CN114019879A - High-low voltage power distribution cabinet monitoring system - Google Patents
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Abstract
The invention belongs to the technical field of high-low voltage distribution equipment, and particularly relates to a monitoring system for a high-low voltage distribution cabinet. The invention overcomes the defects of the prior art and carries out accurate temperature monitoring on each electrical element and circuit through the thermal imaging monitoring module. The monitoring system of the high-low voltage power distribution cabinet comprises a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power module is respectively and electrically connected with the bus voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module. The monitoring system of the high-low voltage power distribution cabinet provided by the invention detects by adopting a thermal imaging detection method performed by the thermal imaging unit, and can accurately measure various parameters of a power distribution system.
Description
Technical Field
The invention belongs to the technical field of high-low voltage distribution equipment, and particularly relates to a monitoring system for a high-low voltage distribution cabinet.
Background
The electric marketing material has the characteristics of mixing 'few varieties, large batch' with 'many varieties, large batch', and has high manual management difficulty and high labor intensity. The problems of low efficiency, repeated low-added-value labor by manpower, unclear and untimely warehouse entry and exit management exist in aspects of reception, warehouse entry and exit, transportation, inventory and the like. The most common of the existing automatic stereoscopic warehouses is a roadway stacking crane, the device has the problems of large modification amount, complex system structure and high investment cost in the application process, and the system is difficult to update and re-modify after the stereoscopic warehouses are modified.
Meanwhile, the existing tunnel stacker crane is mainly of a mechanical structure, does not relate to a monitoring system used in a matched mode, and is not convenient for real-time monitoring and technical transformation of a data center precision power distribution cabinet of the tunnel stacker crane.
Therefore, a system capable of accurately monitoring the power distribution cabinet needs to be designed to solve the problems in the prior art.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-low voltage power distribution cabinet monitoring system which can accurately monitor the temperature of each electrical element and circuit through a thermal imaging monitoring module.
The invention also aims to provide a thermal imaging detection method by adopting the thermal imaging unit in the monitoring system of the high-low voltage power distribution cabinet.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high-low voltage power distribution cabinet monitoring system comprises a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power supply module is respectively electrically connected with the bus voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module, and supplies power to each module;
the output end of the incoming line loop current acquisition module is in communication connection with the input end of the signal processing circuit, and the output end of the outgoing line loop current acquisition module is in communication connection with the input end of the signal processing circuit; the output end of the signal processing circuit is in communication connection with the input end of the processor;
the output end of the bus voltage detection module is also in communication connection with the input end of the processor, and the output end of the processor is respectively in communication connection with the input end of the communication module and the input end of the data storage module; the bus voltage detection module is used for detecting the voltage difference between the positive bus and the negative bus;
the incoming line loop current acquisition module is used for acquiring incoming line partial current, converting the incoming line partial current into small current and outputting the small current to the signal processing circuit; the outgoing line loop current acquisition module is used for acquiring outgoing line partial current, converting the outgoing line partial current into small current and outputting the small current to the signal processing circuit;
the thermal imaging monitoring module is used for monitoring the temperature change of the whole power distribution cabinet and giving an alarm when the temperature is abnormal;
the signal processing circuit is used for raising current signals collected by the incoming line loop current collection module and the outgoing line loop current collection module to the lowest sampling point of an analog-to-digital converter arranged in the processor;
the processor is used for receiving the electric signals of the bus voltage detection module and the signal processing circuit and storing the electric signals through the data storage module;
the thermal imaging monitoring module comprises:
the thermal imaging unit is used for carrying out non-contact thermal imaging detection on electrical elements and circuits in the power distribution cabinet;
the photographing unit is used for photographing the electrical components and the circuits detected by the thermal imaging unit to obtain thermal imaging pictures of the electrical components and the circuits; and
the analysis unit is used for receiving the thermal imaging picture output by the photographing unit, comparing the thermal imaging picture with a standard thermal imaging picture when the electrical component and the circuit work normally, and judging whether the electrical component and the circuit are normal or not according to a comparison result;
the output end of the thermal imaging unit and the output end of the photographing unit are respectively in communication connection with the input end of the analysis unit.
Specifically, the power supply module supplies power to each module in a multi-path isolation voltage output mode; the power module comprises a first circuit breaker and a second circuit breaker, the first circuit breaker and the second circuit breaker are provided with residual current device protection, the first circuit breaker and the second circuit breaker are arranged in parallel, the first circuit breaker and the second circuit breaker adopt a power supply form of double power supply end mutual switching (double power supply switching) (the second circuit breaker is disconnected when the first circuit breaker is switched on, and the first circuit breaker is disconnected when the second circuit breaker is switched on), namely, the first circuit breaker and the second circuit breaker are connected to each electric appliance in the high-low voltage power distribution cabinet after being connected in parallel.
Specifically, the bus voltage detection module comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and an operational amplifier, wherein one end of the first resistor is connected with the positive bus, and the other end of the first resistor is connected with the non-inverting input end of the operational amplifier; one end of the third resistor is connected with the analog ground, and the other end of the third resistor is connected with the non-inverting input end of the operational amplifier; one end of the second resistor is connected with the negative bus, and the other end of the second resistor is connected with the inverting input end of the operational amplifier; one end of the fourth resistor is connected with the inverting input end of the operational amplifier, and the other end of the fourth resistor is connected with the output end of the operational amplifier; one end of the fifth resistor is connected with the output end of the operational amplifier, the other end of the fifth resistor is connected with the processor, the positive bus voltage is input to the non-inverting input end of the operational amplifier after being subjected to voltage reduction processing by the first resistor and the third resistor, the negative bus voltage is input to the inverting input end of the operational amplifier after being subjected to voltage reduction processing by the second resistor, then the detection differential pressure between the positive bus and the negative bus is obtained after the operation processing of the operational amplifier, and the detection differential pressure is output to the processor as the second detection differential pressure.
Specifically, the incoming loop current acquisition module adopts a 5A current transformer, and the outgoing loop current acquisition module adopts a 100A/20mA current transformer.
Specifically, the communication module is an RS485 communication module.
Specifically, the analysis unit includes:
the data processing unit is used for receiving the thermal imaging picture output by the photographing unit, comparing the thermal imaging picture with a standard thermal imaging picture when the electrical component and the circuit work normally, and judging whether the electrical component and the circuit work normally or not according to a comparison result;
the alarm unit is used for sending alarm information when the data processing unit judges that the electrical components and the circuit are abnormal; and
the display unit is used for displaying alarm information and/or electrical element and normal circuit information;
the input end of the data processing unit is in communication connection with the output end of the photographing unit, and the output end of the data processing unit is in communication connection with the input end of the alarm unit and the input end of the display unit respectively.
Further, the invention also provides a thermal imaging detection method by adopting the thermal imaging unit in the high-low voltage power distribution cabinet monitoring system, which comprises the following steps:
s1: carrying out binarization segmentation on the image through a threshold value, wherein the threshold value is as follows:
then, conducting on-off operation and on-off operation on the image subjected to binarization segmentation respectively, conducting connected domain operation to obtain a connected domain area value, only keeping the connected domain with the connected domain area larger than Amin after calculation as a candidate connected domain of a brightness segmentation result, and marking as Rt, wherein Amin is 0.0025 r c, r and c are the width and height of the connected domain, and an ROI (region of interest) for detecting the distribution position of the electrical appliance element is marked as Rm;
s2: the obtained values without any intersection in the Rt and Rm values are fused into an ROI area and recorded as Rf values;
s3: counting the sum of pixel values (specifically, gray values calculated according to RGB values) of each column of pixel points in Rf in a direction by columns to form a gray histogram, and separating a plurality of electrical components and lines in a region by peak values and low values of the histogram, so we record a new ROI after separation as sRf;
s4: truncating the height of the new ROI sRf after splitting according to the mean of all row pixels;
s5: filtering out ROI areas which are not electrical elements and lines;
then the thermal imaging picture of each electrical element and circuit can be obtained, and compared with the preset standard thermal imaging picture when each electrical element and circuit normally work, whether each electrical element and circuit are normal can be judged.
Compared with the prior art, the invention has the following beneficial effects:
1. the monitoring system of the high-low voltage power distribution cabinet realizes centralized monitoring of data in the high-low voltage power distribution cabinet through remote communication. The system is suitable for single-path input, single-stage output and single-point detection; double-path input, single-segment output and single-point detection; the system power input mode of double-path input, single-section output and double-point detection.
2. The monitoring system of the high-low voltage power distribution cabinet can accurately measure various parameters of a power distribution system, including bus voltage and frequency of three-phase incoming lines, and current, split phase and total active power, reactive power, power factor, active electric energy and reactive electric energy of 2-path three-phase incoming lines.
3. The monitoring system of the high-low voltage power distribution cabinet can accurately measure on-off states and other electrical parameters of 36 outgoing lines (current, active power, reactive power, power factor, active electric energy, reactive electric energy and branch lines of a single-phase branch), and can accurately monitor the temperature of each electrical element and line through the thermal imaging monitoring module.
Drawings
Fig. 1 is a block diagram of a connection relationship between modules in a monitoring system of a high-voltage and low-voltage power distribution cabinet according to embodiment 1;
FIG. 2 is a circuit diagram of a bus voltage detection module according to embodiment 1;
FIG. 3 is a block diagram of a thermal imaging monitoring module of embodiment 1;
FIG. 4 is a block diagram of an analyzing unit of embodiment 1;
the various reference numbers in the figures mean: 1. a power supply module; 2. a bus voltage detection module; 3. the incoming line loop current acquisition module; 4. the outgoing line loop current acquisition module; 5. a thermal imaging monitoring module; 50. a thermal imaging unit; 51. a photographing unit; 52. an analysis unit; 520. a data processing unit; 521. an alarm unit; 522. a display unit; 6. a signal processing circuit; 7. a communication module; 8. a processor; 9. and a data storage module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1, a monitoring system for high-low voltage power distribution cabinets comprises a power module 1, a bus voltage detection module 2, an incoming line loop current collection module 3, an outgoing line loop current collection module 4, a thermal imaging monitoring module 5, a signal processing circuit 6, a communication module 7, a processor 8 and a data storage module 9. The power supply module 1 is respectively electrically connected with the bus voltage detection module 2, the incoming line loop current acquisition module 3, the outgoing line loop current acquisition module 4, the thermal imaging monitoring module 5, the signal processing circuit 6, the communication module 7, the processor 8 and the data storage module 9, and supplies power to each module;
the output end of the incoming line loop current acquisition module 3 is in communication connection with the input end of the signal processing circuit 6, and the output end of the outgoing line loop current acquisition module 4 is in communication connection with the input end of the signal processing circuit 6; the output end of the signal processing circuit 6 is in communication connection with the input end of the processor 8;
the output end of the bus voltage detection module 2 is also in communication connection with the input end of the processor 8 (this connection relation is not shown in the figure), and the output end of the processor 8 is in communication connection with the input end of the communication module 7 and the input end of the data storage module 9 respectively.
The power module 1 supplies power to each module in a multi-path isolation voltage output mode; the power supply module 1 comprises a first circuit breaker QF11 and a second circuit breaker QF21 with Residual Current Device (RCD) protection, wherein the first circuit breaker QF11 and the second circuit breaker QF21 are arranged in parallel, the first circuit breaker QF11 and the second circuit breaker QF21 adopt a power supply form of dual power supply end mutual switching (dual power supply switching) (when the first circuit breaker QF11 is switched on, the second circuit breaker QF21 is disconnected, and when the second circuit breaker QF21 is switched on, the first circuit breaker QF11 is disconnected), namely, the first circuit breaker QF11 and the second circuit breaker QF21 are connected in parallel and then are connected to all electric appliances in a high-low voltage power distribution cabinet;
as shown in fig. 2, the bus voltage detection module 2 is used for detecting a voltage difference between a positive bus and a negative bus; in this embodiment: the bus voltage detection module 2 comprises a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5 and an operational amplifier A2, wherein one end of the first resistor R1 is connected with a positive bus, and the other end of the first resistor R1 is connected with the non-inverting input end of the operational amplifier A2; one end of the third resistor R3 is connected to an Analog Ground (AGND), and the other end is connected to the non-inverting input terminal of the operational amplifier a 2; one end of the second resistor R2 is connected with the negative bus, and the other end is connected with the inverting input end of the operational amplifier A2; one end of the fourth resistor R4 is connected with the inverting input end of the operational amplifier A2, and the other end is connected with the output end of the operational amplifier A2; one end of the fifth resistor R5 is connected with the output end of the operational amplifier a2, the other end is connected with the processor 8, the positive bus voltage is subjected to voltage reduction processing by the first resistor R1 and the third resistor R3 and then input to the non-inverting input end of the operational amplifier a2, the negative bus voltage is subjected to voltage reduction processing by the second resistor R2 and then input to the inverting input end of the operational amplifier a2, and then the operational processing by the operational amplifier a2 is performed to obtain the detection differential voltage between the positive bus and the negative bus, and the detection differential voltage is output to the processor 8 as the second detection differential voltage.
The resistances of the first resistor R1, the second resistor R2, the third resistor R3, the fourth resistor R4, and the fifth resistor R5 are selected according to specific application scenarios, and each resistor may also be composed of a plurality of serially connected small resistors, which is not limited in the present invention. The operational amplifier a2 may be an active operational amplifier, and the voltages at the respective input terminals may be compared and output.
As shown in fig. 1, the incoming line loop current collection module 3 is configured to collect incoming line partial current, convert the incoming line partial current into small current, and output the small current to the signal processing circuit 6; the outgoing line loop current acquisition module 4 is used for acquiring outgoing line partial current, converting the outgoing line partial current into small current and outputting the small current to the signal processing circuit 6. In this embodiment: the incoming loop current acquisition module 3 adopts a 5A current transformer, and the outgoing loop current acquisition module 4 adopts a 100A/20mA current transformer.
The thermal imaging monitoring module 5 is used for monitoring the temperature change of the whole power distribution cabinet and giving an alarm when the temperature is abnormal.
The signal processing circuit 6 is used for raising current signals collected by the incoming line loop current collection module 3 and the outgoing line loop current collection module 4 to the lowest sampling point of an analog-to-digital converter (ADC) arranged in the processor 8.
The communication module 7 (communication interface module) adopts a general RS-485 and Modbus RTU communication protocol, and can realize functions of remote measurement, remote control, remote signaling and the like, in the invention, because the high-low voltage power distribution cabinet monitoring system is not provided with a display structure, after the high-low voltage power distribution cabinet monitoring system is installed in a power distribution cabinet, local data display needs to transmit data from the communication module 7 to a touch screen arranged outside the power distribution cabinet through the RS-485 and Modbus RTU communication protocols, at the moment, a communication port of the communication module 7 needs to be occupied, and therefore, the communication module 7 is designed into a dual-communication mode.
The processor 8 is used for receiving the electric signals of the bus voltage detection module 2 and the signal processing circuit 6, storing the electric signals through the data storage module and sending the electric signals to the upper computer through the communication module 7.
In this embodiment: the signal processing circuit 6 adopts a controllable precise voltage stabilizing source (TL431) to raise signals, the collected current signals are raised to the lowest point and can be sampled and processed by an ADC, the signal processing circuit 6 is provided with 42 signal paths (namely, the total number of the current signals is 42), the 42 signal paths are divided into 7 groups, each group of 6 signal paths carries out signal selection through a single-end 8-channel multi-way switch (CD4051), the single-end 8-channel multi-way switch is controlled by the processor 8 and is conducted in a time-sharing mode, and 7 current signals flow into the ADC of the processor 8 through the signal paths to carry out analog-to-digital (A/D) conversion at the same time.
As shown in fig. 3, the thermal imaging monitoring module 5 includes a thermal imaging unit 50, a photographing unit 51 and an analyzing unit 52, and an output terminal of the thermal imaging unit 50 and an output terminal of the photographing unit 51 are respectively connected to an input terminal of the analyzing unit 52 in communication.
The thermal imaging unit 50 is used for performing non-contact thermal imaging detection on electrical components and circuits in the power distribution cabinet; the photographing unit 51 is configured to photograph the electrical components and the lines detected by the thermal imaging unit 50, obtain thermal imaging pictures of the electrical components and the lines, and transmit the thermal imaging pictures obtained by photographing to the analysis unit 52; the analysis unit 52 is configured to receive the thermal imaging picture output by the photographing unit 51, compare the thermal imaging picture with a standard thermal imaging picture when the electrical component and the circuit work normally, and determine whether the electrical component and the circuit work normally according to a comparison result.
As shown in fig. 4, the analyzing unit 52 includes a data processing unit 520, an alarm unit 521 and a display unit 522, wherein an input end of the data processing unit 520 is communicatively connected with an output end of the photographing unit 51, and an output end of the data processing unit 520 is communicatively connected with an input end of the alarm unit 521 and an input end of the display unit 522, respectively.
The data processing unit 520 is configured to receive the thermal imaging picture output by the photographing unit 51, compare the thermal imaging picture with a standard thermal imaging picture when the electrical component and the circuit work normally, and determine whether the electrical component and the circuit work normally according to a comparison result; an alarm unit 521, configured to send alarm information when the data processing unit 520 determines that the electrical component and the line are abnormal; and a display unit 522 for displaying alarm information and/or electrical components and line normal information. In an actual application scenario, the data processing unit 520 may send a high level signal to the alarm unit 521 and the display unit 522 when determining that the electrical component and the line are abnormal, and the alarm unit 521 and the display unit 522 respectively send alarm information and display alarm information according to the received high level signal. The high-level signal may also carry specific information (including one or more of name, number, location, etc.) of the abnormal electrical components and circuits, so that the display unit 522 may correspondingly display the specific information of the abnormal electrical components and circuits, thereby facilitating maintenance.
In this embodiment: the thermal imaging detection method of the thermal imaging unit 50 is as follows:
s1: carrying out binarization segmentation on the image through a threshold value, wherein the threshold value is as follows:
During specific testing, the thermal imaging unit 50 takes a picture through the infrared camera to obtain a thermal imaging picture inside the power distribution cabinet, the processing modes of the thermal imaging picture include, but are not limited to, MATLAB, OpenCV and the like, and other modes can be adopted to realize binarization segmentation of the thermal imaging picture. Alternatively, the threshold θ may be calculated using a MATLAB methodTAThen, the gray value of each pixel point in the thermal imaging picture can be assigned according to the numerical value of each point in the input thermal imaging picture matrix, and then the average gray value can be counted according to the gray value of each pixel point
And calculating the difference between classes σI. For example, the mean gray value
187, difference between classes σ of gray values of each partITo 5, a threshold value θ can be calculatedTAIs 240.
And then, respectively performing opening operation and closing operation on the image subjected to the binary segmentation, and then performing connected domain operation to obtain a connected domain area value, only keeping the connected domain with the connected domain area larger than Amin as a candidate connected domain of a brightness segmentation result after calculation, and marking as Rt, wherein Amin is 0.0025 r c, r and c are the width and height of the connected domain, and an ROI (region of interest) for detecting the distribution position of the electrical appliance element is marked as Rm. Here, the detecting and extracting manner of the ROI includes, but is not limited to, an image masking method, and specifically, the image masking method for the ROI region may be implemented by a conventional method in the art, and is not the invention point of the present invention, and thus, is not described again. For example, the mask is a binary image, the mask value of the region of interest is set to 255, and the mask value of the region of non-interest is 0, wherein the mask can be set by calling the Mat (Rect) setTo method through the Mat function method in OpenCV.
S2: the obtained values without any intersection in the Rt and Rm values are fused into an ROI area and recorded as Rf values;
s3: counting the sum of pixel values (specifically, gray values calculated according to RGB values) of each column of pixel points in Rf in a direction by columns to form a gray histogram, and separating a plurality of electrical components and lines in a region by peak values and low values of the histogram, so we record a new ROI after separation as sRf; the gray histogram may be created by MATLAB, OpenCV, or the like.
S4: truncating the height of the new ROI sRf after splitting according to the mean of all row pixels;
s5: ROI regions that are not electrical components and lines are filtered out.
The processing methods implemented by using software such as MATLAB and OpenCV in the above thermal imaging detection method may be all conventional methods in the art.
Based on the steps, thermal imaging pictures of the electrical components and circuits can be obtained, and the thermal imaging pictures are compared with preset standard thermal imaging pictures of the electrical components and circuits in normal working, so that whether the electrical components and circuits are normal or not can be judged.
When the obtained thermal imaging picture is compared with the standard thermal imaging picture, the difference value of pixel points at the same position in the two pictures can be obtained, and whether each electrical component and each circuit are normal can be determined according to whether the difference value exceeds a preset pixel difference threshold value (equipment is carried out according to the actual working conditions of different types of electrical components and circuits). Here, whether the electrical components and the circuits are normal is judged according to the difference between the pixel points at the same positions of the two pictures, which is equivalent to judging whether the electrical components and the circuits are in a normal working state according to the difference between the current temperature of the electrical components and the circuits and the standard temperature during normal working, so that accurate temperature monitoring of the electrical components and the circuits can be realized.
According to the high-low voltage power distribution cabinet monitoring system, the detection modules are arranged at the positions of the bus, the incoming line loop, the outgoing line loop and the like, so that various parameters in a power distribution system can be accurately detected in real time, wherein the parameters comprise bus voltage and frequency of a three-phase incoming line, current of two paths of three-phase incoming lines, split phase and total active power, reactive power, power factors, active electric energy, reactive electric energy and other on-off states and electric parameters of 36 outgoing lines; moreover, remote centralized monitoring of data in the high-voltage power distribution cabinet and the low-voltage power distribution cabinet can be realized through remote communication; and the thermal imaging monitoring module is arranged to shoot thermal imaging pictures of electrical components and circuits in the power distribution cabinet and compare the thermal imaging pictures with the standard thermal imaging pictures, so that whether the electrical components and the circuits are in a normal operation state or not can be judged, and accurate temperature monitoring of the electrical components and the circuits is realized.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, where the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A monitoring system of a high-low voltage power distribution cabinet is characterized by comprising a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power supply module is respectively electrically connected with the bus voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module, and supplies power to each module;
the output end of the incoming line loop current acquisition module is in communication connection with the input end of the signal processing circuit, and the output end of the outgoing line loop current acquisition module is in communication connection with the input end of the signal processing circuit; the output end of the signal processing circuit is in communication connection with the input end of the processor;
the output end of the bus voltage detection module is in communication connection with the input end of the processor, and the output end of the processor is in communication connection with the input end of the communication module and the input end of the data storage module respectively;
the thermal imaging monitoring module comprises a thermal imaging unit, a photographing unit and an analysis unit, wherein the output end of the thermal imaging unit and the output end of the photographing unit are respectively in communication connection with the output end of the analysis unit.
2. The monitoring system for the high-low voltage power distribution cabinet according to claim 1, wherein the power module supplies power to each module by adopting a multi-path isolated voltage output mode; wherein, power module includes two first circuit breakers and the second circuit breaker of taking the residual current device protection, and first circuit breaker and second circuit breaker set up in parallel each other.
3. The monitoring system of the high-low voltage power distribution cabinet according to claim 1, wherein the bus voltage detection module comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and an operational amplifier, one end of the first resistor is connected with the positive bus, and the other end of the first resistor is connected with the non-inverting input end of the operational amplifier; one end of the third resistor is connected with the analog ground, and the other end of the third resistor is connected with the non-inverting input end of the operational amplifier; one end of the second resistor is connected with the negative bus, and the other end of the second resistor is connected with the inverting input end of the operational amplifier; one end of the fourth resistor is connected with the inverting input end of the operational amplifier, and the other end of the fourth resistor is connected with the output end of the operational amplifier; one end of the fifth resistor is connected with the output end of the operational amplifier, and the other end of the fifth resistor is connected with the processor.
4. The monitoring system of claim 1, wherein the incoming loop current collection module employs a 5A current transformer, and the outgoing loop current collection module employs a 100A/20mA current transformer.
5. The monitoring system for the high-low voltage power distribution cabinet of claim 1, wherein the communication module is an RS485 communication module.
6. The monitoring system for the high-low voltage power distribution cabinet according to claim 1, wherein the analysis unit comprises a data processing unit, an alarm unit and a display unit;
the input end of the data processing unit is in communication connection with the output end of the photographing unit, and the output end of the data processing unit is in communication connection with the input end of the alarm unit and the input end of the display unit respectively.
7. A thermal imaging detection method adopting the thermal imaging unit in the monitoring system of the high-low voltage power distribution cabinet of any one of claims 1 to 6 is characterized by comprising the following steps:
s1: carrying out binarization segmentation on the image through a threshold value, wherein the threshold value is as follows:
then, conducting on-off operation and on-off operation on the image subjected to binarization segmentation respectively, conducting connected domain operation to obtain a connected domain area value, only keeping the connected domain with the connected domain area larger than Amin after calculation as a candidate connected domain of a brightness segmentation result, and marking as Rt, wherein Amin is 0.0025 r c, r and c are the width and height of the connected domain, and an ROI (region of interest) for detecting the distribution position of the electrical appliance element is marked as Rm;
s2: the obtained values without any intersection in the Rt and Rm values are fused into an ROI area and recorded as Rf values;
s3: counting the sum of pixel values (specifically, gray values calculated according to RGB values) of each column of pixel points in Rf in a direction by columns to form a gray histogram, and separating a plurality of electrical components and lines in a region by peak values and low values of the histogram, so we record a new ROI after separation as sRf;
s4: truncating the height of the new ROI sRf after splitting according to the mean of all row pixels;
s5: filtering out ROI areas which are not electrical elements and lines;
then the thermal imaging picture of each electrical element and circuit can be obtained, and compared with the preset standard thermal imaging picture when each electrical element and circuit normally work, whether each electrical element and circuit are normal can be judged.
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