blade by adopting a plasma physical vapor deposition method, and a cold air channel (4) which is ventilated by a gas film cooling hole is blocked by adopting a first high-temperature resistant material during plating, so that the gas film cooling hole becomes a blind hole, and the fluidity of plasma jet in the gas film cooling hole of the blade and the cold air channel (4) is reduced; the first high-temperature resistant material is graphite or alumina;
physical shielding devices are respectively arranged on one side of the air inlet edge and one side of the air outlet edge of each blade to slow down the impact of plasma jet on the interiors of the second air film cooling hole (2) and the third air film cooling hole (3), so that the deposition of a coating in the holes is reduced; the physical shielding device is a flat air inlet side speed reducing baffle (5) and an air outlet side speed reducing baffle (6), at least the part of the vane with the curvature radius smaller than 0.012R1 is shielded, and R1 is the maximum curvature radius of the vane body.
2. A plating method for keeping a film cooling hole of a blade unobstructed according to claim 1, wherein said leading edge deceleration baffle (5) and said trailing edge deceleration baffle (6) have a width of 5cm and a distance of 1-10cm from the leading edge and the trailing edge.
3. A plating method for keeping a film cooling hole of a blade unobstructed according to claim 2, wherein said leading edge deceleration baffle (5) and said trailing edge deceleration baffle (6) are at a distance of 2cm from the leading edge and the trailing edge.
4. A plating method for keeping a blade air film cooling hole unobstructed is characterized by comprising the following steps:
classifying the film cooling holes according to the shape of the blade and the relative position relation with the plasma jet, wherein the film cooling holes comprise a first film cooling hole (1) positioned at the blade body position of the blade, a second film cooling hole (2) positioned at the air inlet edge of the blade and a third film cooling hole (3) positioned at the air outlet edge of the blade;
carrying out thermal barrier coating plating on the blade by adopting a plasma physical vapor deposition method, wherein the blade is communicated with a tool for conveying inert gas during plating, and the tool is connected with a cold air channel of the blade and conveys the inert gas to a blade air film cooling hole to ensure that the air film cooling hole has certain pressure;
the temperature of the inert gas is higher than 500 ℃;
physical shielding devices are respectively arranged on one side of the air inlet edge and one side of the air outlet edge of each blade to slow down the impact of plasma jet on the interiors of the second air film cooling hole (2) and the third air film cooling hole (3), so that the deposition of a coating in the holes is reduced; the physical shielding device is a flat air inlet side speed reducing baffle (5) and an air outlet side speed reducing baffle (6), at least the part of the vane with the curvature radius smaller than 0.012R1 is shielded, and R1 is the maximum curvature radius of the vane body.
5. A plating method for keeping blade film cooling holes unobstructed according to claim 1 or 4, wherein said physical shielding device is made of a second high temperature resistant material.
6. A plating method for keeping blade film cooling holes unobstructed according to claim 5, wherein said second refractory material is graphite or a high temperature alloy.
7. A plating method for keeping a film cooling hole of a blade unobstructed according to claim 4, wherein the inert gas pressure in the film cooling hole is 0.01-1 MPa.
8. A plating method for keeping a film cooling hole of a blade unobstructed according to claim 7, wherein the inert gas pressure in the film cooling hole is 0.1 MPa.
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