CN114070910A

CN114070910A - Shell and electronic equipment

Info

Publication number: CN114070910A
Application number: CN202010772231.XA
Authority: CN
Inventors: 王传果; 邱志强; 陈博文
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2022-02-18

Abstract

The embodiment of the application discloses a shell and electronic equipment. The electronic equipment comprises a shell and a microphone, wherein the shell is provided with a fixing surface, a sound guide groove and a sound inlet hole, the sound guide groove is recessed from the fixing surface along the thickness direction of the electronic equipment, the sound inlet hole is communicated with the sound guide groove to the outside of the electronic equipment, the microphone is fixedly connected with the fixing surface, the microphone is provided with a sound pickup hole, and sound outside the electronic equipment is transmitted to the sound pickup hole through the sound inlet hole and the sound guide groove; the central axis of the sound inlet hole and the central axis of the pickup hole are arranged in a staggered mode, the central axis of the sound inlet hole extends along a first direction, the central axis of the pickup hole extends along the thickness direction of the electronic equipment, and the first direction is crossed with the thickness direction of the electronic equipment. The application provides a sound inlet hole of casing is different and the setting of staggering with the extending direction in the pickup hole of microphone among the electronic equipment for impurity gets into the route of microphone complicacy, has reduced the possibility that external impurity got into the microphone, thereby has reduced the damaged risk of microphone.

Description

Shell and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electronics, in particular to a shell and electronic equipment.

Background

A microphone is an energy conversion device that converts a sound signal into an electrical signal, and is widely used in electronic devices such as mobile phones and tablet computers. Generally, a housing of an electronic device is provided with a sound inlet channel for acquiring a sound signal outside the electronic device. However, in the conventional technology, foreign objects outside the electronic device easily enter the microphone from the sound inlet channel, which not only affects the sound collecting effect of the microphone, but also easily causes the microphone to be damaged.

Disclosure of Invention

The embodiment of the application provides a shell and electronic equipment. The sound inlet hole of the shell in the electronic equipment is different from the extension direction of the pickup hole of the microphone and is staggered, so that impurities enter the microphone in a complex path, the possibility that the external impurities enter the microphone is reduced, and the risk of damage to the microphone is reduced.

In a first aspect, the present application discloses an electronic device. The electronic equipment can be a mobile phone, a tablet computer, a notebook computer, a wearable device, an earphone, a recording pen and other products with a recording function. In the embodiments of the present application, the electronic device is described by taking a mobile phone as an example. The electronic equipment comprises a shell and a microphone. The microphone is used for converting acoustic signals into electric signals.

The casing is provided with a fixing surface, a sound guide groove and a sound inlet hole. The sound guide groove is recessed from the fixing surface along the thickness direction of the electronic equipment, and the sound inlet hole is communicated with the sound guide groove to the outside of the electronic equipment. The microphone is fixedly connected with the fixing surface and is provided with a sound pickup hole. Illustratively, the pick-up hole extends in a thickness direction of the electronic device. And sound outside the electronic equipment is transmitted to the sound pickup hole through the sound inlet hole and the sound guide groove.

In this application embodiment, advance the sound hole and communicate with electronic equipment's outside, the outside sound of electronic equipment loops through advance the sound hole, lead the sound groove and pick-up hole, is acquireed by the microphone, the microphone turns into the signal of telecommunication with the acoustic signal who acquires to record sound.

In some embodiments, the housing is a bezel of the electronic device. The sound inlet hole is located at the bottom of the shell. The shell (middle frame) is positioned between the rear cover in the electronic equipment and the display screen in the electronic equipment. In this embodiment, the housing (middle frame) and the rear cover are different structures, which facilitates the assembly of the electronic device. In other embodiments, the housing and the rear cover of the electronic device can be integrally formed, which is not limited in the present application. For example, when the electronic device is an earphone or a smart band, the housing with the sound inlet hole and the rear cover of the electronic device are of the same structure.

In some embodiments, the housing comprises a first housing and a second housing. The second shell is located inside the first shell. The first shell is an appearance surface of the shell. The sound inlet hole penetrates through the first shell and extends to the second shell so as to properly prolong the path of the sound inlet hole and reduce the possibility that external impurities enter the microphone through the sound inlet hole.

In some embodiments, the first housing is made of a metal material to increase the structural strength of the housing. The second shell is made of plastic materials, so that the process difficulty of forming the sound inlet hole by drilling the shell is reduced. The material of the first shell and the second shell is not limited in the present application, and those skilled in the art can select the material of the first shell and the second shell according to the recording requirement of the microphone assembly. The first housing and the second housing may be made of the same material or different materials, which is not limited in the present application.

In some embodiments, the first housing is integrally formed with the second housing. For example, the first housing and the second housing are integrally formed by an injection molding process. In this embodiment, the first casing and the second casing are integrally formed, the sound inlet holes can be further formed through a drilling process, and the step of aligning a part of the sound inlet holes in the second casing with another part of the sound inlet holes in the first casing is omitted, so that the forming process of the sound inlet holes is simplified. In other embodiments, the first housing and the second housing can also be fixedly connected by an adhesive, which is not limited in this application.

In some embodiments, the sound inlet hole extends in a first direction. The first direction intersects with a thickness direction of the electronic device. Illustratively, the first direction is a length direction of the electronic device. In other embodiments, the first direction may be a width direction of the electronic device, or may be a direction intersecting a length direction of the electronic device at an acute angle, for example, the sound inlet is inclined. The extension direction of the sound inlet hole is not limited in the embodiments of the present application.

Wherein, in this application embodiment, the axis of sound inlet and the axis of picking up the sound hole staggers the setting. The central axis of the sound inlet hole extends along a first direction, and the central axis of the sound pickup hole extends along the thickness direction of the electronic device. It can be understood that the central axis of the sound inlet hole does not intersect the central axis of the sound pickup hole. The projection of the sound pickup hole on the fixing surface is staggered with the sound inlet hole.

In this application embodiment, the extending direction of pickup hole in the microphone with the extending direction of the sound hole of advancing in the casing is different (for example perpendicular), and pickup hole with advance the sound hole setting of staggering, external impurity certainly advance the sound hole and pass through the sound hole entering when microphone is inside, need follow different directions twice of buckling at least for impurity gets into the route of microphone is more complicated, has increased sound transmission channel among the electronic equipment and has held dirty ability, has reduced or has avoided external impurity to get into the possibility of microphone, thereby has reduced the bad risk of vibrating diaphragm in the microphone.

The central axis of the sound pickup hole and the central axis of the sound inlet hole are arranged in a staggered mode, and crossed areas can be arranged in the projection area of the sound pickup hole on the fixing surface and the projection area of the sound inlet hole on the fixing surface along the second direction. The distance between the central axis of the sound pickup hole and the central axis of the sound inlet hole is larger, and the length of the intersection of the projection area of the sound pickup hole on the fixing surface and the projection area of the sound inlet hole on the fixing surface is smaller along the second direction. A person skilled in the art can adjust the overlapping area of the projection of the sound pickup hole on the fixing surface and the sound input hole according to the aperture of the sound input hole and the aperture of the sound pickup hole, which is not limited in the present application.

In some embodiments, in the second direction, a distance between the central axis of the pickup hole and the central axis of the intake hole is greater than a radius of the intake hole. The second direction is perpendicular to the thickness direction of the electronic equipment and is arranged to intersect with the first direction. Illustratively, the second direction is a width direction of the electronic device.

It can be understood that the distance between the central axis of the sound pickup hole and the central axis of the sound inlet hole is greater than the radius of the sound inlet hole, and at this time, in the second direction, the cross width of the projection area of the sound pickup hole on the fixing surface and the projection area of the sound inlet hole on the fixing surface is less than or equal to the radius of the sound pickup hole. For example, in the embodiment of the present application, a non-overlapping region between a projection of a sound collecting hole on the fixing surface and a projection of the sound inlet hole on the fixing surface is described as an example.

In this application embodiment, on the second direction, the axis of picking up the sound hole with advance the distance between the axis of sound hole and be greater than the radius of advancing the sound hole, pick up the sound hole and advance the staggered distance of sound hole great, make impurity entering the route of picking up the sound hole is longer in the microphone, advances the distance of sound hole dislocation great, makes impurity entering the route of picking up the sound hole is longer in the microphone, has further reduced external impurity entering the possibility of microphone.

In some embodiments, the sound guide groove and the sound inlet hole are formed integrally, so as to simplify the forming process of the housing. The width of the sound guide groove in the second direction is larger than the aperture of the sound inlet hole, so that the staggered arrangement design of the sound inlet hole and the sound pickup hole is simplified. Illustratively, the width of the sound guide groove in the second direction is greater than or equal to 1.5 times the aperture of the sound inlet hole, so that the sound inlet hole and the sound pickup hole can have a larger offset distance, the dirt accommodating capacity of the sound transmission channel is further increased, and the risk of the microphone being bad due to external impurities is further reduced.

In some embodiments, the sound guide groove has a first space and a second space which are arranged in a staggered manner along the second direction, and the first space is communicated with the sound inlet hole. The projection of the sound pickup hole on the fixing surface is positioned in the second space. That is, the projection of the sound pickup hole on the fixing surface is completely misaligned with the projection of the sound inlet hole on the fixing surface. It can be understood that, in the second direction, the distance between the central axis of the sound inlet hole and the central axis of the sound pickup hole is greater than the sum of the radius of the sound inlet hole and the radius of the sound pickup hole.

In this application embodiment, the projection of sound pick-up hole on the stationary plane is located the second space, and the second space staggers with the projection of sound inlet hole on the stationary plane, and the distance of sound inlet hole and sound pick-up hole dislocation is great, has further increased the ability that sound transmission passageway held dirty, has further reduced external impurity and has aroused the bad risk of microphone.

In some embodiments, the width of the sound guiding groove in the second direction is less than or equal to 3 times of the aperture of the sound inlet, so that the microphone assembly is prevented from occupying a larger internal space of the electronic device due to a larger width of the sound guiding groove, and arrangement of devices inside the electronic device is facilitated, thereby facilitating miniaturization of the electronic device.

In some embodiments, the electronic device further comprises a sound absorbing member. The sound absorbing piece is contained in the sound guide groove and is fixedly connected with the groove wall of the sound guide groove. Inhale sound spare rigid coupling in the cell wall of leading the sound groove avoids inhaling the sound spare and drops and influence electronic equipment's recording effect.

In some embodiments, the sound absorbing member is made of a material selected from the group consisting of sound absorbing cotton, bass (bass) material, and cellular material. When the sound absorbing piece is made of the sound absorbing cotton material, the density of the sound absorbing cotton material is low, so that sound is effectively transmitted and the sound absorbing effect is achieved. Illustratively, the sound-absorbing cotton has a density of 300kg/m or less³. The microporous material has an average pore size of less than 10 microns.

In this application embodiment, inhale the sound piece not only can block external debris, also can transmit acoustic signal effectively to reduce the high frequency resonance that advances the interior formation of sound hole pipeline.

In some embodiments, in a thickness direction of the electronic apparatus, a height of the sound absorbing member is greater than or equal to an aperture of the sound inlet hole.

In this application embodiment, inhale the high more than or equal to of sound spare the aperture of sound inlet hole, it shelters from to inhale the sound spare the sound inlet hole opening makes it can suppress effectively certainly to inhale the sound hole entering high frequency resonance peak of shaking in the sound in the microphone to the sound effect of inhaling of sound spare has been improved.

In some embodiments, in a thickness direction of the electronic apparatus, a height of the sound absorbing member is smaller than a groove depth of the sound guide groove.

Get into high frequency resonance peak of vibration in the sound in the microphone, the groove depth in groove, just inhale the sound piece and inhale the structure of sound piece top, for example clearance setting between the shielding piece prevents inhale the shielding piece that the sound piece withstood the top, avoid the shielding piece to take place deformation to be favorable to guaranteeing microphone assembly's reliability.

In some embodiments, the opening of the sound inlet hole is located on a side wall of the sound guide groove, and a projection of the sound absorbing member on the side wall of the sound guide groove covers the opening of the sound inlet hole. Illustratively, in the second direction, the length of the sound absorbing member is greater than or equal to the aperture of the sound inlet hole.

In this application embodiment, inhale the sound and be in projection on the lateral wall of leading the sound groove covers the opening of advancing the sound hole, inhale the sound piece and shelter from advance the sound hole opening, make it can suppress effectively certainly to inhale the sound piece advance the sound hole and get into high frequency among the sound in the microphone shakes the peak to sound absorbing effect of inhaling the sound piece has further been improved.

In some embodiments, the electronic device further comprises a cover plate. The cover plate and the microphone are stacked in the thickness direction of the electronic device. Illustratively, the cover plate is a circuit board, and the cover plate is electrically connected with the microphone. In the embodiment of the present application, the description is given by taking the cover plate as an example of the circuit board. The other cover plate may have other structures, which is not limited in the present application.

In this application embodiment, the apron is the circuit board, because the circuit board generally is the platykurtic, the thickness of apron is thinner, the apron with the microphone is followed electronic equipment's thickness direction stacks up the setting, is favorable to reducing the microphone subassembly and is in electronic equipment's thickness direction's size makes electronic equipment is thinner.

The cover plate and the microphone are stacked in the thickness direction of the electronic device, and both the width and the length of the electronic device are larger than the thickness of the electronic device, so that the cover plate or the microphone can have a larger size in the width or the length direction of the electronic device, and the cover plate and the microphone can be integrated with a main board or a sub-board of the electronic device, thereby being beneficial to miniaturization of the electronic device. For example, when a microphone assembly is located on top of the electronic device, the cover and the microphone can be integrated with a main board of the electronic device; when the microphone assembly is located at the bottom of the electronic device, the cover plate and the microphone can be integrated on the auxiliary plate of the electronic device.

In some embodiments, the cover plate is provided with a through hole, and the through hole is located between the sound pickup hole and the sound guide groove. The through hole penetrates through the cover plate along the thickness direction of the electronic equipment. The projection of the through hole on the fixing surface is positioned in the sound guide groove and is staggered with the sound inlet hole. And after the sound outside the electronic equipment passes through the sound guide groove from the sound inlet hole, the sound is transmitted to the microphone through the through hole.

In the embodiment of the present application, the extending direction of the through hole in the cover plate is different from (e.g. perpendicular to) the extending direction of the sound inlet hole in the housing, and the through hole and the sound inlet hole are arranged in a staggered way, when external impurities enter the microphone from the sound inlet hole, the through hole needs to be bent for a certain angle (for example 90 degrees) to pass through the sound guide groove, then bending the microphone in different directions for a certain angle (for example, 90 degrees) to pass through the through hole and then contacting the microphone, that is, the external impurities entering the microphone from the sound inlet hole need to be bent at least twice in different directions, the path of impurities entering the microphone is more complex, the capacity of accommodating dirt of a sound transmission channel in the microphone assembly is increased, the possibility of external impurities entering the microphone is reduced or avoided, and therefore the risk of poor vibrating diaphragm in the microphone is reduced.

In some embodiments, the electronic device further comprises a shield. The shielding piece is located on one side, far away from the microphone, of the cover plate and covers the through hole. The shielding piece is used for shielding external sundries, and the acoustic signal can penetrate through the shielding piece. The shielding piece is used for ensuring the sealing performance of the electronic equipment, preventing external impurities from entering the microphone, and reducing or avoiding the possibility that external impurities enter the microphone, so that the risk of poor vibrating diaphragm in the microphone is reduced.

In some embodiments, the shield is a dust screen. The dustproof net not only has a dustproof function, but also has a certain liquid-proof function so as to improve the sealing performance of the electronic equipment.

In other embodiments, the shield is a waterproof membrane. In this embodiment, the waterproof membrane is used for preventing liquid, and avoids that liquid media enter the interior of the electronic equipment from the sound inlet channel to influence the performance of the electronic equipment. It can be understood that the waterproof film can not only prevent liquid, but also play a role in dust prevention, and has a better dust prevention effect.

In other embodiments, one skilled in the art can design additional waterproof members according to the actual requirements of the microphone assembly to further increase the sealing performance of the microphone. Illustratively, the waterproof piece is fixed at one end of the sound inlet hole close to the microphone body and covers the opening of the sound inlet hole, and the position of the waterproof piece is not limited in the application.

In some embodiments, a side of the housing facing the cover plate is provided with a step structure. The electronic equipment further comprises an adhesive layer, and the adhesive layer is used for fixing the shielding piece to the step structure. The material of the adhesive layer is not limited in the present application. Illustratively, the adhesive layer is a back adhesive, and the shielding piece is adhered to the step structure through the waterproof back adhesive.

In this embodiment, the shielding element is fixed on the step structure on the side of the casing facing the cover plate through the adhesive layer, and the shielding element can be stably fixed on the casing, that is, the shielding element is not easy to fall off, so that the shielding element is prevented from falling off to block a sound transmission channel, and the reliability of the microphone assembly is improved.

In some embodiments, the housing is a bezel. The shell is also provided with an auxiliary hole and an auxiliary channel. The auxiliary hole and the sound inlet hole extend in the same direction, and the auxiliary channel is located between the auxiliary hole and the sound pickup hole. The auxiliary hole with the outside intercommunication of electronic equipment, so that the outside sound of electronic equipment can pass through in proper order the auxiliary hole behind the auxiliary passage, pass through the pickup hole again and transmit extremely the microphone. Illustratively, the auxiliary passage communicates between the auxiliary hole and the sound inlet hole to allow sound to pass from the auxiliary hole to the sound pickup hole. In other embodiments, the auxiliary channel may also communicate between the auxiliary hole and the sound guide groove, which is not limited in this application.

In this embodiment, the sound outside the electronic device can be transmitted to the microphone through the sound inlet hole and also can be transmitted to the microphone through the auxiliary hole, so that a path for the microphone to acquire the sound outside the electronic device is increased, and the recording effect of the microphone assembly is improved.

In some embodiments, the auxiliary hole is a functional hole in the electronic device. The functional holes include one or more of a sound hole, an earphone hole, or a charging hole.

In the embodiment of the application, the auxiliary hole is a commonly used functional hole in the electronic device, and on the basis of not additionally increasing the opening of the electronic device, a path for the microphone assembly to acquire external sound is increased, so that on the basis of improving the recording effect of the microphone assembly, the number of the openings of the electronic device is reduced.

In a second aspect, the present application further provides a housing applied to an electronic device. The shell comprises a sound inlet hole and a sound guide groove communicated with the sound inlet hole. The casing is provided with a fixing surface, the sound guide groove is recessed along the thickness direction of the electronic equipment from the fixing surface, and the sound inlet hole is communicated with the sound guide groove to the outside of the electronic equipment. And sound outside the electronic equipment is transmitted to a microphone in the electronic equipment along the sound inlet hole and the sound guide groove in sequence.

In an embodiment of the application, the microphone is capable of converting an acoustic signal into an electrical signal for inputting an audio signal. And sound outside the electronic equipment is transmitted to the inside of the microphone assembly through the sound inlet hole, so that the electronic equipment realizes a recording function. For example, when the electronic device is in a video or recording mode, the electronic device can record sound through the microphone assembly. Or when the electronic equipment is in a call mode, the microphone assembly receives the voice of the user and converts the received voice into an electric signal, and other components in the electronic equipment convert the electric signal into radio waves and send the radio waves to the communication base station, so that the opposite party of the call can obtain the voice of the user.

The sound inlet hole extends along the first direction, and the width of the sound guide groove in the second direction is larger than the aperture of the sound inlet hole. Illustratively, the width of the sound guiding groove in the second direction is greater than 1.5 times the aperture of the sound inlet hole. Wherein the first direction and the second direction are arranged crosswise. Illustratively, the first direction is disposed perpendicular to the second direction. For example, the first direction is a longitudinal direction of the housing, and the second direction is a width direction of the housing.

In this application embodiment, the casing is equipped with along the not sound hole of advancing that equidirectional extension and leads the sound groove, and leads the sound groove and be greater than the aperture of advancing the sound hole along the width of second direction, and when the microphone was installed in the casing, the pickup hole on the microphone can stagger the setting with advancing the sound hole to make external impurity certainly it is more complicated to advance the sound hole to get into the route of microphone in the electronic equipment, has increased sound transmission channel in the electronic equipment and has held dirty ability, has reduced the bad risk of vibrating diaphragm in the microphone, thereby has improved the quality of electronic equipment.

In some embodiments, the housing is further provided with an auxiliary hole and an auxiliary channel. The auxiliary hole and the sound inlet hole extend in the same direction, and the auxiliary channel is located between the auxiliary hole and the sound inlet hole. The auxiliary hole communicates with the outside of the casing, so that sound outside the casing (outside the electronic equipment) can sequentially pass through the auxiliary hole and the auxiliary channel, and then is transmitted to the microphone through the pickup hole. Illustratively, the auxiliary passage communicates between the auxiliary hole and the sound inlet hole to allow sound to pass from the auxiliary hole to the sound pickup hole. In other embodiments, the auxiliary channel may also communicate between the auxiliary hole and the sound guide groove, which is not limited in this application.

In this embodiment, the sound outside the casing can be transmitted to the microphone through the sound inlet hole and also can be transmitted to the microphone through the auxiliary hole, so that the path for the microphone to acquire the sound is increased, and the recording effect of the microphone assembly is improved.

In some embodiments, the housing is a middle frame of the electronic device, and the auxiliary hole includes one or more of a sound hole, an earphone hole, or a charging hole in the electronic device.

In the embodiment of the application, the auxiliary hole is a functional hole in the electronic device, and on the basis of not additionally increasing the opening of the electronic device, a path for the microphone assembly to acquire external sound is increased, so that on the basis of improving the recording effect of the microphone assembly, the number of the openings of the electronic device is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in a first implementation;

fig. 2 is a schematic view of a portion of the microphone assembly shown in fig. 1 in a first embodiment;

fig. 3 is a schematic diagram of a partially exploded structure of the microphone assembly shown in fig. 2;

fig. 4 is a top view of the microphone assembly of fig. 2;

fig. 5 is a schematic partial cross-sectional view of the microphone assembly of fig. 4 taken along line a-a;

FIG. 6 is a schematic partial cross-sectional view of the microphone assembly of FIG. 4 taken along line B-B;

fig. 7 is a schematic view of the microphone shown in fig. 2;

fig. 8 is a schematic view of a partial structure of the microphone assembly shown in fig. 2;

FIG. 9 is a top view of the microphone assembly of FIG. 1 in a second embodiment;

fig. 10 is a top view of the microphone assembly of fig. 1 in a third embodiment;

FIG. 11 is a schematic cross-sectional view of the microphone assembly of FIG. 1 in a fourth embodiment;

figure 12 is an acoustic frequency response curve for the microphone assembly of figure 11;

figure 13 is a schematic cross-sectional view of the microphone assembly of figure 11;

fig. 14 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in a second implementation;

fig. 15 is a schematic partial cross-sectional view of the electronic device shown in fig. 14.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to a first embodiment of the present disclosure. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, an earphone, a recording pen, or other products with recording functions. The wearable device may be a smart bracelet, a smart watch, Augmented Reality (AR) glasses, virtual reality technology (VR) glasses, or the like. In the embodiment of the present application, the electronic apparatus 100 is described as an example of a mobile phone.

The electronic device 100 includes a rear cover 10 and a microphone assembly 20. The microphone assembly 20 is located inside the rear cover 10. The microphone assembly 20 is capable of converting acoustic signals into electrical signals for input of audio signals. The rear cover 10 protects the microphone assembly 20 and other components inside the electronic device 100.

As shown in fig. 1, the microphone assembly 20 is provided with an inlet hole 201. The sound inlet hole 201 communicates with the outside of the electronic device 100, and sound outside the electronic device 100 is transmitted to the inside of the microphone assembly 20 through the sound inlet hole 201, so that the electronic device 100 realizes a recording function. For example, when the electronic apparatus 100 is in a video taking or recording mode, the electronic apparatus 100 can record sound through the microphone assembly 20. Alternatively, when the electronic device 100 is in the call mode, the microphone assembly 20 receives the voice of the user and converts the received voice into an electrical signal, and other components inside the electronic device 100 convert the electrical signal into radio waves and transmit the radio waves to the communication base station, so that the opposite party of the call can obtain the voice of the user.

In some embodiments, the sound inlet 201 is located at the bottom of the electronic device 100. In this embodiment, the sound inlet hole 201 is located at the bottom of the electronic device 100, and when the user holds the electronic device 100 according to the conversation habit, the sound inlet hole 201 is closer to the sound source (the user's mouth), so that the sound generated by the user can be effectively transmitted to the microphone through the sound inlet hole 201, thereby improving the conversation effect of the electronic device 100.

In some embodiments, electronic device 100 also includes a noise reduction microphone (not shown in the figures). The noise reduction microphone is used for filtering noise of the background in the call process and eliminating noise in the sound so as to improve the recording quality of the microphone assembly 20. Illustratively, the noise reduction microphone is located at the top of the electronic device 100, and the noise reduction microphone and the microphone assembly 20 are respectively located at two opposite sides of the electronic device 100, and collect different audio signals to filter background noise.

With continued reference to fig. 1, the electronic device 100 further includes a speaker assembly 30. The speaker assembly 30 is capable of converting electrical signals into acoustic signals. That is, the speaker assembly 30 is used to output an audio signal. The speaker assembly 30 is provided with a sound hole 301. The sound hole 301 communicates with the outside of the electronic device 100, and the sound output from the speaker assembly 30 is effectively transmitted to the outside of the electronic device 100 through the sound hole 301. For example, when the electronic device 100 is in the call mode, other components inside the electronic device 100 acquire an electrical signal of the voice of the other party, and the speaker assembly 30 can convert the electrical signal into an acoustic signal, so that the user can hear the voice of the user.

In the present embodiment, the microphone unit 20 and the speaker unit 30 are respectively an input audio and an output audio, the electronic apparatus 100 can input and output audio, and the electronic apparatus 100 has a recording and playing function, so that the electronic apparatus 100 can realize a call, a voice, and the like.

As shown in fig. 1, in some embodiments, sound hole 301 is located on the top of electronic device 100. In this embodiment, the sound playing hole 301 is located at the top of the electronic device 100, and when the user holds the electronic device 100 according to the conversation habit, the sound playing hole 301 is closer to the ear of the user, so that the user can effectively obtain the sound emitted by the speaker body, thereby being beneficial to improving the conversation effect of the electronic device 100.

With continued reference to fig. 1, the electronic device 100 further includes a display 40. The display screen 40 is used to display a picture. The display screen 40 and the rear cover 10 are respectively located on two opposite sides of the microphone assembly 20. When the user uses the electronic device 100, the display 40 faces the user and the back cover faces away from the user.

In the present embodiment, the display 40 may be any product or component having a display function, and the present application is not limited thereto. In other embodiments, the electronic device 100 may not include the display 40, which is not limited in this application. For example, when the electronic device 100 is a headset, the electronic device 100 is not provided with the display 40.

As shown in fig. 1, in the first embodiment, the electronic device 100 provided in the present application is described by taking an example in which the sound inlet 201 and the sound broadcasting hole 301 are respectively located on two opposite sides of the display screen 40. Illustratively, the sound inlet hole 201 is located at the lower end of the display screen 40, and the sound broadcasting hole 301 is located at the upper end of the display screen 40. In other embodiments, the sound inlet 201 and the broadcast hole 301 may be located at any position of the electronic device 100, which is not limited in the present application. For example, sound hole 301 is located at the bottom of electronic device 100. The sound hole 301 is used to implement an audio playing function of the electronic device 100, such as music or video. In the following embodiments of the present application, the electronic device 100 will describe in detail the sound inlet 201 and the sound emitting hole 301 in other positions of the electronic device 100, which is not described herein again.

Referring to fig. 1 and fig. 2 together, fig. 2 is a partial structural schematic diagram of the microphone assembly 20 shown in fig. 1 in a first embodiment. The microphone assembly 20 includes a microphone 21 and a case 22. The microphone 21 is mounted to the housing 22. The microphone 21 is used to convert acoustic signals into electrical signals. The sound inlet hole 201 is provided in the case 22. Sound outside the electronic apparatus 100 is transmitted to the microphone 21 through the sound inlet hole 201, and the microphone 21 converts the acquired acoustic signal into an electrical signal to record the sound.

The microphone 21 includes a plurality of electronic components (not shown in the figure), and the electronic components are matched with each other to achieve the effect of recording. For example, the microphone 21 includes a diaphragm and a backplate. The vibrating membrane is opposite to the back plate and is arranged at intervals to form a capacitor structure. The sound outside the electronic device 100 is transmitted through the sound inlet hole 201, and the vibration of the sound is transmitted to the diaphragm of the microphone 21, so that the relative distance between the diaphragm and the back plate is changed, thereby changing the electrical signal of the capacitor structure and realizing the conversion of the acoustic signal into the electrical signal. The structure of the microphone 21 is not limited in the present application, and those skilled in the art can design the microphone 21 according to actual requirements.

As shown in fig. 1, in some embodiments, the housing 22 is a bezel of the electronic device 100. The sound inlet hole 201 is located at the bottom of the housing 22. The housing 22 (middle frame) is located between the rear cover 10 and the display screen 40. In this embodiment, the housing 22 and the rear cover 10 are different structures, which facilitates the assembly of the electronic device 100. In other embodiments, the housing 22 and the rear cover 10 of the electronic device 100 can be integrally formed, but the present application is not limited thereto. For example, when the electronic device 100 is an earphone or a smart band, the housing 22 having the sound inlet hole 201 and the rear cover 10 of the electronic device 100 have the same structure.

The side of the housing 22 serves as an external surface of the electronic device 100. Illustratively, the material of the housing 22 includes a metal material, so as to enhance the strength of the external structure of the electronic device 100 and improve the aesthetic appearance of the electronic device 100.

As shown in fig. 2, in some embodiments, the housing 22 includes a first housing 221 and a second housing 222. The second casing 222 is located inside the first casing 221. The first casing 221 is an external surface of the casing 22. The sound inlet hole 201 penetrates through the first casing 221 and extends to the second casing 222, so as to appropriately extend the path of the sound inlet hole 201, and reduce the possibility that external impurities enter the microphone 21 through the sound inlet hole 201. The shapes and sizes of the first casing 221 and the second casing 222 shown in fig. 2 are only examples, and those skilled in the art can adjust the shapes and sizes of the first casing 221 and the second casing 222 according to actual requirements, which is not limited in the present application.

In some embodiments, the first housing 221 is made of a metal material to increase the structural strength of the housing 22. The second casing 222 is made of plastic material to reduce the difficulty of drilling the casing 22 to form the sound inlet 201. The present application does not limit the material of the first casing 221 and the second casing 222, and those skilled in the art can select the material of the first casing 221 and the second casing 222 according to the recording requirement of the microphone assembly 20. The first casing 221 and the second casing 222 may be made of the same material or different materials, which is not limited in the present application.

In some embodiments, the first shell 221 is integrally formed with the second shell 222. For example, the first housing 221 and the second housing 222 are integrally formed through an injection molding process. In this embodiment, the first casing 221 and the second casing 222 are integrally formed, and the sound inlet hole 201 can be further formed through a drilling process, so that the alignment step of a part of the sound inlet hole 201 in the second casing 222 and another part of the sound inlet hole 201 in the first casing 221 is saved, thereby simplifying the forming process of the sound inlet hole 201. In other embodiments, the first casing 221 and the second casing 222 can also be fixedly connected by an adhesive, which is not limited in the present application.

Referring to fig. 2 and 3 together, fig. 3 is a partially exploded schematic view of the microphone assembly 20 shown in fig. 2. The housing 22 further has a fixing surface 220 and a sound guide groove 202. The sound guide groove 202 communicates with the sound inlet hole 201. The sound guide groove 202 is recessed from the fixing surface 220 in the thickness direction Z of the electronic apparatus 100. Illustratively, the sound guide groove 202 is located in the second housing 222 inside the housing 22. The microphone assembly 20 further includes a cover plate 23 and a shutter 24. The cover plate 23 is provided with a through hole 230. In some embodiments, the cover plate 23 is a circuit board, and the circuit board is electrically connected to the microphone 21 to transmit signals. The shielding member 24 is used to ensure the sealing performance of the electronic device 100, prevent foreign objects from entering the microphone 21, and reduce or avoid the possibility of foreign objects entering the microphone 21, thereby reducing the risk of poor diaphragm in the microphone 21. The shield 24 may be a dust screen or a waterproof film, but the present application is not limited thereto.

Referring to fig. 4 and 5, fig. 4 is a top view of the microphone assembly 20 shown in fig. 2; fig. 5 is a schematic partial cross-sectional view of the microphone assembly 20 of fig. 4 taken along line a-a. The sound inlet 201 communicates the sound guide groove 202 to the outside of the electronic device 100. The microphone 21 is fixed to the fixing surface 220. The sound guide groove 202 communicates with the sound inlet hole 201 to form a sound propagation channel. The external sound of the electronic device 100 passes through the sound inlet hole 201, passes along the sound guide groove 202, and is finally captured by the microphone 21. Illustratively, the sound guide groove 202 and the sound inlet hole 201 are formed integrally to simplify the forming process of the housing 22.

As shown in fig. 4, the projection of the cover plate 23 on the fixing surface 220 is larger than the opening of the sound guide groove 202, and covers the opening of the sound guide groove 202. In the embodiment of the present application, the cover plate 23 covers the opening of the sound guide groove 202 to improve the sealing performance of the sound propagation channel, and prevent sound leakage, thereby improving the recording effect of the microphone assembly 20.

As shown in fig. 4, in some embodiments, the sound inlet port 201 extends in the first direction Y. Illustratively, the first direction Y is a length direction of the electronic apparatus 100. In other embodiments, the first direction Y may be a width direction of the electronic device 100, or may be a direction intersecting a length direction of the electronic device 100 at an acute angle, for example, the sound inlet 201 is inclined. The extending direction of the sound inlet 201 is not limited in the embodiment of the present application, and those skilled in the art can adjust the extending direction of the sound inlet 201 according to the actual requirement of the electronic device 100. In the embodiment of the present application, the description is given taking the first direction Y as an example of the longitudinal direction of the electronic apparatus 100.

Referring to fig. 5, the cover 23 and the microphone 21 are stacked along the thickness direction Z of the electronic device 100. The thickness direction Z of the electronic apparatus 100 is arranged to intersect the first direction Y. Illustratively, the thickness direction Z of the electronic device 100 is perpendicular to the first direction Y. In the embodiment of the present application, the cover plate 23 is taken as a circuit board, and the cover plate 23 is electrically connected to the microphone 21. In other embodiments, the cover 23 can also provide leads for other components, such as the microphone assembly 20, to electrically connect the microphone 21 and a circuit board in the electronic device 100, which is not limited in this application.

In the embodiment of the present application, the cover plate 23 is a circuit board, and since the circuit board is generally flat, the thickness of the cover plate 23 is relatively thin, and the cover plate 23 and the microphone 21 are stacked in the thickness direction of the electronic device 100, which is beneficial to reducing the size of the microphone assembly 20 in the thickness direction of the electronic device 100, so that the electronic device 100 is relatively thin.

Moreover, the cover 23 and the microphone 21 are stacked in the thickness direction Z of the electronic device 100, and both the width and the length of the electronic device 100 are larger than the thickness of the electronic device 100, so that the cover 23 or the microphone 21 can have a larger size in the width and the length directions of the electronic device 100, and the cover 23 and the microphone 21 can be integrated with a main board or a sub-board of the electronic device 100, thereby being beneficial to miniaturization of the electronic device 100. For example, when the microphone 21 is located on the top of the electronic device 100, the cover 23 and the microphone 21 can be integrated on the main board of the electronic device 100; when the microphone 21 is located at the bottom of the electronic device 100, the cover 23 and the microphone 21 can be integrated with the sub-board of the electronic device 100.

Referring to fig. 4 and 6, fig. 6 is a partial cross-sectional view of the microphone assembly 20 shown in fig. 4 along line B-B. The through hole 230 penetrates the cover plate 23 in the thickness direction Z of the electronic apparatus 100. The projection of the through hole 230 on the fixing surface 220 is located in the sound guide groove 202 and is offset from the sound inlet hole 201. The sound from the outside of the electronic device 100 is transmitted from the sound inlet 201 through the sound guide groove 202, and then transmitted to the microphone 21 through the through hole 230.

In the embodiment of the present application, the extending direction of the through hole 230 in the cover plate 23 is different from (e.g., perpendicular to) the extending direction of the sound inlet hole 201 in the housing 22, and the through hole 230 and the sound inlet hole 201 are arranged in a staggered manner, so that when external impurities enter the microphone 21 from the sound inlet hole 201, the external impurities need to be bent at a certain angle (e.g., 90 degrees) first to pass through the sound guide groove 202, and then bent at a certain angle (e.g., 90 degrees) in different directions to pass through the through hole 230 to contact the microphone 21, that is, the external impurities enter the microphone 21 from the sound inlet hole 201 at least need to be bent twice in different directions, so that the path of the impurities entering the microphone 21 is more complicated, the capability of the sound transmission channel in the microphone assembly 20 for accommodating dirt is increased, the possibility of the external impurities entering the microphone 21 is reduced or avoided, and the risk of poor diaphragm in the microphone 21 is reduced.

As shown in fig. 6, in some embodiments, the shield 24 is located on the side of the cover plate 23 away from the microphone 21 and covers the through hole 230. The shielding piece 24 is used for shielding foreign matters, and the acoustic signal can penetrate through the shielding piece 24. In some embodiments, the shield 24 is a dust screen. The dust screen has not only a dust-proof function but also a certain liquid-proof function, so as to improve the sealing performance of the electronic device 100.

In other embodiments, the shield 24 is a waterproof membrane. In this embodiment, the waterproof film is used for preventing liquid, and prevents a liquid medium from entering the interior of the electronic device 100 from the sound inlet channel to affect the performance of the electronic device 100. It can be understood that the waterproof film can not only prevent liquid, but also play a role in dust prevention, and has a better dust prevention effect.

In other embodiments, one skilled in the art can design a waterproof element according to the actual requirement of the microphone assembly 20 to further increase the sealing performance of the microphone 21. Illustratively, the waterproof member is fixed at one end of the sound inlet 201 close to the microphone body and covers the opening of the sound inlet 201, and the position of the waterproof member is not limited in the present application.

Referring to fig. 6, a step structure 223 is disposed on a side of the housing 22 facing the cover 23. The step structure 223 is used to carry the shield 24. Illustratively, the microphone assembly 20 further includes an adhesive layer 25, the adhesive layer 25 being used to secure the shield 24 to the step structure 223. The material used for the adhesive layer 25 in the present application is not limited. Illustratively, the adhesive layer 25 is a backing adhesive and the shield 24 is adhered to the step structure 223 by a waterproof backing adhesive.

In this embodiment, the shielding element 24 is fixed on the step 223 of the side of the casing 22 facing the cover plate 23 by the adhesive layer 25, and the shielding element 24 can be firmly fixed on the casing 22, that is, the shielding element 24 is not easy to fall off, so as to avoid the blocking of the sound transmission channel caused by the falling off of the shielding element 24, thereby being beneficial to improving the reliability of the microphone assembly 20.

Referring to fig. 6 and 7 together, fig. 7 is a schematic structural diagram of the microphone 21 shown in fig. 2. The microphone 21 is provided with a sound pickup hole 210. As shown in fig. 6, the sound pickup hole 210 extends in the thickness direction Z of the electronic device 100 and is located on a side of the microphone 21 facing the cover plate 23. The sound pickup hole 210 communicates with the through hole 230 of the cover 23 so that the microphone 21 picks up an acoustic signal through the sound pickup hole 210.

Referring to fig. 2 and 6, sound outside the housing 22 enters the inside of the electronic device 100 along the first direction Y through the sound inlet 201, passes through the sound guide groove 202 along the second direction X after being bent once, and is finally transmitted to the sound collecting hole 210 along the thickness direction Z of the electronic device 100 after being bent once.

It can be understood that, in the embodiment of the present application, the sound outside the electronic device 100 transmitted to the sound pickup hole 210 along the sound inlet hole 201 needs to be bent at least twice in different directions, so that the path of the foreign matter entering the microphone 21 is more complicated.

Referring to fig. 8, fig. 8 is a schematic view of a portion of the microphone assembly 20 shown in fig. 2. The central axis L1 of the sound inlet hole 201 is offset from the central axis L2 of the sound pickup hole 210. The central axis L1 of the sound inlet hole 201 extends in the first direction Y, and the central axis L2 of the sound pickup hole 210 extends in the thickness direction Z of the electronic device 100.

It can be understood that the projection of the sound pickup hole 210 on the fixing surface 220 is arranged to be staggered with respect to the sound inlet hole 201. Referring to fig. 5 and 6, the sectional view of the microphone assembly 20 shown in fig. 5 cannot reflect the through hole 230 and the sound pickup hole 210, while the sectional view of the microphone assembly 20 shown in fig. 6 cannot reflect the sound inlet hole 201, and it can be understood that the sound pickup hole 210 and the through hole 230 are disposed to be offset from the sound inlet hole 201. In the embodiment of the present application, sound outside the electronic device 100 passes through the sound inlet 201, the sound guide groove 202, the through hole 230, and the sound collecting hole 210 in this order and is captured by the microphone 21.

In the embodiment of the present application, the extending direction of the sound collecting hole 210 in the microphone 21 is different from (for example, perpendicular to) the extending direction of the sound inlet hole 201 in the casing 22, and the sound collecting hole 210 and the sound inlet hole 201 are arranged in a staggered manner, when external impurities enter the microphone 21 through the sound collecting hole 210 from the sound inlet hole 201, the external impurities need to be bent twice along different directions, so that the path of the impurities entering the microphone 21 is more complicated, the capability of the sound transmission channel in the microphone component 20 for accommodating dirt is increased, the possibility of the external impurities entering the microphone 21 is reduced or avoided, and therefore the risk of bad diaphragms in the microphone 21 is reduced.

As shown in fig. 8, the central axis L1 of the sound inlet hole 201 and the central axis L2 of the sound pickup hole 210 are offset from each other, and the extension line of the central axis L1 of the sound inlet hole 201 does not intersect with the extension line of the central axis L2 of the sound pickup hole 210. At this time, in the second direction X, a projection area of the sound pickup hole 210 on the fixing surface 220 and a projection area of the sound inlet hole 201 on the fixing surface 220 may be provided with an intersecting area. The second direction X is perpendicular to the thickness direction Z of the electronic apparatus 100 and intersects the first direction Y. Illustratively, the second direction X is a width direction of the electronic device 100.

It is understood that the greater the distance between the extension line of the central axis L1 of the sound inlet hole 201 and the extension line of the central axis L2 of the sound pickup hole 210, the smaller the length of intersection of the projection area of the sound pickup hole 210 on the fixing surface 220 and the projection area of the sound inlet hole 201 on the fixing surface 220 in the second direction X, that is, the greater the distance the projection of the sound pickup hole 210 on the fixing surface 220 is displaced from the sound inlet hole 201. Those skilled in the art can adjust the gap between the central axis L1 of the sound inlet hole 201 and the central axis L2 of the sound pickup hole 210 according to the aperture of the sound inlet hole 201 and the aperture of the sound pickup hole 210, which is not limited in the present application.

In some embodiments, in the second direction X, a distance between the central axis L1 of the sound inlet hole 201 and the central axis L2 of the sound pickup hole 210 is greater than or equal to a radius of the sound inlet hole 201. That is, in the second direction X, the intersection width of the projection area of the sound pickup hole 210 on the fixing surface 220 and the projection area of the sound inlet hole 201 on the fixing surface 220 is smaller than or equal to the radius of the sound pickup hole 210. For example, as shown in fig. 8, in the embodiment of the present application, in the second direction X, a region where a projection region of the sound collecting hole 210 on the fixing surface 220 and a projection region of the sound inlet hole 201 on the fixing surface 220 do not intersect is taken as an example for description.

In the embodiment of the present application, in the second direction X, the distance between the central axis L1 of the sound inlet hole 201 and the central axis L2 of the sound pickup hole 210 is greater than or equal to the radius of the sound inlet hole 201, and the staggered distance between the sound inlet hole 201 and the sound pickup hole 210 is greater, so that the path of impurities entering the sound pickup hole 210 in the microphone 21 is longer, and the possibility of external impurities entering the microphone 21 is further reduced.

In some embodiments, the aperture D1 of the sound inlet port 201 is larger than the aperture D2 of the sound pick-up port 210. In this embodiment, the aperture D1 of the sound inlet hole 201 is larger than the aperture D2 of the sound pickup hole 210, and external sound is effectively transmitted to the inside of the microphone 21 through the sound inlet hole 201, thereby ensuring the recording effect of the microphone assembly 20.

Referring to fig. 8, the width D3 of the sound guiding slot 202 in the second direction X is greater than the aperture D1 of the sound inlet 201, so as to simplify the design of the staggered arrangement of the sound inlet 201 and the sound collecting hole 210. Illustratively, the width D3 of the sound guiding groove 202 in the second direction X is greater than or equal to 1.5 times the aperture D1 of the sound inlet 201, so as to enable the sound inlet 201 and the sound pickup hole 210 to have a larger offset distance.

In some embodiments, the sound guide groove 202 has a first space 205 and a second space 206 arranged in a staggered manner along the second direction X, and the first space 205 is communicated with the sound inlet 201. The second space 206 is disposed to be offset from the sound inlet hole 201. That is, the second space 206 communicates with the sound inlet hole 201 through the first space 205. The projection of the pick-up hole 210 onto the fixing surface 220 is located in the second space 206. That is, the projection of the sound pickup hole 210 on the fixing surface 220 is completely displaced from the projection of the sound inlet hole 201 on the fixing surface 220. It is understood that, in the second direction X, the distance between the central axis L1 of the sound inlet hole 201 and the central axis L2 of the sound pickup hole 210 is greater than the sum of the radius of the sound inlet hole 201 and the radius of the sound pickup hole 210.

In the embodiment of the present application, the projection of the sound pickup hole 210 on the fixing surface 220 is located in the second space 206, and the second space 206 is staggered from the projection of the sound inlet hole 201 on the fixing surface 220, so that the staggered distance between the sound inlet hole 201 and the sound pickup hole 210 is relatively large, the capability of accommodating dirt in the sound transmission channel is further increased, and the risk of the microphone 21 being bad due to external impurities is further reduced.

In some embodiments, the width D3 of the sound guiding groove 202 in the second direction X is less than or equal to 3 times of the aperture D1 of the sound inlet 201, so as to avoid that the width D3 of the sound guiding groove 202 is large, so that the microphone assembly 20 occupies a large internal space of the electronic device 100, which is beneficial to the arrangement of devices inside the electronic device 100, and thus, the miniaturization of the electronic device 100 is facilitated.

Referring to fig. 8 and 9 together, fig. 9 is a top view of the microphone assembly 20 shown in fig. 1 in a second embodiment. In the present embodiment, the microphone assembly 20 includes most of the technical features of the foregoing embodiments, and most of the technical solutions of the following embodiments that are the same as the foregoing embodiments are not described again.

As shown in fig. 8, in the first embodiment, the sound guide groove 202 extends along the right side of the sound inlet hole 201, and the sound pickup hole 210 in the microphone 21 is described as an example located on the right side of the sound inlet hole 201. As shown in fig. 9, in the second embodiment, the sound guide groove 202 extends along the left side of the sound inlet hole 201, and the sound pickup hole 210 in the microphone 21 is located on the left side of the sound inlet hole 201.

The misalignment direction between the sound pickup hole 210 and the sound input hole 201 is not limited in the present application, and those skilled in the art can appropriately adjust the position of the sound input hole 201 relative to the sound guide groove 202 and the position of the microphone 21 relative to the sound input hole 201 according to the arrangement of other devices inside the electronic device 100, which is not limited in the present application.

Referring to fig. 10, fig. 10 is a top view of the microphone assembly 20 shown in fig. 1 in a third embodiment. In the present embodiment, the microphone assembly 20 includes most of the technical features of the foregoing embodiments, and most of the technical solutions of the following embodiments that are the same as the foregoing embodiments are not described again.

As shown in fig. 10, the sound guide groove 202 includes a first sound guide groove 2021 and a second sound guide groove 2022 communicating with the first sound guide groove 2021. The first sound guiding groove 2021 and the second sound guiding groove 2022 extend in different directions. Illustratively, the first sound guide groove 2021 extends along the second direction X, and the second sound guide groove 2022 extends along the first direction Y. The second sound guide groove 2022 communicates between the sound pickup hole 210 and the first sound guide groove 2021.

In this embodiment, the sound guiding groove 202 includes a first sound guiding groove 2021 and a second sound guiding groove 2022 extending in different directions, external impurities entering the sound guiding groove 202 from the sound inlet 201 need to be bent by a certain angle (e.g., 90 degrees) to enter the first sound guiding groove 2021, then bent by a certain angle (e.g., 90 degrees) to enter the second sound guiding groove 2022, and finally bent by a certain angle (e.g., 90 degrees) to enter the through hole 230, and the external impurities entering the microphone 21 from the sound inlet 201 need to be bent at least three times, so that the path of the impurities entering the microphone 21 is more complicated, the dirt accommodating capability of the sound guiding channel of the microphone assembly 20 is increased, and the possibility of the external impurities entering the microphone 21 is reduced or avoided.

In the embodiment of the present application, the extending direction of the first sound guide groove 2021 is not changed to be an example. In other embodiments, the extending direction of the first sound guiding groove 2021 or the second sound guiding groove 2022 can be changed continuously, which is not limited in the present application. For example, the sound guide groove 202 has an "S" curved shape.

Referring to fig. 11, fig. 11 is a schematic cross-sectional view of the microphone assembly 20 shown in fig. 1 in a fourth embodiment. In the present embodiment, the microphone assembly 20 includes most of the technical features of the foregoing embodiments, and most of the technical solutions of the following embodiments that are the same as the foregoing embodiments are not described again. For example, the housing 22 in the microphone assembly 20 is provided with the sound inlet hole 201 extending in the first direction Y, and the microphone 21 is provided with the sound pickup hole 210 extending in the thickness direction Z of the electronic apparatus 100. Sound pickup hole 210 communicates with sound inlet hole 201, and the projection of sound pickup hole 210 on fixing surface 220 is offset from sound inlet hole 201. The first direction Y intersects with the thickness direction Z of the electronic apparatus 100. Illustratively, the first direction Y is perpendicular to the thickness direction Z of the electronic device 100.

In this embodiment, the microphone assembly 20 further includes a sound absorbing member 26. The sound absorbing member 26 is made of one or more materials selected from sound absorbing cotton, bass (bass) material, microporous material, etc. When the sound absorbing member 26 is made of a sound absorbing cotton material, the sound absorbing cotton material has a low density, so that sound can be effectively transmitted and absorbed. Illustratively, the sound-absorbing cotton has a density of 300kg/m or less³. The microporous material has an average pore size of less than 10 microns.

In the embodiment of the present application, the sound absorbing member 26 not only can block external impurities, but also can effectively lose the transmission acoustic signal, and reduce the high frequency resonance formed in the sound inlet hole 201 pipeline.

As shown in fig. 11, the sound absorbing material 26 is housed in the sound guide groove 202 and fixed to the groove wall of the sound guide groove 202. Illustratively, the microphone assembly 20 further includes an adhesive layer (not shown in the drawings) for fixing the sound-absorbing member 26 on the wall of the sound-guiding groove 202, so as to prevent the sound-absorbing member 26 from falling off and affecting the recording effect of the microphone assembly 20.

In this application embodiment, outside sound is transmitted to microphone 21 behind sound absorbing member 26, and sound absorbing member 26 can suppress the vibration peak of high frequency resonance in the acoustic signal, avoids the vibration peak of high frequency resonance too high, influences microphone 21 sound pressure identification ability to improve the developments of the high frequency of microphone subassembly 20 recording, frequency response, whole tone and the ability of making an uproar of falling, improve microphone subassembly 20 and send a voice recording and experience.

As shown in fig. 11, in some embodiments, in the thickness direction Z of the electronic apparatus 100, the height D4 of the sound absorbing member 26 is greater than or equal to the aperture D1 of the sound inlet hole 201. In the embodiment of the present application, the height D4 of the sound absorbing member 26 is greater than or equal to the aperture D1 of the sound inlet hole 201, and the sound absorbing member 26 blocks the opening of the sound inlet hole 201, so that the sound absorbing member 26 can effectively suppress the high-frequency resonance peak of sound entering the microphone 21 from the sound inlet hole 201, thereby improving the sound absorbing effect of the sound absorbing member 26.

In some embodiments, the height D4 of the sound-absorbing member 26 is smaller than the groove depth D5 of the sound-guiding groove 202 in the thickness direction Z of the electronic apparatus 100. Illustratively, a gap is provided between the sound absorber 26 and the shield 24.

In this embodiment, the height D4 of the sound absorbing member 26 is smaller than the groove depth D5 of the sound guiding groove 202, and a gap is formed between the sound absorbing member 26 and the shielding member, so as to prevent the sound absorbing member 26 from abutting against the shielding member 24 above, and prevent the shielding member 24 from deforming, thereby facilitating the reliability of the microphone assembly 20. And the height D4 of sound absorbing member 26 is smaller than the diameter of sound inlet hole 201, so that sound absorbing member 26 is prevented from blocking the opening of sound inlet hole 201 and affecting the transmission of sound signals.

In some embodiments, the gap between the sound absorbing member 26 and the shielding member 24 is greater than 0.2 mm, so as to avoid the liquid entering into the sound guiding groove 202, and when the sound absorbing member 26 is made of sound absorbing cotton, the sound absorbing member is expanded after absorbing liquid, and abuts against the shielding member 24 above the sound absorbing member 26, thereby further preventing the sound absorbing member 26 from blocking the opening of the sound guiding groove 202 and influencing the transmission of sound signals.

Referring to fig. 11 and 12 together, fig. 12 is an acoustic frequency response curve of the microphone assembly 20 shown in fig. 11. The abscissa of the graph represents the frequency of the sound and the ordinate represents the decibel of the sound. Wherein, fig. 12 illustrates two curves: the solid line shows the acoustic frequency response curve of the microphone assembly 20 with the sound absorbing member 26. The dotted line represents the acoustic frequency response curve of the microphone assembly 20 without the sound absorbing member 26. As can be seen from fig. 12, the sound pressure level in the solid line is overall weaker than the sound pressure level in the dashed line at a frequency of about 8000 Hz. In other words, when the sound absorbing material 26 is provided in the microphone unit 20, the peak of the high-frequency resonance in the acoustic signal is small compared to when the sound absorbing material 26 is not provided in the microphone unit 20. The acoustic frequency response curve of the microphone assembly shown in fig. 12 is only an example, and the acoustic frequency response curve of the microphone assembly is not limited in the present application.

It can be understood that, outside sound is transmitted to microphone 21 behind sound absorbing member 26, and sound absorbing member 26 can suppress the vibration peak of high frequency resonance in the acoustic signal, avoids the vibration peak of high frequency resonance too high, influences microphone 21 acoustic pressure and knows the ability to improve microphone subassembly 20 transmission recording and experience.

Referring to fig. 11 and 13 together, fig. 13 is a cross-sectional view of the microphone assembly 20 shown in fig. 11. In some embodiments, the opening 2011 of the sound inlet port 201 is located on a sidewall of the sound guide groove 202. The projection of sound absorbing member 26 on the side wall of sound guide groove 202 covers opening 2011 of sound inlet hole 201. Illustratively, in the second direction X, the length of the sound absorbing member 26 is greater than or equal to the aperture of the sound inlet hole 201.

In the embodiment of the present application, the projection of sound absorbing member 26 on the side wall of sound guide groove 202 covers opening 2011 of sound inlet hole 201, and sound absorbing member 26 blocks opening 2011 of sound inlet hole 201, so that sound absorbing member 26 can effectively suppress the high-frequency vibration peak in the sound entering microphone 21 from sound inlet hole 201, thereby further improving the sound absorbing effect of sound absorbing member 26.

Referring to fig. 14, fig. 14 is a schematic structural diagram of an electronic device 100 according to a second embodiment of the present disclosure. In this embodiment, most technical solutions of the electronic device 100 that are the same as the electronic device 100 are not described again. The structure of the microphone assembly 20 shown in this embodiment can be combined with the structure of any one of the microphone assemblies 20 shown in fig. 2 to 13. For example, the housing 22 in the microphone assembly 20 is provided with a sound inlet 201 extending in the first direction Y, and the microphone 21 is provided with a sound pickup hole extending in the thickness direction Z of the electronic device 100. The projection of the sound pickup hole on the fixing surface 220 is arranged to be staggered with the sound inlet hole 201. The first direction Y intersects with the thickness direction Z of the electronic apparatus 100. Illustratively, the first direction Y is perpendicular to the thickness direction Z of the electronic device 100.

In this embodiment, the electronic device 100 further includes a noise reduction component 50 and a noise reduction sound recording hole 501 in communication with the noise reduction component 50. The noise reduction member 50 takes sound outside the electronic apparatus 100 through the noise reduction recording hole 501. Wherein the noise reduction assembly 50 is spaced apart from the microphone assembly 20. Illustratively, the noise reduction assembly 50 and the microphone assembly 20 are respectively disposed at two opposite ends of the electronic device 100. The noise reduction sound recording hole 501 penetrates the rear cover 10 to obtain sound outside the electronic apparatus 100. As shown in fig. 14, the electronic apparatus 100 further includes a rear camera 60. The noise reduction sound recording hole 501 is adjacent to the rear camera 60.

In the embodiment of the present application, the microphone assembly 20 is located at the bottom of the electronic device 100, the noise reduction assembly 50 is located at the top of the electronic device 100, the microphone assembly 20 synchronously acquires background sound during the process of acquiring sound outside the electronic device 100, for example, sound of a user, and the processor in the electronic device 100 processes the audio signals acquired by the microphone assembly 20 and the noise reduction assembly 50 to filter the background noise in the audio signals acquired by the microphone assembly 20, so as to improve the recording or call quality of the electronic device 100.

In the embodiment of the present application, the noise reduction sound recording hole 501 is described as being opened in the rear cover 10. In other embodiments, the noise reduction hole can be opened on the top or side of the housing 22, and the application does not limit the specific position of the noise reduction recording hole 501.

Referring to fig. 14 and 15 together, fig. 15 is a partial cross-sectional view of the electronic device 100 shown in fig. 14 along the line C-C. The housing 22 is further provided with an auxiliary hole 203 and an auxiliary passage 204. The auxiliary hole 203 is located at the bottom of the electronic device 100, and the auxiliary hole 203 extends in the same direction as the sound inlet 201. The auxiliary channel 204 is located between the auxiliary hole 203 and the sound pickup hole 210. The auxiliary hole 203 communicates with the outside of the electronic device 100, so that the sound outside the electronic device 100 can pass through the auxiliary hole 203, the auxiliary channel 204, and the sound pickup hole 210 to be transmitted to the microphone 21. As shown in fig. 15, exemplarily, the auxiliary passage 204 communicates between the auxiliary hole 203 and the sound inlet hole 201 to transmit sound from the auxiliary hole 203 to the sound pickup hole 210. In other embodiments, the auxiliary channel 204 may also communicate between the auxiliary hole 203 and the sound guide groove 202, which is not limited in the present application.

In this embodiment, the sound outside the electronic device 100 can be transmitted to the microphone 21 not only through the sound inlet hole 201, but also through the auxiliary hole 203, so that the path of the microphone 21 for acquiring the sound outside the electronic device 100 is increased, which is beneficial to improving the recording effect of the microphone assembly 20.

In some embodiments, the auxiliary aperture 203 is a functional aperture in the electronic device 100. The functional holes include one or more of a sound hole, an earphone hole, or a charging hole.

In the embodiment of the present application, the auxiliary hole 203 is a commonly used functional hole in the electronic device 100, and on the basis of not additionally increasing the opening of the electronic device 100, a path for the microphone assembly 20 to acquire external sound is increased, so that on the basis of improving the recording effect of the microphone assembly 20, the number of openings of the electronic device 100 is reduced.

In some embodiments, the electronic device 100 includes a first speaker component and a second speaker component. The first speaker assembly and the second speaker assembly are respectively located at two opposite ends of the electronic device 100. Illustratively, the first speaker assembly is located at the bottom of the electronic device 100 and the second speaker assembly is located at the top of the electronic device 100. The first speaker assembly is provided with a first sound hole, and the second speaker assembly is provided with a second sound hole. The microphone assembly 20 is located on the same end of the electronic device 100 as the first speaker assembly. The sound inlet 201 and the first sound hole are both located at the bottom of the electronic device 100. Wherein the auxiliary hole 203 is a first sound hole.

In the embodiment of the present application, the first speaker is used for audio playing, for example, playing music or video. The second speaker assembly is configured to convert the electrical signal into an acoustic signal, and transmit the acoustic signal to the outside of the electronic device 100 through the second broadcast hole, so that the user can hear the sound of the user at the call end.

In the embodiment of the present application, the speaker for transmitting the voice of the user at the call end and the speaker for implementing the audio playing function are different structures, so that the electronic device 100 can implement audio playing even in a call state. For example, the user may also use the electronic device 100 to watch a video while using the electronic device 100 to make a call, and at this time, the user may acquire not only the sound of the call end but also the sound of the video.

Moreover, in the embodiment of the present application, the second speaker assembly is located at the top of the electronic device 100, and when the user holds the electronic device 100 according to the conversation habit, the second sound hole for transmitting the sound of the user at the conversation end is closer to the ear of the user, so that the user can effectively obtain the sound signal of the user at the conversation end, which is beneficial to improving the conversation effect of the electronic device 100.

Referring to fig. 1 and 13 together, the embodiment of the present disclosure is described by taking the microphone assembly 20 as an example, which is located at the bottom of the electronic device 100. In other embodiments, the microphone assembly 20 can be located on the top of the electronic device 100, and the location of the microphone assembly 20 on the electronic device 100 is not limited in the present application. For example, the microphone assembly 20 may also be located on the top of the electronic device 100, with the sound inlet 201 extending through the back cover of the electronic device 100. In this case, the microphone assembly 20 can be used to reduce noise and filter background noise during a call, so as to improve the recording quality of the electronic device 100.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An electronic device is characterized by comprising a shell and a microphone, wherein the shell is provided with a fixing surface, a sound guide groove and a sound inlet hole, the sound guide groove is recessed from the fixing surface along the thickness direction of the electronic device, and the sound inlet hole is communicated with the sound guide groove to the outside of the electronic device;

the microphone is fixedly connected with the fixing surface and provided with a sound pickup hole, and sound outside the electronic equipment is transmitted to the sound pickup hole through the sound inlet hole and the sound guide groove; the central axis of the sound inlet hole and the central axis of the sound pickup hole are arranged in a staggered mode, the central axis of the sound inlet hole extends along a first direction, the central axis of the sound pickup hole extends along the thickness direction of the electronic equipment, and the first direction is intersected with the thickness direction of the electronic equipment.

2. The electronic device according to claim 1, wherein the sound inlet hole extends in the first direction, and a width of the sound guide groove in a second direction intersecting the first direction is greater than or equal to 1.5 times an aperture of the sound inlet hole.

3. The electronic device according to claim 2, wherein the sound guide groove has a first space and a second space which are arranged in a staggered manner along the second direction, the first space communicates with the sound inlet, and a projection of the sound pickup hole on the fixing surface is located in the second space.

4. The electronic device according to any one of claims 1 to 3, further comprising a sound absorbing member housed in the sound guide groove and fixedly secured to a groove wall of the sound guide groove; in the thickness direction of the electronic device, the height of the sound absorbing piece is larger than or equal to the aperture of the sound inlet hole.

5. The electronic device according to claim 4, wherein the opening of the sound inlet hole is located on a side wall of the sound guide groove, and a projection of the sound absorbing member on the side wall of the sound guide groove covers the opening of the sound inlet hole.

6. The electronic device of claim 4, wherein the sound-absorbing member is made of a material selected from the group consisting of sound-absorbing cotton, Beth material, and microporous material.

7. The electronic device according to any one of claims 1 to 6, further comprising a cover plate, wherein the cover plate and the microphone are stacked in a thickness direction of the electronic device, and the cover plate is provided with a through hole between the sound pickup hole and the sound guide groove.

8. The electronic device of claim 7, wherein the cover plate is a circuit board and the cover plate is electrically connected to the microphone.

9. The electronic device of claim 8, further comprising a shield at a side of the cover plate away from the microphone and covering the through hole.

10. The electronic device according to claim 9, wherein a side of the housing facing the cover plate is provided with a step structure, and further comprising an adhesive layer for fixing the shutter to the step structure.

11. The electronic device according to any one of claims 1 to 10, wherein the housing is a middle frame, the housing is further provided with an auxiliary hole and an auxiliary channel, the auxiliary hole and the sound input hole extend in the same direction, and the auxiliary channel is located between the auxiliary hole and the sound pickup hole.

12. A shell is applied to electronic equipment and is characterized by comprising a sound inlet hole and a sound guide groove communicated with the sound inlet hole, wherein the shell is provided with a fixing surface, the sound guide groove is recessed from the fixing surface along the thickness direction of the electronic equipment, the sound inlet hole is communicated with the sound guide groove to the outside of the electronic equipment, the sound inlet hole extends along a first direction, and the width of the sound guide groove in a second direction is more than 1.5 times of the aperture of the sound inlet hole; wherein the first direction intersects the second direction.

13. The casing of claim 12, further comprising an auxiliary hole extending in the same direction as the sound inlet hole and an auxiliary channel between the auxiliary hole and the sound inlet hole.

14. The housing of claim 13, wherein the housing is a center frame of the electronic device, and wherein the auxiliary hole comprises one or more of a sound hole, an earphone hole, or a charging hole in the electronic device.