CN114054330A - Piezoelectric micromechanical ultrasonic transducer packaging structure - Google Patents
Piezoelectric micromechanical ultrasonic transducer packaging structure Download PDFInfo
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- CN114054330A CN114054330A CN202111356553.7A CN202111356553A CN114054330A CN 114054330 A CN114054330 A CN 114054330A CN 202111356553 A CN202111356553 A CN 202111356553A CN 114054330 A CN114054330 A CN 114054330A
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- 238000004806 packaging method and process Methods 0.000 title abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000000994 depressogenic effect Effects 0.000 claims description 21
- 239000010409 thin film Substances 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a piezoelectric micro-mechanical ultrasonic transducer packaging structure which comprises a substrate and a PMUT chip. The substrate is provided with a sunken area in a concave mode, the sunken area comprises a first sunken area and a second sunken area which are distributed in a step mode in the thickness direction of the substrate, and a first through hole penetrating through the substrate in the thickness direction of the substrate is formed in the middle of the sunken area. The PMUT chip is disposed in the recess region, the PMUT chip includes a circuit board and a body structure formed on a surface of the circuit board, the circuit board is located in the first recess region, and the body structure is located in the second recess region. The piezoelectric micromechanical ultrasonic transducer packaging structure is simple in structure and is in tight fit with a PMUT (piezoelectric micromechanical ultrasonic transducer) integrally, so that the PMUT has good sound wave absorption and diffusion performance.
Description
Technical Field
The invention relates to the technical field of micro-nano manufacturing, in particular to a piezoelectric micro-mechanical ultrasonic transducer packaging structure.
Background
With the development of scientific technologies such as electronic computers, modern information, traffic, remote sensing, machine intelligence and the like, the demand of ultrasonic sensors is increasing day by day, the application field of the ultrasonic sensors is permeated into each department of national economy and daily cultural life of people, and the ultrasonic sensors are particularly applied to various civil electronic devices, so that the ultrasonic sensors bring convenience for the masses.
The invention patent with publication number CN213579454U discloses a high-performance sensor protection device, in which a shell is taken down from a base when in use, the shell and the base are connected with a clamping hook through a clamping block, a sensor is placed in the shell and fixed through springs at two sides, and the sensor is tightly attached to an air vent of the shell through the base springs. The patent application with the publication number of CN112327282A discloses an ultrasonic radar shell with an anti-interference function, wherein the upper shell is of a horn mouth structure, the lower shell is of an inverted horn mouth structure, an inner shell is arranged in the lower shell, a sleeving hole is formed in the bottom of the inner shell, and an ultrasonic radar is installed in the sleeving hole. The invention patent application with publication number CN111822316A discloses an encapsulation structure of an ultrasonic flight sensor and a distance measurement electronic device, wherein an ultrasonic transducer is encapsulated in a cavity defined by a first substrate, a side plate and a second substrate, and an application specific integrated circuit chip is encapsulated on the outer surface of the second substrate, which is far away from the cavity.
The piezoelectric micro-mechanical ultrasonic transducer has the advantages of small volume, low power consumption and the like, and the application fields comprise intelligent furniture, intelligent robots and the like. The performance of piezoelectric micromachined ultrasonic transducers is susceptible to structural and environmental influences. The conventional packaging method for the sensor has relatively high requirements on mechanical properties such as rigidity of the transducer, for example, the packaging structure of the invention patent with publication number CN213579454U and the invention patent application with publication number CN 112327282A. The sensor is sealed by some materials, and the outer layer of the protective material can influence the collection and emission of sound waves; under the condition of fully considering the protection of the transducer, the integral structure is easy to be complicated, and the positioning is not good enough; the package portion, which is protected from external impact, is prone to shaking and position deviation, and the base portion reflects sound to affect signal extraction.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a piezoelectric micromechanical ultrasonic transducer packaging structure which is simple in structure and is in tight fit with a PMUT (piezoelectric micromechanical ultrasonic transducer) integrally, so that the PMUT has better sound wave absorption and diffusion properties.
To achieve the above object, an embodiment of the present invention provides a piezoelectric micromachined ultrasonic transducer package structure, which includes a substrate and a PMUT chip.
The substrate is provided with a sunken area in a concave mode, the sunken area comprises a first sunken area and a second sunken area which are distributed in a step mode in the thickness direction of the substrate, and a first through hole penetrating through the substrate in the thickness direction of the substrate is formed in the middle of the sunken area.
The PMUT chip is disposed in the recess region, the PMUT chip includes a circuit board and a body structure formed on a surface of the circuit board, the circuit board is located in the first recess region, and the body structure is located in the second recess region.
In one or more embodiments of the present invention, the substrate surface is recessed inward to form the first recessed area, a bottom portion of the first recessed area is recessed to form the second recessed area, the bottom of the second recessed area is provided with the first through hole, and a cross-sectional area of the first recessed area is larger than a cross-sectional area of the second recessed area.
In one or more embodiments of the present invention, a depth of the second recessed region is greater than or equal to a height of a body structure of the PMUT chip.
In one or more embodiments of the present invention, one end of the first through hole close to the second recessed area is coated with a thin film layer for dust prevention.
In one or more embodiments of the present invention, the first through hole is configured in a trumpet-shaped structure, and a radial sectional area thereof is gradually increased in a direction away from the second recessed area, so that sound is diffused and collected.
In one or more embodiments of the present invention, a side surface of the first through-hole is configured in a curved surface structure, and radians of the side surface in the axial direction of the first through-hole are distributed in an exponential function.
In one or more embodiments of the present invention, the substrate surface is formed with a chamfer at an edge of the first recess region.
In one or more embodiments of the present invention, a plurality of positioning holes are formed on the circuit board, and a plurality of threaded holes are formed at the bottom of the first recessed area, and the threaded holes are disposed corresponding to the positioning holes.
In one or more embodiments of the present invention, a third recessed area, which is connected to the first recessed area, is recessed on the edge of the first recessed area on the surface of the substrate, so as to facilitate the placement, fixation, or removal of the circuit board.
In one or more embodiments of the present invention, the body structure of the PMUT chip includes a supporting layer, an insulating layer, a lower electrode, a piezoelectric layer, and an upper electrode, which are sequentially distributed along a direction away from the circuit board, where the supporting layer is configured as a ring structure, two sides of the supporting layer are respectively connected to the circuit board and the insulating layer, a second through hole is formed in the circuit board at a position corresponding to the body structure, and the second through hole and the ring-shaped supporting layer are coaxially disposed.
In one or more embodiments of the present invention, a diameter of the second through hole is equal to or greater than a minimum inner diameter of the annular support layer.
In one or more embodiments of the present invention, the material of the insulating layer includes silicon dioxide, which improves the signal-to-noise ratio of the PMUT chip by its own structure.
In one or more embodiments of the invention, the wiring board contains components such as amplifiers, filters, and the like.
Compared with the prior art, the piezoelectric micromechanical ultrasonic transducer packaging structure provided by the embodiment of the invention adopts an embedded packaging structure, has an anti-collision effect, enables the substrate to be tightly matched with the PMUT chip, and has a stable integral structure and a small structural size.
According to the piezoelectric micro-mechanical ultrasonic transducer packaging structure, the substrate comprises at least two-stage depressed areas, so that a PMUT chip can be quickly and accurately positioned; the circuit board and the depressed area are provided with corresponding positioning holes (threaded holes), so that the circuit board can be conveniently mounted and dismounted; the edge part of the depressed area is provided with a chamfer, so that the circuit board is convenient to position and mount; the edge part of the depressed area is provided with a third depressed area, so that the circuit board can be conveniently detached; the supporting layer of the PMUT chip is designed in an annular structure, and the circuit board is provided with corresponding second through holes, so that the reflection of sound waves can be reduced; the whole structure is stable and reasonable.
According to the piezoelectric micromechanical ultrasonic transducer packaging structure, the first through hole is partially constructed into a horn-shaped structure, the side surface of the first through hole is of a curved surface structure, sound waves are easy to collect and emit, the influence of the environment on a sensor is reduced, and the signal-to-noise ratio is improved.
Drawings
Fig. 1 is a three-dimensional cross-sectional view of a piezoelectric micromachined ultrasonic transducer package structure of an embodiment of the present invention;
fig. 2 is a top view of a piezoelectric micromachined ultrasonic transducer package structure according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a piezoelectric micromachined ultrasonic transducer package structure according to an embodiment of the present invention;
FIG. 4 is a side profile view of a PMUT chip in a piezoelectric micromachined ultrasonic transducer package according to an embodiment of the present invention;
fig. 5 is a three-dimensional cross-sectional view of a PMUT chip in a piezoelectric micromachined ultrasonic transducer package structure in accordance with an embodiment of the present invention;
fig. 6 and 7 are schematic structural diagrams of a piezoelectric micromachined ultrasonic transducer package structure according to another embodiment of the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in fig. 1 to 3, an embodiment of the invention provides a piezoelectric micromachined ultrasonic transducer package structure, which includes a substrate 10 and a PMUT chip 20. The PMUT chip 20 is embedded in the substrate 10, and the PMUT chip 20 includes a circuit board 21 and a body structure 22 formed on the circuit board 21.
The substrate 10 may be configured in a square or circular shape, but is not limited to these two shapes. One side surface of the substrate 10 is inwardly recessed to form a first recess region 11. The shape of the first recessed area 11 is adapted to the shape of the circuit board 21 of the PMUT chip 20, and may be a circular or square structure. The bottom of the first recessed area 11 is formed with a plurality of threaded holes 111, and the threaded holes 111 are used for fixing the circuit board 21 of the PMUT chip 20.
The surface of the substrate 10 is formed with a chamfer 14 at the edge of the first recess 11. The provision of the chamfer 14 facilitates the location and placement of the circuit board 21. The surface of the substrate 10 is concavely provided with a third depressed area 15 communicated with the first depressed area 11 at the edge of the first depressed area 11, and the circuit board 21 is convenient to place, fix or take out due to the arrangement of the third depressed area 15.
The bottom of the first recessed region 11 is recessed toward the other side of the substrate 10 to form a second recessed region 12. The shape of the second recessed region 12 is adapted to the shape of the body structure 22 of the PMUT chip 20, and the depth thereof is not less than the height of the body structure 22 of the PMUT chip 20. In one embodiment, the second recessed area 12 may also be circular or square in shape. The second depressed area 12 is located right in the middle of the first depressed area 11, and the cross-sectional area of the second depressed area 12 is smaller than that of the first depressed area 11. The circuit board 21 of the PMUT chip 20 is disposed in the first recess 11, and the body structure 22 of the PMUT chip 20 is disposed in the second recess 12.
The bottom of the second recessed area 12 is opened with a first through hole 13 penetrating the substrate 10 along the thickness direction of the substrate 10. One end of the first through hole 13 close to the second recessed area 12 is coated with a thin film layer for dust prevention. The first through hole 13 is configured in a horn-like structure, and the radial sectional area of the first through hole 13 gradually increases in a direction away from the second recessed area 12. The first through-holes 13 of the horn-like structure facilitate the diffusion and collection of sound. The side surface of the first through hole 13 is configured in a curved surface structure, and the radian of the side surface of the first through hole 13 in the axial direction of the first through hole 13 is distributed in an exponential function.
As shown in fig. 4 to 5, the body structure 22 of the PMUT chip 20 includes a support layer 221, an insulating layer 222, a lower electrode 223, a piezoelectric layer 224, and an upper electrode 225, which are sequentially distributed along a direction away from the wiring board 21. The support layer 221 is configured in a ring structure, and both sides thereof are connected to the wiring board 21 and the insulating layer 222, respectively. The material of the insulating layer 222 comprises silicon dioxide, which can improve the signal-to-noise ratio of the PMUT chip 20 by its own structure. Upper and lower electrodes are disposed on both sides of the piezoelectric layer 224. The circuit board 21 is provided with a plurality of positioning holes, and the positioning holes are arranged corresponding to the threaded holes in the first recessed area 11. The circuit board 21 is provided with a second through hole 211 corresponding to the body structure 22, and the second through hole 211 is coaxial with the annular support layer 221 and has a diameter larger than or equal to the minimum diameter of the annular support layer 221. This design may reduce secondary reflections of sound. The wiring board 21 contains components such as amplifiers, filters, and the like.
During packaging, the third recessed area 15, the chamfer 14 and the threaded hole 111 are used, the circuit board 21 of the PMUT chip 20 is aligned to the first recessed area 11 by using an operation tool, and the PMUT chip 20 is positioned and fixed by using a positioning column or sealant. After the mounting is completed, the body structure 22 of the PMUT chip 20 is accommodated in the second recessed area 12; the first recessed region 11 houses a wiring board 21 of the PMUT chip 20.
In one embodiment, the substrate 10 may also be assembled in two parts, including an upper substrate a on which the first and second recessed regions 11 and 12 are formed and a lower substrate B on which the first through hole 13 is formed. During assembly, the upper substrate a and the lower substrate B clamp the circuit board 21, and respectively realize positioning and sound wave transmission and reception of the PMUT chip 20, as shown in fig. 6 and 7.
Compared with the prior art, the piezoelectric micromechanical ultrasonic transducer packaging structure provided by the embodiment of the invention adopts an embedded packaging structure, has an anti-collision effect, enables the substrate to be tightly matched with the PMUT chip, and has a stable integral structure and a small structural size.
According to the piezoelectric micro-mechanical ultrasonic transducer packaging structure, the substrate comprises at least two-stage depressed areas, so that a PMUT chip can be quickly and accurately positioned; the circuit board and the depressed area are provided with corresponding positioning holes (threaded holes), so that the circuit board can be conveniently mounted and dismounted; the edge part of the depressed area is provided with a chamfer, so that the circuit board is convenient to position and mount; the edge part of the depressed area is provided with a third depressed area, so that the circuit board can be conveniently detached; a space is reserved on the back, and the reflection of sound waves is reduced; the whole structure is stable and reasonable.
According to the piezoelectric micromechanical ultrasonic transducer packaging structure, the first through hole is partially constructed into a horn-shaped structure, the side surface of the first through hole is of a curved surface structure, sound waves are easy to collect and emit, the influence of the environment on a sensor is reduced, and the signal-to-noise ratio is improved.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. A piezoelectric micromachined ultrasonic transducer package, comprising:
the substrate is concavely provided with a sunken area, the sunken area comprises a first sunken area and a second sunken area which are distributed in a step shape in the thickness direction of the substrate, and the middle part of the sunken area is provided with a first through hole which penetrates through the substrate in the thickness direction of the substrate;
the PMUT chip is configured in the depressed area, the PMUT chip comprises a circuit board and a body structure formed on the surface of the circuit board, the circuit board is positioned in the first depressed area, and the body structure is positioned in the second depressed area.
2. The piezoelectric micromachined ultrasonic transducer package structure of claim 1, wherein the substrate surface is recessed inward to form the first recessed region, a bottom portion of the first recessed region is recessed to form the second recessed region, the bottom portion of the second recessed region is formed with the first through hole, and a cross-sectional area of the first recessed region is larger than a cross-sectional area of the second recessed region.
3. The piezoelectric micromachined ultrasonic transducer package of claim 2, wherein the depth of the second recessed region is greater than or equal to the height of the body structure of the PMUT chip.
4. The piezoelectric micromachined ultrasonic transducer package of claim 2, wherein an end of the first via proximate the second recessed region is coated with a thin film layer.
5. The piezoelectric micromachined ultrasonic transducer package of claim 2, wherein the first via is configured as a horn-like structure having a radial cross-sectional area that gradually increases away from the second recessed region.
6. The piezoelectric micromachined ultrasonic transducer package structure of claim 5, wherein a side surface of the first via is configured as a curved surface structure, and an arc degree of the side surface in an axial direction of the first via is exponentially distributed.
7. The piezoelectric micromachined ultrasonic transducer package of claim 2, wherein the substrate surface is formed with a chamfer at an edge of the first recessed area.
8. The package structure of claim 2, wherein the circuit board has a plurality of positioning holes, and the bottom of the first recessed area has a plurality of threaded holes corresponding to the positioning holes.
9. The piezoelectric micromachined ultrasonic transducer package structure of claim 2, wherein the substrate surface is recessed with a third recessed region at an edge of the first recessed region, the third recessed region being in communication with the first recessed region.
10. The package structure of claim 1, wherein the body structure of the PMUT chip comprises a supporting layer, an insulating layer, a lower electrode, a piezoelectric layer, and an upper electrode sequentially distributed along a direction away from the circuit board, the supporting layer is configured as a ring structure, two sides of the supporting layer are respectively connected to the circuit board and the insulating layer, a second through hole is formed through the circuit board at a position corresponding to the body structure, and the second through hole is coaxially disposed with the ring-shaped supporting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111356553.7A CN114054330B (en) | 2021-11-16 | 2021-11-16 | Piezoelectric micromechanical ultrasonic transducer packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111356553.7A CN114054330B (en) | 2021-11-16 | 2021-11-16 | Piezoelectric micromechanical ultrasonic transducer packaging structure |
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| Publication Number | Publication Date |
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| CN114054330A true CN114054330A (en) | 2022-02-18 |
| CN114054330B CN114054330B (en) | 2022-09-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130169110A1 (en) * | 2011-12-28 | 2013-07-04 | Samsung Electronics Co., Ltd. | Ultrasonic transducer structure, ultrasonic transducer, and method of manufacturing ultrasonic transducer |
| CN104720848A (en) * | 2013-12-20 | 2015-06-24 | 三星麦迪森株式会社 | Ultrasonic diagnostic apparatus and manufacturing method thereof |
| CN106477512A (en) * | 2016-11-23 | 2017-03-08 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and its method for packing |
| CN210668332U (en) * | 2019-09-27 | 2020-06-02 | 苏州敏芯微电子技术股份有限公司 | Circuit board, packaging structure and electronic equipment |
| CN111344248A (en) * | 2017-11-14 | 2020-06-26 | 美商楼氏电子有限公司 | Sensor package with ingress protection |
-
2021
- 2021-11-16 CN CN202111356553.7A patent/CN114054330B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130169110A1 (en) * | 2011-12-28 | 2013-07-04 | Samsung Electronics Co., Ltd. | Ultrasonic transducer structure, ultrasonic transducer, and method of manufacturing ultrasonic transducer |
| CN104720848A (en) * | 2013-12-20 | 2015-06-24 | 三星麦迪森株式会社 | Ultrasonic diagnostic apparatus and manufacturing method thereof |
| CN106477512A (en) * | 2016-11-23 | 2017-03-08 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and its method for packing |
| CN111344248A (en) * | 2017-11-14 | 2020-06-26 | 美商楼氏电子有限公司 | Sensor package with ingress protection |
| CN210668332U (en) * | 2019-09-27 | 2020-06-02 | 苏州敏芯微电子技术股份有限公司 | Circuit board, packaging structure and electronic equipment |
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| CN114054330B (en) | 2022-09-16 |
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