CN114040631B

CN114040631B - Heat dissipation device and electronic equipment

Info

Publication number: CN114040631B
Application number: CN202010707315.5A
Authority: CN
Inventors: 张晨晨; 易青; 崔福利; 靳林芳; 付国超
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2023-04-11
Anticipated expiration: 2040-07-21
Also published as: CN114040631A

Abstract

The present application relates to the field of heat dissipation technologies for electronic devices, and in particular, to a heat dissipation apparatus and an electronic device. The electronic device includes: the heat dissipation device comprises a shell, a heat dissipation device and a heat source device, wherein the heat dissipation device and the heat source device are arranged in the shell, and at least one surface of the heat source device is in contact with the heat dissipation device; the heat dissipation device comprises an electronic device and a heat dissipation structure connected with the electronic device, the heat dissipation structure comprises a carbon material layer and a protective layer, the outer surface of the electronic device is attached to the carbon material layer, and the protective layer is arranged on one side, deviating from the electronic device, of the carbon material layer. This application can improve electronic equipment's radiating effect, reduces the phenomenon of local high temperature, avoids equipment, connects insecure scheduling problem.

Description

Heat dissipation device and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies for electronic devices, and in particular, to a heat dissipation apparatus and an electronic device.

Background

Various electronic devices or heating devices can be arranged in the electronic equipment, some electronic devices can generate heat or generate heat in work, the heat needs to be led out, and the electronic devices are cooled so as to ensure the normal work of the electronic devices.

With the development of circuit integration and chip packaging technologies, more and more high power consumption devices are integrated together, so that the product size is smaller and smaller, which leads to heat concentration and the heat generating devices cannot dissipate heat quickly. When the heating device can not quickly dissipate heat, the heat can be transferred to the surrounding devices and even the skin of a human body in various complex heat transfer modes, so that other devices and the human body are damaged. Therefore, heat dissipation performance is an important parameter affecting overall performance of electronic equipment, and how to effectively discharge heat in a narrow space to prevent malfunction of an electronic device or damage to the device is an important issue for research in the related art. In addition, the emphasis on heat dissipation of the heat generating device also raises the problem that the heat quantity in the peripheral portion of the device or the equipment rises, and a large quantity of heat can be felt locally or externally to the peripheral device.

Therefore, a large amount of soaking heat conductive materials are popular to solve the heat dissipation problem of electronic equipment, but existing soaking heat conductive materials often introduce various problems such as assembly, unreliable connection, poor appearance or influence on device performance, and the like, and still need to be improved.

Disclosure of Invention

An object of the present application is to provide a heat dissipation device and an electronic apparatus, which can improve the heat dissipation effect of the electronic apparatus, and alleviate or solve at least one of the above mentioned problems to some extent.

According to a first aspect of the present application, there is provided an electronic device comprising:

the heat dissipation device comprises a shell, a heat dissipation device and a heat source device, wherein the heat dissipation device and the heat source device are arranged in the shell, and at least one surface of the heat source device is in contact with the heat dissipation device;

the heat dissipation device comprises an electronic device and a heat dissipation structure connected with the electronic device, the heat dissipation structure comprises a carbon material layer and a protective layer, the outer surface of the electronic device is attached to the carbon material layer, and the protective layer is arranged on one side, deviating from the electronic device, of the carbon material layer.

The electronic equipment is provided with a heat dissipation device and a heat source device, wherein the heat dissipation device comprises an electronic device and a heat dissipation structure arranged on the outer side of the electronic device, and the heat dissipation structure can be used for dissipating heat of the heat source device, can also be used for dissipating heat of the electronic device, and can also be used for dissipating heat of the electronic device and the heat source device. Specifically, the heat dissipation structure can avoid heat from concentrating on a certain surface of the electronic device through the arrangement of the carbon material layer, not only can the heat transferred to the electronic device by the heat source device be uniformly dissipated to the periphery, but also the heat inside the electronic device can be uniformly turned on, the normal work of the electronic device, the heat source device and other devices can be ensured, and the phenomenon of overhigh isothermal degree of the shell can be avoided. And the protective layer is arranged on one side of the carbon material layer, which is far away from the electronic device, so that the protective layer can be used for contacting with a heat source device, the carbon material layer can be effectively protected, the carbon material layer is prevented from being punctured or damaged, and the problem of installation reliability of the electronic device is not influenced while heat dissipation is solved.

Optionally, the electronic device may be a battery, the heat dissipation device may be in a heat wrapping form inside the battery, and multiple heat materials may be added between the package film and the outer protective film of the battery, for example, the heat dissipation device may be a heat dissipation material, a heat storage material, a heat insulation material, or the like, especially, a heat dissipation material such as a carbon material may be added, the heat dissipation material may cover a single surface, two surfaces, three surfaces, four surfaces, five surfaces, six surfaces, or the like of the battery, and may be cut in different forms according to the shape of the battery.

Alternatively, the carbon material layer may be replaced with a heat storage material, a heat insulating material, or the like.

In one possible implementation, the carbon material layer comprises a first surface and a side surface, the first surface is a surface close to one side of the heat source device, and the side surface extends along at least part of the edge of the first surface in a direction away from the first surface in an angle manner so as to conduct heat of the first surface to the side surface;

the first surface and the side face are attached to at least part of the outer surface of the electronic device.

Optionally, the side surface may include a first side surface and a second side surface, and the first side surface and the second side surface may be oppositely disposed. Further, the side may further include a third side, and the third side may be located between the first side and the second side.

Optionally, the side surface extends away from the first surface along at least a portion of the edge of the first surface at an angle, may extend away from the first surface at an angle greater than 0 ° and less than 180 °, may further extend away from the first surface at an angle greater than 0 ° and less than or equal to 90 °, and may for example extend away from the first surface at an angle of 90 °. The at least partial edge may be the entire edge of the first surface, or may be a partial edge of the first surface, for example, two side edges of the first surface or three side edges of the first surface.

Like this, this carbon element material layer can avoid the heat to concentrate on the first surface through the setting of first surface and side, with heat conduction to side, even messenger's heat scatters, helps promoting electronic equipment's radiating effect.

In one possible implementation, the carbon material layer further includes a second surface, the second surface is opposite to the first surface, and the side surface is located between the first surface and the second surface, so as to conduct heat of the first surface to the side surface and the second surface; (ii) a

The first surface, the second surface and the side face are arranged on at least part of the outer surface of the electronic device in a fit mode.

Like this, this carbon element material layer can avoid the heat to concentrate on the first surface through the setting of first surface, second surface and side, with heat conduction to side and second surface, and even messenger's heat scatters, helps promoting electronic equipment's radiating effect.

In one possible implementation, the material of the carbon material layer includes, but is not limited to, one or more of graphite, graphene, carbon nanotubes, or carbon fibers.

In one possible embodiment, the thermal conductivity of the carbon material layer is not less than 100W/mK, further may be 100W/mK-1600W/mK, further may be 100W/mK-1200W/mK, further may be 150W/mK-1000W/mK, or the like.

In one possible implementation, the thickness of the carbon material layer is 0.01mm to 0.1mm, and further may be 0.01mm to 0.05mm.

Further, when the carbon material layer is replaced with a heat storage material, a heat insulating material, or the like, the thickness of the heat storage material or the heat insulating material may be 0.01mm to 1mm.

The carbon material layer with the heat conductivity coefficient or the thickness is beneficial to improving the heat dissipation rate and bringing heat from a hot area to a cold area more quickly, and is beneficial to reducing the cost and lightening the weight on the basis of ensuring the heat dissipation performance.

In one possible implementation manner, the number of the carbon material layers is one or more;

when the number of the carbon material layers is multiple, the carbon material layers are bonded by using a bonding substance, and the thickness of the bonding substance is 0.005mm-0.03mm, and further can be 0.01mm-0.03mm.

In a possible implementation manner, a first bonding layer is arranged between the outer surface of the electronic device and the carbon material layer, and the first bonding layer is a grid glue layer.

Like this, when realizing the soaking, derive the heat high efficiency, can also eliminate the carbon element material and paste the bubble problem that produces easily at the electron device surface, through the setting that the net was glued, help eliminating the bubble, improve the bonding effect, promote the connection reliability.

In one possible implementation, the thickness of the first adhesive layer is 0.01mm to 0.03mm.

In a possible implementation manner, the protective layer is a conductive layer, a second adhesive layer is arranged between the conductive layer and the carbon material layer, and the second adhesive layer is an insulating adhesive layer.

The insulating glue is arranged between the conducting layer and the carbon material layer, so that the short circuit influence caused by the conduction of the conducting layer and the carbon material layer can be prevented, and the safety and the reliability are realized; and when the carbon material layer is soaked, the conducting layer is arranged on the outer side of the carbon material layer, so that the effects of electric conduction, heat conduction, protection, electromagnetic shielding and the like are realized.

In one possible implementation, the thickness of the second adhesive layer is 0.01mm to 0.03mm;

and/or the thickness of the conducting layer is 0.01-0.03mm.

In a possible implementation manner, the heat dissipation structure includes a first bonding layer, a carbon material layer, a second bonding layer and a protective layer, which are sequentially stacked, wherein the first bonding layer is a grid glue layer, the second bonding layer is an insulating glue layer, and the protective layer is a conductive layer; the first adhesive layer is used for being adhered to the outer surface of the electronic device.

In a possible implementation manner, the heat dissipation structure includes a first adhesive layer, a conductive cloth layer, a second adhesive layer, a carbon material layer, and a protective layer, which are sequentially stacked, where the first adhesive layer is used for adhering to an outer surface of the electronic device.

In one possible implementation, the protective layer is a label layer, and the label layer includes a high molecular polymer film.

The label layer is arranged on the outer side of the carbon material layer, so that the carbon material layer can be effectively protected, the carbon material layer is prevented from being punctured or damaged, and the problem of installation reliability of electronic devices such as batteries is not influenced while heat dissipation is solved.

In a possible implementation manner, a third adhesive layer is arranged between the label layer and the carbon material layer, and the total thickness of the label layer and the third adhesive layer is 0.01-0.1mm, and further can be 0.01-0.05 mm.

In one possible implementation, the electronic device includes a battery.

In one possible implementation, the heat source device includes a circuit board.

According to a second aspect of the present application, there is provided a heat dissipating device comprising:

electronic device and the heat radiation structure who is connected with electronic device, heat radiation structure includes carbon element material layer and protective layer, electronic device's surface laminating has the carbon element material layer, the protective layer sets up and deviates from at the carbon element material layer one side of electronic device.

In one possible implementation, the electronic device includes a battery, a chip, a circuit module, a board module, a resistor, or a capacitor.

As set forth in the foregoing first aspect with respect to the electronic device, the heat dissipation apparatus is based on the same inventive concept as the foregoing electronic device, and therefore has at least all the features and advantages as described in the foregoing electronic device, and can achieve the effect of improving heat dissipation of the electronic device, and will not be described in detail herein.

According to a third aspect of the present application, there is provided a heat dissipating device comprising: a battery and a heat dissipation structure connected with the battery;

the heat dissipation structure comprises a carbon material layer and a protective layer and is used for dissipating heat of a heat source device and/or a battery;

the carbon material layer at least comprises a first surface and a side surface, the first surface is a surface close to one side of the heat source device, and the side surface extends along at least part of the edge of the first surface in a direction which is angled and far away from the first surface;

the first surface with the side laminating set up in at least partial surface of battery, the protective layer sets up at the carbon material layer deviates from one side of battery.

It should be noted that, regarding the specific structure, type, packaging form, thickness of the carbon material layer, and the type, thickness, etc. of the protective layer or the adhesive layer, etc., in the heat dissipation device, reference may be made to the description of the electronic device of the first aspect, which at least has all the features and advantages of the electronic device of the first aspect, and no further description is provided herein.

The technical scheme provided by the application can achieve the following beneficial effects:

the application discloses electronic equipment, including setting up in the inside heat source device and the heat abstractor of casing, heat abstractor wherein, through the setting on carbon element material layer, can avoid the heat to concentrate on certain surface of electron device, not only can the even scattering of heat that the electron device was given to by the heat source device around, can all turn on the inside heat of electron device simultaneously, guarantee the normal work of devices such as electron device, heat source device, still can avoid the too high phenomenon of casing isothermal degree. And the protective layer is arranged on one side of the carbon material layer, which is far away from the electronic device, so that the carbon material layer can be effectively protected, the carbon material layer is prevented from being punctured or damaged, and the problem of installation reliability of the electronic device is not influenced while heat dissipation is solved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a battery position structure in an electronic device in the prior art;

FIG. 2 is a schematic diagram of an electronic device according to the prior art;

FIG. 3 is a schematic diagram of another prior art electronic device;

fig. 4 (a) is a schematic diagram of a battery structure in an electronic device in the prior art;

fig. 4 (b) is a schematic perspective view of a battery in an electronic device in the prior art;

FIG. 5 (a) is a schematic diagram of a battery structure in another electronic device in the prior art;

fig. 5 (b) is a schematic perspective view of a battery in another electronic device in the prior art;

FIG. 6 is a diagram illustrating a battery structure of another electronic device in the prior art;

FIG. 7 is a schematic view of a heat sink provided in an exemplary embodiment of the present application;

FIG. 8 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of an electronic device according to another exemplary embodiment of the present application;

FIG. 10 is a schematic structural view of a carbon material layer provided in accordance with an exemplary first embodiment of the present disclosure;

FIG. 11 is a schematic illustration of the cladding process of the carbon material layer of FIG. 10;

FIG. 12 is a schematic structural view of a carbon material layer provided in accordance with an exemplary second embodiment of the present application;

FIG. 13 is a schematic illustration of the cladding process for the carbon material layer of FIG. 12;

FIG. 14 is a schematic structural view of a carbon material layer provided in accordance with an exemplary third embodiment of the present application;

FIG. 15 is a schematic illustration of the cladding process of the carbon material layer of FIG. 14;

FIG. 16 is a schematic illustration of a layered structure of a carbon material layer and a protective layer according to an exemplary embodiment of the present disclosure;

FIG. 17 is a schematic view of a heat sink according to another exemplary embodiment of the present application;

FIG. 18 is a schematic view of a heat sink provided in accordance with another exemplary embodiment of the present application;

FIG. 19 is a schematic view of a first adhesive layer configuration provided in accordance with an exemplary embodiment of the present application;

fig. 20 is a schematic view of a protrusion structure in the first adhesive layer according to an exemplary embodiment of the present disclosure.

Wherein the reference numerals are as follows:

1-a shell;

2-a display screen;

3-Printed Circuit Board (PCB);

4-electronic components/shields;

5-a battery; 51-a winding core; 52-packaging film; 53-a label layer; 54-flexible printed circuit board (FPC); 55-a battery protection plate; 56-sharp corner; 57-graphite layer; 58-insulating gummed paper; 59-graphite conductive cloth;

6-a heat dissipation structure;

61-a layer of carbon material; 601-a first surface; 602-a first side; 603-a second side; 604-a third side; 605-a second surface;

62-a protective layer;

63-a conductive layer;

64 a conductive cloth layer;

65-a first adhesive layer; 651-projection;

66-a second adhesive layer;

7-an electronic device; 701-sticking to the surface.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

In order to better understand the technical solution of the present application, the following detailed description is made with reference to the accompanying drawings. It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Unless defined or indicated otherwise, technical and scientific terms used herein have the same meaning as is familiar to those skilled in the art.

As a background art, as circuit integration and chip packaging technologies develop, more and more high power devices are integrated, so that the product size is smaller, which leads to heat concentration, and the heat generating device cannot dissipate heat quickly, which leads to local temperature increase and fails to meet the requirement, so that the heat dissipation problem needs to be solved. Taking a battery as an example, the heat dissipation problem of a heat generating/receiving device in an existing electronic apparatus will be described in detail, and it should be understood that other related or similar electronic devices requiring heat dissipation also have the same or similar problems.

Batteries are an indispensable component in electronic devices and can provide energy support for the devices. However, the shape of the battery is often medium, as shown in fig. 1, in the electronic device, due to the barrier of the battery, the heat of the heat generating device in the device cannot be rapidly dispersed to the periphery of the device, and the heat is concentrated on a single surface of the battery 5 (e.g., the upper surface of the battery 5 in fig. 1). This is detrimental to the heat dissipation of the entire device, resulting in a local temperature rise of the device.

Specifically, as shown in fig. 2 or fig. 3, the electronic device may include a housing 1, a battery 5, an electronic component/shield 4, a Printed Circuit Board (PCB) 3, and a Display device 2 such as an organic light-Emitting Diode (OLED) Display, a Liquid Crystal Display (LCD) and the like. The position of the battery 5, PCB3, etc. in the electronic device relative to the screen or housing 1 may take a variety of forms. For example, as shown in fig. 2, in the electronic device, a display screen 2, a PCB3, a battery 5 and a housing 1 may be disposed from top to bottom, both upper and lower surfaces of the PCB3 may be integrated with electronic components/shields 4, during operation, the PCB3 (a heat generating device or a heat source device) provided with the electronic components/shields 4 may generate a certain amount of heat or generate heat, and the heat needs to be conducted out in time, and since the lower surface of the heat generating device is tightly attached to the upper surface of the battery 5, the heat may be concentrated on the upper surface of the battery 5, resulting in a local high temperature. That is to say, when the heating device concentrates on one side (for example, the upper side) of the battery, due to the obstruction of the battery 5, the heat can not be rapidly transmitted to the periphery of the battery and the lower side (the other side ends except the upper side) of the battery, so the heat of the heating device can be rapidly transmitted to the direction that the other side is not obstructed by the battery 5, which can lead to the temperature of the screen of the electronic device, namely the display screen 2 (or the shell 1), to be higher, which is not favorable for the user experience, and even scald accidents can occur. Similarly, as shown in fig. 3, in the electronic device, a display screen 2, a battery 5, a PCB3 and a housing 1 may be disposed from top to bottom, both upper and lower surfaces of the PCB3 may be integrated with electronic components/shields 4, during the operation, the PCB3 (heat generating device) disposed with the electronic components/shields 4 may generate a certain amount of heat or generate heat, and the heat needs to be led out in time, and since the upper surface of the heat generating device is tightly attached to the lower surface of the battery, the heat may be concentrated on the lower surface of the battery 5, resulting in a local high temperature. That is, when the heat generating device is concentrated on one side (the lower side) of the battery 5, the heat cannot be rapidly transferred to the periphery and the upper side (the other side ends except the lower side) of the battery due to the obstruction of the battery 5, and thus the heat of the heat generating device is rapidly transferred to the direction where the other side is not obstructed by the battery 5, which may cause the temperature of the electronic device housing 1 (or the display screen 2) to be higher, which is not favorable for the user experience, and even may cause a scald accident.

As shown in fig. 4 (a) and 4 (b), the conventional battery structure may include a winding core 51, a battery protection plate 55, a Flexible Printed Circuit (FPC) 54, an encapsulation film 52 such as an aluminum plastic film, and a label layer 53, and sharp corners 56 may be formed around the battery. In order to alleviate the problem of battery heat dissipation, based on the function of soaking heat conduction, the mode of wrapping graphite on the outermost layer of battery is mostly selected in the prior art to solve the problem of heat concentration. Specifically, as shown in fig. 5 (a) and 5 (b), the battery includes a winding core 51, a battery protection plate 55, an FPC 54, an encapsulation film 52 such as an aluminum plastic film, a label layer 53, and a graphite layer 57, wherein the encapsulation film 52, the label layer 53, and the graphite layer 57 are sequentially disposed on the outer side of the winding core 51, that is, the graphite layer 57 is disposed on the outermost side. The scheme mainly has the following defects: the graphite outer layer protective film is thin and attached to the outermost surface of the battery, so that graphite is easy to puncture, the graphite layer is easy to leak, and the problem of short circuit of an external device is caused. In addition, outer plastic-aluminum membrane or label layer can have four closed angle 56 positions of paper when present this kind of laminate polymer battery packs, and label paper has redundantly, and this will lead to the graphite layer to paste insecurely, and the equipment sticks up easily, has graphite layer 57 layering simultaneously, falls whitewashed scheduling problem.

In addition, as shown in fig. 6, a conventional lithium battery with graphite conductive cloth added thereto includes a winding core 51 (electric core), a flexible circuit board 54, an insulating adhesive tape 58, graphite conductive cloth 59, and an electromagnetic shielding film, which adds an electromagnetic shielding function. Wrapping the insulating gummed paper 58 on the outer surface of the winding core 51; this electrically conductive cloth 59 parcel of graphite is at the surface of insulating adhesive tape 58, and electrically conductive cloth 59 of graphite is including graphite layer and fibrous layer, and this graphite layer parcel is at the surface of insulating adhesive tape, and this fibrous layer parcel is at the surface of graphite layer, and this kind of structure can evenly distribute away the heat in the battery use to the heat that produces in the battery use through electrically conductive cloth 59 of graphite, prevents that the battery is overheated. However, this solution also has similar problems as described above, and wrapping the graphite conductive cloth 59 around the outer ring of the battery, because the conductive cloth is a flexible fabric, there is a problem that the conductive cloth is not firmly adhered to the outer shell, which easily causes the battery to move in the device shell, and easily causes the battery safety risk. In addition, generally, the battery two-dimensional code needs to be marked outside the battery, and due to the characteristics of the conductive cloth, the problem that the two-dimensional code is difficult to print and identify is caused when the two-dimensional code is printed on the graphite conductive cloth. And the graphite conductive cloth can cause the problem of increasing the thickness of the battery, the thickness of the whole machine is increased, and the defect is obvious under the condition of compact equipment space.

As can be seen from the above description, the heat dissipation structure of the conventional battery has more or less problems and needs to be improved. In view of this, the technical solution of the embodiment of the present application provides a heat dissipation apparatus and an electronic device including the heat dissipation apparatus, so as to rapidly dissipate heat of an electronic device to the periphery, and not affect the problem of printing a two-dimensional code of a battery, and not affect the problem of reliability of battery installation, and can improve firm reliability of connection, and protect a graphite layer from being damaged.

In an embodiment, the heat dissipation device and the electronic device including the heat dissipation device of the present application are further described in detail by way of the specific embodiments with reference to the accompanying drawings. It should be noted that the same reference numerals in the embodiments of the present application denote the same component parts or the same components, and for the same components in the embodiments of the present application, the reference numerals may be given to only one of the components or the components in the drawings, and it should be understood that the reference numerals are also applicable to other similar components or the components.

To facilitate understanding of the heat dissipation device provided in the embodiments of the present application, an application scenario of the heat dissipation device is first described below, and the heat dissipation device may be applied to an electronic device. By way of example, electronic devices may include, but are not limited to, cell phones, tablet computers, laptop computers, in-vehicle computers, display screen devices (e.g., televisions), wearable devices such as wearable watches, smart bracelets, smart glasses, head mounted displays, and the like, as well as Augmented Reality (AR) devices, virtual Reality (VR) devices, personal Digital Assistants (PDAs), smart home products, and the like. In addition, the electronic device of the present application is not limited to the above-described device, but may include a newly developed electronic device. The embodiment of the present application is not particularly limited to the specific form of the electronic device.

By way of example and not limitation, in the embodiments of the present application, the electronic device may be a smart wearable electronic device, for example, a smart wearable watch.

For convenience of description, the embodiment of the application specifically explains the electronic device by taking the intelligent wearable watch as the electronic device as an example. However, those skilled in the art will understand that the principles of the present application may be implemented in any suitably arranged electronic device, i.e., the electronic device is not limited to a smart wearable watch. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

Specifically, referring to fig. 7 to 9, in some embodiments, the present application provides an electronic device, which includes a housing 1, a display screen 2, and a heat dissipation device, where the housing 1 and the display screen 2 may be fixedly connected, and the housing 1 and the display screen 2 may form a closed space to accommodate the heat dissipation device and other devices. The heat dissipation device comprises an electronic device and a heat dissipation structure connected with the electronic device, and the heat dissipation structure can be used for dissipating heat of the electronic device and/or a heat source device so as to lead out heat of the electronic device in time or dissipate heat around, avoid local high temperature and ensure normal work of the electronic device or peripheral parts.

Specifically, as shown in fig. 7 to 9, the heat dissipation device includes an electronic device and a heat dissipation structure connected to the electronic device, the heat dissipation structure includes a carbon material layer 61 and a protective layer 62, the carbon material layer 61 is attached to an outer surface of the electronic device, and the protective layer 62 is disposed on a side of the carbon material layer 61 away from the electronic device. The specific structure of the heat sink will be described in detail below with reference to fig. 10 to 20, and will not be described in detail here.

For example, as shown in fig. 7, the electronic device may be a battery, and the heat dissipation device includes a battery and a heat dissipation structure connected to the battery. Specifically, the battery comprises a winding core 51 and an encapsulation film 52 wrapped outside the winding core, the heat dissipation structure comprises a carbon material layer 61 and a protective layer 62, the carbon material layer 61 is attached to the outer surface of the encapsulation film 52, the protective layer 62 is arranged on one side, deviating from the encapsulation film 52, of the carbon material layer 61, and the protective layer 62 can be used for being in contact with a heat source device.

In the battery, the packaging film 52 includes, but is not limited to, an aluminum plastic film, and may be other packaging materials that can be applied to a pouch battery, which is not limited in this application. In addition, the battery can also comprise components such as a battery protection board and an FPC, the battery protection board and the FPC can be arranged at one side end of the battery, the battery protection board can be an integrated circuit board capable of playing a protection role, electric energy in the winding core is transmitted to the outside through the flexible FPC, and the specific arrangement of the components such as the battery protection board and the FPC is not limited in the embodiment of the application.

In the heat dissipation structure of the battery, the protective layer 62 includes, but is not limited to, a label layer. That is, the protection layer 62 may be a label Film such as a Polyimide Film (PI Film) commonly used in batteries, and related performance information of various batteries may be identified on the label layer, or a two-dimensional code may be sprayed on the label layer. In addition, in other embodiments, the protection layer 62 may also be other layered structures capable of protecting the battery or the carbon material layer, such as various polymer material layers, conductive layers, etc.

Therefore, compared with the conventional graphite layer or graphite conductive cloth arranged at the outermost side of the battery, the heat dissipation structure of the battery directly attaches the carbon material layer 61 to the outer surface of the battery packaging film 52, and arranges the protective layer 62 such as a label layer at the outer side of the carbon material layer 61, thereby not only not affecting the reliability problem of the battery and the carbon material layer 61 but also not affecting the two-dimensional code brushing on the outer surface of the battery. Meanwhile, the carbon material layer 61 is attached to the inside of the battery label layer, and due to the protection of the label layer, the risks that the carbon material such as graphite is punctured and warped can be effectively reduced.

Therefore, the electronic equipment can improve the heat dissipation effect through the arrangement of the unique heat dissipation device, meets the heat dissipation requirement of the heat source device, is reliable in connection, and can protect the carbon material layer from being damaged.

It should be understood that, in the above heat dissipation device, the electronic device may be a heating device, that is, the electronic device itself can generate a certain amount of heat in the working process, and the heat dissipation structure can effectively and timely conduct and dissipate the heat of the electronic device. Or, the electronic device can also be a heated device, at least one side surface of the electronic device is close to the heat source, heat generated by the heat source is transferred to one side surface of the electronic device, and the heat dissipation structure can prevent the heat from being concentrated on the side surface of the electronic device, so that the heat is uniformly dissipated around or on other side edges. Or, the electronic device can also be a heating device and a heated device such as a battery, at least one side surface of the electronic device is close to the heat source, the heat generated by the heat source is transferred to one side surface of the electronic device, and the electronic device can generate certain heat in the working process.

In order to effectively dissipate heat of electronic devices in electronic equipment, the specific types of the electronic devices in the heat dissipation device can be diversified, namely, the heat dissipation structure can be adapted to different electronic devices for heat dissipation, the product universality is good, and the heat dissipation optimization problem of different electronic devices can be met. In addition, the heat dissipation structure can meet the heat dissipation requirements of electronic devices with different sizes without influencing the universality of the heat dissipation structure. Specifically, in some embodiments, the electronic device may be a battery, and the battery may be a pouch battery, which can alleviate the problems of unreliable assembly or connection, and a heat dissipation effect that needs to be improved in the existing pouch battery.

In other embodiments, the electronic device may also be an electronic device such as a circuit module, a board module, a chip, a resistor, a capacitor, or the like. Of course, in other embodiments, the electronic device may be other types of electronic devices, and will not be described one by one. When the heat dissipation structure is used for heat dissipation, the damage of the heat dissipation material layer can be avoided, and the effect of not firm connection is avoided. For brevity and convenience of description, the embodiments of the present application mainly use an electronic device as a battery for detailed description, but it should be understood that the specific type of the electronic device is not limited thereto, and the heat dissipation structure of the present application may be used for heat dissipation of any heat generating or receiving device, such as an electronic device such as a chip, a resistor, a capacitor, and the like.

It should be noted that, the embodiments of the present application are not limited to specific positions of the heat dissipation device in the electronic apparatus or connections with other devices, and may have various arrangements. For example, the heat sink may be disposed above the PCB, or may be disposed below the PCB, or may be disposed in close contact with another heat generating device. Taking the electronic device as an example, the battery is suitable for any electronic equipment which causes heat concentration due to battery obstruction, and the electronic equipment is not limited to a stacked-plate structure (the heat generating device is above or below the battery), or a staggered-plate structure (the heat generating device is at the side edge or the periphery of the battery), and the like.

Specifically, in some embodiments, as shown in fig. 8, the electronic device further includes a PCB3, both upper and lower surfaces of the PCB3 may be integrated with electronic components/shields 4, the PCB3 integrated with the electronic components/shields, the heat dissipation device may be disposed in the enclosed space formed by the housing 1 and the display screen 2, and the PCB3 integrated with the electronic components/shields 4 is disposed above the heat dissipation device, wherein the electronic components may be a battery, the battery includes a winding core 51 and an encapsulation film 52 wrapped outside the winding core, the heat dissipation structure includes a carbon material layer 61 and a protection layer 62, the outer surface of the encapsulation film 52 is attached with the carbon material layer 61, and the protection layer 62 is disposed on a side of the carbon material layer 61 departing from the encapsulation film 52. In the working process, the PCB3 (heating device or heat source) provided with the electronic component/shield 4 can generate certain heat or generate heat, and the lower surface of the heating device is tightly attached to the upper surface of the battery, so that the heat can be concentrated on the upper surface of the battery, and the heat needs to be timely guided out and radiated to the periphery to avoid local high temperature.

This heat radiation structure through carbon element material layer 61's setting, can avoid the heat to concentrate on the upper surface of battery, not only can the even scattered of heat that the battery was given to the heat source device, can all open the inside heat of battery simultaneously, guarantees the normal work of devices such as battery, PCB, still can avoid the phenomenon of display screen high temperature.

In other embodiments, as shown in fig. 9, the electronic device further includes a PCB3, electronic components/shields 4 may be integrated on both upper and lower surfaces of the PCB3, the PCB3 integrated with the electronic components/shields 4 may be disposed in an enclosed space formed by the housing 1 and the display screen 2, and the PCB3 integrated with the electronic components/shields 4 is disposed below the heat dissipation device, where the electronic components may be a battery, the battery includes a winding core 51 and a packaging film 52 wrapped outside the winding core, the heat dissipation structure includes a carbon material layer 61 and a protective layer 62, the outer surface of the packaging film 52 is attached with the carbon material layer 61, and the protective layer 62 is disposed on a side of the carbon material layer 61 departing from the packaging film 52. In the working process, the PCB3 (heating device or heat source) provided with the electronic component/shield 4 can generate certain heat or generate heat, and the upper surface of the heating device is tightly attached to the lower surface of the battery, so that the heat can be concentrated on the lower surface of the battery, and the heat needs to be timely guided out and dissipated to the periphery, and local high temperature is avoided.

This heat radiation structure through the setting of carbon element material layer 61, can avoid the heat to concentrate on the lower surface of battery, not only can the even scattered of heat that the battery was given to the heat source device all around, can all open the inside heat of battery simultaneously, guarantees the normal work of devices such as battery, PCB, still can avoid the phenomenon that the display screen high temperature.

The specific structure or type of the electronic component/shield integrated on the PCB is not limited in the embodiments of the present application, and all of them can be selected and set by those skilled in the art according to actual needs, and will not be described in detail herein.

In some embodiments, the display screen 2 may be an OLED, an LCD, or the like, but is not limited thereto, and other manners may also be adopted. It should be understood that the display screen 2 may include a display for outputting display content to a user and a touch device for receiving touch events input by the user on the display screen. In the embodiment of the present application, the structure and material of the display screen are not limited.

In addition, those skilled in the art understand that, in order to provide the required functions for the user, the electronic device may include several devices arranged inside the device, which is not particularly limited in this application, and those skilled in the art may adjust the position or specific structure of each device according to the actual requirement.

The configuration illustrated in the embodiment of the present application is not intended to specifically limit the electronic device. In other embodiments of the present application, an electronic device may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components may be used. For example, the electronic device may further include a camera and a flash.

As can be seen from the above, the electronic device includes a heat dissipation device, which includes an electronic component, a carbon material layer 61 and a protective layer 62, wherein the carbon material layer 61 is directly attached to the outer surface of the electronic component, and the protective layer 62 is disposed outside the carbon material layer 61. From this, can play and dispel the heat to electronic device, effectually evenly distribute away the heat, avoid electronic device's heat accumulation in same region, prevent the overheated phenomenon of electronic device. In addition, the electronic equipment provided by the embodiment of the invention can solve the problems that the heat of the equipment is concentrated and cannot be dispersed due to the obstruction of electronic devices such as batteries; the heat inside the battery can be quickly dissipated to the periphery while the heat outside the battery is uniformly distributed; moreover, the problem of printing the two-dimension code of the battery is not influenced while the heat dissipation is solved; the problem of the reliability of battery installation is not influenced while the heat dissipation is solved. In addition, the carbon material layer is wrapped outside the battery, and various cutting and wrapping schemes are provided, so that different scenes can be met.

The heat dissipation device in the electronic apparatus will be further described below. The heat dissipation device is described in detail by taking an electronic device as an example, and a person skilled in the art will understand that the principle of the present invention can be applied to any electronic device with any suitable arrangement. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

Referring to fig. 7-20, an embodiment of the present invention provides a heat dissipation device, in which an electronic device may be a battery, and the battery 5 includes a winding core 51, an encapsulation film 52 wrapped around the winding core 51, a battery protection plate 55 disposed at one side end of the winding core 51, and an FPC 54; the heat dissipation structure comprises a carbon material layer 61 and a protective layer 62, wherein the carbon material layer 61 covers the outer side of the packaging film 52, and the protective layer 62 is arranged on one side, away from the packaging film 52, of the carbon material layer 61.

The heat dissipation structure of the battery is different from the heat dissipation structure of the existing battery, and the carbon material layer 61 is wrapped on the inner side of the protective layer 62 such as a label layer, so that the heat dissipation effect of external devices of the battery can be achieved, and meanwhile, the battery can be effectively cooled. Because carbon material layer 61 parcel is inboard at battery label layer (like the PI membrane), the label layer with carbon material layer 61 like the effectual parcel in graphite layer, consequently can not introduce because increase the graphite layer graphite that brings and rise up, the unable spraying of two-dimensional code, the battery pastes the risk that insecure caused at the casing.

The structural shape of the battery can be various types, for example, the overall structure of the battery can be roughly in a rectangular parallelepiped shape, a square shape, a cylindrical shape or other shape structures, and the invention is not limited to the specific shape structure of the battery. The following description will be made mainly by taking a battery as a common rectangular parallelepiped, but those skilled in the art will understand that the battery is not limited to this, and may be a battery having other structures such as a square, a cylinder, etc.

In order to adapt to different application scenarios or meet different requirements, the specific manner of coating the carbon material layer 61 on the outer side of the encapsulation film 52 may be of various types, for example, the battery has a rectangular parallelepiped shape with six surfaces, and at least three of the surfaces may be coated with the carbon material layer, so that the heat of one of the surfaces is conducted to the remaining two or more surfaces, thereby achieving effective heat dissipation of the battery. Illustratively, three surfaces, four surfaces, or five surfaces of the battery may be wrapped. The surface of one side of the battery protection plate area is fragile and complex in shape, so that the surface can be wrapped without a carbon material layer, and the rest surfaces of the battery can be wrapped by the carbon material layer.

Specifically, as shown in fig. 10 and 11, in some embodiments, the layer of carbon material 61 includes a first surface 601 and sides, which may be disposed around at least a portion of the first surface 601; where the first surface 601 is a surface for contacting a heat generating device such as an electronic component/shield integrated PCB, in order to avoid heat concentration on the first surface 601, it is necessary to conduct heat to the remaining surfaces such as the side surfaces disposed around the first surface 601. Optionally, the side surface includes a first side surface 602 and a second side surface 603, for example, a left side surface and a right side surface respectively disposed at the left side and the right side of the first surface 601.

As shown in fig. 11, during the wrapping process, the battery may be provided, and the carbon material layer may be cut into a shape having a first surface 601, a first side 602, and a second side 603; then, the cut carbon material layer is wrapped on the outer side of the packaging film 52; the protective layer 62 may then be wrapped around the layer of carbonaceous material and the remaining outer side of the leaky plastic-aluminum film or battery protection plate.

By adopting the scheme of three-side wrapping, the carbon material layer is simple in cutting shape, cost is saved, weight is reduced, heat dissipation can be considered, and heat can be guided to the first side face and the second side face of the two sides through the first surface.

As shown in fig. 12 and 13, in other embodiments, the layer of carbon material 61 includes a first surface 601 and sides, which may be disposed around at least a portion of the first surface 601; where the first surface 601 is a surface for contacting a heat generating device such as an electronic component/shield integrated PCB, in order to avoid heat concentration on the first surface 601, it is necessary to conduct heat to the remaining surfaces such as the side surfaces disposed around the first surface 601. Optionally, the side surfaces include a first side surface 602, a second side surface 603, and a third side surface 604, for example, a left side surface, a right side surface, and a front side surface (or a bottom side surface) respectively disposed at a left side, a right side, and a front side (or a bottom side) of the first surface 601.

As shown in fig. 13, during the wrapping process, the battery may be provided first, and the carbon material layer may be cut into a shape having a first surface 601, a first side 602, a second side 603, and a third side 604; then, the cut carbon material layer is wrapped on the outer side of the packaging film 52; the protective layer 62 may then be wrapped around the layer of carbon material and the remaining exterior aluminum-plastic film or battery protection plate.

The four-side wrapping scheme is adopted, so that the overall thickness of the battery can be reduced, and the four-side wrapping scheme can be preferably adopted under the condition that the overall framework space is short; and can compromise the heat dissipation, can lead the heat to peripheral first side, second side and third side by the first surface.

As shown in fig. 14 and 15, in other embodiments, the layer of carbon material 61 includes a first surface 601, a second surface 605, the first surface 601 and the second surface 605 being oppositely disposed and sides disposed around the first surface 601 and the second surface 605. Where the first surface 601 is a surface for contacting a heat generating device such as a PCB integrated with electronic components/shields, in order to avoid heat concentration on the first surface 601, it is necessary to conduct heat to the remaining surfaces such as the side surfaces disposed around the first surface 601 and the second surface 605. Optionally, the side surfaces include a first side surface 602, a second side surface 603, and a third side surface 604, for example, a left side surface, a right side surface, and a front side surface (or a back side surface) respectively disposed at the left side, the right side, and the front side (or the back side) of the first surface 601. For example, the first surface 601 may be an upper surface, and the second surface 605 may be a lower surface; alternatively, the first surface 601 may be a lower surface and the second surface 605 may be an upper surface.

As shown in fig. 15, during the wrapping process, the battery may be provided first, and the carbon material layer is cut into a shape having a first surface 601, a second surface 605, a first side 602, a second side 603 and a third side 604; then, the cut carbon material layer is wrapped on the outer side of the packaging film 52; the protective layer 62 may then be wrapped around the outer sides of the layer of carbon material and the battery protection plate.

The scheme of adopting five face parcels, detach the scheme with the side parcel at battery protection shield place promptly, increased heat radiating area, can be faster with the heat effluvium, avoid thermal accumulation, can be with heat by first surface direction peripheral first side, second side, third side and second surface. The heat of the heat source can be uniformly distributed around the battery through the carbon material layer, and the heat is carried from the hot area to the cold area.

In addition, when the carbon material layer is adopted to wrap the battery, sharp corners and weak positions of the battery can be removed according to the shape and the requirement of the battery.

From this, this heat radiation structure of battery can be in proper order from inside to outside: the winding core 51, the packaging film 52 such as an aluminum plastic film, the carbon material layer 61 and the protective layer 62 such as a label layer have a good heat equalizing effect by wrapping the carbon material layer 61 on the outer side of the packaging film 52 of the battery, and can uniformly conduct heat in a high-temperature hot spot area to a surrounding cold area. The heat dissipation structure is suitable for a scene of peripheral heat dissipation by using a three-dimensional device with single-sided heat concentration.

The carbon material layer 61 and the sealing film 52 may be bonded, that is, a bonding material may be disposed between the carbon material layer 61 and the sealing film 52, and the carbon material layer 61 and the sealing film 52 may be effectively bonded or attached to each other by the bonding material. Similarly, the carbon material layer 61 and the protective layer 62 may be bonded, that is, a bonding material may be disposed between the carbon material layer 61 and the protective layer 62, and the carbon material layer 61 and the protective layer 62 may be effectively bonded or attached by the bonding material. The adhesive substance includes, but is not limited to, an insulating adhesive, a grid adhesive, a conductive adhesive, a double-sided adhesive, and the like, and the specific type of the adhesive substance is not limited in the embodiments of the present invention.

For example, as shown in fig. 16, the protective layer 62 may be a label layer such as a PI film, a double-sided adhesive tape is disposed between the carbon material layer 61 and the protective layer 62, the PI film and the carbon material layer 61 are bonded together by the double-sided adhesive tape, and then the PI film is wrapped on the outer side of the aluminum plastic film of the battery.

The specific material type of the carbon material layer 61 can be varied to meet the heat dissipation requirements of the electronic device. Specifically, in some embodiments, the material of the carbon material layer 61 includes, but is not limited to, one or more of graphite, graphene, carbon nanotubes, or carbon fibers, that is, the carbon material layer may be formed mainly of one or more of graphite, graphene, carbon nanotubes, or carbon fibers. Illustratively, the material of the carbon material layer may be graphite, may be graphene, may be carbon nanotubes, may be carbon fibers, may be a mixture of graphite and graphene in any proportion, may be a mixture of graphite, graphene and carbon nanotubes in any proportion, may be a mixture of graphite, graphene and carbon fibers in any proportion, and the like. The graphite can be natural graphite, artificial graphite, expanded graphite and other various graphite materials.

It should be understood that the specific type of the material of the carbon material layer 61 is not limited to the above listed types, and the material of the carbon material layer may also be of other types, for example, modified materials of the above carbon materials, or other types of carbon materials such as carbon nanohorns, fullerenes, etc., in case of meeting the heat dissipation requirement of the electronic device, and will not be described in detail herein.

When the material of the carbon material layer 61 includes a mixture formed by mixing a plurality of components such as graphite, graphene, carbon nano-particles, or carbon fibers, the components may be mixed in any ratio; that is, when the material of the carbon material layer includes a mixture of two or more of graphite, graphene, carbon nanotube, and carbon fiber, the specific proportion or content of each component is not particularly limited, and can be adjusted and controlled by those skilled in the art according to actual conditions.

In some embodiments, the material of the carbon material layer 61 is preferably graphite or graphene. The carbon materials of graphite and graphene have good heat-conducting property, belong to good heat-conducting materials, have wide sources and are easy to obtain, and are more beneficial to uniformly radiating the heat of electronic devices to the periphery.

In order to ensure a good heat dissipation effect and improve the heat dissipation performance, it is necessary to set the thermal conductivity of the carbon material layer 61 within a suitable range. Specifically, in some embodiments, the thermal conductivity (thermal conductivity) of the carbon material layer 61 may be equal to or greater than (equal to or greater than) 100W/m · K, further may be 100W/m · K to 1600W/m · K, further may be 100W/m · K to 1200W/m · K, further may be 150W/m · K to 1000W/m · K, further may be 200W/m · K to 800W/m · K. Typically, but not by way of limitation, the thermal conductivity of the layer of carbonaceous material may be, for example, any value in the range of 100W/m.K, 150W/m.K, 200W/m.K, 300W/m.K, 400W/m.K, 500W/m.K, 600W/m.K, 800W/m.K, 1000W/m.K, 1500W/m.K, 1600W/m.K, and any two of these values.

The carbon material layer 61 within the above thermal conductivity range is helpful for increasing the heat dissipation rate, facilitating the heat transfer, and enabling the heat to be carried from the hot area to the cold area more quickly, thereby facilitating the uniform heat dissipation to the periphery.

The carbon material layers 61 may be stacked in various ways, for example, in a single layer or a plurality of layers. Specifically, in some embodiments, the number of layers of the carbon material layer 61 may be one or more, i.e., the number of layers of the carbon material layer 61 is equal to or greater than one, and may be, for example, one to ten layers, one to eight layers, one to five layers, two to three layers, or the like. Typically, but not by way of limitation, the number of layers of carbon material may be one, may be two, may be three, may be four, may be five, may be six, etc. The number of the carbon material layers 61 is not limited in the embodiment of the present invention, and can be adjusted and controlled by those skilled in the art according to actual situations.

When the number of the carbon material layers 61 is multiple, that is, two or more layers, the carbon material layers 61 are bonded by using a bonding material, and the bonding material may be insulating glue, grid glue, conductive glue, or the like.

In the case where the number of the carbon material layers 61 is a plurality of layers, the types of the materials of the carbon material layers 61 may be the same or different. For example, the material of each carbon material layer 61 may be all graphite or all graphene; or, some of the carbon material layers 61 are made of graphite, and other carbon material layers 61 are made of graphene or carbon nanotubes.

In some embodiments, the thickness of the layer of carbon material 61 is 0.01mm to 0.1mm, and further may be 0.01mm to 0.05mm, and further may be 0.02mm to 0.04mm. That is, when the carbon material layer is a single layer, the thickness of the single carbon material layer is 0.01 to 0.1mm and when the carbon material layer is a plurality of layers, the total thickness of the plurality of carbon material layers is 0.01 to 0.1mm. Typically, but not by way of limitation, the thickness of the layer of carbonaceous material may be, for example, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.1mm, and any value in the range of any two of these values.

Further, when the carbon material layer 61 is replaced with a heat storage material, a heat insulating material, or the like, the thickness of the heat storage material or the heat insulating material may be 0.01mm to 1mm, and may be, for example, any value in the range of 0.01mm, 0.04mm, 0.05mm, 0.06mm, 0.1mm, 0.2mm, 0.4mm, 0.5mm, 0.8mm, 1mm, and any two of these points.

By controlling the thickness of the carbon material layer 61 within an appropriate range, heat dissipation performance can be ensured, heat dissipation efficiency can be improved, and cost can be reduced. When the thickness of the carbon material layer is too small, the heat dissipation is slow, and a good heat dissipation effect may not be achieved; when the thickness of the carbon material layer is too large, the thickness is increased, the weight is increased, the cost is high, and the performance is not obviously improved.

In some embodiments, when the number of the carbon material layers 61 is a plurality of layers, the carbon material layers 61 are bonded with the bonding material therebetween, and the thickness of the bonding material (bonding layer) may be 0.005 to 0.03mm, and further may be 0.01 to 0.03mm. Typically, but not limited to, the thickness of the bonding substance may be, for example, 0.005mm, 0.008mm, 0.01mm, 0.02mm, 0.03mm, etc.

By controlling the thickness of the binder within a suitable range, reliable adhesion between the carbon material layers is facilitated while heat dissipation performance and connection strength are ensured, and reduction in thickness and cost are facilitated.

As can be seen from the above, the arrangement of the carbon material layer in the heat dissipation structure helps to improve the heat dissipation effect and prevent the heat from concentrating in a certain hot area. In addition, in order to effectively dissipate heat from electronic devices, a carbon material layer having good conductivity may be used as a heat dissipation means to perform composite heat dissipation with at least one of a copper sheet (copper foil), an aluminum heat sink, a metal sheet, and a conductive sheet of compressed metal powder. Alternatively, in order to meet different requirements of different electronic devices, a carbon material layer and a conductive layer or a shielding layer can be compounded.

In order to achieve the same heat dissipation effect or endow the heat dissipation structure with the performances of electric conduction, shielding and the like under the condition of meeting the heat dissipation requirement, the heat dissipation structure can be made of other heat dissipation materials besides the carbon Material layer, such as heat storage materials or Phase Change Materials (PCM), heat insulation materials such as heat insulation films, metals with high heat conductivity such as copper foils and graphite soaking heat conduction composite materials such as copper foil graphite composite materials and the like.

That is, in other embodiments, the carbon material layer may be replaced by a heat storage material layer or a phase change material layer, or may be a composite layered structure of the heat storage material layer or the phase change material layer and the carbon material layer, in case of satisfying the same heat dissipation effect or the required heat dissipation effect.

Alternatively, in the case of satisfying the equivalent heat dissipation effect or the required heat dissipation effect, the carbon material layer may be replaced with a heat insulating material such as a heat insulating film in other embodiments, or may be provided as a composite layered structure of a heat insulating material such as a heat insulating film and the carbon material layer.

Alternatively, in the case of satisfying the same heat dissipation effect or the required heat dissipation effect, in other embodiments, a composite layered structure provided with a metal such as a copper foil and the above-described carbon material layer, for example, a copper foil graphite composite layer or the like, may be used.

In addition, in other embodiments, specific structural forms or compositions of the heat dissipation structure include, but are not limited to, the above listed ones, and may also have other structural forms or configurations, which are not described in detail herein.

For example, in some embodiments, as shown in fig. 17, the heat dissipation structure includes a first adhesive layer 65, a carbon material layer 61, a second adhesive layer 66, and a protective layer, which are sequentially stacked, wherein the protective layer may be the conductive layer 63, and the carbon material layer 61 may be any one of the carbon material layers 61 described above. In this heat dissipation structure, the first adhesive layer 65 is used to bond the carbon material layer 61 to the adhesive surface 701 of the electronic component 7, and the second adhesive layer 66 is used to bond the protective layer, i.e., the conductive layer 63, to the carbon material layer 61.

The first adhesive layer 65 may be a grid adhesive, that is, the first adhesive layer may be a grid adhesive layer. The grid glue may be provided with a plurality of protrusions, and the shape of the plurality of protrusions may have various forms. For example, the grid glue layer has a plurality of protrusions, and the plurality of protrusions are in a dot shape, a parallel strip shape, a parallel crossed grid shape or a honeycomb shape arranged in an array.

The second adhesive layer 66 may be an insulating glue, i.e., the second adhesive layer may be an insulating glue layer.

The carbon material layer 61 is provided with a binder on both sides thereof to prevent the layers from being separated from each other, and the form thereof is not limited. For example, the first adhesive layer 65 may be a general adhesive substance or a mesh adhesive substance. When the temperature of the surface of the object to be bonded, i.e., the surface of the electronic device, is high, the gas expands to generate bubbles in the carbon material bonding process, or the surface of the object to be bonded is a glass surface, the first bonding layer 65 is preferably made of a mesh bonding material.

Therefore, the heat dissipation structure adopts the carbon material to carry out soaking, and meanwhile, the conducting layer above the heat dissipation structure also meets the requirements of conducting heat, shielding, preventing metal from mistakenly touching and solving the problem of electricity jumping. The conducting layer and the carbon material layer adopt insulating glue, so that short circuit can be prevented, and two purposes are achieved at one time; meanwhile, grid glue with different shapes is added between the carbon material layer and the surface of a bonding object, such as an encapsulation film, protrusions with different shapes exist on the surface of the glue, air exhaust grooves exist between the protrusions, and when the glue and the air on the surface of the bonding object expand due to heating, the air can be exhausted through the air exhaust grooves, and air bubbles are eliminated. In addition, when the heat dissipation structure is adhered to the surface of glass, air in the exhaust grooves reacts with photo-generated electrons, so that the covering capacity of white ink on black ink can be improved, and the black appearance problem is improved.

Specifically, the conductive layer 63 may be a metal such as aluminum foil, copper foil, or the like, a metal powder such as copper powder, silver powder, or various types of conductive materials such as metal fabric. The conductive layer can conduct heat and play roles in protection, electric conduction, heat conduction, electromagnetic shielding and the like. The carbon material layer 61 can perform a heat-soaking function, and the second adhesive layer 66 selects an insulating adhesive to prevent conduction between the metal heat-conducting layer and the carbon material layer 61, which causes short circuits of other devices. In addition, when the carbon material layer 61 is used for adhering to a glass design or a large area, the first adhesive layer 65 is selected from a mesh adhesive to increase the adhesion effect and prevent bubbles and a black appearance.

Specifically, in the heat dissipation structure, the thickness of the first adhesive layer 65 may be 0.01 to 0.03mm, and further may be 0.01 to 0.02mm. Typically but not limited to, for example, 0.01mm, 0.02mm, 0.03mm, etc. The thickness of the second adhesive layer 66 may be 0.01 to 0.03mm, and further may be 0.01 to 0.02mm. Typically but not limited to, for example, 0.01mm, 0.02mm, 0.03mm, etc.

The thickness of the carbon material layer 61 may be 0.01mm to 0.1mm, further 0.01mm to 0.05mm, and further 0.02mm to 0.04mm. Typical but not limiting examples are 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.1mm, etc. The thickness of the conductive layer 63 may be 0.01mm to 0.03mm, further 0.01mm to 0.02mm, and further 0.02mm to 0.03mm. Typical but not limiting examples are 0.01mm, 0.02mm, 0.03m, etc.

By controlling the thicknesses of the first adhesive layer 65, the second adhesive layer 66, the carbon material layer 61, and the conductive layer 63 within an appropriate range, it is possible to ensure reliable adhesion between the layered structures while ensuring heat dissipation performance and connection strength, and to reduce the thickness, weight, and cost.

Specifically, as shown in fig. 19 and 20, in the heat dissipation structure, a plurality of protrusions 651 are arranged on the grid adhesive surface of the first adhesive layer 65, the shape of the plurality of protrusions 651 may be various, including but not limited to a bar shape, a square shape, a circular shape, a rectangular shape, and other irregular shapes, the surface area of the grid surface may be increased, and air may enter while ensuring air exhaust. The embodiment of the invention does not limit the specific shape structure, the specific material type and the like of the grid glue.

Accordingly, the heat dissipation structure including the first adhesive layer 65, the carbon material layer 61, the second adhesive layer 66, and the conductive layer 63 can efficiently dissipate heat while achieving uniform heating, and has electromagnetic shielding and metal mistouch prevention effects. And insulating glue is adopted between the conducting layer and the carbon material, so that short circuit influence caused by conduction can be effectively prevented. The grid glue with different shapes can effectively eliminate the problem of bubbles generated when the carbon material is adhered to the surface of an object, and can eliminate the problem of black appearance left when graphite is adhered to the surface of glass in response to solar radiation.

In other embodiments, as shown in fig. 18, the heat dissipation structure includes a first adhesive layer 65, a conductive cloth layer 64, a second adhesive layer 66, a carbon material layer 61, and a protective layer 62, which are sequentially stacked, wherein the carbon material layer 61 may be any one of the carbon material layers 61 described above. In this heat dissipation structure, the first adhesive layer 65 is used to bond the conductive cloth layer 64 to the adhesive surface 701 of the electronic component 7, and the second adhesive layer 66 is used to bond the conductive cloth layer 64 to the carbon material layer 61.

The protective layer 62 may be a sticky protective layer, that is, the protective layer 62 and the carbon material layer 61 may be directly bonded and compounded together; alternatively, a third adhesive layer may be provided between the carbon material layer 61 and the protective layer 62, and the carbon material layer 61 and the protective layer 62 may be bonded together by the third adhesive layer.

In the heat dissipation structure, the protective layer 62 may be a label layer, for example, a PI film, and the total thickness of the protective layer 62 or the protective layer 62 and the third adhesive layer is 0.01 to 0.1mm, and further may be 0.01 to 0.05mm; typically but not by way of limitation, for example, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, 0.1mm, and the like may be used. Within the thickness range, the protective effect on the carbon material layer can be effectively achieved, the carbon material layer is prevented from being damaged, and the cost is reduced and the weight is reduced.

In addition, the protective layer 62 may also be a composite film of a Polyethylene terephthalate (PET) film and a PI film, the PET film may be disposed on the outer side of the carbon material layer, and the PI film may be disposed on the outer side of the PET film, and the PI film may be used as label paper for identifying various information of electronic devices such as batteries. The total thickness of the protective layer or the protective layer and the third adhesive layer is 0.01-0.1mm, and further 0.01-0.05mm; typical but not limiting examples are 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, 0.1mm, etc.

Compared with the heat dissipation structure, the heat dissipation structure adopts the conductive cloth layer 64 as the conductive layer, and the positions of the conductive cloth layer 64 and the carbon material layer 61 are interchanged, and the heat dissipation mode is that heat is conducted through the conductive cloth layer 64 firstly, and then the heat is uniformly heated through the carbon material layer 61. And moreover, the conductive cloth layer also solves the problems of electromagnetic shielding, ESD (electro-static discharge) flashover, RSE metal false touch and the like of key devices while soaking heat conduction. Because the carbon material layer is arranged above, in order to prevent the carbon material layer from being damaged, the outermost layer can also be provided with a non-conductive protective layer, so that the carbon material layer can be protected, meanwhile, the short circuit of an outer layer device can be prevented, or the carbon material layer can be protected, and meanwhile, various information can be marked. In addition, the conductive cloth layer 64 is arranged in the heat dissipation structure, and the conductive cloth layer 64 has the characteristics of softness and the like, so that the heat dissipation structure is applied to the camera, for example, the heat dissipation structure is adhered to the back surface of the camera, the characteristics of electricity jump, mistaken touch and the like can be prevented by using the conductive cloth layer 64, and the risk of tilting of the FPC (flexible printed circuit) of the camera can be reduced by using the softness of the conductive cloth layer 64. Meanwhile, the camera has high power consumption and high heat dissipation pressure in a shooting and video recording scene, so that a carbon material layer is often arranged behind the camera to increase heat dissipation, and the heat dissipation device provided by the invention is arranged on the back surface of the camera, so that the heat dissipation requirement is considered, the risks of equipment power jump, accidental touch and the like are also considered, the assembly process is simplified, the increase of the thickness of the bending part of the FPC (flexible printed circuit) of the camera can be avoided, and the risk of the FPC of the camera tilting is reduced.

In other embodiments, the heat dissipation structure may further include a first adhesive layer, a PET film, a carbon material layer, and a protective layer (not shown) sequentially stacked, wherein the carbon material layer may be any one of the carbon material layers described above. In the heat dissipation structure, the first adhesive layer is used for adhering the PET film and the adhesive surface of the electronic device together.

Among this heat radiation structure, a side surface that is close to electronic device at the carbon element material layer has set up the PET film, thus, if carrying out the in-process that bonds heat radiation structure and electronic device, the error has appeared, need tear heat radiation structure again and bond, perhaps need tear heat radiation structure and recycle, because the guard action of inboard PET film, can avoid tearing or bond the damage on the in-process carbon element material layer such as etc. again, effectively protect the carbon element material layer not torn or receive the damage, and then can reduce cost.

The connection mode between the PET film and the carbon material layer can be bonding, namely, a bonding substance can be arranged between the carbon material layer and the PET film, and the carbon material layer and the PET film are effectively connected together through the bonding substance; alternatively, the PET film and the carbon material layer may be directly bonded to each other. The connection mode between the protective layer and the carbon material layer can be bonding, namely, a bonding substance can be arranged between the carbon material layer and the protective layer, and the carbon material layer and the protective layer are effectively connected together through the bonding substance; alternatively, the protective layer may be a sticky protective layer, and the protective layer may be directly attached to the carbon material layer.

In addition, the protective layer may be a label layer, and the label layer may be a PI film, or a composite film structure of the PI film and other high molecular polymers.

As can be seen from the above description, the heat dissipation device and the electronic device provided in the embodiments of the present invention have the following advantages:

(1) The heat outside the electronic device such as a battery can be uniformly radiated to the periphery, and the heat inside the battery can be uniformly radiated at the same time.

(2) The carbon material layer wraps the battery protection layer such as the inside of the label layer, and the label layer effectively protects the carbon material layer, so that short circuit risks caused by puncture of the carbon material layer can be prevented.

(3) The carbon material layer is wrapped in the battery protective layer such as the label layer, and the label layer effectively wraps the carbon material layer, so that the assembly problem caused by the warping of the carbon material layer can be prevented.

(4) The carbon material layer wraps up in battery label in situ portion, compares in outer battery with current graphite parcel, can prevent effectively that the battery from pasting insecurely, and the battery drunkenness in the equipment casing, and the like battery safety risk.

(5) The carbon material layer wraps up inside battery label paper, compares with current graphite conductive cloth parcel at outer battery, can effectively prevent the problem of printing two-dimensional code discernment difficulty.

(6) The carbon material layer wraps the inside of the battery label paper, the cutting shape of the carbon material layer can be various, the total thickness of the battery can be effectively adjusted, and the framework space is optimized.

(7) The grid glue is arranged between the carbon material layer and the outer surface of the electronic device, and the insulating glue is arranged between the carbon material layer and the conducting layer, so that the problem of bubbles generated when the heat dissipation material is adhered to the surface of an object can be solved; the short circuit influence caused by the conduction of the carbon material layer and the conductive layer is prevented.

It should be noted that the term "and/or"/"used herein is only one kind of association relationship describing associated objects, and means that there may be three relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

In the description of the present application, it is to be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships and are used only for indicating relative positional relationships, and when the absolute position of a described object is changed, the relative positional relationships may be changed accordingly. It will also be understood that when an element such as a layer or substrate is referred to as being "on" or "under" another element, it can be directly on or under the other element or be indirectly on or under the other element via intervening elements.

It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.

Claims

1. An electronic device, comprising:

the heat dissipation device comprises an electronic device and a heat dissipation structure connected with the electronic device, the heat dissipation structure comprises a carbon material layer and a protective layer, the carbon material layer is attached to the outer surface of the electronic device, and the protective layer is arranged on one side, away from the electronic device, of the carbon material layer;

the carbon material layer comprises a first surface and a side surface, the first surface is a surface close to one side of the heat source device, and the side surface extends along at least partial edge of the first surface in a direction away from the first surface in an angle mode so as to conduct heat of the first surface to the side surface;

the first surface and the side surface are arranged on at least part of the outer surface of the electronic device in a fit manner;

the material of the carbon material layer comprises one or a mixture of graphite, graphene, carbon nanotubes or carbon fibers;

the protective layer is a conductive layer.

2. The electronic device of claim 1, wherein the layer of carbon material further comprises a second surface disposed opposite the first surface, the side surface being between the first surface and the second surface to conduct heat from the first surface to the side surface and the second surface;

the first surface, the second surface and the side face are attached to at least part of the outer surface of the electronic device.

3. The electronic device of claim 1, wherein the carbon material layer has a thermal conductivity of not less than 100W/m-K.

4. The electronic device of claim 1, wherein the carbon material layer has a thickness of 0.01mm to 0.1mm.

5. The electronic device of claim 1, wherein the number of layers of carbon material is one or more;

when the number of the carbon material layers is multiple, the carbon material layers are bonded by bonding substances, and the thickness of the bonding substances is 0.005mm-0.03mm.

6. The electronic device of claim 1, wherein a first adhesive layer is disposed between the outer surface of the electronic component and the carbon material layer, and the first adhesive layer is a mesh glue layer.

7. The electronic device according to claim 6, wherein the thickness of the first adhesive layer is 0.01mm to 0.03mm.

8. The electronic device of claim 1, wherein a second adhesive layer is disposed between the conductive layer and the carbon material layer, and the second adhesive layer is an insulating glue layer.

9. The electronic device according to claim 8, wherein a thickness of the second adhesive layer is 0.01mm to 0.03mm;

and/or the thickness of the conducting layer is 0.01mm-0.03mm.

10. The electronic device of claim 1, wherein the heat dissipation structure comprises a first adhesive layer, a carbon material layer, a second adhesive layer and a protective layer, which are sequentially stacked, wherein the first adhesive layer is a mesh glue layer, the second adhesive layer is an insulating glue layer, and the protective layer is a conductive layer; the first adhesive layer is used for adhering to the outer surface of the electronic device.

11. The electronic device according to claim 1, wherein the heat dissipation structure comprises a first adhesive layer, a conductive cloth layer, a second adhesive layer, a carbon material layer, and a protective layer, which are sequentially stacked, wherein the first adhesive layer is used for bonding with an outer surface of the electronic component.

12. The electronic device of claim 1, wherein the protective layer is a label layer comprising a high molecular polymer film.

13. The electronic device of claim 12, wherein a third adhesive layer is disposed between the label layer and the carbon material layer, and the total thickness of the label layer and the third adhesive layer is 0.01mm-0.1mm.

14. The electronic device of any of claims 1-13, wherein the electronic device comprises a battery.

15. The electronic device of any of claims 1-13, wherein the heat source component comprises a circuit board.

16. A heat dissipating device, comprising:

the electronic device comprises an electronic device and a heat dissipation structure connected with the electronic device, wherein the heat dissipation structure comprises a carbon material layer and a protective layer, the carbon material layer is attached to the outer surface of the electronic device, and the protective layer is arranged on one side, away from the electronic device, of the carbon material layer;

the layer of carbon material comprising a first surface and a side surface, the first surface being a surface adjacent to a side of a heat source device of the electronic device of any of claims 1-15, the side surface extending away from the first surface at an angle along at least a portion of an edge of the first surface to conduct heat from the first surface to the side surface;

17. The heat dissipation device of claim 16, wherein the electronic device comprises a battery, a chip, a circuit module, a board module, a resistor, or a capacitor.

18. A heat dissipating device, comprising: a battery and a heat dissipation structure connected with the battery;

the heat dissipation structure comprises a carbon material layer and a protective layer, and is used for dissipating heat of a heat source device and/or a battery; the electronic device of any of claims 1-15, wherein the outer surface of the electronic component is coated with the layer of carbonaceous material, and the protective layer is disposed on a side of the layer of carbonaceous material facing away from the electronic component;

the carbon material layer at least comprises a first surface and a side surface, the first surface is a surface close to one side of the heat source device, and the side surface extends along the direction which is far away from the first surface and is formed by the angle of at least partial edge of the first surface;

the first surface with the side laminating set up in at least part surface of battery, the protective layer sets up in the carbon material layer deviates from one side of battery.