CN113992176A - Filter and communication device - Google Patents
Filter and communication device Download PDFInfo
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- CN113992176A CN113992176A CN202010658512.2A CN202010658512A CN113992176A CN 113992176 A CN113992176 A CN 113992176A CN 202010658512 A CN202010658512 A CN 202010658512A CN 113992176 A CN113992176 A CN 113992176A
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- 239000000725 suspension Substances 0.000 claims abstract description 225
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- 239000000758 substrate Substances 0.000 claims abstract description 32
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- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000003780 insertion Methods 0.000 abstract description 16
- 230000037431 insertion Effects 0.000 abstract description 16
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- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H5/00—One-port networks comprising only passive electrical elements as network components
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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Abstract
The application discloses wave filter and communication equipment, this wave filter includes: the microstrip line suspension structure comprises a shell, a dielectric substrate and a suspension microstrip line; a cavity is formed in the shell and is provided with a first cavity wall and a second cavity wall which are arranged oppositely; the medium substrate is arranged in the cavity and provided with a first surface and a second surface which are arranged in an opposite way, the first surface faces the wall of the first cavity, and the second surface faces the wall of the second cavity; the suspension microstrip line is arranged on the first surface and comprises a transmission suspension microstrip line and a plurality of filter suspension microstrip lines, and the plurality of filter suspension microstrip lines are all connected with the transmission suspension microstrip line and are arranged at intervals along the extension direction of the transmission suspension microstrip line; the first surface is arranged at intervals with the first cavity wall, and the second surface is arranged at intervals with the second cavity wall; each filter suspension microstrip line is used for forming a zero point of the filter. By the mode, the designed filter meets the requirements of smaller insertion loss and smaller size.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to a filter and a communications device.
Background
With the development of 5G technologies (5th Generation mobile networks or 5th Generation with less systems, 5th-Generation, also called 5G or fifth Generation mobile communication technologies), in the early construction of 5G base stations, the base stations need to be compatible with 4G (the 4th Generation mobile communication technology, also called fourth Generation mobile communication technology) communication and 5G communication. Therefore, multi-frequency co-station can be realized, repeated construction is avoided, and the commercialization cost is reduced. In order to meet the requirement of sharing the base station by the 4G signal and the 5G signal, the mutual interference between the established 4G signal and the 5G signal needs to be reduced to meet the requirement of mutual separation. Therefore, a filter is required to filter the 5G signal, so as to reduce the interference of the 5G signal to the 4G signal.
The 5G communication requires that the filter has smaller insertion loss and the filter has smaller volume. The existing coaxial cavity filter has overlarge volume and does not meet the requirement of smaller volume; the filter of the existing common microstrip line structure has overlarge insertion loss and does not meet the requirement of having smaller insertion loss. The existing filter can not meet the requirements of smaller insertion loss and smaller size.
Disclosure of Invention
The present application provides a filter and a communication device to solve the above technical problems.
In order to solve the technical problem, the application adopts a technical scheme that: the filter comprises a shell, a dielectric substrate and a suspension microstrip line; wherein,
the shell forms a cavity body by the interior of the shell and is provided with a first cavity wall and a second cavity wall which are arranged oppositely;
the medium substrate is arranged in the cavity and provided with a first surface and a second surface which are arranged in an opposite way, the first surface faces the wall of the first cavity, and the second surface faces the wall of the second cavity;
the suspension microstrip line is arranged on the first surface and comprises a transmission suspension microstrip line and a plurality of filter suspension microstrip lines, and the plurality of filter suspension microstrip lines are all connected with the transmission suspension microstrip line and are arranged at intervals along the extension direction of the transmission suspension microstrip line;
the first surface is arranged at intervals with the first cavity wall, and the second surface is arranged at intervals with the second cavity wall; each filter suspension microstrip line is used for forming a zero point of the filter.
Further, the plurality of filter suspension microstrip lines comprise at least one first filter suspension microstrip line and at least one second filter suspension microstrip line; the shape of each first filter suspension microstrip line comprises a rectangle or a square; each second filtering suspension microstrip line comprises a first sub-filtering suspension microstrip line and a second sub-filtering suspension microstrip line, one end of the first sub-filtering suspension microstrip line is connected with the transmission suspension microstrip line, the other end of the first sub-filtering suspension microstrip line is connected with one end of the second sub-filtering suspension microstrip line, and the width of the second sub-filtering suspension microstrip line is larger than that of the first sub-filtering suspension microstrip line.
Further, the length of the first sub-filter suspension microstrip line is greater than that of the second sub-filter suspension microstrip line, and the width of the first sub-filter suspension microstrip line is greater than that of the second sub-filter suspension microstrip line.
Further, the dielectric substrate has a first direction and a second direction perpendicular to each other; the transmission suspension microstrip line extends along a first direction, and the first filter suspension microstrip line and the second filter suspension microstrip line extend along a second direction.
Furthermore, the at least one first filter suspension microstrip line comprises a first filter suspension microstrip line and a second first filter suspension microstrip line, and the at least one second filter suspension microstrip line comprises a first second filter suspension microstrip line and a second filter suspension microstrip line; the transmission suspension microstrip line is sequentially connected with a first filter suspension microstrip line, a first second filter suspension microstrip line, a second filter suspension microstrip line and a second first filter suspension microstrip line; the passband range of the suspended microstrip line is 500MHz-2700MHz, and the stopband range is 3300MHz-6000 MHz.
Further, the transmission suspension microstrip line divides the dielectric substrate into a first side and a second side which are distributed along a second direction along the first direction; the first filter suspension microstrip line, the first second filter suspension microstrip line and the second first filter suspension microstrip line are located on the first side, and the second filter suspension microstrip line is located on the second side.
Further, the suspended microstrip line further includes:
the transmission suspension microstrip line is connected with one end of the transmission suspension microstrip line close to the first filter suspension microstrip line and used for accessing a radio frequency signal;
and the filter output end suspension microstrip line is connected with one end of the transmission suspension microstrip line close to the second first filter suspension microstrip line and used for outputting the filtered radio-frequency signal.
Further, the medium substrate is welded with the cavity wall of the cavity.
Further, the cavity wall of the cavity is silver.
In order to solve the above technical problem, the present application further provides a communication device, which includes an antenna and a radio frequency unit connected to the antenna; the radio frequency unit comprises the filter and is used for filtering the accessed radio frequency signal.
The application has at least the following beneficial effects: through set up suspension microstrip line on dielectric substrate for coaxial cavity filter, the filter of this application has less volume. Simultaneously because first surface and the first chamber wall interval set up, the second surface sets up with the second chamber wall interval for the suspension microstrip line unsettled setting that sets up on the dielectric substrate, thereby the wave filter of this application has less insertion loss. Therefore, the filter can meet the requirements of large power capacity and small size.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a filter according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of the filter embodiment of the present application, taken along section line A-A in FIG. 1;
FIG. 3 is a schematic diagram of an exploded structure of a filter according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a first surface of a dielectric substrate according to an embodiment of the filter of the present application;
FIG. 5 is a schematic diagram of ADS layout of suspended microstrip lines in an embodiment of the filter of the present application;
figure 6 is a schematic diagram of an LC circuit with suspended microstrip lines of an embodiment of the filter of the present application;
FIG. 7 is a schematic diagram of a simulation of an embodiment of the filter of the present application;
fig. 8 is a schematic structural diagram of a communication device according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Through long-term research of the inventor of the application, the base station needs to be compatible with 4G communication and 5G communication in the early construction of the 5G base station. The 5G communication requires that the filter has smaller insertion loss and the filter has smaller volume. The existing coaxial cavity filter has overlarge volume and does not meet the requirement of smaller volume; the filter of the existing common microstrip line structure has overlarge insertion loss and does not meet the requirement of having smaller insertion loss. The existing filter can not meet the requirements of smaller insertion loss and smaller size. In order to improve the above technical problem, the present application proposes at least the following embodiments.
Referring to fig. 1-3, fig. 1 is a schematic structural diagram of a filter according to an embodiment of the present application, fig. 2 is a schematic cross-sectional diagram of the filter according to the present application, which is obtained by cutting along a cutting line a-a in fig. 1, and fig. 3 is a schematic exploded structural diagram of the filter according to the embodiment of the present application.
As shown in fig. 1 to 3, the filter 100 of the present embodiment includes: a housing 1, a dielectric substrate 2 and a suspended microstrip line 3. The housing 1 forms a cavity therein, and has a first cavity wall 110 and a second cavity wall 120 disposed opposite to each other. The dielectric substrate 2 is disposed in the cavity and has a first surface 210 and a second surface 220 opposite to each other, the first surface 210 faces the first cavity wall 110, and the second surface 220 faces the second cavity wall 120. The suspended microstrip line 3 is disposed on the first surface 210, and includes a transmission suspended microstrip line 31 and a plurality of filter suspended microstrip lines 32. The plurality of filter suspension microstrip lines 32 are all connected to the transmission suspension microstrip line 31, and are arranged at intervals along the extending direction of the transmission suspension microstrip line 31. Wherein the first surface 210 is spaced apart from the first cavity wall 110, and the second surface 220 is spaced apart from the second cavity wall 120; each filter suspension microstrip line 32 is used to form a zero of the filter 100.
In the present embodiment, the suspended microstrip line 3 is disposed on the dielectric substrate 2, so that the filter 100 of the present application has a smaller volume than a coaxial cavity filter. Meanwhile, the first surface 210 and the first cavity wall 110 are arranged at an interval, and the second surface 220 and the second cavity wall 120 are arranged at an interval, so that the suspended microstrip line 3 arranged on the dielectric substrate 2 is suspended. The filter 100 of the present application thus has less insertion loss. Therefore, the filter 100 of the present application can satisfy both a small insertion loss and a small volume requirement. Thus, the volume of the filter 100 of the present application is reduced to at least one third of the volume of a coaxial cavity filter with the same performance; compare with the filter that microstrip line was unsettled setting, the insertion loss of this application filter 100 is little 50% at least.
Compared with a filter in which the microstrip lines are all non-suspended, the filter 100 of the present application has a higher quality factor (i.e., Q value), smaller insertion loss, and lower power consumption. In addition, the suspended microstrip line 3 has the advantages of high manufacturing precision, good consistency and convenience for mass production. The volume of the filter 100 made of the suspended microstrip line 3 is smaller than that of a coaxial cavity filter, and the volume of the filter 100 adopting the suspended microstrip line 3 can meet the volume requirement of 5G communication.
Wherein, zero point is also called transmission zero point, can realize zero point suppression, is convenient for debugging the index. The transmission zero point can enable the transmission function of the filter to be equal to zero, namely, the electromagnetic energy cannot pass through the network on the frequency point corresponding to the transmission zero point, so that the complete isolation effect is achieved, the suppression effect on signals outside the pass band is achieved, and the high isolation between the pass band and a plurality of pass bands or the outside can be better achieved.
As shown in fig. 2-3, the cavity may be a metal cavity. For example, in one embodiment, the chamber may be a silver-plated metal chamber, i.e., a chamber wall of the chamber is silver-plated. The case 1 may include a cover 11 and a body 12. The cover 11 is provided with a first opening groove (not shown), and the body 12 is provided with a second opening groove 121. The cover body 11 covers the main body 12, and the first opening groove and the second opening groove 121 are butted to form a cavity. The dielectric substrate 2 may be disposed between the cover 11 and the body 12, and the dielectric substrate 2 may contact the cover 11 and the body 12, respectively. In other embodiments, the dielectric substrate 2 may only contact the cover 11 or the body 12. When the dielectric substrate 2 contacts the cover 11 and the main body 12, respectively, in order to reduce intermodulation interference, the contact surfaces between the dielectric substrate 2 and the cavity wall of the main body 12 and between the dielectric substrate 2 and the cavity wall of the cover 11 may be welded. The dielectric substrate 2 can be made of a base material with a high dielectric constant, and the dielectric substrate 2 has low intermodulation interference. For example, in one of the embodiments, the dielectric constant of the dielectric substrate 2 may be greater than 3. In one embodiment, the base material of the dielectric substrate 2 may be an FR-4 grade material. The dielectric substrate 2 may be made of a hard insulating material. The hard insulating material is, for example, a ceramic material, a hard rubber material, a glass material, or a resin material. In order to reduce the production cost, in the present embodiment, the dielectric substrate 2 may be a PCB (Printed Circuit Board).
In order to prevent mutual interference between different filter suspension microstrip lines 32, the cavity wall corresponding to the filter suspension microstrip line 32 may extend along the extension direction of the filter suspension microstrip line 32, so as to form a filter suspension microstrip line accommodating cavity for accommodating the filter suspension microstrip line 32. The different filter suspension microstrip lines 32 are isolated by the cavity wall of the receiving cavity of the filter suspension microstrip line, so as to prevent the mutual interference between the different filter suspension microstrip lines 32.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a first surface of a dielectric substrate according to an embodiment of the present application.
As shown in fig. 4, the plurality of filter suspension microstrip lines 32 includes at least one first filter suspension microstrip line 321 and at least one second filter suspension microstrip line 322; the shape of each first filter suspension microstrip line 321 includes a rectangle or a square. Each second filtering suspension microstrip line 322 includes a first sub-filtering suspension microstrip line 10 and a second sub-filtering suspension microstrip line 20. One end of the first sub-filtering suspension microstrip line 10 is connected to the transmission suspension microstrip line 31, and the other end of the first sub-filtering suspension microstrip line 10 is connected to one end of the second sub-filtering suspension microstrip line 20. The width of the second sub-filter suspension microstrip line 20 is greater than the width of the first sub-filter suspension microstrip line 10.
Of course, the present embodiment does not limit the shape of the filter suspension microstrip line 32. Specifically, in the case where the filter suspension microstrip line 32 is formed by a microstrip line, the filter suspension microstrip line 32 may be equivalent to an inductor and a capacitor connected in series, that is, the filter suspension microstrip line 32 itself has both inductance and capacitance. Under the condition that the width of the filter suspension microstrip line 32 is increased, the inductance of the filter suspension microstrip line 32 is reduced, the capacitance is increased, namely, the inductance is reduced, and the capacitance is increased; when the width of the filter suspension microstrip line 32 is reduced, the inductance of the filter suspension microstrip line 32 is increased, and the capacitance is reduced, that is, the inductance is increased, and the capacitance is reduced. The change of the inductance and capacitance of the filter suspension microstrip line 32 will eventually cause the position of the zero point formed by the filter suspension microstrip line 32 to change. Therefore, the inductance and capacitance of each filter suspension microstrip line 32 can be specifically configured by adjusting the width of each filter suspension microstrip line 32. Thereby specifically setting the position of each zero point to form the desired zero point. The width of the filter suspension microstrip line 32 may be the width of the whole filter suspension microstrip line 32, or the width of a partial region of the filter suspension microstrip line 32.
It is foreseen that in other embodiments, when the width of the microstrip line 32 is smaller than a predetermined value, the capacitance of the microstrip line 32 is negligible, and mainly the inductive effect of the microstrip line 32. At this time, the filter suspension microstrip line 32 may be equivalent to an inductor. When the width of the filter suspension microstrip line 32 is greater than a predetermined value, the inductance of the filter suspension microstrip line 32 is negligible, and mainly the capacitive effect of the filter suspension microstrip line 32 is achieved. At this time, the filter suspension microstrip line 32 may be equivalent to a capacitor.
Further, in the present embodiment, the position of the zero point formed by the first filter suspension microstrip line 321 and the position of the zero point formed by the second filter suspension microstrip line 322 may be set by setting the width of the first filter suspension microstrip line 321 to be greater than the width of the second sub-filter suspension microstrip line 20, respectively.
Further, the adjustment of the position of the zero point formed by the second filter suspension microstrip line 322 can also be realized by adjusting the length of the first sub-filter suspension microstrip line 10 and/or the length of the second sub-filter suspension microstrip line 20. For example, the length of the first sub-filter suspension microstrip line 10 may be set to be greater than the length of the second sub-filter suspension microstrip line 20.
To reduce the production cost of the filter 100, the structural design of the filter 100 may be somewhat regular.
As shown in fig. 3 to 4, the dielectric substrate 2 has a first direction L and a second direction W perpendicular to each other. The transmission suspension microstrip line 31 extends along a first direction L, the first filter suspension microstrip line 321 extends along a second direction W, and the second filter suspension microstrip line 322 extends along the second direction W.
Further, in order to reduce the size of the filter 100, a smaller number of filter suspension microstrip lines 32 may be used to implement the filtering function.
As shown in fig. 3-4, the at least one first filter suspension microstrip line 321 includes a first filter suspension microstrip line D1 and a second first filter suspension microstrip line D4; the at least one second filter suspension microstrip line 322 includes a first second filter suspension microstrip line D2 and a second filter suspension microstrip line D3. The transmission suspension microstrip line 31 is sequentially connected to a first filter suspension microstrip line D1, a first second filter suspension microstrip line D2, a second filter suspension microstrip line D3 and a second first filter suspension microstrip line D4. The passband range of the suspended microstrip line 3 is 500MHz-2700MHz, and the stopband range is 3300MHz-6000 MHz.
In the present embodiment, the number of the filter suspension microstrip lines 32 is four, and the number of the filter suspension microstrip lines 32 is small, so that the size of the filter 100 can be reduced.
In this embodiment, the filter 100 may be a low pass filter. For example, the filter 100 may filter signals above a preset threshold. For example, the preset critical value may be in the range of 2700MHz to 3300 MHz. Wherein, 500MHz-2700MHz belongs to 4G signal frequency channel, 3300MHz-6000MHz belongs to 5G signal frequency channel, and this application wave filter 100 can satisfy the coverage requirement of the full frequency channel of 4G signal and 5G signal promptly. The filter 100 forms a pass band in the frequency band range of the 4G signal and forms a stop band in the frequency band range of the 5G signal, so that mutual interference between the 4G signal and the 5G signal can be better avoided.
The specific shape of the four filter suspension microstrip lines 32 connected in sequence is reasonably set in the embodiment, so that four zero points of the filter 100 are generated, and the four zero points are formed at the high end of the passband (500MHz-2700MHz) on the frequency band curve.
Thus, in the present embodiment, the four zeros are formed to achieve a high isolation between the pass band (500MHz to 2700MHz) and the stop band (3300MHz to 6000 MHz).
In order to ensure that enough space is reserved for conveniently arranging the screws at the back. Further, the transmission suspended microstrip line 31 divides the PCB board into a first side a and a second side B distributed along the second direction along the first direction L. The first filter suspension microstrip line D1, the first second filter suspension microstrip line D2 and the second first filter suspension microstrip line D4 are located on the first side a, and the second filter suspension microstrip line D3 is located on the second side B. Therefore, a sufficient space is reserved between the first second filter suspension microstrip line D2 and the second first filter suspension microstrip line D4, and screws can be conveniently arranged behind the space.
As shown in fig. 4, the suspended microstrip line 3 further includes a filter input suspended microstrip line 33 and a filter output suspended microstrip line 34. The filter input end suspension microstrip line 33 is connected with one end of the transmission suspension microstrip line 31 close to the first filter suspension microstrip line D1, so as to access a radio frequency signal; the filter output end suspension microstrip line 34 is connected to one end of the transmission suspension microstrip line 31 close to the second first filter suspension microstrip line D4, and is configured to output a filtered radio frequency signal.
Specifically, in order to make the disclosure of the present application clearer, in this embodiment, reference may be made to fig. 5, where fig. 5 is a schematic diagram of an ADS layout of a suspended microstrip line according to an embodiment of the filter of the present application.
Since the suspended microstrip line 3 has a planar structure in the present embodiment, the layout and the connection relationship between each part of the suspended microstrip line 3 in the suspended microstrip line 3 can be shown in the ADS layout. The rectangles at different positions in fig. 5 represent suspended microstrip lines 3 at different positions in the suspended microstrip lines 3, and the T-shapes represent suspended microstrip lines 3 at transitions of varying widths between the suspended microstrip lines 3. As shown in fig. 5, E1 represents the filter input end suspended microstrip line 33; e3, E4 and E5 represent a first suspended microstrip line D1, E7, E8 and E9 represent a first second suspended microstrip line D2, E11, E12 and E13 represent a second suspended microstrip line D3, and E15, E16 and E17 represent a second first suspended microstrip line D4. Among them, E4, E8, E12 and E16 represent suspended microstrip lines 3 of transition sections of varying widths between the suspended microstrip lines 3. To illustrate with E4, E4 represents the suspended microstrip line 3 of the first suspended microstrip line D1, which is a transition section between the suspended microstrip line 3 represented by E3 and the suspended microstrip line 3 represented by E5, and the width of which changes. When the widths of the suspended microstrip line 3 represented by E3 and the suspended microstrip line 3 represented by E5 are the same, the width of the suspended microstrip line 3 represented by E4 is the same as the width of the suspended microstrip line 3 represented by E3 and the width of the suspended microstrip line 3 represented by E5. Further, E2, E6, E10, E14, and E18 represent the transmission suspended microstrip line 31. Wherein E2 represents the transmission suspension microstrip line 31 between the filter input end suspension microstrip line 33 and the first filter suspension microstrip line D1; e6 represents the transmission suspension microstrip line 31 between the first filter suspension microstrip line D1 and the first second filter suspension microstrip line D2; e10 represents the transmission suspension microstrip line 31 between the first second filter suspension microstrip line D2 and the second filter suspension microstrip line D3; e14 represents the transmission suspension microstrip line 31 between the second first filter suspension microstrip line D4 and the second filter suspension microstrip line D3; e18 represents the transmission suspended microstrip line 31 between the filter output suspended microstrip line 34 and the second first filter suspended microstrip line D4.
In particular, for a clearer understanding of the present application, reference may be made to fig. 6, where fig. 6 is a schematic diagram of an LC circuit of a suspended microstrip line of an embodiment of a filter of the present application.
As shown in fig. 6, the inductor L1 and the capacitor C1 connected in series are an equivalent circuit of the first filter suspension microstrip line D1; the inductor L2 and the capacitor C2 which are connected in series are an equivalent circuit of the first second filter suspension microstrip line D2; the inductor L3 and the capacitor C3 which are connected in series are an equivalent circuit of a second filter suspension microstrip line D3; the inductor L4 and the capacitor C4 connected in series are equivalent circuits of the second first filter suspension microstrip line D4. The inductor L5 is an equivalent inductor of the transmission suspension microstrip line 31 between the first filter suspension microstrip line D1 and the filter input end suspension microstrip line 33; the inductor L6 is an equivalent inductor of the transmission suspension microstrip line 31 between the first filter suspension microstrip line D1 and the first second filter suspension microstrip line D2; the inductor L7 is an equivalent inductor of the transmission suspension microstrip line 31 between the first second filter suspension microstrip line D2 and the second filter suspension microstrip line D3; the inductor L8 is an equivalent inductor of the transmission suspension microstrip line 31 between the second filter suspension microstrip line D3 and the second first filter suspension microstrip line D4; the inductance L9 is the equivalent inductance of the transmission suspension microstrip line 31 between the second first filter suspension microstrip line D4 and the filter output end suspension microstrip line 34. Thus, in the present embodiment, the 9 th order filter 100 is formed, and the inductor L1 and the capacitor C1 connected in series, the inductor L2 and the capacitor C2 connected in series, the inductor L3 and the capacitor C3 connected in series, and the inductor L4 and the capacitor C4 connected in series each form one zero point of the filter 100, and form four zero points in total. And the four zeros are positioned at the high end of the passband (500MHz-2700MHz) on the frequency band curve, so that the high isolation between the passband (500MHz-2700MHz) and the stopband (3300MHz-6000MHz) can be better realized.
Specifically, the filter 100 of the present application can achieve the following indexes:
within the passband range of 500MHz to 2700MHz, the return loss is greater than or equal to 20 dB;
in the passband range of 500MHz-2700MHz, the maximum insertion loss is 0.4 dB;
in the passband range of 500MHz-2700MHz, the maximum insertion loss ripple is 0.3 dB;
in the passband range of 500MHz-2700MHz, the maximum group delay is 4 ns;
in the passband range of 500MHz-2700MHz, the maximum group delay variation is 3 ns;
within the stop band range of 3300MHz-6000MHz, the suppression is greater than or equal to 38 dB;
in the passband range of 500MHz-2700MHz, the input root mean square power is 100W;
within the passband range of 500MHz-2700MHz, the input peak power is 1000W;
in the range of 500MHz to 2700MHz, the intermodulation interference of any order is greater than or equal to 110 dBm.
Referring to fig. 7, fig. 7 is a simulation diagram of an embodiment of the filter of the present application.
See the band curve 200 of the suspended microstrip line 3 as shown in fig. 7. Where the point m3 and the point m4 are a frequency point on the frequency band curve 200. The frequency at point m3 is 3400MHz and the rejection at point m3 is 44.96990 dB; the frequency at point m4 is 6000MHz and the rejection at point m4 is 37.15753 dB. In the frequency plot 200 shown in fig. 7, the pass band is 500MHz-2700MHz (shown but not labeled in the frequency plot 200) and the stop band is 3300MHz-6000MHz (shown but not labeled in the frequency plot 200). Wherein 3300MHz-6000MHz belongs to the frequency band of 5G signal, 500MHz-2700MHz belongs to the frequency band of 4G signal. That is, the filter 100 of the present application satisfies the coverage requirements of the full frequency bands of the 4G signal and the 5G signal. In the present embodiment, the interference of the 4G signal to the 5G signal can be reduced by four zeros formed on the frequency band curve 200 (three zeros are shown in the frequency band curve 200, but not labeled), and the isolation is high.
See return loss curve 300 of suspended microstrip line 3 as shown in fig. 7. Where points m1 and m2 are two frequency points on the return loss curve 300. The frequency at point m1 is 500MHz and the rejection at point m1 is 33.39522 dB. The frequency at point m2 is 2900MHz and the rejection at point m2 is 23.61799 dB. The filter 100 of the present application therefore meets the requirement of return loss greater than or equal to 20 dB.
The present application further provides a communication device, as shown in fig. 8, fig. 8 is a schematic structural diagram of a communication device according to an embodiment of the present application.
As shown in fig. 8, the communication device 400 of this embodiment includes an antenna 410 and a Radio frequency unit 420, where the antenna 410 is connected to the Radio frequency unit 420, and the Radio frequency unit 420 may be an rru (remote Radio unit). The rf unit 420 includes the filter 100 disclosed in the above embodiments, and is used for filtering the incoming rf signal.
In other embodiments, the rf unit 420 may be integrated with the Antenna 410 to form an active Antenna unit (aau).
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (10)
1. A filter, characterized in that the filter comprises:
the shell is internally provided with a cavity, and the cavity is provided with a first cavity wall and a second cavity wall which are arranged oppositely;
the dielectric substrate is arranged in the cavity and provided with a first surface and a second surface which are arranged oppositely, the first surface faces the first cavity wall, and the second surface faces the second cavity wall;
the suspension microstrip lines are arranged on the first surface and comprise transmission suspension microstrip lines and a plurality of filtering suspension microstrip lines, and the plurality of filtering suspension microstrip lines are all connected with the transmission suspension microstrip lines and are arranged at intervals along the extension direction of the transmission suspension microstrip lines;
wherein the first surface is spaced from the first cavity wall and the second surface is spaced from the second cavity wall; each filter suspension microstrip line is used for forming a zero point of the filter.
2. The filter of claim 1,
the plurality of filter suspension microstrip lines comprise at least one first filter suspension microstrip line and at least one second filter suspension microstrip line;
the shape of each first filter suspension microstrip line comprises a rectangle or a square;
each second filtering suspension microstrip line comprises a first sub-filtering suspension microstrip line and a second sub-filtering suspension microstrip line, one end of the first sub-filtering suspension microstrip line is connected with the transmission suspension microstrip line, the other end of the first sub-filtering suspension microstrip line is connected with one end of the second sub-filtering suspension microstrip line, and the width of the second sub-filtering suspension microstrip line is greater than that of the first sub-filtering suspension microstrip line.
3. The filter of claim 2,
the length of the first sub-filter suspension microstrip line is greater than that of the second sub-filter suspension microstrip line, and the width of the first sub-filter suspension microstrip line is greater than that of the second sub-filter suspension microstrip line.
4. The filter of claim 3,
the dielectric substrate is provided with a first direction and a second direction which are perpendicular to each other;
the transmission suspension microstrip line extends along the first direction, and the first filter suspension microstrip line and the second filter suspension microstrip line extend along the second direction.
5. The filter of claim 4,
the at least one first filter suspension microstrip line comprises a first filter suspension microstrip line and a second filter suspension microstrip line, and the at least one second filter suspension microstrip line comprises a first filter suspension microstrip line and a second filter suspension microstrip line;
the transmission suspension microstrip line is sequentially connected with a first filter suspension microstrip line, a first second filter suspension microstrip line, a second filter suspension microstrip line and a second first filter suspension microstrip line; the passband range of the suspended microstrip line is 500MHz-2700MHz, and the stopband range is 3300MHz-6000 MHz.
6. The filter of claim 5,
the transmission suspension microstrip line divides the dielectric substrate into a first side and a second side which are distributed along the second direction along the first direction;
the first filter suspension microstrip line, the first second filter suspension microstrip line and the second first filter suspension microstrip line are located on the first side, and the second filter suspension microstrip line is located on the second side.
7. The filter of claim 6, wherein the suspended microstrip line further comprises:
the transmission suspension microstrip line is connected with one end of the transmission suspension microstrip line close to the first filter suspension microstrip line and used for accessing a radio frequency signal;
and the filtering output end suspension microstrip line is connected with one end, close to the second first filtering suspension microstrip line, of the transmission suspension microstrip line and is used for outputting the radio-frequency signal after filtering.
8. The filter of claim 7,
and the medium substrate is welded with the cavity wall of the cavity.
9. The filter of claim 8,
and the cavity wall of the cavity is silver.
10. A communication device, characterized in that the communication device comprises an antenna and a radio frequency unit connected with the antenna; the radio frequency unit comprises a filter according to any of claims 1-9 for filtering the incoming radio frequency signal.
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| CN202010658512.2A CN113992176A (en) | 2020-07-09 | 2020-07-09 | Filter and communication device |
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| CN202010658512.2A CN113992176A (en) | 2020-07-09 | 2020-07-09 | Filter and communication device |
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