CN114018449B - Flexible printed circuit board pressure sensor module, and preparation method and application thereof - Google Patents
Flexible printed circuit board pressure sensor module, and preparation method and application thereof Download PDFInfo
- Publication number
- CN114018449B CN114018449B CN202111259975.2A CN202111259975A CN114018449B CN 114018449 B CN114018449 B CN 114018449B CN 202111259975 A CN202111259975 A CN 202111259975A CN 114018449 B CN114018449 B CN 114018449B
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- Prior art keywords
- sensor module
- flexible
- circuit board
- printed circuit
- pressure sensor
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000011540 sensing material Substances 0.000 claims abstract description 15
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 229910052723 transition metal Inorganic materials 0.000 claims description 5
- -1 transition metal chalcogenide Chemical class 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- NGTSQWJVGHUNSS-UHFFFAOYSA-N bis(sulfanylidene)vanadium Chemical compound S=[V]=S NGTSQWJVGHUNSS-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical group S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a flexible printed circuit board pressure sensor module, a preparation method and application thereof, and relates to the technical field of flexible pressure sensors. The preparation method of the invention comprises the following steps: printing: dividing a pressure sensing area on the surface of a flexible substrate by taking the flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate; and (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging mode, wherein the temperature of the low-temperature packaging is below 200 ℃; pressing: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer; and (3) forming: and (5) cutting the appearance to obtain the flexible printed circuit board pressure sensor module. The flexible printed circuit board pressure sensor module prepared by the invention has the characteristics of flexible film and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
Description
Technical Field
The invention relates to the technical field of flexible pressure sensors, in particular to a flexible printed circuit board pressure sensor module, a preparation method and application thereof.
Background
With the high-speed development of the mobile internet, the requirements of people on the electronic consumer products and the functional requirements are higher, and the development and application of the flexible electronic equipment and the wearable electronic equipment have wide market prospects. Pressure touch sensors are commonly used in electronic products, but the application of the pressure touch sensors to flexible electronic devices is still challenging, the flexible electronic devices need to be folded or bent when in use, and the sensing performance of the sensors can be changed or degraded due to mechanical pressure and deformation during bending and folding, so that the pressure sensing effect is poor. Therefore, there is a need to develop new pressure sensor modules to accommodate the application requirements of flexible electronic devices.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method for manufacturing a flexible printed circuit board pressure sensor module that has the characteristics of flexible thin film and high sensitivity.
The preparation method of the flexible printed circuit board pressure sensor module comprises the following steps:
Printing: dividing a pressure sensing area on the surface of a flexible substrate by taking the flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate;
And (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging mode, wherein the temperature of the low-temperature packaging is below 200 ℃;
Pressing: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer;
and (3) forming: and (5) cutting the appearance to obtain the flexible printed circuit board pressure sensor module.
In the preparation method, the resistance value of the two-dimensional sensitive material can be obviously changed when the two-dimensional sensitive material is stretched or contracted under the stress, the heat resistance is insufficient, the packaging is carried out at the low temperature below 200 ℃, the material is not influenced by the high temperature, and the prepared flexible printed circuit board pressure sensor module has the advantages of flexible film formation and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
In one embodiment, in the printing step, the two-dimensional sensitive material is an existing pressure sensitive material, for example, a pressure sensitive material with graphene and a transition metal chalcogenide as main raw materials, and the transition metal chalcogenide is molybdenum disulfide and/or vanadium disulfide.
In one embodiment, in the printing step, the tolerance of the width and the length of the pressure sensitive material layer at the time of printing meets the requirements of + -0.05 mm, and the tolerance of the thickness meets the requirements of +0.02/-0.15 mm.
In one embodiment, in the low-temperature packaging step, the temperature of the low-temperature packaging is 150-200 ℃, the transmission speed of the packaging is 2-5m/min, and the packaging time is 1-3min.
In one embodiment, the pressure of the lamination is 140-160psi and the lamination temperature is 150-180 ℃.
The invention also provides a flexible printed circuit board pressure sensor module obtained by adopting the preparation method.
The flexible printed circuit board pressure sensor module has the characteristics of flexible film, high sensitivity and the like.
In one embodiment, the flexible printed circuit board pressure sensor module comprises a flexible substrate, a pressure sensing material layer, an electronic device, bonding glue and a reinforcing plate, wherein the pressure sensing material layer is laid in a pressure sensing area on the flexible substrate, the electronic device is fixed on the flexible substrate, and the reinforcing plate is bonded and fixed on the pressure sensing material layer by the bonding glue.
The invention also provides application of the flexible printed circuit board pressure sensor module in preparation of flexible electronic equipment or wearable equipment.
Compared with the prior art, the invention has the following beneficial effects:
According to the preparation method, the packaging is performed at the low temperature below 200 ℃ based on the properties of the two-dimensional sensitive material, so that the two-dimensional sensitive material is not influenced by high temperature, and the prepared flexible printed circuit board pressure sensor module has the advantages of flexible film formation and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of a pressure sensor module in an embodiment.
In the figure, 1, FPC,2, a pressure sensing material layer, 3, adhesive glue, 4 and a steel sheet.
Detailed Description
In order that the invention may be understood more fully, a more particular description of the invention will be rendered by reference to the preferred embodiments that are now set forth. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
A flexible printed circuit board pressure sensor module, as shown in FIG. 1, includes an FPC 1, a pressure sensitive material layer 2, electronic devices (not shown), an adhesive 3, and a steel sheet 4. The pressure sensing material layer 2 is laid in the pressure sensing area of the FPC 1, the pressure sensing material layer 2 has pressure sensing effect, and electronic devices such as resistors, capacitors, chips and the like are fixed on the FPC 1. The bonding glue 3 is filled on the electronic device and the pressure sensing material layer 2, the steel sheet 4 is attached to the surface of the bonding glue 3, and the steel sheet 4 is used for protecting the pressure sensing material layer 2 and the electronic device.
The flexible printed circuit board pressure sensor module is prepared by the following method:
(1) Printing two-dimensional sensitive materials
And taking one FPC board, dividing each functional area including the pressure sensing area, and processing the flexible substrate according to the existing general processing method of the flexible substrate.
Printing a two-dimensional sensitive material on a pressure-sensitive area of the FPC board, wherein the two-dimensional sensitive material is commercially available pressure-sensitive material containing graphene and transition metal chalcogenide, and a pressure-sensitive material layer is formed on the surface of the FPC board. When the two-dimensional sensitive material is stretched or contracted under the stress, the resistance value of the two-dimensional sensitive material can be obviously changed, so that the pressure sensing effect is achieved. The width tolerance of the pressure sensing area during printing meets +/-0.05 mm, and the thickness of the pressure sensing area meets the tolerance requirement of +0.02/-0.15 mm.
(2) Low-temperature packaging process
Because the high temperature resistant effect of the two-dimensional sensitive material is relatively poor, the two-dimensional sensitive material needs to be packaged at a lower temperature, and in particular, electronic devices such as a resistor, a capacitor, a chip and the like are mounted on the FPC board at 180 ℃ so as to realize corresponding functions. The transmission speed during packaging is 2-5m/min, and the packaging time is 1-3min.
(3) Reinforcing plate of pressing module
Since the electronic device and the two-dimensional sensitive material are packaged, in order to protect the reliability of the electronic device and the two-dimensional sensitive material, the reinforcing plate (i.e., the steel plate) is pressed on the reverse side of the packaged device. Specifically, the lamination is carried out at 180 ℃, the steel plate coated with the adhesive is laminated on the packaged semi-finished product, the pressure is 150psi, and the peel strength after lamination is more than 1.0N/m 2, so that good bonding force is ensured. The steel plate can protect the two-dimensional sensitive material and the electronic device, and ensures the sensitivity of the two-dimensional sensitive material and the corresponding function of the electronic device.
(4) Pressure sensor module molding
And (5) performing shape cutting according to the requirement to obtain the flexible printed circuit board pressure sensor module.
(5) Functional testing
And performing performance test on the formed pressure sensor module, wherein test items comprise tolerance measurement, water drop angle test (water drop angle tester) and voltage test (voltage variation tester).
The test results are: the appearance tolerance of the pressure sensing material layer is less than +/-0.05 mm; the water drop angle test meets the requirement of 10-60 degrees; the voltage variation value of the pressure sensitive adhesive test is smaller than 20MV.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (5)
1. The preparation method of the flexible printed circuit board pressure sensor module is characterized by comprising the following steps of:
Printing: dividing a pressure sensing area on the surface of a flexible substrate by taking the flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate; the two-dimensional sensitive material is a pressure sensitive material with main raw materials of graphene and transition metal chalcogenide, and the transition metal chalcogenide is molybdenum disulfide and/or vanadium disulfide;
and (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging mode, wherein the temperature of the low-temperature packaging is 150-200 ℃, the transmission speed of the packaging is 2-5m/min, and the packaging time is 1-3min;
pressing: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer; the pressing pressure is 140-160psi, and the pressing temperature is 150-180 ℃;
and (3) forming: and (5) cutting the appearance to obtain the flexible printed circuit board pressure sensor module.
2. The method of claim 1, wherein in the printing step, the tolerance of the width and length of the pressure sensitive material layer at the time of printing satisfies a ± 0.05mm requirement, and the tolerance of the thickness satisfies a +0.02/-0.15mm requirement.
3. A flexible printed circuit board pressure sensor module obtained by the manufacturing method according to any one of claims 1 to 2.
4. A flexible printed circuit board pressure sensor module according to claim 3, comprising a flexible substrate, a layer of pressure sensitive material, an electronic device, an adhesive and a reinforcing plate, wherein the layer of pressure sensitive material is laid on a pressure sensitive area on the flexible substrate, the electronic device is secured to the flexible substrate, and the adhesive adhesively secures the reinforcing plate to the layer of pressure sensitive material.
5. Use of the flexible printed circuit board pressure sensor module of claim 3 or 4 for the preparation of flexible electronic or wearable devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259975.2A CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259975.2A CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114018449A CN114018449A (en) | 2022-02-08 |
| CN114018449B true CN114018449B (en) | 2024-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111259975.2A Active CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN114018449B (en) |
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- 2021-10-28 CN CN202111259975.2A patent/CN114018449B/en active Active
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| Publication number | Publication date |
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| CN114018449A (en) | 2022-02-08 |
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