CN114102695B - 一种封胶bga的切片方法 - Google Patents
一种封胶bga的切片方法 Download PDFInfo
- Publication number
- CN114102695B CN114102695B CN202111373636.7A CN202111373636A CN114102695B CN 114102695 B CN114102695 B CN 114102695B CN 202111373636 A CN202111373636 A CN 202111373636A CN 114102695 B CN114102695 B CN 114102695B
- Authority
- CN
- China
- Prior art keywords
- slice
- glue
- placing
- slicing
- bga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 title claims description 5
- 238000000227 grinding Methods 0.000 claims abstract description 17
- 238000011049 filling Methods 0.000 claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 230000008023 solidification Effects 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004848 polyfunctional curative Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
- B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
- B26D1/08—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111373636.7A CN114102695B (zh) | 2021-11-19 | 2021-11-19 | 一种封胶bga的切片方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111373636.7A CN114102695B (zh) | 2021-11-19 | 2021-11-19 | 一种封胶bga的切片方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114102695A CN114102695A (zh) | 2022-03-01 |
CN114102695B true CN114102695B (zh) | 2024-04-26 |
Family
ID=80396486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111373636.7A Active CN114102695B (zh) | 2021-11-19 | 2021-11-19 | 一种封胶bga的切片方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114102695B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101846601A (zh) * | 2010-03-31 | 2010-09-29 | 伟创力电子科技(上海)有限公司 | 球栅阵列封装切片试块的制作方法 |
CN102419276A (zh) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | 一种金相切片样品的制备方法 |
CN102539204A (zh) * | 2011-10-19 | 2012-07-04 | 深圳市金洲精工科技股份有限公司 | 一种pcb切片的制作方法及pcb切片 |
CN102928279A (zh) * | 2012-11-13 | 2013-02-13 | 无锡江南计算技术研究所 | 金相灌样二次填胶方法 |
-
2021
- 2021-11-19 CN CN202111373636.7A patent/CN114102695B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101846601A (zh) * | 2010-03-31 | 2010-09-29 | 伟创力电子科技(上海)有限公司 | 球栅阵列封装切片试块的制作方法 |
CN102419276A (zh) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | 一种金相切片样品的制备方法 |
CN102539204A (zh) * | 2011-10-19 | 2012-07-04 | 深圳市金洲精工科技股份有限公司 | 一种pcb切片的制作方法及pcb切片 |
CN102928279A (zh) * | 2012-11-13 | 2013-02-13 | 无锡江南计算技术研究所 | 金相灌样二次填胶方法 |
Also Published As
Publication number | Publication date |
---|---|
CN114102695A (zh) | 2022-03-01 |
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240418 Address after: Room 101 (office only), No. 230, Huangge Section, Shinan Road, Huangge Town, Nansha District, Guangzhou City, Guangdong Province, 510000 (self made hardware department of Building 2) (multiple photos for one address) Patentee after: Kuo Zhi Tong Testing Technology (Guangzhou) Co.,Ltd. Country or region after: China Address before: 511458 Room 203, software south building, Nansha Information Technology Park, No. 2, Huanshi Avenue South, Nansha District, Guangzhou City, Guangdong Province (office use only) Patentee before: QUALTEC TECHNOLOGY (GUANGZHOU) CO.,LTD. Country or region before: China |
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TR01 | Transfer of patent right |