CN114050112A - Method and system for mounting optical device in BOX (BOX) package - Google Patents
Method and system for mounting optical device in BOX (BOX) package Download PDFInfo
- Publication number
- CN114050112A CN114050112A CN202111386744.8A CN202111386744A CN114050112A CN 114050112 A CN114050112 A CN 114050112A CN 202111386744 A CN202111386744 A CN 202111386744A CN 114050112 A CN114050112 A CN 114050112A
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- Prior art keywords
- optical device
- tool
- mounting
- film
- box
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- 230000003287 optical effect Effects 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 14
- 230000008878 coupling Effects 0.000 claims abstract description 12
- 238000010168 coupling process Methods 0.000 claims abstract description 12
- 238000005859 coupling reaction Methods 0.000 claims abstract description 12
- 238000003848 UV Light-Curing Methods 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
The invention relates to a method and a system for mounting an optical device in a BOX (BOX) package, wherein the method comprises the following steps: preparing a tool adapted to the size of the optical device; adhering the optical device to the tool using a DAF UV film; arranging UV glue on the optical device; coupling and aligning the optical device and a mounting plane by using the tool, and then mounting to ensure that the optical device is adhered to the mounting plane; the DAF UV film is irradiated with UV light until the DAF UV film is detached from the optics and tool, respectively. In the process, the characteristic of viscosity change of the UV film before and after UV lamp irradiation is utilized, and the optical device is pasted by means of a tool, so that the pasting is finished, the interference of mechanical clamping stress can be optimized, the pasting BLT height of the pasted device is optimized, the multichannel coupling yield is optimized, and the process can be synchronously finished with the UV glue curing process.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a method and a system for mounting an optical device in a BOX (BOX).
Background
With the increase of the speed of the optical module, the multichannel process optical device is more and more applied in the BOX package, the structure is more and more complex, more dispensing mounting processes and steps need to be applied to the manufacturing flow of the whole optical device, and the manufacturing flow is long. In the current process, the optical device is mainly clamped by a mechanical arm to carry out coupling dispensing, and UV curing is carried out after coupling. As shown in fig. 1, the current process includes the steps of: step 1, clamping an optical device by a manipulator, and arranging UV glue on the optical device. And 2, adjusting the position of the optical device by the manipulator to couple and align the optical device and the surface mounting plane, and then clamping the optical device by the manipulator to gradually approach the surface mounting plane until the optical device and the surface mounting plane are mutually attached. And 3, loosening the optical device by the mechanical arm and returning to the original position. The process steps are relatively simple and efficient, however, in some cases, the micro-robot is difficult to clamp and maintain clamping reliability due to the limitation that the optical assembly is too small in size. In addition, the way of clamping the optical device by the manipulator also has the interference of clamping stress, so that the height of the mounted blt (bond Line thickness) is poor, and the coupling yield of the multi-channel optical device is reduced.
Disclosure of Invention
The invention aims to provide a method and a system for mounting an optical device in a BOX (BOX), which are particularly suitable for the condition of irregular size of an optical component.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a method of tiling an optical device in a BOX package, comprising the steps of:
preparing a tool adapted to the size of the optical device;
adhering the optical device to the tool using a DAF UV film;
arranging UV glue on the optical device;
coupling and aligning the optical device and a mounting plane by using the tool, then mounting, and bonding the optical device on the mounting plane by using UV glue;
the DAF UV film is irradiated with UV light until the DAF UV film is detached from the optics and tool, respectively.
On the other hand, the embodiment of the invention also provides a mounting system of an optical device in a BOX package, which comprises the optical device, a mounting plane, UV glue, a tool, a DAF UV film and a UV curing lamp, wherein the tool has a size matched with that of the optical device, the DAF UV film is used for mounting the optical device on the tool, and the UV curing lamp is used for irradiating the DAF UV film after the tool couples and aligns the optical device with the mounting plane and mounts the optical device, so that the DAF UV film is separated from the optical device and the tool respectively.
Preferably, the tool is of a T-shaped structure. The instrument adopts T type structure, and horizontal portion in the T type structure is used for pasting with optical device, and vertical portion can be used for accepting external application of force to realize optical device and subsides dress plane coupling counterpoint and subside dress, so simple structure, and convenient to use.
Preferably, the size of the plane for attaching the optical device is equal to the size of the optical device. The size of the tool is equal to that of the optical device, so that the optical device and the mounting plane can be coupled, aligned and mounted more conveniently.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the characteristic of viscosity change of the UV film before and after UV lamp irradiation is utilized, and the optical device is mounted by means of a tool, so that the mounting is finished, the interference of mechanical clamping stress can be optimized, the mounting BLT height of the mounted device is optimized, the coupling yield of multiple channels is optimized, and the mounting and UV glue curing process can be synchronously finished. The size of the tool is smaller than that of a traditional manipulator, so the invention is particularly suitable for the condition that the size of the optical device is small.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a flow chart of a conventional optical device mounting process in a BOX package.
Fig. 2 is a flow chart of a mounting process of the optical device in the BOX package according to the present invention.
Fig. 3a, fig. 3b, and fig. 3c are state change diagrams corresponding to different steps in the die attach process according to the present invention.
The labels in the figure are: 10-a tool; 20-DAF UV film; 30-an optical device; 40-UV glue; 50-mounting plane.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2 and fig. 3a, fig. 3b, and fig. 3c, the method for mounting an optical device in a BOX package according to the present embodiment includes the steps of:
s1, preparing the tool 10 to fit the size of the optical device 30. It should be noted that the tool 10 herein is not a conventional manipulator, but a tool 10 with a smaller size than the manipulator, and the solution of the present invention is to solve the problem of being unable to be operated by the manipulator.
As shown in fig. 3a, the tool 10 preferably has a T-shaped configuration. The tool 10 is of a T-shaped structure, a transverse portion of the T-shaped structure is used for being adhered to the optical device 30, and a longitudinal portion of the T-shaped structure can be used for receiving external force application, so that the optical device 30 and the adhering plane 50 are coupled, aligned and adhered, and the structure is simple and convenient to use.
In addition, the size of the plane where the tool 10 is used to attach the optical device 30 is preferably equal to or slightly smaller than the size of the optical device 30, which may be more beneficial to realize the coupling alignment and attachment of the optical device 30 and the attachment plane 50.
S2, the optical device 30 is stuck on the tool 10 using a DAF UV (Die Attach Film) Film, as shown in fig. 3 a.
The DAF UV film 20 is a semiconductor chip packaging material, and has tackiness in a normal state, and the tackiness disappears after being irradiated with UV light. In this step, the optical device 30 is attached to the tool 10 by using the normal adhesiveness of the DAF UV film 20.
S3, arranging UV glue 40 on said optical device 30, as shown in fig. 3 a. The step may be performed before step S2 or after step S2.
S4, coupling and aligning the optical device 30 and the mounting plane 50 by using the tool 10, and then mounting, so that the optical device 30 is adhered to the mounting plane 50, as shown in fig. 3b, and the optical device 30 is tightly adhered to the mounting plane 50 by UV glue.
In this step, the optical device 30 moves with the movement of the tool 10 after being attached to the tool 10. Therefore, an external force is applied to the tool 10 to adjust the position of the tool 10, so that the position of the optical flag device is adjusted along with the tool 10, and after the mounting plane 50 is coupled and aligned, the optical device 30 is driven to approach the mounting plane 50 until the optical device 30 is attached to the mounting plane 50 and firmly adhered.
S5, the DAF UV film 20 is irradiated with a UV curing lamp until the DAF UV film 20 is detached from the optical device 30 and the tool 10, respectively.
After the DAF UV film 20 is irradiated by the UV curing lamp, the DAF UV film 20 gradually loses adhesiveness and is then detached from the optical device 30 and the tool 10, at which time the entire mounting process is completed. As shown in fig. 3c, the dashed arrows in the figure indicate the light emitted by the UV curing lamp.
From the technical point of view, the scheme of the invention is slightly complex; structurally, a DAF UV film and a UV curing lamp are additionally used, but the manipulator is replaced by the tool, the mounting task which cannot be implemented by the manipulator can be completed, and the optical device and the tool are in a pasting mode instead of a clamping mode, so that the interference of mechanical clamping stress can be eliminated, the poor mounting BLT height of the surface mounted device is optimized, and the coupling yield of multiple channels is optimized. In addition, after the optical device is pasted with the mounting plane, the optical device has a UV curing procedure, so the step S5 can be completed synchronously with the UV glue curing procedure, and the process is substantially simple and has high efficiency.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (5)
1. A method for mounting an optical device in a BOX (BOX) package is characterized by comprising the following steps:
preparing a tool adapted to the size of the optical device;
adhering the optical device to the tool using a DAF UV film;
arranging UV glue on the optical device;
coupling and aligning the optical device and a mounting plane by using the tool, then mounting, and bonding the optical device on the mounting plane by using UV glue;
the DAF UV film is irradiated with UV light until the DAF UV film is detached from the optics and tool, respectively.
2. A method of mounting an optical device in a BOX package as recited in claim 1, wherein said tool is a T-shaped structure.
3. A surface mounting system of an optical device in a BOX (BOX) package comprises the optical device, a mounting plane and UV glue, and is characterized by further comprising a tool, a DAF UV film and a UV curing lamp, wherein the size of the tool is matched with that of the optical device, the DAF UV film is used for adhering the optical device on the tool, and the UV curing lamp is used for irradiating the DAF UV film after the tool couples and aligns the optical device with the mounting plane, so that the DAF UV film is separated from the optical device and the tool respectively.
4. A system of patches of optical devices in a BOX package as recited in claim 3, wherein said tool is a T-shaped structure.
5. A system of mounting an optical device in a BOX package as recited in claim 4, wherein said tool is adapted to apply a plane of equal size to said optical device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386744.8A CN114050112A (en) | 2021-11-22 | 2021-11-22 | Method and system for mounting optical device in BOX (BOX) package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386744.8A CN114050112A (en) | 2021-11-22 | 2021-11-22 | Method and system for mounting optical device in BOX (BOX) package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114050112A true CN114050112A (en) | 2022-02-15 |
Family
ID=80210226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111386744.8A Pending CN114050112A (en) | 2021-11-22 | 2021-11-22 | Method and system for mounting optical device in BOX (BOX) package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114050112A (en) |
-
2021
- 2021-11-22 CN CN202111386744.8A patent/CN114050112A/en active Pending
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