CN114005818A - Wafer transfer method - Google Patents

Wafer transfer method Download PDF

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Publication number
CN114005818A
CN114005818A CN202110170599.3A CN202110170599A CN114005818A CN 114005818 A CN114005818 A CN 114005818A CN 202110170599 A CN202110170599 A CN 202110170599A CN 114005818 A CN114005818 A CN 114005818A
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wafers
row
wafer
column
arranging
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郎欣林
罗会才
闫静
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Shenzhen Fengtai Industrial Technology Co ltd
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Shenzhen Fengtai Industrial Technology Co ltd
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Priority to CN202110170599.3A priority Critical patent/CN114005818A/en
Publication of CN114005818A publication Critical patent/CN114005818A/en
Priority to PCT/CN2022/075364 priority patent/WO2022166953A1/en
Priority to TW111104279A priority patent/TWI823248B/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention relates to the technical field of semiconductor preparation and discloses a wafer transfer method. The wafer transfer method comprises the following steps: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers; arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of wafers; extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging a first column of wafers along a second direction; extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers. The wafer transfer method is used for transferring a plurality of wafers, so that high-density two-dimensional array arrangement with a certain distance is formed among the wafers, and the mass transfer of the wafers is realized.

Description

Wafer transfer method
Technical Field
The invention relates to the technical field of semiconductor preparation, in particular to a wafer transfer method.
Background
When the wafer is diced, the chip performance at the center of the wafer is relatively uniform, and the difference between the chip performance at the edge of the wafer and the chip performance at the center is large, which may have a difference of 5 wavelengths.
Therefore, when manufacturing a display screen using the chips on the wafer, if the chips are transferred and arranged in the order of the chips on the wafer, the quality distribution of the chips on the display screen may be uneven. For example, the quality of the wafer in some regions is generally high, and the quality of the wafer in some regions is generally poor, so that the overall performance of the display screen is not uniform, and the display frames of the display screen have obvious differences.
Disclosure of Invention
In order to solve the technical problem of arranging wafers in the wafer transfer process, the invention provides a wafer transfer method, which comprises the following steps:
arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of wafers;
extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;
arranging the first column of wafers in a second direction;
extracting the second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers;
and arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers.
Optionally, the arranging the first row of wafers in the first direction includes:
extracting the first row of chips from a wafer, wherein the wafer comprises a first row of chips and a second row of chips arranged at a first initial interval; arranging the extracted first row of wafers on the first tray along the first direction;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers comprises:
extracting the second row of chips from the wafer; and arranging the second row of wafers on the first material disc along the first direction at a preset first preset interval relative to the first row of wafers.
Optionally, the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers along a second direction includes:
extracting the first column of wafers from the first tray, wherein the first tray includes a first column of wafers and a second column of wafers arranged at a second initial spacing, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first column on the fourth tray along the second direction;
the extracting the second column of wafers, the second column of wafers including at least one wafer from the remainder of the first row of wafers and at least one wafer from the remainder of the second row of wafers; arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the first tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging the second row of extracted wafers on the fourth tray along the second direction at a preset second preset interval relative to the first row of wafers.
Optionally, the arranging the first row of wafers in the first direction includes:
extracting the first row of wafers from a second tray, wherein the second tray comprises a first row of wafers and a second row of wafers which are arranged at a first initial interval; arranging the extracted first row of wafers on the third tray along the first direction;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the second tray; and arranging the second row of wafers on the third material disc along the first direction at a preset first preset interval relative to the first row of wafers.
Optionally, the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers along a second direction includes:
extracting the first row of wafers from the third tray, wherein the third tray comprises a first row of wafers and a second row of wafers arranged at a second initial interval; the first column of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first column on the fifth tray along the second direction;
the extracting the second column of wafers, the second column of wafers including at least one wafer from the remainder of the first row of wafers and at least one wafer from the remainder of the second row of wafers; arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the third tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging the second row of wafers on the fifth tray along the second direction at a preset second preset interval relative to the first row of wafers.
Optionally, the first initial interval is smaller than the first preset interval.
The wafer transfer method according to any of claims 3 to 5, characterized in that said second initial interval is smaller than said second preset interval.
Optionally, a first preset angle is formed between the first direction and the second direction, and the first preset angle is between 0 ° and 180 °.
Optionally, the first direction and the second direction are perpendicular to each other.
Optionally, the wafer transfer method comprises the steps of:
arranging a first row of wafers along the first direction, the first row of wafers comprising a plurality of first sub-row wafers, the first sub-row of wafers comprising a plurality of wafers;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of second sub-row wafers, and the second sub-row wafers comprise a plurality of wafers;
extracting a first column of wafers, the first column of wafers comprising a plurality of first sub-columns of wafers, the first sub-columns of wafers comprising at least one wafer from the first sub-row of wafers and at least one wafer from the second sub-row of wafers;
arranging the first column of wafers along the second direction;
extracting the second column of wafers, the second column of wafers comprising a plurality of second sub-columns of wafers, the second sub-columns of wafers comprising at least one wafer remaining from the first sub-row of wafers and at least one wafer remaining from the second sub-row of wafers;
and arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:
the wafer transfer method provided by the embodiment of the invention comprises the following steps: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers; arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of wafers; extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging a first column of wafers along a second direction; extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers. The plurality of wafers are transferred by the wafer transfer method, so that a high-density two-dimensional array arrangement with a certain interval is formed among the plurality of wafers.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
In the drawings:
FIG. 1 is a flow chart of a wafer transfer method provided by an embodiment of the present invention;
fig. 2 is an operation diagram of a wafer transfer method according to an embodiment of the present invention.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the device or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Referring to fig. 1 and 2, a wafer transfer method according to an embodiment of the present invention includes the following steps:
s110: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers;
s120: arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of wafers;
s130: extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;
s140: arranging a first column of wafers along a second direction;
s150: extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers;
s160: and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers.
With the above wafer transfer method, by arranging a first row of wafers in a first direction and then arranging a second row of wafers opposite to the first row of wafers, the second row of wafers is spaced from the first row of wafers by a predetermined first predetermined interval. Then, the first row of wafers is extracted, the first row of wafers is arranged in a second direction, the second row of wafers is extracted, and the second row of wafers is arranged opposite to the first row of wafers. The second row of wafers has a predetermined second predetermined spacing from the first row of wafers. Therefore, the steps are repeated for multiple times, the preset first preset intervals and the preset second preset intervals are formed among the wafers, the intervals among the wafers can be adjusted according to actual requirements, and the two-dimensional wafer array with the preset intervals is formed.
Of course, the wafer transfer method provided in this embodiment may not only transfer a single wafer, but also transfer a row of wafers, and may also be applied to a packaged multifunctional integrated unit. Such as a color pixel unit consisting of a plurality of RGB chips, or a backlight unit consisting of a plurality of LED chips. The wafer transfer method provided by the present embodiment can be applied to a multifunctional integrated circuit unit in which one or more of a logic chip, a MEMS device, or a sensor is integrated.
Referring to fig. 2, a two-dimensional rectangular coordinate system is established with one of the wafers as an origin, with one side of the wafer as an x-axis and the other side of the wafer perpendicular to the one side as a y-axis. In the figure, the first direction is a direction a, and the second direction is a direction B, that is, the first direction is along the x-axis direction, and the second direction is along the y-axis direction. The first predetermined interval is y1 and the second predetermined interval is x 1. Of course, in an embodiment, the first direction may also be a y-axis direction, and the second direction may be an x-axis direction.
In a specific embodiment, a wafer transfer method provided by an embodiment of the present invention includes the following steps:
s210: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers;
s220: arranging a second row of wafers along a first direction at a preset first preset interval relative to the first row of wafers;
s230: extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers;
s240: arranging a first column of wafers along a second direction;
s250: extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer from the second row of wafers;
s260: and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers.
In the above wafer transfer method, when the first row of wafers is extracted, the first row of wafers includes at least one wafer in the first row of wafers; the second column of wafers includes at least one wafer from the remainder of the first row of wafers and at least one wafer from the second row of wafers when the second column of wafers is extracted. That is, the number of the first row of wafers is less than that of the second row of wafers, so that the wafers can be transferred and arranged according to the number of the first row of wafers or the second row of wafers, and a plurality of wafers are spaced by a first preset interval and a second preset interval.
Specifically, the first row of wafers includes two wafers and the second row of wafers includes one wafer. Extracting a first row of wafers, namely extracting one wafer in the first row of wafers; and extracting the second row of wafers, namely extracting the remaining wafer in the first row of wafers and one wafer in the second row of wafers. Of course, the first row of wafers may also include one wafer, and the second row of wafers may also include two wafers, such that the first row of wafers is extracted, i.e., one wafer in the first row of wafers and one wafer in the second row of wafers, and the second row of wafers is extracted, i.e., the remaining wafer in the second row of wafers.
In a specific embodiment, a wafer transfer method provided by an embodiment of the present invention includes the following steps:
s310: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers;
s320: arranging a second row of wafers along a first direction at a preset first preset interval relative to the first row of wafers;
s330: extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;
s340: arranging a first column of wafers along a second direction;
s350: extracting a second row of wafers, the second row of wafers including at least one wafer remaining from the first row of wafers;
s360: and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers.
In the above wafer transfer method, when the first row of wafers is extracted, the first row of wafers comprises at least one wafer in the first row of wafers and at least one wafer from the second row of wafers; the second column of wafers includes at least one wafer remaining from the first row of wafers when the second column of wafers is extracted. That is, the number of the first row of wafers is greater than the number of the second row of wafers, so that the wafers can be transferred and arranged according to the number of the first row of wafers or the second row of wafers, and a plurality of wafers are spaced at a first preset interval and a second preset interval.
Specifically, the first row of wafers includes two wafers, the second row of wafers includes one wafer, and the first row of wafers is extracted, i.e., one wafer in the first row of wafers and one wafer in the second row of wafers are extracted. And extracting the second row of wafers, namely extracting the remaining wafer in the first row of wafers. Of course, the first row of wafers may also include one wafer and the second row of wafers includes two wafers, and the first row of wafers is extracted, i.e., one wafer in the first row of wafers and one wafer in the second row of wafers are extracted.
In a specific embodiment, arranging the first row of wafers in the first direction includes:
extracting a first row of chips from a wafer, wherein the wafer comprises the first row of chips and a second row of chips which are arranged at a first initial interval; arranging the extracted first row of wafers on a first tray along a first direction;
arranging a second row of wafers along a first direction at a preset first preset interval relative to a first row of wafers comprises:
extracting a second row of chips from the wafer; and arranging the extracted second row of wafers on the first material disc along the first direction at a preset first preset interval relative to the first row of wafers.
Therefore, the chips on the wafer are arranged on the first material disc, so that the chips are transferred, the chips are arranged at the first preset interval, and the chip transfer efficiency is improved. The wafer is prevented from being transferred to other bearing parts from the wafer, then the wafers are arranged on the other bearing parts, and then the wafer is transferred to the target material disc. By using the wafer transfer method provided by the embodiment of the invention, the wafers can be arranged while being transferred, and the wafer bulk transfer is realized.
In a specific embodiment, extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers along the second direction includes:
extracting a first column of wafers from a first tray, wherein the first tray comprises a first column of wafers and a second column of wafers arranged at a second initial interval, and the first column of wafers comprises at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first row on a fourth tray along a second direction;
extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting a second row of wafers from the first tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging the extracted second row of wafers on the fourth tray along the second direction at a preset second preset interval relative to the first row of wafers.
Therefore, the first row of wafers on the first tray are transferred to the fourth tray, so that a first preset interval and a second preset interval are formed among the wafers on the fourth tray, and a two-dimensional array is formed among the wafers on the fourth tray. Thereby realizing the mass transfer of the wafer and improving the wafer transfer efficiency.
In a specific embodiment, arranging the first row of wafers in the first direction includes:
extracting a first row of wafers from a second tray, wherein the second tray comprises a first row of wafers and a second row of wafers which are arranged at a first initial interval; arranging the extracted first row of wafers on a third tray along a first direction;
arranging a second row of wafers along a first direction at a preset first preset interval relative to a first row of wafers comprises:
extracting a second row of wafers from a second tray; and arranging a second row of wafers on the third material disc along the first direction at a preset first preset interval relative to the first row of wafers.
Like this, through arranging the wafer on the second charging tray on the third charging tray, not only realized shifting between a plurality of wafers, also realized arranging the wafer according to first preset interval, and then improved the efficiency that the wafer shifted. The wafer is prevented from being arranged on other bearing parts after being transferred from the second material disc to other bearing parts, and then the wafer is transferred to the third material disc. By using the wafer transfer method provided by the embodiment of the invention, the wafers can be arranged while being transferred, and the wafer bulk transfer is realized.
In a specific embodiment, extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers along the second direction includes:
extracting a first row of wafers from a third tray, wherein the third tray comprises a first row of wafers and a second row of wafers which are arranged at a second initial interval; the first column of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first row on the fifth tray along the second direction;
extracting a second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting a second row of wafers from a third tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging a second row of wafers on the fifth tray along a second direction at a preset second preset interval relative to the first row of wafers.
Therefore, the first row of wafers on the third tray are transferred to the fifth tray, so that the wafers on the fifth tray are arranged at the first preset intervals and the second preset intervals, and the wafers on the fifth tray are arranged in a two-dimensional array. Thereby realizing the mass transfer of the wafer and improving the wafer transfer efficiency.
In a specific embodiment, the first initial interval is less than a first preset interval. Thus, the plurality of wafers after transfer can be made to have the first preset interval. The first preset interval can be set according to actual needs. Meanwhile, the plurality of chips cut by the wafer are arranged according to a first preset interval. The wafers on the first tray can be arranged at a first preset interval after being transferred to the second tray.
In a specific embodiment, the second initial interval is less than the second predetermined interval. Therefore, the plurality of wafers after being transferred can have a second preset interval, and the second preset interval can be set according to actual needs. Meanwhile, the wafers on the first tray can be arranged at a second preset interval after being transferred to the third tray. The wafers on the third tray can also be arranged according to the first preset interval after being transferred to the fifth tray.
The first preset interval is between 0.5um to 5mm, and the second preset interval is between 0.5um to 5 mm. In one embodiment, the first predetermined interval is between 0.6um and 5mm, and the second predetermined interval is between 0.6um and 5 mm. The first preset interval and the second preset interval are intervals required among a plurality of wafers on the LED display screen. A conventional high definition LED display screen with a resolution of 1920 × 1080 requires 1920 × 1080 × 3 Micro LED chips, which amounts to 620 ten thousand chips. And the wafers on the display screen need to form a high-density two-dimensional array structure at a first preset interval and a second preset interval.
The first direction and the second direction have a first preset angle therebetween, and the first preset angle is between 0 ° and 180 °. The first direction and the second direction have a first preset angle, so that the wafers to be transferred can be selected according to the actual wafer arrangement requirement.
In one embodiment, the first direction and the second direction are perpendicular to each other. The first preset angle is 90 °. This can improve the efficiency of wafer transfer and facilitate adjustment of the position of wafer arrangement. Simultaneously, a two-dimensional array structure is formed among a plurality of wafers.
In a specific embodiment, before arranging the first row of wafers along the first direction, detecting parameters of the wafers is further included, and the parameters of the wafers include one or more of types, chromatic aberrations, or wavelengths of the wafers. The types of the wafers comprise one or more of a red wafer, a blue wafer, a white wafer and a green wafer.
In one embodiment, the wafer transfer method comprises the steps of:
s410: arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of first sub-row wafers, the first sub-row wafers comprising a plurality of wafers;
s420: arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of second sub-row wafers, and the second sub-row wafers comprise a plurality of wafers;
s430: extracting a first column of wafers, the first column of wafers comprising a plurality of first sub-column wafers, the first sub-column wafers comprising at least one wafer from the first sub-row of wafers and at least one wafer from the second sub-row of wafers;
s440: arranging a first column of wafers along a second direction;
s450: extracting a second column of wafers, wherein the second column of wafers comprises a plurality of second subcolumn wafers, and the second subcolumn wafers comprise at least one wafer from the rest of the first subcolumn wafers and at least one wafer from the rest of the second subcolumn wafers;
s460: and arranging a second row of wafers along a second direction at a preset second preset interval relative to the first row of wafers.
The wafer transfer method is realized by arranging a first row of wafers and a second row of wafers, and arranging a first column of wafers and a second column of wafers, wherein the first row of wafers comprises a plurality of first sub-row wafers, and the second row of wafers comprises a plurality of first sub-column wafers. In the process of transferring the wafers, the transfer of the plurality of wafers may be achieved by arranging the plurality of first sub-row wafers and the plurality of second sub-row wafers, and the plurality of first sub-column wafers and the plurality of second sub-column wafers, thereby forming a two-dimensional array structure.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims (10)

1. A wafer transfer method, comprising the steps of:
arranging a first row of wafers along a first direction, the first row of wafers comprising a plurality of wafers;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of wafers;
extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;
arranging the first column of wafers in a second direction;
extracting the second column of wafers, the second column of wafers including at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers;
and arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers.
2. The wafer transfer method of claim 1, wherein the arranging the first row of wafers in the first direction comprises:
extracting the first row of chips from a wafer, wherein the wafer comprises a first row of chips and a second row of chips arranged at a first initial interval; arranging the extracted first row of wafers on the first tray along the first direction;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers comprises:
extracting the second row of chips from the wafer; and arranging the second row of wafers on the first material disc along the first direction at a preset first preset interval relative to the first row of wafers.
3. The wafer transfer method of claim 2, wherein the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers in a second direction comprises:
extracting the first column of wafers from the first tray, wherein the first tray includes a first column of wafers and a second column of wafers arranged at a second initial spacing, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first column on the fourth tray along the second direction;
the extracting the second column of wafers, the second column of wafers including at least one wafer from the remainder of the first row of wafers and at least one wafer from the remainder of the second row of wafers; arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the first tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging the second row of extracted wafers on the fourth tray along the second direction at a preset second preset interval relative to the first row of wafers.
4. The wafer transfer method of claim 1, wherein the arranging the first row of wafers in the first direction comprises:
extracting the first row of wafers from a second tray, wherein the second tray comprises a first row of wafers and a second row of wafers which are arranged at a first initial interval; arranging the extracted first row of wafers on the third tray along the first direction;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the second tray; and arranging the second row of wafers on the third material disc along the first direction at a preset first preset interval relative to the first row of wafers.
5. The wafer transfer method of claim 4, wherein the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, the arranging the first column of wafers in a second direction comprises:
extracting the first row of wafers from the third tray, wherein the third tray comprises a first row of wafers and a second row of wafers arranged at a second initial interval; the first column of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted wafers in the first column on the fifth tray along the second direction;
the extracting the second column of wafers, the second column of wafers including at least one wafer from the remainder of the first row of wafers and at least one wafer from the remainder of the second row of wafers; arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers comprises:
extracting the second row of wafers from the third tray; the second column of wafers includes at least one wafer remaining from the first row of wafers and at least one wafer remaining from the second row of wafers; and arranging the second row of wafers on the fifth tray along the second direction at a preset second preset interval relative to the first row of wafers.
6. The wafer transfer method according to any of claims 2 to 5, characterized in that said first initial interval is smaller than said first preset interval.
7. The wafer transfer method according to any of claims 3 to 5, characterized in that said second initial interval is smaller than said second preset interval.
8. The wafer transfer method according to claim 1, wherein the first direction and the second direction have a first predetermined angle therebetween, the first predetermined angle being between 0 ° and 180 °.
9. The wafer transfer method of claim 8, wherein the first direction and the second direction are perpendicular to each other.
10. The wafer transfer method according to claim 1, characterized in that it comprises the steps of:
arranging a first row of wafers along the first direction, the first row of wafers comprising a plurality of first sub-row wafers, the first sub-row of wafers comprising a plurality of wafers;
arranging a second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, wherein the second row of wafers comprises a plurality of second sub-row wafers, and the second sub-row wafers comprise a plurality of wafers;
extracting a first column of wafers, the first column of wafers comprising a plurality of first sub-columns of wafers, the first sub-columns of wafers comprising at least one wafer from the first sub-row of wafers and at least one wafer from the second sub-row of wafers;
arranging the first column of wafers along the second direction;
extracting the second column of wafers, the second column of wafers comprising a plurality of second sub-columns of wafers, the second sub-columns of wafers comprising at least one wafer remaining from the first sub-row of wafers and at least one wafer remaining from the second sub-row of wafers;
and arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers.
CN202110170599.3A 2021-02-08 2021-02-08 Wafer transfer method Pending CN114005818A (en)

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