CN114059134A - 高密度多排框架电镀装置 - Google Patents
高密度多排框架电镀装置 Download PDFInfo
- Publication number
- CN114059134A CN114059134A CN202111345196.4A CN202111345196A CN114059134A CN 114059134 A CN114059134 A CN 114059134A CN 202111345196 A CN202111345196 A CN 202111345196A CN 114059134 A CN114059134 A CN 114059134A
- Authority
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- Prior art keywords
- electroplating
- assembly
- water
- conveying assembly
- plate
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- 238000009713 electroplating Methods 0.000 title claims abstract description 92
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 91
- 238000007747 plating Methods 0.000 claims abstract description 47
- 239000007921 spray Substances 0.000 claims abstract description 7
- 230000001360 synchronised effect Effects 0.000 claims description 21
- 239000002390 adhesive tape Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 13
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 32
- 239000007788 liquid Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111345196.4A CN114059134A (zh) | 2021-11-15 | 2021-11-15 | 高密度多排框架电镀装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111345196.4A CN114059134A (zh) | 2021-11-15 | 2021-11-15 | 高密度多排框架电镀装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114059134A true CN114059134A (zh) | 2022-02-18 |
Family
ID=80271885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111345196.4A Pending CN114059134A (zh) | 2021-11-15 | 2021-11-15 | 高密度多排框架电镀装置 |
Country Status (1)
Country | Link |
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CN (1) | CN114059134A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114703533A (zh) * | 2022-04-06 | 2022-07-05 | 天津市津荣天晟金属表面处理有限公司 | 微型断路器动触头局部镀厚银生产线 |
CN115573019A (zh) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | 一种引线框架电镀柜 |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH663038A5 (en) * | 1985-07-29 | 1987-11-13 | Vanguard S A | Cell for selective electrolytic deposition |
JPH0273658A (ja) * | 1988-09-08 | 1990-03-13 | Fuji Plant Kogyo Kk | リードフレームへの連続式部分メッキ方法および装置 |
CH684339A5 (fr) * | 1991-03-21 | 1994-08-31 | Electroplating Eng Eesa | Cellule électrolytique pour plaquer sélectivement des motifs choisis sur une bande métallique se déplaçant en continu. |
CN1137810A (zh) * | 1993-11-04 | 1996-12-11 | 桑泰克特贸易公司 | 电镀设备 |
JPH11100691A (ja) * | 1997-09-26 | 1999-04-13 | Dainippon Printing Co Ltd | リードフレームの部分めっき装置および部分めっき方法 |
KR20030021514A (ko) * | 2001-09-06 | 2003-03-15 | 삼성테크윈 주식회사 | 리드프레임 도금장치 |
JP2006152349A (ja) * | 2004-11-26 | 2006-06-15 | Shinko Electric Ind Co Ltd | 部分めっき装置 |
US20060283713A1 (en) * | 2005-05-24 | 2006-12-21 | Shinko Electric Industries Co., Ltd. | Selective plating apparatus and selective plating method |
CN201212064Y (zh) * | 2008-06-26 | 2009-03-25 | 铜陵丰山三佳微电子有限公司 | 用于引线框架的卷式电镀装置 |
KR20100020205A (ko) * | 2008-08-12 | 2010-02-22 | (주) 세기정밀 | 리드프레임 양면 은도금장치 |
CN102191521A (zh) * | 2011-05-24 | 2011-09-21 | 厦门永红科技有限公司 | 引线框架的电镀装置 |
CN103469289A (zh) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | 集成电路引线框架片式电镀夹具 |
CN207435567U (zh) * | 2017-10-25 | 2018-06-01 | 天津创锦真空涂装制品有限公司 | 一种具有连续供料机构的电镀面超薄金属防凸固化设备 |
CN109972181A (zh) * | 2019-04-17 | 2019-07-05 | 天水华洋电子科技股份有限公司 | 一种高密度引线框架压板电镀模具 |
CN110484961A (zh) * | 2019-08-30 | 2019-11-22 | 苏州铭电机械科技有限公司 | 一种fpc电镀*** |
CN212636758U (zh) * | 2020-05-18 | 2021-03-02 | 绍兴上虞伟欣包装制品有限公司 | 一种纸板用涂胶机构 |
CN213203261U (zh) * | 2020-09-10 | 2021-05-14 | 惠州瑞祥金属表面处理有限公司 | 一种高度可调节的电镀设备 |
CN216891281U (zh) * | 2021-11-15 | 2022-07-05 | 东莞奥美特科技有限公司 | 高密度多排框架电镀装置 |
-
2021
- 2021-11-15 CN CN202111345196.4A patent/CN114059134A/zh active Pending
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH663038A5 (en) * | 1985-07-29 | 1987-11-13 | Vanguard S A | Cell for selective electrolytic deposition |
JPH0273658A (ja) * | 1988-09-08 | 1990-03-13 | Fuji Plant Kogyo Kk | リードフレームへの連続式部分メッキ方法および装置 |
CH684339A5 (fr) * | 1991-03-21 | 1994-08-31 | Electroplating Eng Eesa | Cellule électrolytique pour plaquer sélectivement des motifs choisis sur une bande métallique se déplaçant en continu. |
CN1137810A (zh) * | 1993-11-04 | 1996-12-11 | 桑泰克特贸易公司 | 电镀设备 |
US5705043A (en) * | 1993-11-04 | 1998-01-06 | Suntec Trading Ag | Electroplating apparatus |
JPH11100691A (ja) * | 1997-09-26 | 1999-04-13 | Dainippon Printing Co Ltd | リードフレームの部分めっき装置および部分めっき方法 |
KR20030021514A (ko) * | 2001-09-06 | 2003-03-15 | 삼성테크윈 주식회사 | 리드프레임 도금장치 |
JP2006152349A (ja) * | 2004-11-26 | 2006-06-15 | Shinko Electric Ind Co Ltd | 部分めっき装置 |
US20060283713A1 (en) * | 2005-05-24 | 2006-12-21 | Shinko Electric Industries Co., Ltd. | Selective plating apparatus and selective plating method |
CN201212064Y (zh) * | 2008-06-26 | 2009-03-25 | 铜陵丰山三佳微电子有限公司 | 用于引线框架的卷式电镀装置 |
KR20100020205A (ko) * | 2008-08-12 | 2010-02-22 | (주) 세기정밀 | 리드프레임 양면 은도금장치 |
CN102191521A (zh) * | 2011-05-24 | 2011-09-21 | 厦门永红科技有限公司 | 引线框架的电镀装置 |
CN103469289A (zh) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | 集成电路引线框架片式电镀夹具 |
CN207435567U (zh) * | 2017-10-25 | 2018-06-01 | 天津创锦真空涂装制品有限公司 | 一种具有连续供料机构的电镀面超薄金属防凸固化设备 |
CN109972181A (zh) * | 2019-04-17 | 2019-07-05 | 天水华洋电子科技股份有限公司 | 一种高密度引线框架压板电镀模具 |
CN110484961A (zh) * | 2019-08-30 | 2019-11-22 | 苏州铭电机械科技有限公司 | 一种fpc电镀*** |
CN212636758U (zh) * | 2020-05-18 | 2021-03-02 | 绍兴上虞伟欣包装制品有限公司 | 一种纸板用涂胶机构 |
CN213203261U (zh) * | 2020-09-10 | 2021-05-14 | 惠州瑞祥金属表面处理有限公司 | 一种高度可调节的电镀设备 |
CN216891281U (zh) * | 2021-11-15 | 2022-07-05 | 东莞奥美特科技有限公司 | 高密度多排框架电镀装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114703533A (zh) * | 2022-04-06 | 2022-07-05 | 天津市津荣天晟金属表面处理有限公司 | 微型断路器动触头局部镀厚银生产线 |
CN114703533B (zh) * | 2022-04-06 | 2023-08-29 | 天津市津荣天晟金属表面处理有限公司 | 微型断路器动触头局部镀厚银生产线 |
CN115573019A (zh) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | 一种引线框架电镀柜 |
CN115573019B (zh) * | 2022-12-09 | 2023-02-17 | 宁波德洲精密电子有限公司 | 一种引线框架电镀柜 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Su Jian Inventor after: Li Hongji Inventor before: Su Jian Inventor before: Du Yingju Inventor before: Deng Liang |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230328 Address after: 361000 South side of Lianfa Brick Factory, Group 5, Lilin Village, Guankou Town, Jimei District, Xiamen City, Fujian Province Applicant after: Xiamen Xinyi Changda Industry and Trade Co.,Ltd. Address before: 523000 building a, Ogilvy smart Industrial Park, 2 shaping Road, keyuancheng Information Industrial Park, Tangxia Town, Dongguan City, Guangdong Province Applicant before: Dongguan Omeite Technology Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20231225 Address after: 523000 building a, Ogilvy smart Industrial Park, 2 shaping Road, keyuancheng Information Industrial Park, Tangxia Town, Dongguan City, Guangdong Province Applicant after: Dongguan Omeite Technology Co.,Ltd. Address before: 361000 South side of Lianfa Brick Factory, Group 5, Lilin Village, Guankou Town, Jimei District, Xiamen City, Fujian Province Applicant before: Xiamen Xinyi Changda Industry and Trade Co.,Ltd. |