CN114063224B

CN114063224B - Optical module

Info

Publication number: CN114063224B
Application number: CN202010760272.7A
Authority: CN
Inventors: 杨世海; 陈思涛; 张强; 赵其圣
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2023-04-07
Anticipated expiration: 2040-07-31
Also published as: CN114063224A

Abstract

The application discloses an optical module, including silicon optical chip, light source and first fiber socket. The silicon optical chip comprises a light outlet and a first light inlet. The light source includes a package, a laser chip, a first lens and a second lens. The side of the tube shell is provided with an optical window and a socket. The first fiber optic receptacle is connected to the package through the receptacle. The optical signal which is emitted by the laser chip and does not carry information is coupled by the first lens and then is emitted into the first light inlet through the light window. The light signal which is emitted by the light outlet and does not carry information is emitted into the light source through the light window and is coupled to the first optical fiber socket through the second lens of the light source. In this application, the optical signal that does not carry information that will laser chip transmission penetrates into silicon optical chip's first light inlet through the optical window, also penetrates into the light source through the optical window with the optical signal that carries information that silicon optical chip's light-out mouth transmission to in coupling to first fiber socket through the interior second lens of light source.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The traditional optical module comprises a light source, a silicon optical chip and an optical fiber array, wherein the light source is connected with the silicon optical chip, and the silicon optical chip is connected with the optical fiber array. The light source emits a light signal to the silicon photonics chip. The optical signal is modulated by the silicon optical chip to obtain a modulated optical signal. The modulated optical signal is transmitted to one end of the optical fiber socket through the optical fiber array. And the other end of the optical fiber socket is used for connecting an external optical fiber.

Disclosure of Invention

The application provides an optical module, satisfies high broadband and gas tightness good.

A light module, comprising:

a circuit board, a plurality of first and second circuit boards,

the silicon optical chip is electrically connected with the circuit board and is used for modulating the optical signal which does not carry information to obtain the optical signal which carries information;

the light source corresponds to the silicon optical chip and is used for transmitting an optical signal carrying information;

one end of the first optical fiber socket is connected with the light source, and the other end of the first optical fiber socket is used for being connected with an external optical fiber;

the silicon optical chip comprises a light outlet and a first light inlet;

the light source comprises a tube shell;

the optical fiber laser comprises a tube shell, a first lens and a second lens, wherein a laser chip, the first lens and the second lens are arranged in the tube shell, and two opposite side surfaces are respectively provided with an optical window and a socket, wherein the side surface of the optical window faces to a silicon optical chip;

the laser chip is used for emitting optical signals;

the first lens corresponds to the first light inlet and is positioned between the laser chip and the optical window;

a second lens corresponding to the light outlet;

an optical signal which is emitted by the laser chip and does not carry information is coupled through the first lens and then is emitted into the first light inlet through the optical window;

the optical signal carrying information and transmitted by the light outlet is emitted into the light source through the optical window and is coupled to the first optical fiber socket through the second lens of the light source;

the first fiber optic receptacle is connected to the package through the receptacle.

Has the beneficial effects that; the application provides an optical module, including the circuit board, with the silicon optical chip of circuit board electricity connection, with the light source that the silicon optical chip corresponds and the first fiber socket who is connected with the light source. The light source is used to emit an optical signal that does not carry information. The silicon optical chip is used for modulating the optical signal which does not carry information to obtain the optical signal which carries information. The silicon optical chip comprises a light outlet and a first light inlet. The light source includes a package, a laser chip, a first lens and a second lens. Two opposite side surfaces of the tube shell are respectively provided with an optical window and a socket, wherein the side surface where the optical window is positioned faces the silicon optical chip. The first fiber optic receptacle is connected to the housing by a receptacle. The laser chip is used for emitting optical signals which do not carry information. And the first lens corresponds to the first light inlet and is positioned between the laser chip and the light window. And the second lens corresponds to the light outlet. The optical signal which is emitted by the light source and does not carry information is coupled through the first lens and then is emitted into the first light inlet through the light window, and the optical signal which is emitted by the light outlet and carries information is emitted into the light source through the light window and is coupled to the first optical fiber socket through the second lens of the light source. In this application, arrange laser chip, first lens, second lens in the tube, and two sides of tube are provided with optical window and socket, first fiber socket passes through the socket and connects on the tube, the optical signal that does not carry information with laser chip transmission penetrates into silicon optical chip's first light inlet through the optical window, also penetrate into the light source through the optical window with the optical signal that carries information that silicon optical chip's light-emitting window transmission, and couple to first fiber socket in through the second lens in the light source.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded view of an optical module structure according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of an optical module provided in the present application, except for an upper case and a lower case;

FIG. 6 is a schematic structural diagram illustrating a light source and a first fiber optic receptacle according to an embodiment of the present disclosure;

FIG. 7 is an exploded view of a light source and a first fiber optic receptacle according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a light source with a cover plate removed and a first fiber optic receptacle assembly according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a first cover according to an embodiment of the present disclosure;

fig. 11 is a schematic structural view of a second cover body according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a cover plate according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of a second cover and a cover plate according to an embodiment of the present disclosure;

fig. 14 is a schematic structural view of a combination diagram of a first cover and a cover plate according to an embodiment of the present disclosure;

fig. 15 is a schematic structural diagram of a composition diagram of a first cover and a second cover according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides and the like, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion between optical signals and electrical signals in the technical field of optical fiber communication, and interconversion between optical signals and electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode in the optical module industry, and on the basis of the mainstream connection mode, the definition of the pins on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally connected to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the interconversion between the optical signal and the electrical signal is realized inside the optical module 200, so that the establishment of the information connection between the optical fiber 101 and the optical network terminal 100 is realized; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 has an optical module 200 interface 102, which is used for accessing the optical module 200 and establishing bidirectional electrical signal connection with the optical module 200; the optical network terminal 100 has a network cable 103 interface 104 for accessing the network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, and specifically, the optical network terminal 100 transmits a signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, and the optical network terminal 100 monitors the operation of the optical module 200 as an upper computer of the optical module 200.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal 100 is a host computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common host computer of the optical module 200 also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for being connected with an electric port of the optical module 200 such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module 200 is inserted into an electrical connector inside the cage 106, and an optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electric connector on the circuit board 105 is wrapped in the cage 106, so that the electric connector is arranged inside the cage 106; the optical module 200 is inserted into the cage 106, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by the heat sink 107 on the cage 106.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application. Fig. 4 is an exploded view of an optical module structure according to an embodiment of the present disclosure. Fig. 5 is a schematic structural diagram of an optical module with an upper shell and a lower shell removed according to an embodiment of the present application. As shown in fig. 3 to 5, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a silicon optical chip 400, a light source 500, a first fiber optic receptacle 600, and a second fiber optic receptacle 700. In particular, the method comprises the following steps of,

the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned on two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the lower shell.

The two openings may be two openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access; the optoelectronic devices such as the circuit board 300, the silicon optical chip 400, the light source 500, the first fiber optic receptacle 600 and the second fiber optic receptacle 700 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the silicon optical chip 400, the light source 500, the first optical fiber socket 600, the second optical fiber socket 700 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by the clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a limiting amplification chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a rigid circuit board, and the rigid circuit board can also realize a bearing effect due to relatively hard materials of the rigid circuit board, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device by using the flexible circuit board.

The silicon optical chip 400 is arranged on the circuit board 300 and electrically connected with the circuit board 300, and specifically can be wire bonding connection; the periphery of the silicon optical chip is connected to the circuit board 300 by a plurality of conductive wires, so the silicon optical chip 400 is generally disposed on the surface of the circuit board 300.

Silicon photonics chip 400 includes a modulation driver 401, and modulation driver 401 is disposed external to silicon photonics chip 400. The modulation driver 401 may be disposed on the upper surface or the side surface of the silicon optical chip, the upper surface or the side surface of the silicon optical chip 400 is disposed with a pad electrically connected to the modulation driver 401 by wire bonding, and the modulation driver 401 provides the silicon optical chip 400 with a data signal from an upper computer, where the data signal is a modulation signal.

Silicon photonics chip 400 also includes a modulator disposed within silicon photonics chip 400. The silicon optical chip 400 has a plurality of optical channels optically coupled to the light source 500 on the side surface, multiple paths of light with the same wavelength and without information can be input into the silicon optical chip 400 through the optical channels, the light with the same wavelength and without information is provided for each interference arm of the mach-zehnder modulator, the light emitting power of a single laser chip is limited, and the light of a plurality of laser chips can be superposed to improve the light power of a single wavelength.

The silicon optical chip 400 includes a first light inlet, a second light inlet, and a light outlet. The first light inlet and the light outlet respectively correspond to the light source 500, and the second light inlet is connected to the second fiber optic receptacle 700 through a fiber optic ribbon. The first light inlet receives an optical signal without carrying information from the light source 500, the second light inlet receives an optical signal from the second fiber optic receptacle 700, and the light outlet transmits an optical signal with information to the first fiber optic receptacle 600.

The silicon photonics chip 400 is used to modulate optical signals that do not carry information. Specifically, when the silicon optical chip 400 receives the optical signal without carrying information from the light source 500, the modulation signal is loaded onto the optical signal without carrying information to obtain the optical signal carrying information, and the optical signal carrying information is transmitted to the external optical fiber through the first optical fiber receptacle 600 after being emitted into the first optical fiber receptacle 600 through the light source 500. When the silicon optical chip 400 receives the optical signal from the second optical fiber socket 700, the optical signal is demodulated into an electrical signal, and the electrical signal is transmitted to the upper computer through the gold finger.

And a light source 500 corresponding to the silicon optical chip 400 for emitting an optical signal carrying no information.

Fig. 6 is a schematic structural diagram illustrating a combination diagram of a light source and a first fiber optic receptacle according to an embodiment of the present disclosure. Fig. 7 is an exploded view of a light source and a first fiber optic receptacle according to an embodiment of the present disclosure. Fig. 8 is a schematic structural diagram of a light source and a first fiber optic receptacle assembly with a cover plate removed according to an embodiment of the present disclosure. Fig. 9 is a schematic structural diagram of a circuit board according to an embodiment of the present application. Fig. 10 is a schematic structural diagram of a first cover according to an embodiment of the present application. Fig. 11 is a schematic structural diagram of a second cover according to an embodiment of the present application. Fig. 12 is a schematic structural diagram of a cover plate according to an embodiment of the present application. Fig. 13 is a schematic structural diagram of a second cover and a cover plate according to an embodiment of the present disclosure. Fig. 14 is a schematic structural diagram of a combination diagram of a first cover and a cover plate according to an embodiment of the present disclosure. Fig. 15 is a schematic structural diagram of a combination diagram of a first cover and a second cover provided in an embodiment of the present application. As shown in fig. 6-15, in the present embodiment, light source 500 includes an envelope 501. A laser chip 502, a first lens 503, a second lens 504, a third lens 505, an isolator 506 and a heat sink substrate 507 are arranged in the package 501, wherein the heat sink substrate 507 is arranged at the bottom of the package 501, and the laser chip 502, the first lens 503, the second lens 504, the third lens 505 and the isolator 506 are soaked on the heat sink substrate 507.

The package 501 includes a first cap 5011, a second cap 5012, and a cover 5013, two opposite sides of which are provided with an optical window 50113 and a socket 50124, respectively. In particular, the method comprises the following steps of,

the first cover 5011 includes two attached closing plates. The two coupled obturations plates are a first obturation plate 50111 and a second obturation plate 50112, respectively. The first sealing plate 50111 faces the silicon optical chip 400, and the second sealing plate 50112 serves as the bottom of the package 501, wherein the heat sink substrate 507 is disposed on the second sealing plate 50112. The first closing plate 50111 is provided with an optical window 50113 and also with two grooves 50114.

Optical window 50113, a common material being BK ₇ Glass, crown glass, calcium fluoride, ge, photonic masonry, sapphire, zinc selenide, and the like, for conducting optical signals. The optical signal without information emitted by the light source 500 enters the first light inlet through the optical window 50112. The light signal carrying information emitted from the light outlet is emitted into the light source through the light window.

In order to make package 501 more airtight, optical window 50113 is sealed with package 501 by high frequency sealing or molding process.

The notch 50114 is a notch dug in the first closing plate 50111 near one side of the cover plate. The shape of the groove 50114 is convex.

The second cover 5012 includes three airtight plates connected in sequence. The three successive obturation plates are a third obturation plate 50121, a fourth obturation plate 50122 and a fifth obturation plate 50123, respectively. The third closing plate 50121 and the fifth closing plate 50123 are vertically connected to the fourth closing plate 50122. A socket 50124 is provided in the fourth enclosure 50122. The third closing plate 50121 and the fifth closing plate 50123 are both provided with protrusions 50125. The first closing plate 50111 and the fourth closing plate 50122 are two opposite sides of the package 501, and the two protrusions 50125 correspond to the two grooves 50114, respectively.

As shown in FIG. 15, the two projections 50125 of the second cover 5012 are secured within the two slots 50114 of the first cover 5011, respectively, such that the first cover 5011 and the second cover 5012 enclose a uncovered cavity. The length of the second closing plate 50112 of the first cover 5011 is greater than the length of the third closing plate 50121 and the fifth closing plate 50123 of the second cover 5012 so that the first cover 5011 and the second cover 5012 form a capless cavity with a socket 50124. The first closing plate 50111 of the first cover 5011 and the fourth closing plate 50122 of the second cover 5012 serve as two opposite sides of the capless cavity, and the third closing plate 50121 and the fifth closing plate 50123 of the second cover 5012 serve as the other two opposite sides of the capless cavity. The two opposite sides of the package 501 are provided with an optical window 50113 and a socket 50124, respectively, meaning that the optical window 50113 is provided on the first closing plate and the socket 50124 is provided on the fourth closing plate 50122.

The cover plate 5013, together with the first cover and the second cover, forms a sealed cavity. The cover plate 5013 covers the uncovered cavity. The cover 5013 encloses a cavity with a slot 50124 with the uncovered cavity.

The inner wall of the cover plate 5013 is provided with second protrusions 50131. The second protrusion 50131 is the same shape as the cover plate 5013. The second protrusion 50131 has length and width dimensions that are the same as those of the second cover 5012 such that the cover 5013 encloses a cavity with the first and

second covers

5011 and 5012.

The laser chip 502, the first lens 503, the second lens 504, the isolator 505 and the third lens 506 are arranged in the sealed cavity, so that water vapor is prevented from entering the tube shell 501, and the damage of the water vapor to all devices in the tube shell 501 is reduced.

In order to make package 501 thermally conductive, the material of package 501 is some metal with good thermal conductivity.

First fiber optic receptacle 600 is connected to package 501 by way of a socket 50124. The first fiber receptacle 600 and the package 501 form a sealed chamber. In order to enclose the package 5013 and the first fiber optic receptacle 600 in a sealed chamber, the first cap 5011, the second cap 5012, and the cover 5013 are all connected by welding.

The laser chip 502 is used for emitting optical signals which do not carry information. Specifically, the laser chip 502 is provided with an electrical connector 5021. The electrical connector 5021 extends into the package 501 through an opening in the package 501 and is connected to the circuit board 300 for transmitting the bias current provided by the circuit board 300 to the laser chip 502. The laser chip 502 emits an optical signal that does not carry information under the action of the bias current. Wherein, the optical signal without carrying information is an optical signal with relatively stable power.

The first lens 503, corresponding to the first light inlet, is located between the laser chip 502 and the optical window 50113, and is configured to couple the optical signal to the first light inlet of the silicon optical chip 400. Specifically, the first lens 503 is a coupling lens. The optical signal without information emitted from the laser chip 502 is coupled by the first lens 503 and then enters the first light inlet of the silicon optical chip 400 through the optical window 50113.

The second lens 504, corresponding to the light outlet, is located between the optical window 50113 and the first fiber optic receptacle 600, and is used for coupling the optical signal carrying information transmitted from the light outlet to the first fiber optic receptacle 600. Specifically, the second lens 504 is a coupling lens. The optical signal carrying information emitted from the light outlet of the silicon optical chip 400 enters the light source through the optical window 50113 and is coupled to the first optical fiber receptacle 600 through the second lens 504 of the light source 500.

And a third lens 505, located between the optical window 50113 and the second lens 504, for collimating the modulated optical signal. Specifically, an optical signal carrying information emitted from the light exit of the silicon optical chip 400 enters the third lens 505 through the optical window 50113, and the modulated optical signal is collimated by the third lens 505.

And an isolator 506 between the second lens 504 and the third lens 505. The collimated optical signal enters the isolator 506, passes through the isolator 506, and enters the second lens 504. Isolator 506 prevents the collimated optical signal from returning along the original path, reducing optical signal turbulence.

The heat sink substrate 507 is provided with a laser chip 502, a first lens 503, a second lens 504, a third lens 505 and an isolator 506, so that an optical signal which does not carry information and is emitted by the laser chip 502 can be incident on the silicon optical chip 400 through the first lens 503, or an optical signal which carries information and is emitted by the silicon optical chip 400 can be incident on the first fiber optic receptacle 600 through the third lens 505, the isolator 506 and the second lens 504.

The application provides an optical module, including the circuit board, with the silicon optical chip of circuit board electricity connection, with the light source that the silicon optical chip corresponds and the first fiber socket who is connected with the light source. The light source is used to emit an optical signal that does not carry information. The silicon optical chip is used for modulating the optical signal which does not carry information to obtain the optical signal which carries information. The silicon optical chip comprises a light outlet and a first light inlet. The light source includes a package, a laser chip, a first lens and a second lens. Two opposite side surfaces of the tube shell are respectively provided with an optical window and a socket, wherein the side surface where the optical window is positioned faces the silicon optical chip. The first fiber optic receptacle is connected to the housing by a receptacle. The laser chip is used for emitting optical signals. And the first lens corresponds to the first light inlet and is positioned between the laser chip and the optical window. And the second lens corresponds to the light outlet. The optical signal which is emitted by the light source and does not carry information is coupled through the first lens and then is emitted into the first light inlet through the light window, and the optical signal which is emitted by the light outlet and carries information is emitted into the light source through the light window and is coupled to the first optical fiber socket through the second lens of the light source. In this application, arrange laser chip, first lens, in the second lens arranges the tube in, and two sides of tube are provided with optical window and socket, first fiber socket passes through the socket and connects on the tube, the optical signal that does not carry information with the laser chip transmission penetrates into silicon optical chip's the first light inlet through the optical window, also penetrate into the light source through the optical window with the optical signal that carries information of silicon optical chip's light-emitting window transmission in, and couple to first fiber socket through the second lens in the light source.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board is provided with a plurality of circuit boards,

the light source corresponds to the silicon optical chip and is used for emitting an optical signal which does not carry information;

the silicon optical chip comprises a light outlet and a first light inlet;

the light source comprises a tube shell;

the laser chip, the first lens and the second lens are arranged in the tube shell, and two opposite side surfaces are respectively provided with an optical window and a socket, wherein the optical window is positioned on the side surface of the tube shell facing the silicon optical chip;

the laser chip is used for transmitting the optical signal;

the second lens corresponds to the light outlet;

the optical signal carrying information and transmitted by the light outlet is emitted into the light source through the light window and is coupled to the first optical fiber socket through the second lens of the light source;

the first fiber optic receptacle is connected to the housing through the receptacle.

2. The optical module of claim 1, wherein the tube housing comprises a first cover, a second cover, and a cover plate;

the first cover body comprises two connected airtight plates and is provided with the optical window;

the second cover body comprises three airtight plates which are sequentially connected and is provided with the inserting opening;

the cover plate, the first cover body and the second cover body enclose a cavity with a socket.

3. The light module of claim 1, further comprising an electrical connection assembly;

the electric connection piece extends into the tube shell through the opening on the tube shell, and is connected with the circuit board and used for transmitting the bias current provided by the circuit board to the laser chip.

4. The optical module of claim 1, wherein the optical window and the tube shell are encapsulated by a high frequency fusion sealing or a compression molding process.

5. The optical module of claim 1, wherein a third lens is further disposed within the tube housing;

the third lens is located between the optical window and the second lens and used for collimating the modulated optical signal.

6. The optical module of claim 5, wherein an isolator is further disposed within the tube housing;

the isolator is located between the second lens and the third lens.

7. The optical module of claim 6, wherein a heat sink substrate is disposed within the tube shell;

the heat sink substrate is provided with the laser chip, the first lens, the second lens, the isolator and the third lens, so that an optical signal which is emitted by the laser chip and does not carry information is emitted into the silicon optical chip through the first lens, or an optical signal which is emitted by the silicon optical chip and carries information is emitted into the first optical fiber socket through the third lens, the isolator and the second lens.

8. The optical module of claim 2, wherein the material of the package is metal.

9. The light module of claim 1, further comprising a modulation driver;

the modulation driver is arranged outside the silicon optical chip and used for providing modulation signals for the silicon optical chip.