CN114068511A - Display panel and display device - Google Patents
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- CN114068511A CN114068511A CN202111362152.2A CN202111362152A CN114068511A CN 114068511 A CN114068511 A CN 114068511A CN 202111362152 A CN202111362152 A CN 202111362152A CN 114068511 A CN114068511 A CN 114068511A
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- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
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- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Abstract
The invention discloses a display panel and a display device, wherein the display panel comprises an integrated circuit chip, the integrated circuit chip comprises M first connecting parts, and M is more than or equal to 1; the binding end comprises N second connecting parts, and N is more than or equal to 1; the first side surface of the at least one first connecting part and the second side surface of the at least one second connecting part are oppositely arranged and electrically connected with each other; the first side surface and/or the second side surface are/is intersected with the light-emitting surface of the display panel. The side face of the first connecting portion in at least one integrated circuit chip is electrically connected with the side face of the second connecting portion of at least one binding end, so that the binding area of the integrated circuit chip and the binding end is ensured, meanwhile, the planar space of the screen body is saved, and more first connecting portions and second connecting portions can be placed in the limited space of the binding area.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the continuous development of scientific technology, more and more electronic devices with display functions are widely applied to daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present.
Display panel includes drive integrated chip and binds the end, and the mode electric connection of drive integrated chip and the pad of binding the end through positive crimping, nevertheless along with display panel resolution ratio is higher and higher, need set up more quantity's pad, but under the certain circumstances of regional area of binding, but is difficult to realize the design of many pads.
Disclosure of Invention
In view of the above, the present invention provides a display panel and a display device, which are used to solve the problem that it is difficult to design a multi-pad under the condition that the area of a bonding region is constant in the prior art.
In one aspect, the invention provides a display panel, which includes an integrated circuit chip, wherein the integrated circuit chip includes M first connecting portions, and M is greater than or equal to 1; the binding end comprises N second connecting parts, and N is more than or equal to 1; the first side surface of the at least one first connecting part and the second side surface of the at least one second connecting part are oppositely arranged and electrically connected with each other; the first side surface and/or the second side surface are/is intersected with the light-emitting surface of the display panel.
In another aspect, the present invention provides a display device including any one of the display panels provided in the present application.
Compared with the prior art, the display panel and the display device provided by the invention at least realize the following beneficial effects:
the invention provides a display panel and a display device, wherein the display panel comprises an integrated circuit chip, the integrated circuit chip comprises M first connecting parts, and M is more than or equal to 1; the binding end comprises N second connecting parts, and N is more than or equal to 1; the first side surface of the at least one first connecting part and the second side surface of the at least one second connecting part are oppositely arranged and electrically connected with each other; the first side surface and/or the second side surface are/is intersected with the light-emitting surface of the display panel. The side face of the first connecting portion in at least one integrated circuit chip is electrically connected with the side face of the second connecting portion of at least one binding end, so that the binding area of the integrated circuit chip and the binding end is ensured, meanwhile, the planar space of the screen body is saved, and more first connecting portions and second connecting portions can be placed in the limited space of the binding area.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of a display panel in the prior art;
FIG. 2 is a cross-sectional view taken along line Q-Q' of FIG. 1;
FIG. 3 is a schematic diagram of a display panel according to the present invention;
FIG. 4 is a cross-sectional view taken along line P-P' of FIG. 3;
FIG. 5 is a further cross-sectional view taken along line P-P' of FIG. 3;
FIG. 6 is a further cross-sectional view taken along line P-P' of FIG. 3;
FIG. 7 is a further cross-sectional view taken along line P-P' of FIG. 3;
FIG. 8 is a further cross-sectional view taken along line P-P' of FIG. 3;
fig. 9 is a schematic diagram of a display device according to the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Fig. 1 is a schematic structural diagram of a display panel 100 according to the prior art, and fig. 2 is a cross-sectional view taken along a direction Q-Q' in fig. 1. The display panel 100 comprises an integrated circuit chip IC, the integrated circuit chip IC comprises a plurality of first bonding pads 01, the integrated circuit chip IC further comprises a binding area 02, the binding area 02 comprises a plurality of second bonding pads 03, the first bonding pads 01 and the second bonding pads 03 are both of sheet structures, the surface area of the first bonding pads 01 and the surface area of the second bonding pads 03 parallel to the display panel 100 are larger than the surface area of the first bonding pads 01 perpendicular to the display panel 100, and in order to guarantee the binding area between the first bonding pads 01 and the second bonding pads 03, the first bonding pads 01 and the second bonding pads 03 are in a positive pressure connection mode to achieve electric connection.
However, as the resolution requirement of the display panel 100 is higher and higher, the number of pads required to be connected with the data lines is increased, but in order to ensure the binding resistance between the first pad 01 and the second pad 03, the areas of the first pad 01 and the second pad 03 cannot be reduced, that is, in the case that the area of the binding region 02 is fixed, the number of the first pad 01 and the second pad 03 cannot be increased.
In order to solve the above technical problem, the present invention provides a display panel and a display device. Embodiments of the display panel and the display device provided by the present invention will be described in detail below.
In this embodiment, please refer to fig. 3 and fig. 4, in which fig. 3 is a schematic structural diagram of a display panel according to the present invention, fig. 4 is a cross-sectional view taken along direction P-P' in fig. 3, and the display panel 200 of the present embodiment includes: an integrated circuit chip IC including M first connection portions 10 on a first substrate 00, M being greater than or equal to 1; the binding end B comprises N second connecting parts 20, and N is more than or equal to 1; wherein, the first side face L1 of the at least one first connecting portion 10 and the second side face L2 of the at least one second connecting portion 20 are oppositely arranged and electrically connected to each other; the first side face L1 and/or the second side face L2 intersect the light emitting surface S of the display panel 200. In fig. 4, only the first side face L1 and the second side face L2 intersect with the light emitting surface S of the display panel 200, but the disclosure is not limited thereto, and the disclosure may be specifically set according to actual situations.
It can be understood that, the binding end B may include a plurality of signal lines, the signal lines are electrically connected to the second connecting portion 20, the integrated driving chip IC is electrically connected to the second connecting portion 20 in the binding end B through the first connecting portion 10, so that the integrated driving chip IC sends signals to the signal lines, and the display panel displays pictures, in order to satisfy the high resolution of the display panel, the number of the set signal lines is large, and further the number of the first connecting portion 10 and the second connecting portion 20 need to be increased, so as to satisfy the high resolution of the display panel 200. Compared with the sheet structure in the prior art and the front press bonding manner, in the display panel 200 provided in this embodiment, the first side face L1 of the at least one first connection portion 10 in the integrated circuit chip IC and the second side face L2 of the at least one second connection portion 20 at the bonding end B are arranged oppositely and electrically connected to each other, and the first side face L1 of the at least one first connection portion 10 and the second side face L2 of the at least one second connection portion 20 are defined oppositely and electrically connected to each other, that is, the at least one first connection portion 10 and the at least one second connection portion 20 at the bonding end B in the integrated circuit chip IC are arranged in a three-dimensional structure, and the direct insertion bonding manner is adopted to achieve electrical connection through side contact, which is equivalent to reducing the width of each first connection portion 10 and each second connection portion 20 and stretching the height of the connection portions. On the one hand, the width of each first connecting portion 10 and each second connecting portion 20 is reduced, that is, the space occupied by each first connecting portion 10 in the driving integrated chip IC can be effectively reduced, the space occupied by each second connecting portion 20 in the binding end B can be effectively reduced, so that the situation that the driving integrated chip IC and the binding end B are in a limited binding area can be realized, the first connecting portions 10 and the second connecting portions 20 are additionally arranged to meet the high resolution of the display panel 200, on the other hand, because the direct-insertion binding mode is adopted in the embodiment to realize the electrical connection through the side contact, the height of each first connecting portion 10 and each second connecting portion 20 is stretched, the binding area between the first connecting portions 10 and the second connecting portions 20 can be ensured, the binding resistance is ensured, and the electric conductivity can be favorably enhanced. The first connection portion 10 and the second connection portion 20 may be made of metal or other conductive materials, and the specific materials of the first connection portion 10 and the second connection portion 20 are not limited in the present invention and may be set according to actual situations.
In some alternative embodiments, shown in conjunction with FIG. 5, FIG. 5 is a further cross-sectional view taken along line P-P' of FIG. 3. The display panel 200 provided in this embodiment: the first side face L1 and the second side face L2 include a first conductive adhesive 30 therebetween, and the first connection portion 10 and the second connection portion 20 are electrically connected by the first conductive adhesive 30. The first conductive adhesive 30 is anisotropic conductive adhesive or conductive gold ball, and the specific material of the first conductive adhesive 30 is not limited in the present invention and can be specifically set according to actual conditions.
It can be understood that, in the display panel 200 provided in this embodiment, the first side face L1 of the at least one first connection portion 10 and the second side face L2 of the at least one second connection portion 20 are oppositely disposed and electrically connected to each other, and the display panel further includes the first conductive adhesive 30, and the first conductive adhesive 30 is disposed between the first side face L1 and the second side face L2 which are oppositely disposed, so that the first side face L1 and the second side face L2 are electrically connected, wherein the first conductive adhesive 30 is disposed at a position where the first side face L1 and the second side face L2 overlap as much as possible, so as to avoid a short circuit caused by adhesive overflow.
In some alternative embodiments, continuing with fig. 4, the present embodiment provides a display panel 200: the M first connection portions 10 are arranged along the first direction X, and the N second connection portions 20 are also arranged along the first direction X; in the first direction X, the width of the first connection portion 10 is W1, and the width of the second connection portion 20 is W2; in the direction Y perpendicular to the surface of the display panel, the height of the first connection portion 10 is H1, and the height of the second connection portion 20 is H2; wherein W1 < H1, and/or W2 < H2.
In fig. 4, only M ═ N ═ 9 is taken as an example, but the invention is not limited thereto, and the number of the first connection portions 10 and the second connection portions 20 may be set according to the resolution required by the display panel 200.
It is understood that, in the display panel 200 provided in the present embodiment, the M first connection portions 10 are arranged along the first direction X, in which the width of the first connection portion 10 is W1, and in the direction Y perpendicular to the surface of the display panel, the height of the first connection portion 10 is H1, where W1 < H1. That is, the first connection portion 10 is a protruded three-dimensional structure, and the height H1 is greater than the width W1 thereof, which is equivalent to reducing the width W1 of the first connection portion 10 and increasing the height H1 thereof, so that the space occupied by each first connection portion 10 in the driving IC can be effectively reduced on the basis of ensuring the binding area, and more first connection portions 10 can be relatively arranged on the driving IC with a certain space for improving the resolution of the display panel 200. In the display panel 200 provided in this embodiment, the N second connection portions 20 are also arranged along the first direction X, and in the first direction X, the width of the second connection portion 20 is W2; the height of the second connection portion 20 in the direction Y perpendicular to the display panel surface is H2; wherein W2 < H2. That is, the second connecting portion 20 is a protruding three-dimensional structure, and the height H2 is greater than the width W2 thereof, which is equivalent to reducing the width W2 of the second connecting portion 20 and increasing the height H2 thereof, so that the space occupied by each second connecting portion 20 at the binding end B can be effectively reduced on the basis of ensuring the binding area, and more second connecting portions 20 can be relatively arranged at the binding end B with a certain space for improving the resolution of the display panel 200. In the display panel 200 provided in the present embodiment, the first connection portion 10 and the second connection portion 20 may be defined at the same time, W1 < H1, and W2 < H2, that is, the width of each first connection portion 10 and each second connection portion 20 is reduced at the same time, the area of the bonding region occupied by each first connection portion 10 and each second connection portion 20 is effectively reduced, so that in the bonding region where the driving integrated chip IC and the bonding terminal B are limited, the number of the first connection portions 10 and the second connection portions 20 is increased to satisfy the high resolution of the display panel 200, and the height of each first connection portion 10 and each second connection portion 20 is simultaneously stretched, the bonding area between the first connection portions 10 and the second connection portions 20 is ensured, the bonding resistance is ensured, and thus the enhancement of the conductive performance may be facilitated.
In some alternative embodiments, and as shown in continued reference to fig. 5 and 6, fig. 6 is a further cross-sectional view taken along line P-P' of fig. 3. In fig. 5, only the height H1 of the first connecting portion 10 is equal to the height H2 of the second connecting portion 20, and only the height H1 of the first connecting portion 10 is different from the height H2 of the second connecting portion 20 in fig. 6. The display panel 200 provided in this embodiment: the height of the first conductive paste 30 between the first side face L1 and the second side face L2 is H3, wherein H3 is smaller than the smaller of H1 and H2.
It can be understood that the display panel 200 provided in this embodiment includes the first conductive adhesive 30 between the first side face L1 and the second side face L2, the first connection portion 10 and the second connection portion 20 are electrically connected by the first conductive adhesive 30, and the height of the first conductive adhesive 30 between the first side face L1 and the second side face L2 is further defined as H3, as shown in fig. 5, as the height H1 of the first connection portion 10 is equal to the height H2 of the second connection portion 20 in fig. 5, as long as the height H3 of the first conductive adhesive 30 is smaller than H1 or H2, there is no first conductive adhesive 30 in a partial region, and thus it is ensured that the first conductive adhesive 30 does not extend over the connection portions to other regions to cause short circuit. As shown in fig. 6, since the height H2 of the second connection portion 20 in fig. 6 is smaller than the height H1 of the first connection portion 10, if the height H3 of the first conductive adhesive 30 is set to be greater than the height H2 of the second connection portion 20, the first conductive adhesive 30 may overflow the second connection portion 20, which may cause a short circuit of the second connection portion 20, and it is further required to ensure that the height H3 of the first conductive adhesive 30 is smaller than the height H2 of the second connection portion 20, so that a partial region may not have the first conductive adhesive 30, and it is ensured that the first conductive adhesive 30 does not overflow the connection portion and extends to other regions to cause a short circuit.
In some alternative embodiments, shown in conjunction with FIG. 7, FIG. 7 is a further cross-sectional view taken along line P-P' of FIG. 3. The display panel 200 provided in this embodiment: the M first connection portions 10 are arranged along the first direction X, and the N second connection portions 20 are also arranged along the first direction X; the width of the gap between two adjacent first connection portions 10 along the first direction X is W11 on the side close to the first substrate 00, the width of the gap between two adjacent first connection portions 10 along the first direction X is W12 on the side far from the first substrate 00, and at least one second connection portion 20 is disposed in the gap between two adjacent first connection portions 10, wherein W11 < W12.
It can be understood that, in the display panel 200 provided in this embodiment, on the side close to the first substrate 00, the width W11 of the gap between two adjacent first connection portions 10 along the first direction X is smaller than the width W12 of the gap between two adjacent first connection portions 10 along the first direction X, so that the gap between two adjacent first connection portions 10 is a regular trapezoid, when the integrated driver IC is electrically connected to the bonding end B, the oppositely disposed first connection portion 10 and the oppositely disposed second connection portion 20 need to be plugged into each other and disposed on the side far from the first substrate 00, the width W12 of the gap between two adjacent first connection portions 10 along the first direction X is relatively larger, so as to facilitate the insertion of the second connection portion 20 in the bonding end B, avoid the occurrence of touch during the plugging process and affect the quality of the first connection portion 10 and the second connection portion 20, meanwhile, the problem of short circuit caused by the electrical connection between the second connection portion 20 and the other first connection portions 10 which should not be electrically connected can be avoided.
In some alternative embodiments, continuing with fig. 7, the present embodiment provides a display panel 200: the second connecting portion 20 disposed in the gap between two adjacent first connecting portions 10 has a width W21 on the side close to the first substrate 00 and a width W22 on the side away from the first substrate 00, wherein W21 < W22.
It can be understood that the display panel 200 provided in the present embodiment is arranged in the first direction X at the M first connection portions 10, and the N second connection portions 20 are also arranged in the first direction X; on the side close to the first substrate 00, the width of the gap between two adjacent first connection portions 10 along the first direction X is W11, on the side far from the first substrate 00, the width of the gap between two adjacent first connection portions 10 along the first direction X is W12, and at least one second connection portion 20 is disposed in the gap between two adjacent first connection portions 10, wherein W11 < W12, that is, the gap between two adjacent first connection portions 10 is a regular trapezoid, the second connection portion 20 disposed in the gap between two adjacent first connection portions 10 is disposed, the width on the side close to the first substrate 00 is W21, the width on the side far from the first substrate 00 is W22, wherein W21 < W22, that is, the second connection portion 20 may be a regular trapezoid, and may match the shape of the gap between two adjacent first connection portions 10, so that the second connection portion 20 may be more conveniently inserted into the gap between two adjacent first connection portions 10, the electrical connection of the first connection portion 10 and the second connection portion 20 is achieved. Wherein, the first side face L1 of the first connecting portion 10 can be a bevel edge, the second side face L2 of the second connecting portion 20 can also be a bevel edge, and the first side face L1 and the second side edge L2 are arranged in parallel, so that the second connecting portion 20 can be further inserted into a gap between two adjacent first connecting portions 10 conveniently, and the electrical connection between the first connecting portion 10 and the second connecting portion 20 is realized.
In some alternative embodiments, continuing with fig. 4, the present embodiment provides a display panel 200: the other side face L3 of the at least one first connection portion 10 opposite to the first side face L1 is insulated from the other second connection portions 20; the other side face L4 of the at least one second connection portion 20 opposite to the second side face L2 is insulated from the other first connection portions 10.
It can be understood that in the display panel 200 provided in this embodiment, the first connection portion 10 includes a first side face L1 and a side face L3 that are oppositely disposed, the second connection portion 20 includes a second side face L2 and a side face L4 that are oppositely disposed, and as shown in fig. 4, the first side face L1 of the first connection portion 11 is electrically connected to the second side face L2 of the second connection portion 21, in this case, the first connection portion 11 further includes an adjacent second connection portion 22, the first connection portion 11 and the second connection portion 22 need to be insulated, and the second connection portion 21 further includes an adjacent first connection portion 12, the second connection portion 21 and the first connection portion 12 need to be insulated, so as to prevent short circuit between the adjacent connection portions. Fig. 4 only shows that the first connection portion 11 and the second connection portion 22 are arranged at an interval, and the second connection portion 21 and the first connection portion 12 are arranged at an interval, so as to ensure that only one side surface of the first connection portion 10 and the second connection portion 20 are connected, and other side surfaces need to be insulated, thereby avoiding short circuit between adjacent connection portions.
In some alternative embodiments, shown in conjunction with FIG. 8, FIG. 8 is a further cross-sectional view taken along line P-P' of FIG. 3. The display panel 200 provided in this embodiment: the other side L3 of at least one first connection portion 10 opposite to the first side face L1 includes a first insulating layer 40 between it and the adjacent second connection portion 20; and/or, the first insulating layer 40 is also included between the other side L4 face of at least one second connection portion 20 opposite to the second side face L2 and the second connection portion 20 adjacent thereto.
It can be understood that fig. 9 only illustrates that the first side face L1 of the first connection portion 11 and the second side face L2 of the second connection portion 21 are electrically connected by the first conductive paste 30, and since the first connection portion 11 and the second connection portion 21 are already electrically connected, it is necessary to define that the first connection portion 11 and the adjacent another second connection portion 22 are arranged in an insulating manner, and the second connection portion 21 is arranged in an insulating manner with the adjacent another first connection portion 12, so that the display panel 200 provided in this embodiment further includes the first insulating layer 40 by arranging the other side L3 of at least one first connection portion 10 opposite to the first side face L1 and the adjacent second connection portion 20 to include the first insulating layer 40 therebetween; and/or, the first insulating layer 40 is also included between the other side L4 of at least one second connection portion 20 opposite to the second side L2 and the adjacent second connection portion 20, that is, the first insulating layer 40 is provided between the side L3 of the first connection portion 11 and the side L4 of the second connection portion 22, so as to ensure that the first connection portion 11 and the second connection portion 22 are arranged in an insulating manner, and the first insulating layer 40 is provided between the side L4 of the second connection portion 21 and the side L3 of the first connection portion 12, so as to ensure that the second connection portion 21 and the first connection portion 12 are arranged in an insulating manner, so as to ensure that only one side of the first connection portion 10 and the second connection portion 20 is connected, and the other sides need to be insulated, so as to avoid short circuit between the adjacent connection portions.
In some alternative embodiments, continuing with fig. 8, the present embodiment provides a display panel 200: in the direction in which the first connection parts 10 or the second connection parts 20 are arranged, the width of the first conductive paste 30 is smaller than the width of the first connection parts 10 and smaller than the width of the second connection parts 20; and/or the width of the first insulating layer 40 is smaller than the width of the first connection portion 10 and smaller than the width of the second connection portion 20.
It can be understood that: on the one hand, in the display panel 200 provided by this embodiment, in the direction X in which the first connection portions 10 or the second connection portions 20 are arranged, the width of the first conductive paste 30 is smaller than the width of the first connection portions 10 and smaller than the width of the second connection portions 20, so as to reduce the width of the first conductive paste 30, thereby reducing the occupied area of each first conductive paste 30 on the binding region, and thus more first connection portions 10 and second connection portions 20 can be arranged in the limited binding region to satisfy the high resolution of the display panel 200. In another aspect, in the display panel 200 provided in the present embodiment, in the direction X in which the first connection portions 10 or the second connection portions 20 are arranged, the width of the first insulating layer 40 is smaller than the width of the first connection portions 10 and smaller than the width of the second connection portions 20. The width of the first insulating layer 40 is reduced to reduce the occupied area of the binding region by each first insulating layer 40, so that more first connection parts 10 and second connection parts 20 can be disposed in the limited binding region to satisfy the high resolution of the display panel 200. In another aspect, in the display panel 200 provided in this embodiment, in the direction X in which the first connection portions 10 or the second connection portions 20 are arranged, the width of the first conductive paste 30 is smaller than the width of the first connection portions 10 and smaller than the width of the second connection portions 20; and the width of the first insulating layer 40 is smaller than the width of the first connection portion 10 and smaller than the width of the second connection portion 20. Meanwhile, the widths of the first conductive paste 30 and the first insulating layer 40 are reduced, so that the occupied area of the bonding area per first conductive paste 30 and per first insulating layer 40 is reduced, and thus more first connection parts 10 and second connection parts 20 can be arranged in the limited bonding area to meet the high resolution of the display panel 200. However, the present invention does not specifically limit the width of the first conductive adhesive 30 and the first insulating layer 40 in the first direction X, the first conductive adhesive 30 may ensure the electrical connection between the first conductive part 10 and the second conductive part 20, and the first insulating layer 40 may prevent the short circuit between the adjacent connection parts.
The present invention further provides a display device 300 including the display panel 200 according to any of the above embodiments of the present invention. Referring to fig. 9, fig. 9 is a schematic view of a display device provided in the present invention, and the display device 300 includes the display panel 200 according to any of the embodiments of the present invention. The embodiment of fig. 9 only takes a mobile phone as an example to describe the display device 300, and it should be understood that the display device 300 provided in the embodiment of the present invention may be other display devices with a display function, such as a computer, a television, a vehicle-mounted display device, and the present invention is not limited thereto. The display device 300 provided in the embodiment of the present invention has the beneficial effects of the display panel 200 provided in the embodiment of the present invention, and specific reference is specifically made to the detailed description of the display device in the foregoing embodiments, which is not repeated herein.
As can be seen from the above embodiments, the display panel and the display device provided by the present invention at least achieve the following beneficial effects:
the invention provides a display panel and a display device, wherein the display panel comprises an integrated circuit chip, the integrated circuit chip comprises M first connecting parts, and M is more than or equal to 1; the binding end comprises N second connecting parts, and N is more than or equal to 1; the first side surface of the at least one first connecting part and the second side surface of the at least one second connecting part are oppositely arranged and electrically connected with each other; the first side surface and/or the second side surface are/is intersected with the light-emitting surface of the display panel. The side face of the first connecting portion in at least one integrated circuit chip is electrically connected with the side face of the second connecting portion of at least one binding end, so that the binding area of the integrated circuit chip and the binding end is ensured, meanwhile, the planar space of the screen body is saved, and more first connecting portions and second connecting portions can be placed in the limited space of the binding area.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A display panel, comprising:
the integrated circuit chip comprises M first connecting parts positioned on a first substrate, wherein M is more than or equal to 1;
the binding end comprises N second connecting parts, and N is more than or equal to 1; wherein,
the first side surface of at least one first connecting part and the second side surface of at least one second connecting part are oppositely arranged and electrically connected with each other;
the first side surface and/or the second side surface are intersected with the light emitting surface of the display panel.
2. The display panel according to claim 1,
the first side face and the second side face comprise first conductive adhesive therebetween, and the first connecting portion and the second connecting portion are electrically connected through the first conductive adhesive.
3. The display panel according to claim 1,
the M first connecting parts are arranged along a first direction, and the N second connecting parts are also arranged along the first direction;
in the first direction, the width of the first connection part is W1, and the width of the second connection part is W2;
in a direction perpendicular to the surface of the display panel, the height of the first connecting part is H1, and the height of the second connecting part is H2; wherein,
w1 < H1, and/or W2 < H2.
4. The display panel according to claim 3,
the height of the first conductive adhesive between the first side face and the second side face is H3, wherein H3 is smaller than the smaller of H1 and H2.
5. The display panel according to claim 1,
the M first connecting parts are arranged along a first direction, and the N second connecting parts are also arranged along the first direction;
a width of a gap between adjacent first connection portions along the first direction is W11 on a side close to the first substrate, a width of a gap between adjacent first connection portions along the first direction is W12 on a side far from the first substrate, and at least one second connection portion is disposed in the gap between adjacent first connection portions,
W11<W12。
6. the display panel according to claim 5,
the second connection portion disposed in a gap between two adjacent first connection portions has a width W21 at a side close to the first substrate and a width W22 at a side far from the first substrate, wherein,
W21<W22。
7. the display panel according to claim 2,
the other side face of the at least one first connecting part, which is opposite to the first side face, is insulated from the other second connecting parts; and,
the other side face of the at least one second connecting part, which is opposite to the second side face, is insulated from the other first connecting parts.
8. The display panel according to claim 7,
the other side face of the at least one first connecting part, which is opposite to the first side face, and the second connecting part adjacent to the other side face comprise a first insulating layer; and/or the presence of a gas in the gas,
the other side face of the at least one second connecting portion, which is opposite to the second side face, and the second connecting portion adjacent to the other side face also comprise a first insulating layer.
9. The display panel according to claim 8,
in the direction in which the first connection portions or the second connection portions are aligned,
the width of the first conductive adhesive is smaller than that of the first connecting part and smaller than that of the second connecting part; and/or the presence of a gas in the gas,
the width of the first insulating layer is smaller than that of the first connecting portion and smaller than that of the second connecting portion.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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