Disclosure of Invention
Based on the above situation, a primary objective of the present invention is to provide a projection optical machine, which includes an optical housing, a DMD, a sealing member, a circuit board, a sealing sheet, and a resilient sheet, wherein the optical housing is provided with an accommodating cavity, the DMD is accommodated in the accommodating cavity, the sealing member is disposed around the DMD, the resilient sheet has an elastic main body and an installation portion, and the elastic main bodies of the circuit board, the sealing sheet, and the resilient sheet are sequentially stacked and disposed on one side of the DMD from near to far relative to the DMD; the installation department installation of shell fragment is fixed in on the optical chassis, the elasticity main part of shell fragment includes the orientation the bellied bellying of DMD, under the mounted state, the shell fragment pass through the bellying with circuit board contact and with circuit board and DMD compress tightly in on the optical chassis, the circuit board with DMD is in inseparable electrical contact under the effect of compressing tightly of shell fragment.
Preferably, the elastic sheet is a plate-shaped body which can be elastically deformed under stress, and the protruding portion is a plurality of convex strips formed by bending the plate-shaped body.
Preferably, the elastic sheet is in line contact with the circuit board through the protruding part.
Preferably, the elastic sheet comprises a first plate body, a second plate body and a third plate body, and in a natural state, the first plate body, the second plate body and the third plate body are positioned in the same plane, and the second plate body is positioned between the first plate body and the third plate body; the convex strips on the elastic sheet comprise a first convex strip and a second convex strip, the first plate body is connected with the second plate body through the first convex strip, and the second plate body is connected with the third plate body through the second convex strip; the sealing piece is arranged between the first protruding strip and the second protruding strip; the cross sections of the first convex strips and the second convex strips in the direction perpendicular to the extending direction of the first convex strips and the second convex strips are V-like; the installation department sets up on first plate body and third plate body.
Preferably, the DMD includes a first conductive region, the circuit board includes a second conductive region corresponding to the first conductive region, and the DMD is in electrical contact with the circuit board at positions of the first conductive region and the second conductive region; the projection of the convex strip on the electric contact surface of the DMD and the circuit board is at least partially positioned in the first conductive area or the second conductive area.
Preferably, the first conductive area and the second conductive area are respectively provided with a connector, the circuit board and the DMD are electrically connected through the connectors, and the minimum connecting force for electrically connecting the circuit board and the DMD is M; the elastic sheet exerts force on the circuit board through the protruding part, the force is F, the maximum bearing pressure of the DMD is N, and M is not less than F and not more than N.
Preferably, the sealing plate is arranged between the adjacent convex strips and corresponds to the DMD in position; the sealing member has a sealing and buffering function, and is compressed between the optical enclosure and the circuit board.
Preferably, the installation department of shell fragment is provided with the mounting hole of distribution on a plurality of different position, be provided with on the optical chassis with the erection column that the mounting hole corresponds, the projection ray apparatus further includes the installed part, the installed part passes the mounting hole is fixed in order to realize on the erection column the shell fragment with fix between the ray apparatus shell.
Preferably, a heat dissipation assembly fixed to the optical machine housing is disposed on a side of the elastic sheet away from the DMD, the heat dissipation assembly includes a heat dissipation main body and a heat conduction column, the heat conduction column is fixed to a side of the heat dissipation main body close to the DMD, the heat conduction column penetrates through the elastic sheet, the sealing sheet and the circuit board to contact the DMD, and at least a part of heat generated by the operation of the DMD is transferred to the heat dissipation main body through the heat conduction column; the projection optical machine further comprises a fixing piece and a spring sleeved on the fixing piece, and the fixing piece penetrates through the fixing hole and is fixed on the fixing column; in the installation state, the side of the heat dissipation main body close to the DMD is spaced from the elastic sheet.
The invention also provides projection equipment which comprises a shell, wherein the projection equipment further comprises the light projector, and the light projector is arranged in the shell.
The elastic sheet is fixed with the optical machine shell through the mounting part, and the DMD and the circuit board are tightly pressed and fixed between the optical machine shell and the elastic sheet, so that the components between the optical machine shell and the elastic sheet are fixed, the circuit board and the DMD are tightly pressed together through the deformation characteristic of the elastic sheet and the sealing sheet, the pressing force provided by the elastic sheet and the sealing sheet is relatively soft and appropriate, and the stability of electrical connection is guaranteed. Whether the installation in-process at the shell fragment can also be more directly perceived impression and the judgement compresses tightly the state suitable, has overcome and has set up in addition in traditional projection ray apparatus and compress tightly the structure, and not only the structure is complicated, and the installation is inconvenient, compresses tightly the state and is difficult to control and leads to the shortcoming of electric connection unstability or components and parts pressure loss.
The elastic sheet and the circuit board are in line contact, and the sealing sheet clamped between the elastic sheet and the circuit board is matched, so that proper and uniform pressure can be provided for the circuit board.
Other advantages of the present invention will be described in the detailed description, and those skilled in the art will understand the technical features and technical solutions presented in the description.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the nature of the present invention, well-known methods, procedures, and components have not been described in detail.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Referring to fig. 1, the present invention provides a projection optical device 1 for projecting an image onto a projection surface such as a curtain or a wall. Projection ray apparatus 1 includes DMD subassembly 11, ray apparatus shell 10, light emitting module 2, optics adjustment module (being located inside ray apparatus shell 10, not numbered) and camera lens module 3, ray apparatus shell 10 is inside hollow casing, light emitting module 2 part is installed on ray apparatus shell 10, the part is installed in ray apparatus shell 10, optics adjustment module installs in ray apparatus shell 10, DMD subassembly 11 and camera lens module 3 set up at the relative both ends of ray apparatus shell 10 and optics adjustment module are located between DMD subassembly 11 and camera lens module 3. Light emitted by the light emitting module 2 is optically adjusted by the optical adjusting module, then is imaged by the DMD assembly 11, and is projected onto the projection surface from the lens module 3 by the optical adjusting module.
The light emitting module 2 includes components including, but not limited to, one or more of a red light source, a blue light source, a green light source, a pump-in blue light source, a collimating lens, a converging lens, and a beam splitter. The red light source, the blue light source and the green light source are mounted on the light casing 10, the collimating lens, the converging lens and the beam splitter are mounted in the light casing 10, and light emitted by the light sources (including one or more of the red light source, the blue light source and the green light source) enters the optical adjustment module after being processed by one or more of the collimating lens, the converging lens and the beam splitter.
The optical adjustment module includes optical elements including, but not limited to, one or more of a fly-eye lens, a relay lens, a prism, or a galvanometer. The lens module 3 may be provided with an optical element for optical processing. Light emitted by the light emitting module is optically adjusted by the optical adjusting module, then is imaged by the DMD assembly 11, and then is projected onto a projection surface from the lens module 3 through other optical elements (such as a vibrating mirror or a flat sheet).
Referring to fig. 2, the DMD assembly 11 is mounted on one side of the optical chassis 10, the DMD assembly 11 includes a DMD12, a sealing member 13, a circuit board 14, a sealing sheet 15, a clip 16 and a heat dissipation assembly 17, the DMD12 is fixed on the optical chassis 10, the sealing member 13 is disposed around the DMD12, the clip 16 has a clip body 16a and a mounting portion 16b, the circuit board 14, the sealing sheet 15 and the clip body 16 are sequentially stacked on one side of the DMD12 from near to far with respect to the DMD12, and the mounting portion 16b is fixed to the optical chassis 10.
Referring to fig. 2 and 3, a receiving cavity 101 is formed on a side surface of the optical housing 10, the DMD12 is received in the receiving cavity 101, a plurality of electrical connection points (not shown) are disposed on a side surface of the DMD12 close to the circuit board 14, the plurality of electrical connection points define a first conductive area, and the DMD12 is electrically connected to the circuit board 14 through the plurality of electrical connection points. The DMD12 is easily damaged by the maximum pressure N.
With continued reference to fig. 2, the sealing element 13 has a sealing function and is annular in shape. Preferably, the sealing member 13 also has a certain buffering function, and is compressed between the optical housing 10 and the circuit board 14, so that external light or dust can be effectively prevented from entering the DMD12 to affect the operation thereof.
Referring to fig. 4, a first through hole 143 is formed in a central region of the circuit board 14 for allowing a portion of the heat sink 17 to pass through so as to dissipate the operating heat of the DMD 12. The side of the circuit board 14 adjacent to the DMD12 is provided with a plurality of electrical connection points (not shown) defining a second conductive area disposed around the first via 143. The electrical connection points of the first conductive area are in one-to-one correspondence with the electrical connection points of the second conductive area, and when the circuit board 14 contacts the DMD12, the electrical connection points of the first conductive area are electrically connected to the electrical connection points of the second conductive area one-to-one, so that the electrical connection between the DMD12 and the circuit board 14 is realized. It can be understood that the electrical connection points on the DMD12 and the circuit board 14 are respectively formed on the connectors, that is, the DMD12 is provided with a connector, the circuit board 14 is provided with another connector, and the two connectors are butted after being stressed (connection force), so that reliable electrical connection between the circuit board 14 and the DMD12 can be realized, and the minimum connection force for electrically connecting the two connectors is kept to be M.
It is understood that the actual form of the electrical connection points includes, but is not limited to, one or more of contacts, probes, sockets, or pins, etc. As long as it is possible to realize that the electrical connection points in the first conductive region and the electrical connection points in the second conductive region can be matched one by one to realize electrical connection. The circuit board 14 may be a rigid circuit board 14 or a flexible circuit board 14 or a combination of both.
Referring to fig. 5, a sealing sheet 15 is disposed between the elastic sheet 16 and the circuit board 14 for sealing, and alternatively, the sealing sheet 15 may be made of a material with sealing and buffering functions to buffer the pressure of the elastic sheet 16 on the circuit board 14, so that the circuit board 14 is stressed uniformly and moderately. The central region of the sealing sheet 15 is provided with a second through hole 151 through which a part of the heat dissipating module 17 passes.
Referring to fig. 6 and 7, the resilient plate 16 is a plate made of metal, and can be elastically deformed by a force. The elastic sheet 16 is fixedly mounted on the optical chassis 10 through a first fixing structure, the first fixing structure includes mounting holes 165 (mounting portions 16b) distributed at the edge of the elastic sheet 16 and located in a plurality of different directions and mounting posts 102 (the labels are as shown in fig. 3) located on the optical chassis 10 and corresponding to the mounting holes 165, the first fixing structure further includes mounting pieces 170 (the labels are as shown in fig. 2), and the mounting pieces 170 penetrate through the mounting holes 165 to be fixed on the mounting posts 102 so as to directly fix the elastic sheet 16 and the optical chassis 10. It can be understood that, in the invention, the elastic sheet 16 is directly fixed with the optical chassis 10, and the DMD12 and the circuit board 14 are compressed and fixed between the optical chassis 10 and the elastic sheet 16, thereby not only realizing the fixation of components between the optical chassis and the elastic sheet 16, but also compressing the circuit board 14 and the DMD12 together by combining the deformation characteristics of the elastic sheet with the sealing sheet 15, so as to enhance the stability of the electrical connection, and the elastic sheet 16 can be more intuitively felt and judge whether the compression state is appropriate in the installation process, thereby overcoming the defect that the traditional projection optical machine 1 is additionally provided with a compression structure, which has complex structure and inconvenient installation, and the compression state is not easy to control, thus causing the instability of the electrical connection or the pressure loss of the components.
With continued reference to fig. 6 and 7, the edge of the elastic sheet 16 is provided with an avoiding opening 167 for avoiding other components. The elastic sheet 16 is provided with a third through hole 163 at the center for passing a part of the heat dissipation assembly 17 to dissipate the heat generated by the DMD 12. The elastic sheet 16 is bent to form a protruding portion 161 protruding toward the DMD12, and in a state where the projector 1 is assembled, the elastic sheet 16 contacts the circuit board 14 through the protruding portion 161 and presses the circuit board 14, the contact between the elastic sheet 16 and the circuit board 14 is a line contact, the circuit board 14 and the DMD12 are in close electrical contact under the pressing action of the elastic sheet 16, and the stability of electrical connection is improved. In the present invention, the protruding portion 161 is a plurality of protruding strips formed by bending a plate-shaped body, and the protruding strips are parallel to each other. The number of the convex strips is preferably 2, and the convex strips are respectively a first convex strip 161a and a second convex strip 161 b.
Specifically, the resilient tab 16 includes a first plate 162a, a second plate 162b and a third plate 162c, and in a natural state, the first plate 162a, the second plate 162b and the third plate 162c are located in the same plane, and the second plate 162b is located between the first plate 162a and the third plate 162 c; the first plate 162a and the second plate 162b are connected by a first protruding strip 161a, and the second plate 162b and the third plate 162c are connected by a second protruding strip 161 b; the sealing piece 15 is disposed between the first convex strip 161a and the second convex strip 161 b. The mounting portion 16b is provided on the first plate 162a and the third plate 162 c.
It is understood that the first plate 162a and the third plate 162c are located on the same plane, and the second plate 162b may not be coplanar with the first plate 162a and the third plate 162c, for example, the distance between the second plate 162b and the circuit board 14 may be smaller than the distance between the first plate 162a or the third plate 162c and the circuit board 14. Preferably, the distance between the second plate 162b and the circuit board 14 is smaller than the thickness of the sealing sheet 15 in the natural state, so that the sealing sheet 15 can better cooperate with the protruding strip to provide a soft and uniform pressure to the circuit board 14.
Referring to fig. 8 and 9, the first and second ribs 161a and 161b are elongated and have a V-like cross section perpendicular to their extension direction. It is understood that V-like shape includes shapes that are (or approximate to) V-shape or C-shape or U-shape, etc. As long as it is ensured that a protrusion is formed on the spring 16 near the circuit board 14, the protrusion may be formed by bending a metal plate or by separately manufacturing the plate (the first plate 162a and/or the second plate 162 b/the third plate 162c) and the protrusion 161 and then fixedly connecting the plate by welding or any other connection method.
It is understood that the number of the convex portions 161 is not limited to 2, but may be a plurality of convex portions 161, such as 3, 4 or more convex portions 161 may be uniformly formed on the plate body. The overall shape of the protrusion is not limited, and the protrusion may be a strip shape as shown in the drawings, and may be a hemispherical shape or a frustum shape fully distributed on the plate body or a part of the plate body. The cross-section of the boss 161 defines a V-like shape, which may be a T-square or other regular or irregular shape.
Referring to fig. 8, the resilient plate 16 has a certain length and thickness, the structure of the protruding portion 161 is designed according to the dimensional parameters and performance of the DMD12, the connector, and the circuit board, as an embodiment, the magnitude of the force exerted by the resilient plate 16 on the circuit board 14 through the protruding portion 161 is F, the maximum bearing pressure of the DMD12 is N, and M is less than or equal to F and less than or equal to N.
The projection of the convex strip on the electrical contact surface of the DMD12 and the circuit board 14 is at least partially located in the first conductive area or the second conductive area. The strength of the protruding strip can be better applied to the area where the electrical connection point of the DMD12 and the circuit board 14 is located, thereby effectively ensuring the reliability of the electrical connection between the two.
Referring to fig. 2, 10 and 11, a heat dissipation assembly 17 fixed to the chassis 10 is disposed on one side of the DMD12, the heat dissipation assembly 17 includes a heat dissipation body 171 and a heat conduction post 175, the heat conduction post 175 is fixed to a side of the heat dissipation body 171 close to the DMD12, the heat conduction post 175 passes through the third through hole 163 of the elastic sheet 16, the second through hole 151 of the sealing sheet 15 and the first through hole 143 of the circuit board 14 and contacts the DMD12, and at least a portion of heat generated by the operation of the DMD12 is transferred to the heat dissipation body 171 through the heat conduction post 175.
The heat dissipation main body 171 is fixed on the optical chassis 10 through a second fixing structure, the second fixing structure includes a fixing hole 1715 disposed on the heat dissipation main body 171 and a fixing column disposed on the optical chassis 10, the second fixing structure further includes a fixing member 173 and a spring (see fig. 2) sleeved on the fixing member 173 and having a pressure buffering effect, the fixing member 173 penetrates through the fixing hole 1715 and is fixed on the fixing column 103, and the direct fixation of the heat dissipation assembly 17 and the optical chassis 10 is achieved. In the installation state, the side of the heat dissipation main body 171 close to the DMD12 is spaced from the elastic sheet 16, so that the circuit board 14 and/or the DMD12 can be prevented from being damaged due to the fact that the heat dissipation assembly 17 applies pressure to the elastic sheet 16, and the problem that the mutual interference between the fixing structure of the heat dissipation assembly and the circuit board and the DMD fixing structure on a traditional projection light machine is difficult to control due to stress is avoided.
The heat dissipating body 171 includes a base 1711 and fins 1713, the base 1711 is a plate, the fixing holes 1715 are disposed on the base 1711, and the fins 1713 are disposed on the side of the base 1711 away from the DMD 12.
The first through hole 143, the second through hole 151, and the third through hole 163 are square, and the positions thereof are respectively located in the central areas of the components where the first through hole, the second through hole, and the third through hole are not limited as long as the heat dissipation columns can pass through the positions; the shape of the heat sink is not limited, and the heat sink is adapted to the shape of the heat conducting post 175 of the heat sink assembly 17.
When the projection optical device 1 is installed, the elastic sheet 16, the circuit board 14 and the DMD12 are fixed on the optical chassis 10 by the first fixing structure, and then the heat dissipation assembly 17 is fixed on the optical chassis 10 by the second fixing structure.
The invention also provides a projection device (not shown) which comprises a shell and the projection light engine 1, wherein the projection light engine 1 is installed in the projection device.
It will be appreciated by those skilled in the art that the above-described preferred embodiments may be freely combined, superimposed, without conflict.
It will be understood that the embodiments described above are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions for details described herein may be made by those skilled in the art without departing from the basic principles of the invention.