CN114096055B - Manufacturing method of thick double-sided pluggable finger double-sided FPC board and double-sided FPC board - Google Patents
Manufacturing method of thick double-sided pluggable finger double-sided FPC board and double-sided FPC board Download PDFInfo
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- CN114096055B CN114096055B CN202111414897.9A CN202111414897A CN114096055B CN 114096055 B CN114096055 B CN 114096055B CN 202111414897 A CN202111414897 A CN 202111414897A CN 114096055 B CN114096055 B CN 114096055B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000012790 adhesive layer Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 14
- 239000002699 waste material Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 7
- 239000013039 cover film Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 238000004904 shortening Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The embodiment of the invention discloses a manufacturing method of a thick double-sided pluggable finger double-sided FPC board and the double-sided FPC board, wherein the method comprises the following steps: s10, punching and windowing treatment is carried out on the rubber block, and a first rubber layer with reinforced windowing is obtained; s20, stacking and pressing the two single-sided soft boards and the first adhesive layer to obtain a double-sided substrate, wherein the first adhesive layer is positioned between the two single-sided soft boards; s30, drilling a plurality of through holes in the working area of the double-sided substrate and plating copper on each through hole, wherein the through holes and the reinforcing windows have preset distances; s40, manufacturing a circuit layer on the surface of each single-sided soft board; s50, embedding a supporting component into the reinforcing window and fixing the supporting component with the double-sided substrate so as to increase the thickness of the corresponding position of the double-sided substrate. The invention simplifies the conventional rigid-flex printed circuit board manufacturing process into the processing form of the double-sided FPC board, and increases the thickness required between the double-sided pluggable fingers by utilizing the reinforcing mode of the supporting component, thereby simplifying the manufacturing process and shortening the manufacturing period.
Description
Technical Field
The invention relates to the field of manufacturing of FPC (flexible printed circuit) boards, in particular to a manufacturing method of a double-sided FPC board with thick double-sided plug fingers and the double-sided FPC board.
Background
At present, along with the densification and diversification of FPC products in electronic products, the requirements of users on the FPC products are also increasing, and the requirements are also quite novel. One of the FPC boards requires that the double sides are required to have the fingers to be plugged and plugged, the fingers are communicated, and meanwhile, the thickness of the double-sided plugged fingers is required to be larger than the total thickness of the FPC of the double-sided soft board.
The existing manufacturing thought is to design the plug finger position into a rigid-flex printed circuit board to meet the thickness requirement of the double-sided plug finger, specifically, firstly, respectively pasting and pressing hard board materials on two sides of a soft board of the plug finger position, transferring the plug finger from an inner layer to an outer layer, conducting the double-sided plug finger through a through hole, and finally, printing ink on the surface of the hard board to protect circuits and holes outside the plug finger position.
However, the existing rigid-flex printed circuit board has high manufacturing cost, complex flow and poor yield, and is unfavorable for production control, so that a manufacturing method of the thick double-sided pluggable finger double-sided FPC board is urgently needed.
Disclosure of Invention
The invention aims to provide a manufacturing method of a thick double-sided pluggable finger double-sided FPC board and the double-sided FPC board, and aims to solve the problems of reducing the manufacturing difficulty of the thick double-sided pluggable finger double-sided FPC board and improving the manufacturing efficiency of the thick double-sided pluggable finger double-sided FPC board.
In order to solve the technical problems, the aim of the invention is realized by the following technical scheme: provided is a method for manufacturing a thick double-sided pluggable finger double-sided FPC board, comprising the following steps:
s10, punching and windowing treatment is carried out on the rubber block, and a first rubber layer with reinforced windowing is obtained;
s20, stacking and pressing the two single-sided soft boards and the first adhesive layer to obtain a double-sided substrate, wherein the first adhesive layer is positioned between the two single-sided soft boards;
s30, drilling a plurality of through holes in the working area of the double-sided substrate and plating copper on each through hole, wherein the through holes and the reinforcing windows have preset distances;
s40, manufacturing a circuit layer on the surface of each single-sided soft board;
s50, embedding a supporting component into the reinforced windowing and fixing the supporting component with the double-sided substrate so as to increase the thickness of the corresponding position of the double-sided substrate.
Further, after the step S40, the method includes:
and paving a layer of covering protection film on a part of the area of the circuit layer corresponding to the working area, and exposing the rest area of the circuit layer to form a golden finger.
Further, the manufacturing process of the supporting component comprises the following steps:
cutting the reinforcing plate, and respectively adhering two second adhesive layers to two opposite sides of the reinforcing plate;
cutting the reinforcing plate bonded with the second adhesive layer according to a preset size to obtain a plurality of supporting components composed of reinforcing blocks and two layers of second adhesive layers respectively arranged on two opposite sides of the reinforcing blocks.
Further, the step S50 includes:
cutting the double-sided substrate along a preset cutting boundary line by utilizing laser, and embedding the supporting component into the reinforced windowing after one end of one single-sided soft board is turned outwards, wherein the cutting boundary line is used for dividing the double-sided substrate waste material area;
and pressing the double-sided substrate by using a quick press to fix the supporting component and the two single-sided soft boards.
Further, the cutting the double-sided substrate along a preset cutting boundary line by using the laser includes:
and controlling the downward movement amount of the laser cutting based on a preset control instruction so as to cut off one of the single-sided soft boards.
Further, the embedding the reinforcing block into the reinforcing fenestration includes:
embedding the supporting component into a reinforced fenestration, and aligning the supporting component with a marking line, wherein the marking line is preset on a boundary line between the waste area and the working area;
and pressing the second adhesive layer on the two single-sided soft boards by using a hot soldering iron, so that the second adhesive layer is heated to generate adhesiveness.
Further, after the two-sided substrate is pressed by the fast press to fix the supporting component and the two single-sided flexible boards, the method includes:
and punching the double-sided substrate along the mark line by using a die to cut off the waste material area of the double-sided substrate.
Further, the equipment parameters of the quick press are set as follows: the temperature is 160-200 ℃ and the pressure is 60-80 KG/cm 2 The pressing time is 160-200 seconds.
The embodiment of the invention also provides the double-sided FPC board manufactured by the manufacturing method of the thick double-sided pluggable finger double-sided FPC board, which comprises the covering film, the circuit layer, the single-sided soft board, the first adhesive layer, the single-sided soft board, the circuit layer and the covering film which are arranged from top to bottom, wherein the double-sided FPC board further comprises the reinforcing block for enlarging the thickness of one end of the double-sided FPC board, the reinforcing block is arranged between the edges of the two single-sided soft boards, and the reinforcing block is respectively fixed with the two single-sided soft boards through the two second adhesive layers.
Further, the reinforcing plate is made of FR4 material.
The embodiment of the invention provides a manufacturing method of a thick double-sided pluggable finger double-sided FPC board and the double-sided FPC board, wherein: the manufacturing method of the thick double-sided pluggable finger double-sided FPC board comprises the following steps: s10, punching and windowing treatment is carried out on the rubber block, and a first rubber layer with reinforced windowing is obtained; s20, stacking and pressing the two single-sided soft boards and the first adhesive layer to obtain a double-sided substrate, wherein the first adhesive layer is positioned between the two single-sided soft boards; s30, drilling a plurality of through holes in the working area of the double-sided substrate and plating copper on each through hole, wherein the through holes and the reinforcing windows have preset distances; s40, manufacturing a circuit layer on the surface of each single-sided soft board; s50, embedding a supporting component into the reinforced windowing and fixing the supporting component with the double-sided substrate so as to increase the thickness of the corresponding position of the double-sided substrate. The invention simplifies the conventional rigid-flex printed circuit board manufacturing process into the processing form of the double-sided FPC board, and increases the thickness required between the double-sided pluggable fingers by utilizing the reinforcing mode of the supporting component, thereby simplifying the manufacturing process, shortening the manufacturing period and improving the yield.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for manufacturing a thick double-sided pluggable finger double-sided FPC board according to an embodiment of the present invention;
fig. 2 is a schematic first structural diagram of a method for manufacturing a thick double-sided pluggable finger double-sided FPC board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a reinforcing block of a thick double-sided pluggable finger double-sided FPC board according to an embodiment of the present invention;
fig. 4 is a second schematic structural diagram of a manufacturing method of a thick double-sided pluggable finger double-sided FPC board according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a double-sided FPC board according to an embodiment of the present invention.
The figure identifies the description:
1. a cover film; 2. a circuit layer; 3. a single-sided soft board; 4. a first adhesive layer; 41. reinforcing and windowing; 5. a reinforcing block; 6. a second adhesive layer; 7. a golden finger; 8. a working area; 9. a waste region; 10. and a via hole.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a thick double-sided pluggable finger double-sided FPC board, including the following steps:
s10, punching and windowing treatment is carried out on the rubber block, so as to obtain a first rubber layer 4 with a reinforced windowing 41;
s20, overlapping and pressing the two single-sided soft boards 3 and the first adhesive layer 4 to obtain a double-sided substrate, wherein the first adhesive layer 4 is positioned between the two single-sided soft boards 3;
s30, drilling a plurality of through holes 10 on the working area 8 of the double-sided substrate and plating copper on each through hole 10, wherein the through holes 10 and the reinforcing windows 41 have a preset distance;
s40, manufacturing a circuit layer 2 on the surface of each single-sided soft board 3;
s50, embedding a supporting component into the reinforced open window 41 and fixing the supporting component with the double-sided substrate so as to increase the thickness of the corresponding position of the double-sided substrate.
It should be noted that, the reference numerals of the steps in the embodiment are only for convenience of description, and do not represent limitation of the execution sequence of the steps, and the execution sequence of the steps may be adjusted according to the needs or performed simultaneously in actual application, and these adjustments or substitutions are all within the protection scope of the present invention. Meanwhile, the manufacturing method of the double-sided FPC board with the thick double-sided pluggable finger is the manufacturing method of the double-sided FPC board with the thick double-sided pluggable finger.
Referring to fig. 1 and 2, before step S10, firstly, the glue block is cut according to a preset size, and an alignment hole for embedding the positioning pin is drilled on the glue block, then, in step S10, the glue block is subjected to punching and windowing treatment by using a die, so that the glue layer at the position on the glue block, which needs to be reinforced, is punched, and the required first glue layer 4 is obtained.
Specifically, the thickness of the first adhesive layer 4 is set to 23 to 27 μm.
Before step S20, the two single-sided flexible boards 3 are respectively cut according to a preset size, and then alignment holes for embedding the positioning pins are drilled on the two single-sided flexible boards 3, wherein the alignment holes on the single-sided flexible boards 3 are in one-to-one correspondence with the alignment holes on the glue blocks, in step S20, one single-sided flexible board 3, the first glue layer 4 and the other single-sided flexible board 3 are laminated in sequence by using a jig, and then the three are laminated together by a quick press, wherein the single-sided flexible board 3 is made of PI (polyimide) materials, the first glue layer 4 can be made of sticky materials, and in the embodiment, the glue blocks are made of pure glue (generally glue materials without filler).
Specifically, the thickness of the single-sided flexible sheet 3 is set to 18 to 22 μm.
In step S30, to avoid the problem of the conduction of the hole at the plugging position, the via 10 is transferred to the area without the reinforcing window 41, and the circuit is adjusted so as not to affect the function and quality of the double-sided FPC board as a whole.
In step S40, the circuit layers 2 are fabricated on the surface of each single-sided flexible board 3 by a conventional method, and then the circuit layers 2 on the two single-sided flexible boards 3 are conducted by the copper layer on the via holes 10 in step S30.
In step S50, in order to solve the problem that the prior art has complicated manufacturing process and low manufacturing efficiency caused by reaching the thickness requirement of the double-sided plug finger through the rigid-flex printed circuit board, the support assembly is plugged into the reinforcing windowed 41 position, so that the thickness of the plug finger position in the double-sided FPC board is increased to a preset thickness, and the market demand is further met.
Specifically, the thickness of the wiring layer 2 is set to 16 to 20 μm.
In one embodiment, after the step S40, the method includes:
s41, a layer of covering protection film is paved on a part of the area of the circuit layer 2 corresponding to the working area 8, and the rest area of the circuit layer 2 is exposed to form the golden finger 7.
In this embodiment, by laying a cover protection film on the circuit layer 2, the circuit layer 2 on the double-sided FPC board can be protected, and the exposed golden finger 7 is used for connecting with other components; it should be noted that, for the printing ink on the surface of the hard board in the prior art to protect the circuit and the hole outside the plug finger position, the double-sided plug finger of the application, namely the golden finger 7, is designed into layered double-sided circuits, and the circuit layer 2 can be protected only by attaching a layer of covering protection film, so that the printing ink process is not needed, the manufacturing process of the double-sided FPC board is greatly shortened, and meanwhile, the yield of the circuits is greatly improved.
As shown in fig. 3, in one embodiment, the process of making the support assembly includes:
s60, cutting the reinforcing plate, and respectively adhering two second adhesive layers 6 to the two opposite sides of the reinforcing plate;
s61, cutting the reinforcing plate bonded with the second adhesive layer 6 according to a preset size to obtain a plurality of supporting components composed of reinforcing blocks 5 and two layers of second adhesive layers 6 respectively arranged on two opposite sides of the reinforcing blocks 5.
In this embodiment, the thickness of the supporting component is set to be more than 0.2mm, and it should be noted that the thickness of the supporting component is not limited in this application, so long as the thickness between two golden fingers 7 meets the actual requirement, specifically, two double-sided thermosetting pure adhesives are respectively attached to two opposite sides of the reinforcing plate, the whole attaching operation is more convenient, and it should be noted that dust falls on the reinforcing plate before attaching to avoid affecting the attaching effect, so this application can clean the reinforcing plate before attaching operation.
Referring to fig. 4, in an embodiment, the step S50 includes:
s51, cutting the double-sided substrate along a preset cutting boundary line by utilizing laser, and embedding the supporting component into the reinforced open window 41 after one end of one single-sided soft board 3 is turned outwards, wherein the cutting boundary line is used for dividing the double-sided substrate waste region 9;
and S52, pressing the double-sided substrate by using a quick press to fix the supporting component and the two single-sided soft boards 3.
In this embodiment, the double-sided substrate is subjected to UV laser slotting, so that the reinforcement fenestration 41 is exposed, and then one of the single-sided flexible boards 3 is conveniently flipped open, and the supporting component is placed in the reinforcement fenestration 41; in order to fix the support assembly firmly with the two single-sided soft boards 3, the double-sided base board is pressed by a quick press, so that the second adhesive layer 6 on the reinforcing block 5 is fully contacted with the single-sided soft boards 3. It should be noted that the portion of the peripheral non-product area after a sheet of material is formed into a product is called scrap.
In one embodiment, the cutting the double-sided substrate along a predetermined cutting boundary line by using the laser in the step S51 includes:
and S53, controlling the downward movement amount of the laser cutting based on a preset control instruction so as to cut off one of the single-sided soft boards 3.
In this embodiment, the downward movement amount of the laser cutting is controlled, so that the laser can only cut off the single-sided flexible board 3 located on the upper layer, but the single-sided flexible board 3 located on the lower layer cannot be cut, and the reason for this is that the waste material area 9 on the single-sided flexible board 3 is also provided with a positioning hole for cutting excessive waste materials, and the waste material area cannot be positioned after one cutting, so that when the single-sided flexible board 3 located on the upper layer is turned over, the single-sided flexible board 3 located on the lower layer is driven to move, and the insertion of the supporting component is affected.
In an embodiment, the embedding the reinforcing block 5 into the reinforcing fenestration 41 in the step S51 includes:
s54, embedding the supporting component into the reinforcing window 41, and aligning the supporting component with a marking line, wherein the marking line is preset on the boundary line between the waste region 9 and the working region 8;
and S55, pressing the two single-sided soft boards 3 by using a hot soldering iron, so that the second adhesive layer 6 is heated to generate adhesiveness.
In this embodiment, the marking line may be a marking groove disposed on the lower single-sided flexible board 3, or may be a marking line disposed on the lower single-sided flexible board 3 and having different colors, and it is convenient to determine whether the supporting component is completely plugged into a preset position in the reinforcing window 41 through the marking line, so as to ensure that the reinforcing area has no residual gap, and further ensure the yield of the double-sided FPC board.
Before the quick press in the step S52 is utilized, the iron head which can be heated by a hot iron is heated by a heat transfer mode, so that the connection strength of the second adhesive layer 6 and the single-sided soft board 3 is improved; in the present embodiment, the second adhesive layer 6 may be made of pure adhesive, but it should be noted that if the second adhesive layer 6 is pure adhesive, the adhesive performance will be generated after the temperature of the second adhesive layer 6 reaches 80 ℃.
In one embodiment, after the step S52, the method includes:
s56, punching the double-sided substrate along the mark line by using a die to cut off the waste material area 9 of the double-sided substrate.
In this embodiment, after the support assembly is fixed to the two single-sided flexible boards 3, the corresponding scrap areas 9 on the double-sided substrate are cut off using a mold.
Preferably, the device parameters of the quick press are set as follows: the temperature is 160-200 ℃ and the pressure is 60-80 KG/cm 2 The pressing time is 160-200 seconds.
In this embodiment, the device parameters of the quick-press are adjusted, so that the connection strength between the supporting component and the two single-sided flexible boards 3 is in an optimal state.
In one embodiment, after the step S41, the method includes the following steps:
s31, carrying out surface treatment on the exposed golden finger 7;
in this embodiment, the bare gold finger 7 is subjected to gold plating or electrical gold plating, so that a layer of nickel gold is deposited on the gold finger 7 or the bonding pad.
Referring to fig. 5, the embodiment of the invention further provides a double-sided FPC board manufactured by the manufacturing method of the thick double-sided pluggable finger double-sided FPC board, which comprises a cover film 1, a circuit layer 2, a single-sided flexible board 3, a first adhesive layer 4, the single-sided flexible board 3, the circuit layer 2 and the cover film 1 which are arranged from top to bottom, wherein the double-sided FPC board further comprises a reinforcing block 5 for expanding the thickness of a part of the double-sided FPC board corresponding to the golden finger 7, the reinforcing block 5 is arranged between the edges of the two single-sided flexible boards 3, and the reinforcing block 5 is respectively fixed with the two single-sided flexible boards 3 through two second adhesive layers 6.
In this embodiment, the thickness of the two single-sided flexible printed circuits 3 corresponding to a part of the golden finger 7 is increased by the reinforcing block 5, so that the thickness of the golden finger 7 of the double-sided FPC board meets the actual requirement.
In one embodiment, the stiffening plate is made of FR4 material.
It should be noted that, the symbol of a flame-retardant material grade means a material specification that the resin material must self-extinguish after being burned, and it is not a material name but a material grade, so that FR-4 grade materials used for general circuit boards are very various, but most are composite materials made of so-called tetra-functional (Tera-functional) epoxy resin plus Filler (Filler) and glass fiber.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (7)
1. A manufacturing method of a thick double-sided pluggable finger double-sided FPC board is characterized by comprising the following steps:
s10, punching and windowing treatment is carried out on the rubber block, and a first rubber layer with reinforced windowing is obtained;
s20, stacking and pressing the two single-sided soft boards and the first adhesive layer to obtain a double-sided substrate, wherein the first adhesive layer is positioned between the two single-sided soft boards;
s30, drilling a plurality of through holes in the working area of the double-sided substrate and plating copper on each through hole, wherein the through holes and the reinforcing windows have preset distances;
s40, manufacturing a circuit layer on the surface of each single-sided soft board;
s50, embedding a supporting component into the reinforced windowing and fixing the supporting component with the double-sided substrate so as to increase the thickness of the corresponding position of the double-sided substrate;
the manufacturing process of the supporting component comprises the following steps:
cutting the reinforcing plate, and respectively adhering two second adhesive layers to two opposite sides of the reinforcing plate;
cutting the reinforcing plate bonded with the second adhesive layer according to a preset size to obtain a plurality of supporting components composed of reinforcing blocks and two layers of second adhesive layers respectively arranged on two opposite sides of the reinforcing blocks;
the S50 includes:
cutting the double-sided substrate along a preset cutting boundary line by utilizing laser, and embedding the supporting component into the reinforced windowing after one end of one single-sided soft board is turned outwards, wherein the cutting boundary line is used for dividing the double-sided substrate waste material area;
pressing the double-sided substrate by using a quick press to fix the supporting component and the two single-sided soft boards;
embedding the reinforcement block into the reinforcement fenestration includes:
embedding the supporting component into a reinforced fenestration, and aligning the supporting component with a marking line, wherein the marking line is preset on a boundary line between the waste area and the working area;
and pressing the second adhesive layer on the two single-sided soft boards by using a hot soldering iron, so that the second adhesive layer is heated to generate adhesiveness.
2. The method for manufacturing the thick double-sided pluggable finger double-sided FPC board according to claim 1, wherein: after S40, the method includes:
and paving a layer of covering protection film on a part of the area of the circuit layer corresponding to the working area, and exposing the rest area of the circuit layer to form a golden finger.
3. The method of manufacturing a thick double sided pluggable finger double sided FPC board according to claim 1, wherein the cutting the double sided substrate along a predetermined cutting boundary line using a laser comprises:
and controlling the downward movement amount of the laser cutting based on a preset control instruction so as to cut off one of the single-sided soft boards.
4. The method for manufacturing the thick double-sided pluggable finger double-sided FPC board according to claim 1, wherein: after the support assembly is fixed with the two single-sided soft boards by using the quick press to press the double-sided substrate, the method comprises the following steps:
and punching the double-sided substrate along the mark line by using a die to cut off the waste material area of the double-sided substrate.
5. The method for manufacturing the thick double-sided pluggable finger double-sided FPC board according to claim 1, wherein: the equipment parameters of the quick press are set as follows: the temperature is 160-200 ℃ and the pressure is 60-80 KG/cm 2 The pressing time is 160-200 seconds.
6. A double-sided FPC board manufactured by the manufacturing method of the thick double-sided plug-and-pull finger double-sided FPC board according to any one of claims 1 to 5, characterized in that: the flexible printed circuit board comprises a cover film, a circuit layer, a single-sided flexible printed circuit board, a first adhesive layer, a single-sided flexible printed circuit board, a circuit layer and a cover film which are arranged from top to bottom, wherein the flexible printed circuit board further comprises a reinforcing block for expanding the thickness of one end of the double-sided FPC board, the reinforcing block is arranged between the edges of the two single-sided flexible printed circuit boards, and the reinforcing block is respectively fixed with the two single-sided flexible printed circuit boards through two second adhesive layers.
7. The double sided FPC board according to claim 6, characterized in that: the reinforcing plate is made of FR4 material.
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| CN114900951B (en) * | 2022-06-08 | 2022-11-25 | 东莞光阳兴业电子配件有限公司 | Conveniently-connected and separable double-sided FPC board and connecting and separating method |
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