CN114001546B - Dynamic handover method for wafer lifting drying and wafer drying device - Google Patents

Dynamic handover method for wafer lifting drying and wafer drying device Download PDF

Info

Publication number
CN114001546B
CN114001546B CN202111279319.9A CN202111279319A CN114001546B CN 114001546 B CN114001546 B CN 114001546B CN 202111279319 A CN202111279319 A CN 202111279319A CN 114001546 B CN114001546 B CN 114001546B
Authority
CN
China
Prior art keywords
wafer
clamping part
clamping
drying
dynamic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111279319.9A
Other languages
Chinese (zh)
Other versions
CN114001546A (en
Inventor
赵德文
李长坤
申兵兵
高庆刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huahaiqingke Co Ltd
Original Assignee
Huahaiqingke Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huahaiqingke Co Ltd filed Critical Huahaiqingke Co Ltd
Priority to CN202111279319.9A priority Critical patent/CN114001546B/en
Publication of CN114001546A publication Critical patent/CN114001546A/en
Application granted granted Critical
Publication of CN114001546B publication Critical patent/CN114001546B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/001—Handling, e.g. loading or unloading arrangements
    • F26B25/003—Handling, e.g. loading or unloading arrangements for articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a dynamic handover method for wafer lifting drying and a wafer drying device, wherein the dynamic handover method comprises the following steps: the clamping part of the lifting mechanism is moved to the lower side of the delivery position in advance; the jacking mechanism pushes the wafer to move upwards; when the center of the wafer passes through the clamping part, the clamping part moves upwards in an accelerating mode until the speed of the clamping part is the same as that of the jacking mechanism, and then the clamping part and the jacking mechanism move upwards at a constant speed; when the clamping part and the jacking mechanism move to the intersection position, a clamping arm of the clamping part clamps the wafer; the clamping part of the lifting mechanism clamps the wafer to move upwards continuously, and the lifting mechanism moves upwards along with the clamping part and then moves downwards to the initial position.

Description

Dynamic handover method for wafer lifting drying and wafer drying device
Technical Field
The invention belongs to the technical field of wafer post-processing, and particularly relates to a dynamic handover method for wafer lifting drying and a wafer drying device.
Background
Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for obtaining global Planarization in the fabrication of Integrated Circuits (ICs). With the development of integrated circuit manufacturing technology, the control of the defects on the surface of the wafer is more and more strict. In the wafer manufacturing process, a large number of defects are generated due to the adsorption of pollutants such as particles or organic matters on the surface of the wafer, and a post-treatment process is required to remove the defects. Particularly, since a large amount of chemicals and abrasives are used in chemical mechanical polishing to contaminate the wafer surface, a post-treatment process is required to remove contaminants from the wafer surface after polishing, and the post-treatment process generally consists of cleaning and drying to provide a smooth and clean wafer surface.
Common drying techniques are Spin Rinse Drying (SRD) and Marangoni drying (also known as "Marangoni" or "Marangoni"). Drying of wafers based on the marangoni effect has received much attention due to its superior performance in eliminating liquid mark defects, as compared to conventional SRDs. The marangoni effect is an interfacial convection phenomenon caused by a surface tension gradient. The existing drying technology based on the marangoni effect is to blow organic vapor such as IPA containing isopropyl alcohol on a 'meniscus' formed by a wafer-air-liquid when the wafer is taken out of a water bath of deionized water, and induce the marangoni effect to realize backflow of attached liquid, thereby obtaining a fully dried wafer.
During the lifting and drying process, the smooth movement of the wafer during the wafer handover is important. Therefore, the damage to the surface liquid film can be effectively avoided, the accurate identification of the meniscus is facilitated, and the marangoni effect is fully induced.
In general, when the wafer is transferred, the first transport mechanism stops after the wafer reaches the designated position, and then the second transport mechanism takes away the wafer from the first transport mechanism to complete the transfer. Or the first conveying mechanism conveys the wafer to the designated position and then places the wafer on the wafer positioning mechanism, and then the second conveying mechanism takes the wafer away from the wafer positioning mechanism to complete the handover.
However, during the wafer lifting and drying process, the wafer is not allowed to stand still. The wafer stopped moving will destroy the liquid film on the surface of the wafer, and affect the drying effect of the wafer. Thus, dynamic wafer handoff is required.
How to achieve the reliability and efficiency of dynamic wafer handover is always an urgent technical problem to be solved by those skilled in the art.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
To this end, an embodiment of the present invention provides a dynamic handover method for wafer lift drying, which includes:
s1, moving the clamping part of the lifting mechanism to the lower side of the delivery position in advance;
s2, the jacking mechanism pushes the wafer to move upwards;
s3, when the center of the wafer passes through the clamping part, the clamping part moves upwards in an accelerating way until the speed of the clamping part is the same as that of the jacking mechanism, and then the clamping part and the jacking mechanism move upwards at a constant speed;
s4, when the clamping part and the jacking mechanism move to the connection position, the clamping arm of the clamping part clamps the wafer;
and S5, the clamping part of the lifting mechanism clamps the wafer to move upwards continuously, and the lifting mechanism moves upwards along with the clamping part and then moves downwards to the initial position.
In a preferred embodiment, when the clamping part is accelerated to the speed of the jacking mechanism, the vertical position of the clamping part is matched with the position of the wafer clamping point.
In a preferred embodiment, after the speeds of the lifting mechanism and the jacking mechanism are synchronized, the clamping part starts to horizontally move towards the wafer; when the jacking mechanism moves to the joint position, the clamping part clamps the wafer.
As a preferred embodiment, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm.
In addition, the invention also discloses a dynamic handover method for wafer lifting drying, which comprises the following steps:
s10, moving the clamping part of the lifting mechanism to the lower side of the delivery position in advance;
s20, the jacking mechanism pushes the wafer to move upwards;
s30, when the center of the wafer passes through the clamping part, the clamping part accelerates to move upwards;
s40, horizontally moving the clamping arm of the clamping part towards the wafer;
and S50, when the clamping part of the lifting mechanism moves to the joint position, the speed of the clamping part is higher than that of the jacking mechanism, the clamping arm of the clamping part supports the wafer to move upwards, and the jacking mechanism moves downwards to the initial position.
In a preferred embodiment, before the wafer is moved to the joint position, the clamping part is moved to a horizontal position corresponding to the clamping state.
In a preferred embodiment, the difference between the speeds of the clamping part and the jacking mechanism is not more than 10% of the speed of the jacking mechanism during wafer handover.
As a preferred embodiment, in step S30, after the center of the wafer passes through the clamping portion, the clamping portion is moved horizontally toward the wafer.
Meanwhile, the invention also provides a wafer drying device which executes the steps of the dynamic handover method for wafer pulling drying.
In addition, the invention also discloses a control device which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor executes the computer program to realize the steps of the dynamic delivery method for wafer pulling drying.
The beneficial effects of the invention include: through the motion control of the jacking mechanism and the lifting mechanism, the stable, efficient and accurate connection of the wafer is realized, the integrity of a water film on the surface of the wafer is ensured, the marangoni effect is induced efficiently, and the drying effect of the surface of the wafer is improved.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a flow chart of a dynamic interface method for pulling and drying a wafer according to the present invention;
FIGS. 2-4 are schematic views of the wafer position in the wafer drying apparatus during the handoff process;
FIG. 5 is a graph of displacement versus time for the lift mechanism and the pull mechanism of the corresponding dynamic handoff method of FIG. 1;
FIG. 6 is a flow chart of another embodiment of a dynamic interface method for pull drying a wafer according to the present invention;
FIG. 7 is a graph of displacement versus time for the lift mechanism and the pull mechanism of the dynamic handoff method of FIG. 6;
fig. 8 is a displacement-time curve of another embodiment of the lift mechanism and the pull mechanism in the dynamic handover method corresponding to fig. 6.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is illustrative and exemplary in nature and is not to be construed as limiting the embodiments of the invention and the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings accompanying this specification are for the purpose of illustrating the concepts of the invention and are not necessarily to scale, the drawings being schematic representations of the shapes of the parts and their interrelationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the present invention, the Wafer (Wafer) is also called a Substrate (Substrate), and the meaning and the actual function are equivalent.
The invention provides a dynamic cross-connecting method for wafer pulling drying, which is a flow chart shown in figure 1. The dynamic wafer handoff process is described below with reference to the wafer drying apparatus shown in fig. 2 to 4:
s1, moving the clamp part 21 of the lifting mechanism 20 to the lower side of the joint position in advance;
in fig. 2, the wafer drying apparatus includes a lift mechanism 10 and a pull mechanism 20. Before the wafer transfer, the gripping portion 21 of the pulling mechanism 20 needs to be moved downward in advance in order to provide a distance for acceleration of the gripping portion 21. Meanwhile, the clamping part 21 moves downwards in advance, so that the moving direction of the clamping part can be consistent with the moving direction of the wafer lifted by the lifting mechanism 10, and the drying effect is prevented from being influenced by sudden change of the wafer speed in the wafer handover process.
Further, the gripping portion 21 of the pulling mechanism 20 needs to be moved to the lower side of the joint position. In the wafer lifting and drying treatment, the joint position of the wafer needs to be set in advance according to the drying process so as to ensure the wafer drying effect. In general, the wafer transfer position is set to be 150mm above the liquid level in the tank.
S2, the jacking mechanism 10 pushes the wafer to move upwards;
namely, the jacking mechanism 10 moves upwards along the sliding rail under the driving of the moving module. To facilitate wafer transfer control, the movement speed of the lift-off mechanism 10 is first accelerated to V 0 Then at a speed V 0 And moving upwards at a constant speed. Furthermore, the acceleration of the lift mechanism 10 should not be too large to ensure the smooth movement of the wafer.
FIG. 5 illustrates a ceiling during wafer handoffDisplacement-time curves for the lifting mechanism and the pulling mechanism, wherein the displacement-time curve corresponding to the lifting mechanism 10 is shown by a dotted line, and the displacement-time curve corresponding to the pulling mechanism 20 is shown by a solid line, P 1 Is the wafer transfer position.
S3, when the center of the wafer passes through the clamping part 21, the clamping part 21 accelerates to move upwards until the speed of the clamping part 21 is the same as that of the jacking mechanism 10, and then the clamping part 21 and the jacking mechanism 10 move upwards at a constant speed;
specifically, the clamping portion 21 of the lifting mechanism 20 cannot be accelerated too early, so as to prevent the clamping portion 21 from being positioned above the wafer transfer position all the time due to too high speed, and the clamping portion 21 and the lifting mechanism 10 cannot be transferred.
In FIG. 5, the lifting mechanism 20 is accelerated to V 0 Then the lifting mechanism 20 and the jacking mechanism 10 move uniformly, and the slopes of the corresponding curves are the same. I.e., the speed of upward movement of the lift mechanism 20 and the lift mechanism 10 is the same.
Since the relative positions of the clamping portion 21 and the jacking mechanism 10 are fixed after the speeds of the two are the same, when the clamping portion 21 of the lifting mechanism 20 accelerates to the speed of the jacking mechanism 10, the vertical position of the clamping portion 21 needs to correspond to the position of the wafer clamping point, so as to ensure that the clamping portion 21 of the lifting mechanism 20 accurately clamps the wafer.
Furthermore, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm. The position of the wafer clamping point can be flexibly adjusted according to the wafer drying process.
S4, when the clamping part 21 and the jacking mechanism 10 move to the joint position, the clamping part 21 clamps the wafer;
the clamping part 21 and the jacking mechanism 10 move upwards synchronously at a constant speed, and when the clamping part and the jacking mechanism reach a set handover position P 1 Thereafter, the clamping portion 21 clamps the wafer. I.e. the wafer is at t 1 And finishing the wafer handover at the time point.
And S5, the wafer is clamped by the clamping part 21 of the lifting mechanism 20 and moves upwards continuously, and the jacking mechanism 10 moves upwards along with the clamping part 21 of the lifting mechanism 20 and then moves downwards to the initial position.
Since the clamp portion 21 of the pulling mechanism 20 may be moved at the initial stage of the movementIf the wafer is not clamped by the clamping portion 21, the wafer may drop downward and have a sudden speed change. To eliminate the potential for wafer drop, t 1 After the time point, the lift mechanism 10 needs to move upward a distance in synchronization with the clamping portion 21 to avoid sudden speed change of the moving wafer.
In order to improve the efficiency of wafer transfer, it takes a certain time for the clamp portion 21 to move to the clamping point of the wafer, and thus, it is necessary to accurately control the start time of the clamp portion 21. Specifically, after the speeds of the lifting mechanism 20 and the lifting mechanism 10 are synchronized, the clamping part 21 starts to move horizontally towards the wafer; when the jacking mechanism 10 moves to the handing-over position, the clamping part 21 clamps the wafer, so as to eliminate waiting time in the handing-over process and ensure the efficiency of handing-over the wafer.
In addition, the invention also discloses a dynamic handover method for pulling and drying the wafer, and a flow chart of the method is shown in FIG. 6. The specific handover steps are described below with reference to fig. 2 to 4:
s10, the clamping part 21 of the pulling mechanism 20 is moved to the lower side of the joint position in advance;
s20, the jacking mechanism 10 pushes the wafer to move upwards;
s30, when the wafer center passes through the clamping part 21, the clamping part 21 accelerates to move upwards;
s40, the clamp arm of the clamp portion 21 horizontally moves toward the wafer;
s50, when the clamping portion 21 of the lifting mechanism 20 moves to the transfer position, the speed of the clamping portion 21 is higher than that of the lifting mechanism 10, the clamping arm of the clamping portion 21 holds the wafer and moves upward, and the lifting mechanism moves downward to the initial position.
Compared with the dynamic delivery method shown in fig. 1, the delivery method shown in fig. 6 utilizes the speed difference between the clamping part 21 and the lifting mechanism 10, so that the clamping part 21 supports the wafer of the lifting mechanism 10 from the bottom, and the dynamic delivery is smoothly and efficiently completed.
At the time of wafer transfer, the moving speed of the clamp portion 21 is slightly higher than the moving speed of the wafer on the lift-up mechanism 10. Preferably, the difference in speed of the clamp 21 and the jacking mechanism 10 is no more than 10% of the speed of the jacking mechanism 10. The separation of the wafer from the lift-up mechanism 10 is realized by the speed difference between the two.
Further, the clamping part 21 can start the clamping action in advance, the clamping part 21 does not clamp and impact the wafer, and the risk of fragments is eliminated. Specifically, in step S30, after the wafer center passes through the clamping portion 21, the clamping arms of the clamping portion 21 can move horizontally toward the wafer, and the pair of clamping arms shown in fig. 2 can move horizontally toward the wafer under the driving of the air cylinder or the electric cylinder. Since the opening of the clamping portion 21 is smaller than the diameter of the wafer, the clamping portion 21 can lift the wafer from the bottom, and the impact of the rapid movement of the clamping arm of the clamping portion 21 on the wafer is avoided.
When the clamping part 21 acts, the clamping part 21 is positioned below the wafer, so that the impact of the clamping part 21 on the edge of the wafer is effectively avoided, and the risk of fragments in the handover process is eliminated. The gripping part 21 is accelerated upward while the gripping arm of the gripping part 21 is moved horizontally; when the clamping part 21 is accelerated continuously, the clamping part 21 catches up with the wafer on the jacking mechanism 10 and surmounts the wafer, and then the clamping arm of the clamping part 21 supports the wafer, so that the dynamic transfer of the wafer is realized.
Compared with the wafer delivery method shown in fig. 1, the horizontal movement of the clamping portion 21 is reserved for a longer time, so that the difficulty in controlling the movement of the clamping portion 21 is reduced, and the clamping portion 21 can be smoothly moved to a set position.
As a preferred embodiment, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm. The position of the wafer chuck point can be controlled by controlling the horizontal distance of the chuck portion 21.
In the wafer transfer method shown in fig. 6, the speed of the clamping portion 21 is required to be slightly higher than the speed of the lifting mechanism 10, so that the lifting mechanism 10 can be accelerated and then moved at a constant speed, as shown in fig. 7, wherein the displacement-time curve corresponding to the lifting mechanism 10 is shown by a dotted line, the displacement-time curve corresponding to the lifting mechanism 20 is shown by a solid line, and P is the displacement-time curve corresponding to the lifting mechanism 20 1 Is the wafer hand-off position. After the wafer is handed over, the lift mechanism 10 may continue to move upward or may directly move downward.
In FIG. 7, at t 1 Time point, drawing machineThe wafer is held by the clamping portion 21 of the mechanism 20 from the bottom, and at this time, the speed of the clamping portion 21 is higher than that of the lift mechanism 10, and the wafer is separated from the lift mechanism 10 and is securely held by the clamping portion 21. When the lift-up mechanism 10 reaches the delivery position P 1 Thereafter, it may continue to move upward.
It is understood that after the wafer is delivered, the lift-off mechanism 10 may also be decelerated to move upward and then moved downward to the initial position, as shown in fig. 8, for processing the next wafer. In FIG. 8, the displacement-time curve for the jacking mechanism 10 is shown in dashed lines, while the displacement-time curve for the lifting mechanism 20 is shown in solid lines, P 1 Is the wafer transfer position.
Meanwhile, the invention also provides a wafer drying device, as shown in fig. 2, the steps of the dynamic handover method are executed, so that the reliable, efficient and accurate handover of the wafer is realized, the drying effect of the wafer is effectively ensured, and the production beat of wafer drying is promoted.
In addition, the invention also discloses a control device which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor executes the computer program to realize the steps of the dynamic delivery method for wafer pulling drying.
The Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, etc.
The memory may be an internal storage unit of the control device, such as a hard disk or a memory of the control device. The memory may also be an external storage device of the control device, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like provided on the control device. Further, the memory may also include both an internal storage unit of the control device and an external storage device. The memory is used for storing the computer program and other programs and data required by the control device. The memory may also be used to temporarily store data that has been output or is to be output.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (6)

1. A dynamic cross-linking method for wafer lift drying, comprising:
s10, moving the clamping part of the lifting mechanism to the lower side of the delivery position in advance;
s20, the jacking mechanism pushes the wafer to move upwards;
s30, when the wafer center passes through the clamping part, the clamping part moves upwards in an accelerated manner;
s40, horizontally moving the clamping arm of the clamping part towards the wafer;
s50, when the clamping part of the lifting mechanism moves to the connection position, the speed of the clamping part is higher than that of the lifting mechanism; the clamping part supports the wafer arranged on the jacking mechanism from the bottom by utilizing the speed difference between the clamping part and the jacking mechanism so as to complete the dynamic connection of the wafer; the clamping arm of the clamping part supports the wafer to move upwards, and the jacking mechanism moves downwards to an initial position.
2. A dynamic handoff method as claimed in claim 1, wherein said clamping portion is moved to a horizontal position corresponding to the clamped state before the wafer is moved to the handoff position.
3. A dynamic handoff method as recited in claim 1, wherein the difference between the speed of the clamp and the speed of the lift mechanism is no greater than 10% of the speed of the lift mechanism during the wafer handoff.
4. A dynamic handover method according to claim 1, wherein in step S30, the clamping portion moves horizontally towards the wafer after the center of the wafer passes the clamping portion.
5. A wafer drying apparatus, characterized by performing the steps of the dynamic handover method for wafer pull drying according to any one of claims 1 to 4.
6. A control device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the dynamic handover method of wafer lift drying as claimed in any one of claims 1 to 4.
CN202111279319.9A 2021-11-01 2021-11-01 Dynamic handover method for wafer lifting drying and wafer drying device Active CN114001546B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111279319.9A CN114001546B (en) 2021-11-01 2021-11-01 Dynamic handover method for wafer lifting drying and wafer drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111279319.9A CN114001546B (en) 2021-11-01 2021-11-01 Dynamic handover method for wafer lifting drying and wafer drying device

Publications (2)

Publication Number Publication Date
CN114001546A CN114001546A (en) 2022-02-01
CN114001546B true CN114001546B (en) 2022-09-30

Family

ID=79925794

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111279319.9A Active CN114001546B (en) 2021-11-01 2021-11-01 Dynamic handover method for wafer lifting drying and wafer drying device

Country Status (1)

Country Link
CN (1) CN114001546B (en)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4611966A (en) * 1984-05-30 1986-09-16 Johnson Lester R Apparatus for transferring semiconductor wafers
JP3627132B2 (en) * 1997-11-18 2005-03-09 東京エレクトロン株式会社 Substrate drying processing apparatus and substrate drying processing method
JP4554146B2 (en) * 2002-09-24 2010-09-29 忠弘 大見 Rotary silicon wafer cleaning equipment
US20080066339A1 (en) * 2006-09-14 2008-03-20 Mike Wallis Apparatus and method for drying a substrate
CN101459100B (en) * 2009-01-09 2011-12-21 富创得科技（沈阳）有限公司 Automatic conveying device for compact wafer
JP5522028B2 (en) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium
CN203486519U (en) * 2013-10-12 2014-03-19 四川蓝彩电子科技有限公司 Clamping conveying device for wafer pin electroplating
CN108257894B (en) * 2018-01-12 2020-05-19 清华大学 Wafer drying device
CN108831849A (en) * 2018-06-25 2018-11-16 清华大学 Wafer drying device and drying means based on hot kalimeris brother Buddhist nun effect
CN110733718B (en) * 2019-11-14 2021-10-08 深圳市达特尔机器人有限公司 Film tearing method, film tearing device applied to same and film tearing machine
CN211507584U (en) * 2020-07-10 2020-09-15 清华大学 Marangoni drying device applied to wafer post-processing
CN111780537A (en) * 2020-07-10 2020-10-16 华海清科股份有限公司 Marangoni drying device applied to wafer post-processing
CN211507583U (en) * 2020-07-10 2020-09-15 清华大学 Wafer post-processing system
CN111540704B (en) * 2020-07-10 2020-09-25 清华大学 Wafer deflection device and wafer processing equipment
CN111785663B (en) * 2020-07-10 2023-02-28 华海清科股份有限公司 Wafer post-processing system
CN212952992U (en) * 2020-08-16 2021-04-13 河南通用智能装备有限公司 Material supporting guide rail width adjusting structure for wafer continuous production
CN113345821B (en) * 2021-08-06 2021-11-16 杭州众硅电子科技有限公司 Wafer cleaning and drying method and mechanism

Also Published As

Publication number Publication date
CN114001546A (en) 2022-02-01

Similar Documents

Publication Publication Date Title
US9984904B2 (en) Substrate treatment system, substrate transfer method and computer storage medium
KR101791269B1 (en) Liquid processing apparatus, liquid processing method, and computer-readable storage medium having program stored therein
KR102225474B1 (en) Peel-off apparatus, peel-off system, peel-off method and computer storage medium
JP4732918B2 (en) Substrate processing method and substrate processing apparatus
US20140284000A1 (en) Separation apparatus, separation system, separation method and non-transitory computer readable storage medium
CN107924832B (en) Substrate processing method and substrate processing apparatus
US20090226621A1 (en) Coating treatment method, computer-readable storage medium, and coating treatment apparatus
JP6007925B2 (en) Substrate cleaning apparatus, substrate cleaning method, and storage medium
KR102125606B1 (en) Substrate processing apparatus
KR101668212B1 (en) Liquid processing method, liquid processing apparatus and recording medium
KR102493554B1 (en) Substrate processing method, substrate processing apparatus and storage medium
US8303197B2 (en) Method of developing a substrate and apparatus for performing the same
CN114001526B (en) Wafer lifting and drying method and wafer drying device
KR101997880B1 (en) Substrate processing apparatus, coating and developing apparatus and substrate processing method
KR101842119B1 (en) Method and Apparatus for treating substrate
CN114001546B (en) Dynamic handover method for wafer lifting drying and wafer drying device
JP2010177458A (en) Liquid processing device
US20010045223A1 (en) Semiconductor wafer cleaning apparatus and method of using the same
CN107564837B (en) Apparatus and method for processing substrate
JP5262829B2 (en) Developing apparatus and developing method
CN111146128B (en) Die transfer module and die bonding apparatus having the same
JP7144975B2 (en) Substrate processing method and substrate processing apparatus
KR101994420B1 (en) Apparatus and Method for treating substrate
KR20160083422A (en) Substrate treating apparatus and substrate treating method
CN117658005A (en) Wafer lifting device, wafer drying equipment and wafer lifting method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant