CN114011727A

CN114011727A - Survey and compile all-in-one

Info

Publication number: CN114011727A
Application number: CN202111209376.XA
Authority: CN
Inventors: 郑军; 邬晨欢; 黄举; 钱徐锋
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2022-02-08

Abstract

The invention relates to a testing and weaving integrated machine. The integrated testing and encoding machine comprises a feeding assembly, a positioning assembly and a positioning assembly, wherein the feeding assembly is used for feeding and positioning an IC; the detection assembly is arranged at the downstream of the feeding assembly and is used for detecting the IC after the feeding positioning; and the taping component is arranged at the downstream of the detection component and is used for taping the detected IC. The integrated testing and encoding machine solves the problem that the sorting machine can mix ICs together after detecting and sorting the ICs, which is not beneficial to subsequent processing.

Description

Survey and compile all-in-one

Technical Field

The invention relates to the technical field of integrated circuit production equipment, in particular to a testing and weaving integrated machine.

Background

Nowadays, technology is continuously developed and innovated, and application and demand of Integrated Circuits (ICs) are increasing, and since the ICs need to undergo multiple precise manufacturing processes during production, a series of tests must be performed before the ICs are shipped and sold to ensure the product quality of the ICs. The detection content comprises electrical property test, visual detection and the like, and after all tests are finished, the IC product passing the tests can enter the sales market only by being braided. Existing sort testers mix together the ICs that pass the inspection and sorting after they have been inspected and sorted. In the subsequent IC application process, the IC needs to be positioned again to perform taping, which results in low production efficiency.

Disclosure of Invention

In view of this, it is necessary to provide a testing and encoding all-in-one machine to solve the technical problem that in the prior art, the sorting machine can mix the ICs together after detecting and sorting the ICs, and the production efficiency is low.

The invention provides a testing and weaving integrated machine, which comprises: the feeding assembly is used for feeding and positioning the IC; the detection assembly is arranged at the downstream of the feeding assembly and is used for detecting the IC after the feeding positioning; and the taping component is arranged at the downstream of the detection component and is used for taping the detected IC.

So set up, use the material loading subassembly earlier and be used for carrying out the material loading location to IC, then detect the IC after the material loading location through the detecting element, directly let the braid subassembly carry out the braid to the IC after detecting at last and handle. Like this, when the braid subassembly was handled to the IC braid, can directly utilize material loading subassembly and detection subassembly to the material loading location and the detection of IC, need not additionally to set up the relevant part that carries out material loading location and detection to the IC, very big simplification a series of manufacturing procedure of IC, improved IC's production installation effectiveness.

In another embodiment, a braid assembly comprises: the braiding track is connected with an output track of the detection assembly; and a taping robot for mounting the detected IC on a tape.

So set up, can promote braid efficiency and degree of automation.

In another embodiment, the taping assembly further includes a top surface detector for detecting a top surface of the IC, the top surface detector being located upstream of the taping robot, the taping robot placing the failed IC into the taping zone drop bin if the top surface detector detects that the top surface of the IC does not meet the top surface detection criteria; if the top detector detects that the top surface of the IC meets the top surface detection criteria, the taping robot mounts the acceptable IC on the tape.

So set up, can promote and detect the automaticity.

In another embodiment, a detection assembly comprises: the temperature and pressure detection assembly is arranged at the downstream of the feeding assembly and is used for carrying out temperature control and pressure detection on the IC; 3D determine module, 3D determine module install the low reaches of warm pressure determine module, and 3D determine module is used for detecting IC's appearance, and the braid unit mount is in 3D determine module's low reaches.

So set up, can promote and detect the automaticity, realize temperature and pressure test.

In another embodiment, a warm-pressure detection assembly includes: the preheating disc is arranged at the downstream of the feeding assembly; the preheating feeding manipulator is arranged at the preheating disc and used for placing the IC (integrated circuit) for feeding and positioning the feeding assembly in the preheating disc; the pressure measuring area feeding shuttle is arranged at the downstream of the preheating disc; the pressure measuring feeding mechanical arm is arranged at the position of the pressure measuring area feeding shuttle and is used for placing the preheated IC into the pressure measuring area feeding shuttle; the pressure measuring device is arranged at the downstream of the material inlet shuttle in the pressure measuring area and used for measuring the pressure of the IC and marking the pressure measuring result of the IC; the pressure measuring area discharge shuttle is arranged at the downstream of the pressure measuring device; and the warm-pressing screening mechanical arm is arranged at the position of the pressure measuring area discharging shuttle, the qualified IC is placed at the position of the 3D detection assembly according to the pressure measuring result, and the unqualified IC is placed in the warm-pressing area blanking box.

So set up, can preheat to realize automatic feeding and unloading, preheat and pressure measurement.

In another embodiment, a 3D detection assembly includes: the PNP material shuttle is arranged at the downstream of the warm pressing screening mechanical arm and is used for receiving qualified ICs; the 3D detector is arranged at the downstream of the PNP material shuttle; the 3D detection manipulator is arranged between the 3D detector and the PNP material shuttle, and is used for grabbing the IC on the PNP material shuttle at the 3D detector for 3D detection and then placing the IC which is used for marking the 3D detection result after the 3D detection into the PNP material shuttle; the 3D screening mechanical arm is installed between the PNP material shuttle and the braiding assembly, the 3D screening mechanical arm places qualified ICs at the braiding assembly according to 3D detection results, and places unqualified ICs in the 3D detection blanking box.

So set up, can carry out 3D automatically and detect and carry out the automatic blanking that detects.

In another embodiment, a loading assembly comprises: a vibrating tray for receiving unsorted and detected ICs; a guide rail installed downstream of the vibratory tray for conveying the sorted ICs; the IC positioner is arranged at the downstream of the guide rail and used for positioning the IC; and the surface detection mechanism is arranged at the downstream of the IC positioner and is used for detecting the information of the surface of the IC, if the IC passes the surface detection, the IC is put at the detection component, and if the IC does not pass the surface detection, the IC is put in the blanking box of the feeding area.

So set up, can realize automatic feeding and material all in one piece to conveniently select separately and fix a position.

In another embodiment, a surface sensing mechanism comprises: the pin objective table is used for being matched with the IC positioner to fix the IC; and the pin detector is used for detecting pins of the IC on the pin objective table.

So set up, can carry out pin cooperation and detection, promoted the automatic performance.

In another embodiment, a loading assembly comprises: an IC rotator installed downstream of the IC positioner, the IC rotator for rotating the IC to a predetermined direction; and the discharging manipulator is used for placing the IC rotated to the preset direction by the IC rotator to the detection assembly.

So set up, can carry out IC location and rotation to convenient detection and location.

In another embodiment, the loading assembly further comprises a loading zone shuttle mounted downstream of the drop robot, the drop robot placing the IC turned to the predetermined orientation onto the loading zone shuttle.

So set up, can carry out automatic feeding, promote degree of automation and production efficiency.

Drawings

Fig. 1 is a schematic top view of an embodiment of the integrated test-and-knitting machine according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

For ease of understanding and clarity of the description of the method, the structure of the attaching device will be briefly described before the description of the method.

As shown in fig. 1, fig. 1 shows an embodiment of the testing and weaving machine of the present invention, which includes a feeding assembly 10, a detecting assembly 20 and a braiding assembly 30. Wherein the inspection assembly 20 is disposed downstream of the feeding assembly 10 and the taping assembly 30 is disposed downstream of the inspection assembly 20.

By applying the technical scheme of the invention, the feeding assembly 10 is firstly used for feeding and positioning the IC, then the IC after feeding and positioning is detected by the detection assembly 20, and finally the braid assembly 30 is directly used for braid processing on the detected IC. Like this, when braid subassembly 30 was handled to the IC braid, can directly utilize material loading subassembly 10 and detection subassembly 20 to the material loading location and the detection of IC, need not additionally to set up the relevant part of carrying out material loading location and detection to the IC, very big simplification a series of manufacturing procedure of IC, improved IC's detection packing efficiency, practiced thrift time and cost of labor.

As an alternative embodiment, braiding assembly 30 comprises a braiding track 31 and a braiding robot. Where the taping track 31 is connected to the output track of the inspection unit 20. In use, the taping robot mounts the tested IC to the tape.

More preferably, in the solution of the present embodiment, the taping unit 30 further includes a top surface detector 32, the top surface detector 32 is used for detecting the top surface of the IC, and the top surface detector 32 is located upstream of the taping robot. In use, if the top surface detector 32 detects that the top surface of the IC does not meet the top surface detection criteria, the braiding robot places the failed IC into the braiding area drop box; if the top surface detector 32 detects that the top surface of the IC meets the top surface detection criteria, the taping robot mounts the acceptable IC on the tape. Therefore, whether the label on the top surface of the IC is accurate and clear or not can be judged, and the actual direction of the IC can be judged.

As shown in fig. 1, in the solution of the present embodiment, the detecting component 20 includes a temperature and pressure detecting component and a 3D detecting component. Wherein, warm pressure detection subassembly installs in the low reaches of material loading subassembly 10, and 3D detection subassembly installs in warm pressure detection subassembly's low reaches, and braid subassembly 30 installs in 3D detection subassembly's low reaches. When the temperature and pressure detection assembly is used, the temperature and pressure of the IC are controlled and detected by the temperature and pressure detection assembly, and then the appearance of the IC is detected by the 3D detection assembly. It should be noted that the 3D detection component mainly determines whether the external shape of the IC is consistent with the standard external shape through visual detection, so as to determine whether the IC is deformed or damaged.

Optionally, in the technical scheme of this embodiment, the warm-pressing detection assembly includes a pre-warm plate 21, a pre-warm feeding manipulator 22, a pressure measuring feeding manipulator, a pressure measuring area feeding shuttle 23, a pressure measuring device 24, a pressure measuring area discharging shuttle 25, and a warm-pressing screening manipulator. The preheating tray 21 is installed at the downstream of the feeding assembly 10, the preheating feeding manipulator 22 is installed at the preheating tray 21, the pressure measuring area feeding shuttle 23 is installed at the downstream of the preheating tray 21, the pressure measuring feeding manipulator is installed at the pressure measuring area feeding shuttle 23, the pressure measuring device 24 is installed at the downstream of the pressure measuring area feeding shuttle 23, the pressure measuring area discharging shuttle 25 is installed at the downstream of the pressure measuring device 24, and the temperature and pressure screening manipulator is installed at the pressure measuring area discharging shuttle 25. When in use, the pre-warming feeding manipulator 22 puts the ICs loaded and positioned by the loading assembly 10 into the pre-warming tray 21, so as to pre-warm the ICs. The IC after preheating is placed into a pressure measuring area feeding shuttle 23 by a pressure measuring feeding mechanical arm, a pressure measuring device 24 is used for measuring the pressure of the IC and marking the pressure measuring result of the IC, the pressure measuring device 24 mainly plays a role in testing the electrical property of the IC under a specific environment, the temperature and pressure screening mechanical arm places qualified ICs into a 3D detection assembly according to the pressure measuring result, and unqualified ICs are placed into a temperature and pressure area blanking box 26. Optionally, the preheating plate 21 may provide a refrigerant and a heating rod for heating through a refrigerant machine to realize a temperature control function, the whole machine is sealed as an integral chamber, and a dryer is used to blow air to the internal chamber, so as to ensure that the feeding area and the testing area are in a dry environment, thereby meeting the requirements of frost prevention and condensation prevention for the IC and the surrounding environment thereof in a low-temperature environment. When the preheating plate 21 needs to be heated, an electric heating structure can be adopted for heating so as to improve the heating efficiency. Optionally, in the technical scheme of this embodiment, the preheating feeding manipulator 22 and the pressure measuring feeding manipulator are the same manipulator, and the range of the preheating feeding manipulator 22 covers the preheating plate 21 and the pressure measuring area feeding shuttle 23. As other alternative embodiments, the pre-temperature loading robot 22 and the pressure loading robot may be two different robots.

In the technical solution of this embodiment, more preferably, the 3D detecting assembly includes a PNP material shuttle 27, a 3D detector 28, a 3D detecting manipulator and a 3D screening manipulator 29, where the PNP material shuttle 27 is installed downstream of the warm-pressing screening manipulator, the 3D detector 28 is disposed downstream of the PNP material shuttle 27, the 3D detecting manipulator is installed between the 3D detector 28 and the PNP material shuttle 27, and the 3D screening manipulator 29 is installed between the PNP material shuttle 27 and the braiding assembly 30. In the using process, the PNP material shuttle 27 is used for receiving qualified ICs, the 3D detection manipulator grabs the ICs on the PNP material shuttle 27 to carry out 3D detection at the 3D detector 28, then the ICs which are used for marking 3D detection results after 3D detection are placed into the PNP material shuttle 27, finally the 3D screening manipulator 29 places the qualified ICs at the braiding component 30 according to the 3D detection results, and places the unqualified ICs in the 3D detection blanking box.

As shown in fig. 1, in the solution of the present embodiment, the feeding assembly 10 includes a vibration plate 11, a guide rail, an IC positioner 12, and a surface detection mechanism 13. Wherein a guide rail is installed downstream of the vibration plate 11, an IC positioner 12 is installed downstream of the guide rail, and a surface detection mechanism 13 is installed downstream of the IC positioner 12. In use, the IC to be sorted and detected is received by the vibrating tray 11, the guide rail conveys the IC to be sorted, the IC positioner 12 is used for positioning the IC, and finally, the information of the surface of the IC is detected by the surface detection mechanism 13. If the IC passes the surface inspection, the IC is transported to the inspection module 20, and if the IC does not pass the surface inspection, the IC is put into the feeding area blanking box 15. It should be noted that the surface information may include two-dimensional code information or barcode information.

As an alternative embodiment, in the technical solution of the present embodiment, the surface detection mechanism 13 includes a pin stage and a pin detector. The pin stage is matched with the IC positioner 12 to fix the IC, and the pin detector is used for detecting the pins of the IC on the pin stage.

As shown in fig. 1, in the solution of the present embodiment, the feeding assembly 10 includes an IC rotator 14 and a discharging robot. Wherein the IC rotator 14 is mounted downstream of the IC positioner 12. In the using process, the IC rotator 14 rotates the IC to the predetermined direction, and the placing robot places the IC rotated by the IC rotator 14 to the predetermined direction on the detecting assembly 20, so that the subsequent detection of the IC and the processing procedures of production and installation can be facilitated.

Optionally, in the technical solution of the present embodiment, the loading assembly 10 further includes a loading area shuttle 16, the loading area shuttle 16 is installed downstream of the discharging manipulator, and the discharging manipulator places the IC turned to the predetermined direction on the loading area shuttle 16.

Specifically, the use flow of the testing and editing all-in-one machine is as follows: bulk IC is put into a vibration disc 11 and enters a straight vibration track through a bent track, and a blowing function is added at the joint of the bent track and the straight track to jointly act on the IC to enable the IC to reach the tail end of the track to take material. And then entering a turntable detection area, firstly carrying out IC positioning through an IC positioner 12, carrying out pin detection and detection on the surface detection mechanism 13 after positioning, detecting the pins without entering a feeding area blanking box 15, entering an IC rotator 14 after passing, rotating the ICs to an angle corresponding to pressure measurement, and then entering a feeding area material shuttle 16. And then, the IC is taken by a preheating feeding manipulator 22 and enters a preheating disc 21 for preheating, when the temperature of the IC reaches the preset temperature, the IC is sent to a pressure measuring device 24, after the electrical property test is finished, the IC enters a pressure measuring area discharging shuttle 25, the IC is screened by a warm-pressing screening manipulator, the qualified IC is placed at a PNP material shuttle 27, and the unqualified IC is placed in a warm-pressing area blanking box 26. The PNP shuttle 27 brings the IC to the 3D detector 28, allowing the 3D detector 28 to perform visual inspection. After the visual detection is finished, the IC enters the PNP material shuttle 27, and the failed items are respectively fed into the 3D detection blanking box according to the failed detection. Preferably, the 3D detection blanking boxes can be classified, the blanking boxes with the unqualified sizes are placed into the size blanking boxes, and the blanking boxes with the unqualified identifications are placed into the identification blanking boxes. Finally, the detected IC enters the area where the braiding assembly 30 is located, the detected IC is mounted on the braiding through the braiding track 31 and the braiding manipulator, and the IC mounted on the braiding can be output and discharged.

The various shuttle devices are mainly used as IC conveying carriers, so that the ICs can be conveniently conveyed in a state of being unknown at present. Optionally, the positioner or the manipulator may be a clamping type, a suction cup type, or even a soft bionic finger.

In the process, the bulk IC must be subjected to electrical property test and visual test to ensure the consistency and stability of the product, the IC passing the test can be called as a qualified product, and before sale, the IC product needs to be subjected to taping treatment, such as 2500 pieces/disc, 4000 pieces/disc and the like, so that the counting and storage of the product are facilitated.

According to the technical scheme, the sorting machine and the braider are combined together, the testing and braiding all-in-one machine is invented, a large number of repeated steps are saved, the overall efficiency of the IC testing and sorting braiding is greatly improved to the maximum extent on the premise that functions are not lost, labor cost and production cost are saved, and finally, as the size of the machine is much smaller than that of the two machines, the same factory building planning can accommodate more machines, and the production scale is improved.

The features of the above-described embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above-described embodiments are not described, but should be construed as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a survey and compile all-in-one which characterized in that includes:

the feeding assembly (10) is used for feeding and positioning the IC;

the detection assembly (20) is arranged at the downstream of the feeding assembly (10) and is used for detecting the IC after feeding and positioning;

and the braiding assembly (30) is arranged at the downstream of the detection assembly (20) and is used for braiding the detected IC.

2. The machine according to claim 1, wherein the braid assembly (30) comprises:

a braiding track (31), the braiding track (31) being connected to an output track of the detection assembly (20);

and a taping robot for mounting the detected IC on a tape.

3. The apparatus of claim 2 wherein the braid assembly (30) further comprises a topside detector (32), the topside detector (32) for detecting a topside of the IC, the topside detector (32) located upstream of the braid robot, the braid robot placing an unacceptable IC in the braid area drop bin if the topside detector (32) detects that the topside of the IC does not meet a topside detection criteria; the taping robot mounts a qualified IC on the tape if the top side detector (32) detects that the top side of the IC meets a top side detection criterion.

4. The testing and weaving all-in-one machine according to claim 1, characterized in that the detection assembly (20) comprises:

the warm-pressing detection assembly is arranged at the downstream of the feeding assembly (10) and is used for carrying out temperature control and pressure detection on the IC;

the 3D detection assembly is installed at the downstream of the warm-pressing detection assembly, the 3D detection assembly is used for detecting the appearance of the IC, and the braid assembly (30) is installed at the downstream of the 3D detection assembly.

5. The testing and weaving all-in-one machine according to claim 4, wherein the warm-pressing detection assembly comprises:

a pre-temperature tray (21) mounted downstream of the feeding assembly (10);

the preheating feeding manipulator (22) is installed at the preheating disc (21) and is used for placing the IC (integrated circuit) fed and positioned by the feeding assembly (10) into the preheating disc (21);

a pressure measuring region feeding shuttle (23) arranged at the downstream of the preheating disc (21);

the pressure measuring feeding manipulator is arranged at the position of the pressure measuring area feeding shuttle (23) and is used for placing the preheated IC into the pressure measuring area feeding shuttle (23);

the pressure measuring device (24) is arranged at the downstream of the pressure measuring area feeding shuttle (23) and is used for measuring the pressure of the IC and marking the pressure measuring result of the IC;

a pressure measuring region discharging shuttle (25) installed downstream of the pressure measuring device (24);

and the warm-pressing screening mechanical arm is arranged at the position of the pressure measuring area discharging shuttle (25), places qualified ICs at the position of the 3D detection assembly according to the pressure measuring result, and places unqualified ICs in the warm-pressing area discharging box (26).

6. The testing and encoding all-in-one machine of claim 5, wherein the 3D detection component comprises:

the PNP material shuttle (27) is arranged at the downstream of the warm-pressing screening mechanical arm, and the PNP material shuttle (27) is used for receiving qualified ICs;

a 3D detector (28) disposed downstream of the PNP shuttle (27);

the 3D detection manipulator is arranged between the 3D detector (28) and the PNP material shuttle (27), and is used for grabbing the IC on the PNP material shuttle (27) to carry out 3D detection at the 3D detector (28), and then putting back the 3D detection result of the IC mark after the 3D detection to the PNP material shuttle (27);

the 3D screening mechanical arm (29) is installed between the PNP material shuttle (27) and the braiding component (30), the 3D screening mechanical arm (29) places qualified ICs at the braiding component (30) according to the 3D detection result, and places unqualified ICs in the 3D detection blanking box.

7. The testing and weaving all-in-one machine according to claim 1, characterized in that the loading assembly (10) comprises:

a vibrating tray (11) for receiving unsorted and detected ICs;

a guide rail installed downstream of the vibratory tray (11) for conveying the sorted ICs;

an IC positioner (12) mounted downstream of the rail for positioning an IC;

and the surface detection mechanism (13) is arranged at the downstream of the IC positioner (12) and is used for detecting the information of the surface of the IC, if the IC passes the surface detection, the IC is put at the detection component (20), and if the IC does not pass the surface detection, the IC is put in the blanking box (15) of the feeding area.

8. The testing-weaving machine according to claim 7, characterized in that the surface detection means (13) comprise:

a pin stage for fixing the IC in cooperation with the IC positioner (12);

and the pin detector is used for detecting pins of the IC on the pin objective table.

9. The testing and weaving all-in-one machine according to claim 7, characterized in that the loading assembly (10) comprises:

an IC rotator (14) mounted downstream of the IC positioner (12), the IC rotator (14) for rotating the IC to a predetermined orientation;

a discharging manipulator for placing the IC rotated to the predetermined direction by the IC rotator (14) at the detecting component (20).

10. The machine according to claim 9, wherein the loading assembly (10) further comprises a loading zone shuttle (16), the loading zone shuttle (16) being mounted downstream of the discharge robot, the discharge robot placing ICs turned to a predetermined orientation onto the loading zone shuttle (16).