CN114096073A - Baking equipment for semiconductor and circuit board - Google Patents
Baking equipment for semiconductor and circuit board Download PDFInfo
- Publication number
- CN114096073A CN114096073A CN202111324599.0A CN202111324599A CN114096073A CN 114096073 A CN114096073 A CN 114096073A CN 202111324599 A CN202111324599 A CN 202111324599A CN 114096073 A CN114096073 A CN 114096073A
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- Prior art keywords
- frame
- semiconductor
- plates
- circuit board
- baking
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 230000001681 protective effect Effects 0.000 claims abstract description 6
- 230000000903 blocking effect Effects 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 23
- 230000004888 barrier function Effects 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012056 semi-solid material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
The present disclosure relates to baking apparatuses, and particularly to a baking apparatus for a semiconductor and a circuit board. The baking equipment for the semiconductor and the circuit board can prevent residual materials from being adhered to the baking device and conveniently clean redundant materials. A baking apparatus for semiconductor and circuit board, comprising: a frame; the protective shell is arranged on the rack; a frame mounted on the frame; a sliding frame slidably mounted on the frame; a roaster mounted on the carriage. According to the invention, the semiconductor can be baked through the baking device, the lifting assembly can drive the baking device to move up and down as required, so that the semiconductor can be baked conveniently, the semiconductor to be baked can be placed through the placing assembly, the semiconductor can move backwards while the baking device moves downwards through the pushing assembly, the material falling on the semiconductor can be cooled through the cooling assembly, and the cooled material can be automatically poured out after baking is finished through the pulling assembly.
Description
Technical Field
The present disclosure relates to baking apparatuses, and particularly to a baking apparatus for a semiconductor and a circuit board.
Background
In the manufacturing process of semiconductor or circuit board, a baking device is often used to heat the semiconductor or circuit board to cure the material coated on the surface of the semiconductor or circuit board for subsequent processing and use of the semiconductor or circuit board.
At present, when a semiconductor or a circuit board is baked, the semiconductor or the circuit board is generally placed on a heating screen plate of a baking device, the semiconductor is directly contacted with the heating screen plate, semi-solid materials coated on the semiconductor can be adhered to the heating screen plate, redundant materials can also fall on the baking device in the baking process, and because the baking frequency is high, the adhered materials are gradually increased, the cleaning difficulty is high, and the stability of the semiconductor production process is seriously influenced.
Therefore, it is desirable to provide a baking apparatus for semiconductor and circuit board that can prevent the residual material from adhering to the baking device and facilitate the cleaning of the excess material.
Disclosure of Invention
In order to overcome the defects of easy adhesion of residual materials and inconvenient cleaning of the existing baking equipment, the technical problem to be solved is as follows: the baking equipment for the semiconductor and the circuit board can prevent residual materials from being adhered to the baking device and conveniently clean redundant materials.
The technical scheme is as follows: a baking apparatus for semiconductor and circuit board, comprising: a frame; the protective shell is arranged on the rack; a frame mounted on the frame; a sliding frame slidably mounted on the frame; the roaster is mounted on the sliding frame; the lifting component is arranged on the rack; and the placing assembly is arranged on the frame.
Further, the lifting assembly comprises: two electric telescopic rods are arranged on the frame; the connecting plates are two and are all installed at the extending end of the electric telescopic rod, and the connecting plates are all connected with the sliding frame.
Further, the placing component comprises: at least two guide rods are arranged on the frame; at least two first sliding sleeves are arranged and are arranged on the guide rod in a sliding manner; and the placing plate is arranged between the first sliding sleeves.
Further, still include the pushing assembly, the pushing assembly includes: two first racks are arranged on the sliding frame; two brackets are arranged on the rack; at least two gears are rotatably arranged on the bracket, wherein the two gears are meshed with the first rack; two belt pulley sets are arranged and are respectively arranged between the two gears; the second rack, the second rack is two, all installs on placing the board, and the second rack all meshes with two other gears.
Further, still including cooling module, cooling module includes: two support plates are arranged and are mounted on the rack; the cooling box is arranged between the two supporting plates; two concave plates are arranged and are arranged in the cooling box; two vertical plates are arranged in the cooling box; the separation plate is installed between two risers and two concave plates in a sliding mode.
Further, still include pulling assembly, pulling assembly includes: two transverse plates are arranged and are mounted on the frame; two second sliding sleeves are arranged and are arranged on the transverse plate in a sliding manner; two contact plates are arranged on the placing plate and matched with the second sliding sleeve; two springs are arranged and are arranged between the second sliding sleeve and the frame, and the springs are in a stretching state; at least two fixed pulleys are arranged on the transverse plate and the frame respectively; and two pull wires are arranged on the second sliding sleeve, the tail ends of the pull wires are connected with the blocking plate by bypassing the two close fixed pulleys, and the blocking plate is positioned at the upper part of the cooling box.
Further, still including collecting the subassembly, collecting the subassembly and including: two guide rods are arranged and are mounted on the cooling box, and the guide rods are connected with the rack; a collecting frame placed between the two guide rods; the handle is arranged on the collecting frame.
Further, the method also comprises the following steps: the grip is made of rubber.
The invention has the beneficial effects that: according to the invention, the semiconductor can be baked through the baking device, the lifting assembly can drive the baking device to move up and down as required, so that the semiconductor can be baked conveniently, the semiconductor to be baked can be placed through the placing assembly, the semiconductor can move backwards while the baking device moves downwards through the pushing assembly, the material falling from the semiconductor can be cooled through the cooling assembly, the cooled material can be automatically poured out after baking is finished through the pulling assembly, and redundant material can be collected through the collecting assembly.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic perspective view of the lifting assembly of the present invention.
Fig. 3 is a schematic perspective view of the placement module of the present invention.
Fig. 4 is a schematic perspective view of the pushing assembly of the present invention.
Fig. 5 is a schematic perspective view of a first cooling module according to the present invention.
Fig. 6 is a schematic perspective view of a second cooling module according to the present invention.
FIG. 7 is a perspective view of the pulling assembly of the present invention.
Fig. 8 is a perspective view of the collection assembly of the present invention.
Reference numerals: 1_ frame, 2_ protective shell, 3_ frame, 4_ carriage, 5_ roaster, 6_ lifting assembly, 61_ electric telescopic rod, 62_ connecting plate, 7_ placing assembly, 71_ guide bar, 72_ first sliding sleeve, 73_ placing plate, 8_ pushing assembly, 81_ first rack, 82_ bracket, 83_ gear, 84_ pulley set, 85_ second rack, 9_ cooling assembly, 91_ supporting plate, 92_ cooling box, 93_ concave plate, 94_ vertical plate, 95_ baffle plate, 10_ pulling assembly, 101_ horizontal plate, 102_ second sliding sleeve, 103_ guide bar, 104_ spring, 105_ contact plate, 106_ stay wire, 11_ collecting assembly, 111_ guide bar, 112_ collecting frame, 113_ handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The utility model provides a semiconductor and circuit board are with toasting equipment, as shown in fig. 1-8, including frame 1, protective housing 2, frame 3, carriage 4, roaster 5, lifting unit 6 and place subassembly 7, be equipped with protective housing 2 in the frame 1, frame 1 upper portion is equipped with frame 3, and the frame 3 back side sliding type is equipped with carriage 4, and carriage 4 upper portion is equipped with roaster 5, and frame 1 rear portion is equipped with lifting unit 6, is equipped with on the frame 3 and places subassembly 7.
When using the device, the semiconductor that the staff will toast is placed on placing subassembly 7, put the back, the staff promotes and places subassembly 7 rearward movement, and then drive the semiconductor and move to suitable position backward, then, the staff drives carriage 4 through lifting unit 6 and slides down on frame 3, carriage 4 slides down and drives roaster 5 downstream and be close to the semiconductor and toast, the unnecessary semi-solid material of coating drops on the semiconductor, after the use was accomplished, the staff drives carriage 4 upward sliding through lifting unit 6, roaster 5 upwards moves thereupon and resets, so, can toast the semiconductor.
As shown in fig. 1 and 2, the lifting assembly 6 includes an electric telescopic rod 61 and a connecting plate 62, the electric telescopic rods 61 are symmetrically arranged at the rear side of the lower portion of the frame 1, the connecting plates 62 are arranged at the extending ends of the electric telescopic rods 61, and the connecting plates 62 are connected with the sliding frame 4.
When using the device, staff control electric telescopic handle 61 shortens, electric telescopic handle 61 shortens and drives connecting plate 62 downstream, connecting plate 62 downstream drives carriage 4 lapse, carriage 4 lapse drives roaster 5 lapse and is close to the semiconductor and toasts, use the completion back, staff control electric telescopic handle 61 extension, electric telescopic handle 61 extension drives carriage 4 lapse through connecting plate 62, roaster 5 rebound thereupon resets, so, can drive roaster 5 as required and reciprocate, conveniently toast the semiconductor.
As shown in fig. 1, fig. 3, fig. 4 and fig. 7, the placing assembly 7 includes two guide rods 71, two first sliding sleeves 72 and a placing plate 73, the two guide rods 71 are symmetrically arranged on the frame 3, the first sliding sleeves 72 are slidably arranged on the guide rods 71, and the placing plate 73 is arranged between the first sliding sleeves 72.
When using the device, the staff puts the semiconductor that needs toast to placing on board 73, puts the back, and the staff promotes to place board 73 and moves backward, places board 73 and moves backward and drives first sliding sleeve 72 and slide backward on guide bar 71, places board 73 and moves backward and drives the semiconductor rearward and move to roaster 5 below, so, can place the semiconductor that needs toast.
Example 2
On the basis of embodiment 1, as shown in fig. 1 and 4, the device further includes a pushing assembly 8, the pushing assembly 8 includes a first rack 81, a support 82, a gear 83, a pulley set 84 and a second rack 85, the first rack 81 is arranged on the upper portion of the sliding frame 4 in bilateral symmetry, the support 82 is arranged on the lower portion of the rack 1 in bilateral symmetry, the gear 83 is arranged on the front portion and the rear portion of the support 82 in a rotating mode, the gear 83 on the rear portion is meshed with the first rack 81, the pulley set 84 is connected between the front and rear gears 83, the pulley set 84 is composed of two pulleys and a flat belt, a pulley is arranged on the gear 83 on the front portion, another pulley is arranged on the gear 83 on the rear portion, the flat belt is connected between the two pulleys in a winding mode, the second rack 85 is arranged on the bottom of the placing plate 73 in bilateral symmetry, and the second rack 85 is meshed with the gear 83 on the front portion.
When the device is used, the sliding frame 4 slides downwards to drive the first rack 81 to move downwards, the first rack 81 moves downwards to drive the rear gear 83 to rotate, the front gear 83 is driven by the belt pulley group 84 to rotate, the front gear 83 rotates to drive the second rack 85 to move backwards, the second rack 85 moves backwards to drive the placing plate 73 to move backwards, and then the semiconductor is driven to move backwards to the lower part of the roaster 5, so that the semiconductor can move backwards when the roaster 5 moves downwards.
On the basis of embodiment 1, as shown in fig. 1, 5, 6, 7 and 8, the cooling device 9 further comprises a cooling module 9, wherein the cooling module 9 comprises a supporting plate 91, a cooling box 92, a concave plate 93, a vertical plate 94 and a blocking plate 95, the supporting plate 91 is symmetrically arranged at the front and back of the lower portion of the rack 1, the cooling box 92 is arranged between the front supporting plate 91 and the back supporting plate 91, the concave plate 93 is symmetrically arranged at the front part in the cooling box 92 at the left and right, the vertical plate 94 is symmetrically arranged at the rear part in the cooling box 92 at the left and right, and the blocking plate 95 is slidably arranged between the two vertical plates 94 and the two concave plates 93.
When the device is used, redundant semi-solid materials coated on the semiconductor fall into the cooling box 92 to be cooled and solidified, after baking is completed, a worker pulls the barrier plate 95 to slide upwards on the vertical plate 94, so that the materials in the cooling box 92 are driven to move upwards, when the barrier plate 95 slides upwards to contact with the upper part of the concave plate 93, under the action of the concave plate 93, the barrier plate 95 rotates forwards to pour out the cooled materials, and therefore the materials falling on the semiconductor can be cooled.
On the basis of embodiment 1, as shown in fig. 1 and 7, the cooling device further includes a pulling assembly 10, the pulling assembly 10 includes a transverse plate 101, a second sliding sleeve 102, a contact plate 103, a spring 104, a fixed pulley 105 and a pull wire 106, the transverse plate 101 is disposed on both left and right sides of the frame 3, the second sliding sleeve 102 is slidably disposed on the transverse plate 101, the contact plate 103 is symmetrically disposed on the left and right sides of the bottom of the placing plate 73, the contact plate 103 is engaged with the second sliding sleeve 102, the spring 104 is connected between the second sliding sleeve 102 and the frame 3, the spring 104 is in a stretching state, the fixed pulley 105 is disposed on the rear portion of the transverse plate 101, the same fixed pulley 105 is symmetrically disposed on the rear portion of the frame 3, the pull wire 106 is disposed on the bottom of the second sliding sleeve 102, the tail end of the pull wire 106 is connected with the blocking plate 95 by bypassing the two fixed pulleys 105, and at this time, the blocking plate 95 is located on the upper portion of the cooling box 92.
When the device is used, the placing plate 73 moves backwards to drive the contact plate 103 to move backwards, at this time, under the action of the reset of the spring 104, the second sliding sleeve 102 slides backwards on the transverse plate 101, the pulling wire 106 is loosened, under the action of gravity, the blocking plate 95 slides downwards to enter the cooling box 92, when the placing plate 73 moves forwards, the contact plate 103 moves forwards, when the contact plate 103 moves forwards to be in contact with the second sliding sleeve 102, the contact plate 103 moves forwards to push the second sliding sleeve 102 to slide forwards, the spring 104 deforms, the second sliding sleeve 102 slides forwards to pull the blocking plate 95 to move upwards through the pulling wire 106, and then the cooled material is poured out, so that the cooled material can be automatically poured out after the baking is finished.
On the basis of embodiment 1, as shown in fig. 1 and 8, the cooling device further comprises a collecting assembly 11, the collecting assembly 11 comprises guide rods 111, a collecting frame 112 and a handle 113, the guide rods 111 are symmetrically arranged on the left and right sides of the front side of the cooling box 92, the guide rods 111 are connected with the rack 1, the collecting frame 112 is placed between the left guide rod 111 and the right guide rod 111, and the handle 113 is arranged on the front side of the collecting frame 112.
When the device is used, the blocking plate 95 rotates forwards to pour the cooled material into the collecting frame 112, and after the device is used, a worker pulls the handle 113 to take down the collecting frame 112 and clean the material in the collecting frame 112, so that redundant material can be collected.
It should be understood that this example is only for illustrating the present invention and is not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Claims (8)
1. The utility model provides a semiconductor and baking equipment for circuit board which characterized in that, including: a frame (1); the protective shell (2) is arranged on the rack (1); the frame (3) is arranged on the frame (1); a sliding frame (4) which is arranged on the frame (3) in a sliding way; a roaster (5) mounted on the carriage (4); the lifting component (6) is arranged on the rack (1); a placement assembly (7) mounted on the frame (3).
2. The baking apparatus for semiconductor and circuit board as claimed in claim 1, wherein the elevating member (6) comprises: two electric telescopic rods (61) are arranged on the frame (1); connecting plates (62), connecting plates (62) are two, all install the extension end at electric telescopic handle (61), and connecting plates (62) all are connected with carriage (4).
3. Baking apparatus for semiconductors and circuit boards, according to claim 2, characterized in that the placement module (7) comprises: at least two guide rods (71), wherein the guide rods (71) are arranged on the frame (3); at least two first sliding sleeves (72) are arranged, and are arranged on the guide rod (71) in a sliding manner; and the placing plate (73) is installed between the first sliding sleeves (72).
4. The baking apparatus for semiconductor and circuit board as claimed in claim 3, further comprising a pushing assembly (8), wherein the pushing assembly (8) comprises: two first racks (81), wherein the two first racks (81) are respectively arranged on the sliding frame (4); two supports (82), wherein the two supports (82) are arranged on the rack (1); at least two gears (83), wherein the gears (83) are rotatably arranged on the bracket (82), and the two gears (83) are meshed with the first rack (81); two belt pulley sets (84) are arranged and are respectively arranged between the two gears (83); the two second racks (85) are arranged on the placing plate (73), and the two second racks (85) are meshed with the other two gears (83).
5. The baking apparatus for semiconductor and circuit board as claimed in claim 4, further comprising a cooling module (9), wherein the cooling module (9) comprises: two support plates (91), wherein the two support plates (91) are arranged on the rack (1); a cooling box (92) installed between the two support plates (91); two concave plates (93), wherein the two concave plates (93) are arranged in the cooling box (92); two vertical plates (94), wherein the two vertical plates (94) are arranged in the cooling box (92); and the blocking plate (95) is slidably arranged between the two vertical plates (94) and the two concave plates (93).
6. The baking apparatus for semiconductor and circuit board as claimed in claim 5, further comprising a pulling member (10), wherein the pulling member (10) comprises: two transverse plates (101), wherein the two transverse plates (101) are arranged on the frame (3); two second sliding sleeves (102), wherein the two second sliding sleeves (102) are both arranged on the transverse plate (101) in a sliding manner; two contact plates (103) are arranged on the placing plate (73), and the contact plates (103) are matched with the second sliding sleeve (102); two springs (104) are arranged, and are mounted between the second sliding sleeve (102) and the frame (3), and the springs (104) are in a stretching state; at least two fixed pulleys (105), wherein the fixed pulleys (105) are respectively arranged on the transverse plate (101) and the frame (3); two pull wires (106) are arranged on the second sliding sleeve (102), the tail end of each pull wire (106) is connected with the blocking plate (95) by passing around two close fixed pulleys (105), and the blocking plate (95) is positioned at the upper part of the cooling box (92).
7. The baking apparatus for semiconductor and circuit board as claimed in claim 6, further comprising a collecting assembly (11), wherein the collecting assembly (11) comprises: two guide rods (111) are arranged on the cooling box (92), and the guide rods (111) are connected with the rack (1); a collecting frame (112) placed between the two guide rods (111); a handle (113) mounted on the collecting frame (112).
8. The baking apparatus for semiconductor and circuit board as claimed in claim 7, wherein the handle (113) is made of rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111324599.0A CN114096073A (en) | 2021-11-10 | 2021-11-10 | Baking equipment for semiconductor and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111324599.0A CN114096073A (en) | 2021-11-10 | 2021-11-10 | Baking equipment for semiconductor and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114096073A true CN114096073A (en) | 2022-02-25 |
Family
ID=80299772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111324599.0A Pending CN114096073A (en) | 2021-11-10 | 2021-11-10 | Baking equipment for semiconductor and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114096073A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114752979A (en) * | 2022-04-26 | 2022-07-15 | 赣州市文祥电镀有限公司 | Plated item toasts equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
| CN109413877A (en) * | 2018-09-13 | 2019-03-01 | 镇江华印电路板有限公司 | A kind of carbon film spray tin printed circuit board preparation process |
| CN111760767A (en) * | 2019-04-02 | 2020-10-13 | 群翊工业股份有限公司 | Vertical UV light source hardening device and application method thereof |
| CN111964373A (en) * | 2020-08-04 | 2020-11-20 | 贺永辉 | All-round equipment that toasts of disc type integrated circuit board |
| CN113074533A (en) * | 2021-03-12 | 2021-07-06 | 黄小良 | Waste recovery treatment equipment for production of square wet tissue |
| CN113117980A (en) * | 2021-05-07 | 2021-07-16 | 抚州盛宏电子有限公司 | Adhesive deposite device that electron processing was used |
-
2021
- 2021-11-10 CN CN202111324599.0A patent/CN114096073A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
| CN109413877A (en) * | 2018-09-13 | 2019-03-01 | 镇江华印电路板有限公司 | A kind of carbon film spray tin printed circuit board preparation process |
| CN111760767A (en) * | 2019-04-02 | 2020-10-13 | 群翊工业股份有限公司 | Vertical UV light source hardening device and application method thereof |
| CN111964373A (en) * | 2020-08-04 | 2020-11-20 | 贺永辉 | All-round equipment that toasts of disc type integrated circuit board |
| CN113074533A (en) * | 2021-03-12 | 2021-07-06 | 黄小良 | Waste recovery treatment equipment for production of square wet tissue |
| CN113117980A (en) * | 2021-05-07 | 2021-07-16 | 抚州盛宏电子有限公司 | Adhesive deposite device that electron processing was used |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114752979A (en) * | 2022-04-26 | 2022-07-15 | 赣州市文祥电镀有限公司 | Plated item toasts equipment |
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