CN113990996A - Miniature light emitting diode display device - Google Patents
Miniature light emitting diode display device Download PDFInfo
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- CN113990996A CN113990996A CN202111249338.7A CN202111249338A CN113990996A CN 113990996 A CN113990996 A CN 113990996A CN 202111249338 A CN202111249338 A CN 202111249338A CN 113990996 A CN113990996 A CN 113990996A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Abstract
The invention provides a micro light-emitting diode display device which comprises a circuit substrate, a plurality of positioning bulges and a plurality of micro light-emitting diodes. The positioning bulges are configured on the circuit substrate. Each positioning protrusion has a positioning side surface and a bottom surface. A first included angle is formed between each positioning side surface and the corresponding bottom surface, and the first included angle is smaller than 90 degrees. The positioning bulges form a plurality of positioning spaces on the circuit substrate. The micro light-emitting diodes are respectively arranged in the different positioning spaces and are electrically connected with the circuit substrate. Each micro light emitting diode has a light emitting surface and a side surface. Each light-emitting surface is positioned on one side of the corresponding micro light-emitting diode far away from the circuit substrate, and a second included angle is formed between each side surface and the corresponding light-emitting surface. The second included angle is greater than or equal to the first included angle.
Description
Technical Field
The present disclosure relates to display devices, and particularly to a micro light emitting diode display device.
Background
The micro light emitting diode is thinned and miniaturized based on the structure of the light emitting diode, and is reduced from the side length of a crystal grain to less than 100 micrometers from about 1 millimeter. Compared with light emitting diodes, micro light emitting diodes have the advantages of high pixel density, high brightness, high contrast, wide color gamut, high response speed, high luminous efficiency, high resolution, and the like, and have become the mainstream of the new generation of display technology.
In the fabrication process of the micro led display device, millions of micro leds are formed on a growth substrate by epitaxy, dicing, etc., and then the micro leds are separated from the growth substrate, and the micro leds are adsorbed by a temporary substrate, and finally the micro leds are transferred to a circuit substrate by the temporary substrate and electrically connected to conductive bumps on the circuit substrate. The transfer process of the micro-leds is called mass transfer (mass transfer), and the position of all micro-leds needs to be precisely controlled. Once the transfer process of the micro led is shifted or failed, one electrode of the micro led may be connected to two conductive bumps on the circuit substrate to form a short circuit, or two electrodes of the micro led may be electrically connected to one conductive bump on the circuit substrate to form a short circuit, or the electrode of the micro led may be deviated from the conductive bump on the circuit substrate to form an effective electrical connection (e.g., an open circuit), resulting in poor yield or even failure of the transfer process.
Disclosure of Invention
The invention is directed to a micro light emitting diode display device with excellent transfer yield and precision.
According to an embodiment of the present invention, a micro light emitting diode display device includes a circuit substrate, a plurality of positioning protrusions, and a plurality of micro light emitting diodes. The positioning bulges are configured on the circuit substrate. Each positioning protrusion is provided with a positioning side surface and a corresponding bottom surface. A first included angle is formed between each positioning side surface and the bottom surface. The positioning bulges form a plurality of positioning spaces on the circuit substrate. The micro light-emitting diodes are respectively arranged in the different positioning spaces and are electrically connected with the circuit substrate. Each micro light emitting diode has a light emitting surface and a side surface. Each light-emitting surface is positioned on one side of the corresponding micro light-emitting diode far away from the circuit substrate, and a second included angle is formed between the side surface and the corresponding light-emitting surface. The second included angle is smaller than 90 degrees and is larger than or equal to the first included angle.
In an embodiment of the invention, any one of the micro light emitting diodes is located between two positioning side surfaces of two adjacent positioning protrusions, and the micro light emitting diode has another side surface connected with the light emitting surface. The two side surfaces face the two positioning side surfaces, respectively.
In an embodiment of the invention, the micro light emitting diode includes a first electrode and a second electrode located on the same side, and an extension line of a connection line of the first electrode and the second electrode passes through two positioning side surfaces of the two positioning protrusions.
In an embodiment according to the present invention, the plurality of positioning side surfaces of the plurality of positioning projections surround any one of the positioning spaces.
In an embodiment according to the present invention, only one micro led is correspondingly configured in each positioning space.
In an embodiment according to the present invention, the second included angle is between 15 degrees and 75 degrees.
In an embodiment according to the present invention, an angle difference between the second included angle and the first included angle is less than or equal to 15 degrees.
In an embodiment of the invention, the micro light emitting diode display device further includes a plurality of conductive bumps, wherein at least one conductive bump is disposed in each positioning space, and each micro light emitting diode is bonded to the circuit substrate via the corresponding conductive bump. Each positioning projection is provided with a top surface, and the height of the top surfaces in the thickness direction of the circuit substrate is equal to the light emitting surfaces of the micro light emitting diodes.
In an embodiment of the invention, the micro light emitting diode display device further includes a common electrode layer. The common electrode layer covers the top surfaces of the positioning bulges and is electrically connected with the micro light-emitting diodes.
In an embodiment of the invention, the circuit substrate defines a display area, and the micro light emitting diodes are disposed in the display area. The micro light emitting diode display device further comprises a common electrode pad arranged outside the display area, and the common electrode layer is connected with the common electrode pad.
In an embodiment of the invention, a portion of the positioning protrusions is located outside the display area, and the positioning protrusions have connecting side surfaces opposite to the positioning side surfaces. The common electrode layer covers the connection side surface and extends to be connected with the common electrode pad, and the connection side surface and the bottom surface form a third included angle. The third included angle is smaller than the first included angle.
In an embodiment of the invention, a cross-sectional width of each positioning protrusion decreases from the circuit substrate to the top surface.
In an embodiment according to the present invention, each of the positioning projections has a trapezoidal cross-sectional profile.
In an embodiment of the invention, the positioning protrusions and the micro light emitting diodes are alternately arranged on the circuit substrate.
In an embodiment of the invention, two conductive bumps are disposed in the positioning space, and each of the micro light emitting diodes includes a first electrode and a second electrode on the same side. The first electrode and the second electrode of each micro light-emitting diode are respectively jointed with the two conductive bumps in the corresponding positioning space. The first electrode and the second electrode have a first distance therebetween, the two conductive bumps have a second distance therebetween, and a ratio of the second distance to the first distance is between 2 and 10.
In an embodiment of the invention, a gap is formed between one of the side surfaces of the micro light emitting diode and the corresponding positioning side surface, and a width of the gap is less than or equal to 5 micrometers (μm).
In view of the above, in the micro led display device of the present invention, the plurality of positioning protrusions and the plurality of conductive bumps are alternately arranged on the circuit substrate, and each micro led is disposed between any two adjacent positioning protrusions. In the process of mass transfer, the positions of the micro light-emitting diodes can be accurately positioned through the positioning bulges, so that each micro light-emitting diode is accurately and electrically connected with the corresponding conductive bump, the situations of short circuit or open circuit and the like caused by mis-positioning or error are avoided, and the transfer yield and accuracy are further improved.
Drawings
FIGS. 1A and 1B are schematic partial cross-sectional views illustrating a transfer process of a micro light emitting diode display device according to an embodiment of the invention;
FIG. 2 is a schematic top view of a portion of the micro LED display device of FIG. 1B;
FIG. 3 is a schematic top view of a portion of a micro LED display device according to another embodiment of the present invention;
FIG. 4 is a schematic partial cross-sectional view of a micro light emitting diode display device according to yet another embodiment of the present invention;
FIG. 5 is a schematic partial cross-sectional view of a micro light emitting diode display device according to yet another embodiment of the present invention;
fig. 6 is a schematic partial cross-sectional view of a micro led display device according to a further embodiment of the invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1A and fig. 1B are schematic partial cross-sectional views illustrating a transfer process of a micro led display device according to an embodiment of the invention. Fig. 2 is a partial top schematic view of the micro led display device of fig. 1B. Referring to fig. 1A and 1B, the micro light emitting diodes 120 are first peeled off from the growth substrate (not shown), the micro light emitting diodes 120 are adsorbed by the temporary substrate 10, and finally the micro light emitting diodes 120 are moved onto the circuit substrate 110 by the temporary substrate 10, and the micro light emitting diodes 120 are electrically connected to the conductive bumps 112 on the circuit substrate 110, respectively, so as to complete the transfer process of the micro light emitting diode display apparatus 100.
Referring to fig. 1A, fig. 1B and fig. 2, in the present embodiment, the micro light emitting diode display device 100 includes a circuit substrate 110, a plurality of positioning protrusions 113 and a plurality of micro light emitting diodes 120, wherein the positioning protrusions 113 are disposed on the circuit substrate 110, and each positioning protrusion 113 has a first positioning side surface 113B, a second positioning side surface 113c opposite to the first positioning side surface 113B, and a bottom surface 113 d. The first positioning side surface 113b and the second positioning side surface 113c of each positioning protrusion 113 are respectively connected to two sides of the bottom surface 113d, and the bottom surface 113d is connected to the circuit substrate 110.
As shown in fig. 1A, the positioning protrusions 113 form a plurality of positioning spaces 101 on the circuit substrate 110, for example, in any two adjacent positioning protrusions 113, the second positioning side surface 113c of one positioning protrusion 113 faces the first positioning side surface 113b of the other positioning protrusion 113, and the positioning space 101 is located between the second positioning side surface 113c and the first positioning side surface 113b facing each other. Further, any two adjacent positioning spaces 101 are separated by a positioning protrusion 113.
Referring to fig. 1B and fig. 2, the micro light emitting diodes 120 are respectively disposed in the different positioning spaces 101 and electrically connected to the circuit substrate 110. Specifically, one micro led 120 is disposed in each positioning space 101, and any two adjacent micro leds 120 are separated by one positioning protrusion 113. As shown in fig. 2, the positioning protrusions 113 and the micro light emitting diodes 120 are laterally and alternately arranged on the circuit substrate 110, and each micro light emitting diode 120 is located between the second positioning side surface 113c of one positioning protrusion 113 and the first positioning side surface 113b of another positioning protrusion 113.
Each of the micro light emitting diodes 120 has a light emitting surface 121, a first side surface 125 and a second side surface 126, wherein the light emitting surface 121 is located on a side of the micro light emitting diode 120 away from the circuit substrate 110, and the first side surface 125 and the second side surface 126 are respectively connected to two opposite sides of the light emitting surface 121. Specifically, one or more positioning spaces 101 may exist between two adjacent positioning protrusions 113. As for the positioning spaces 101 existing between the adjacent two positioning protrusions 113, the arrangement direction of the positioning spaces 101 is perpendicular to the arrangement direction of the adjacent two positioning protrusions 113. That is, in fig. 2, a plurality of micro light emitting diodes 120 may be disposed between any two positioning protrusions 113 adjacent in the horizontal direction, but the micro light emitting diodes 120 are arranged in the vertical direction, and the first side surface 125 of each micro light emitting diode 120 faces the second positioning side surface 113c of one positioning protrusion 113, and the second side surface 126 faces the first positioning side surface 113b of another positioning protrusion 113.
Further, each of the micro light emitting diodes 120 further has a bottom surface facing the circuit substrate 110, wherein the light emitting surface 121 and the bottom surface are opposite to each other, and the first side surface 125 and the second side surface 126 are respectively connected to two opposite sides of the bottom surface. That is, the first side surface 125 and the second side surface 126 are located between the light emitting surface 121 and the bottom surface.
Referring to fig. 1B, the cross-sectional profile of each positioning protrusion 113 is a trapezoid, and is an isosceles trapezoid. That is, the first positioning side surface 113b and the second positioning side surface 113c of each positioning protrusion 113 are symmetrical to each other, and a first included angle a1 is included between the first positioning side surface 113b and the bottom surface 113d and between the second positioning side surface 113c and the bottom surface 113 d. In each micro light emitting diode 120, a second included angle a2 is formed between the first side surface 125 and the light emitting surface 121 and between the second side surface 126 and the light emitting surface 121. The second included angle A2 is less than 90 degrees and greater than or equal to the first included angle A1. Preferably, the second included angle a2 may be between 15 degrees and 75 degrees. In addition, if the second included angle a2 is greater than the first included angle a1, the difference between the second included angle a2 and the first included angle a1 may be less than or equal to 15 °.
In addition, assuming that the micro light emitting diodes 120 are horizontally symmetrical, the sum of the included angle Ac and the first included angle a1 between the first side surface 125 and the bottom surface and the second side surface 126 of each micro light emitting diode 120 may be less than 180 degrees. Specifically, in the cross-sectional profile of the micro led 120 and the positioning protrusion 113 shown in fig. 1B, since the sum of the second included angle a2 and the included angle Ac is 180 degrees, if the second included angle a2 is greater than the first included angle a1, the sum of the first included angle a1 and the included angle Ac should be less than 180 degrees. On the premise that the width of the light-emitting surface 121 of the micro light-emitting diode 120 is not changed, the first side surface 125 and the second side surface 126 of the micro light-emitting diode 120 are relatively steep slopes, and two ends of the bottom surface of the micro light-emitting diode 120 facing the circuit substrate 110 are respectively closer to the second positioning side surface 113c and the first positioning side surface 113b, so that the probability that the edge of the micro light-emitting diode 120 contacts the positioning protrusion 113 is increased, and the positioning accuracy is improved.
Referring to fig. 1B, in the present embodiment, the micro light emitting diode display device further includes a plurality of conductive bumps 112 disposed on the circuit substrate 110, and at least one conductive bump 112 is disposed in each positioning space 101. Taking the horizontal micro led as an example, two conductive bumps 112 are disposed in each positioning space 101 in pairs. Each micro light emitting diode 120 is connected to the circuit substrate 110 through two conductive bumps 112 in the corresponding positioning space 101. On the other hand, each positioning protrusion 113 has a top surface 113a, wherein the first positioning side surface 113b and the second positioning side surface 113c are respectively connected to two opposite sides of the top surface 113a, and the height of the top surface 113a of each positioning protrusion 113 in the thickness direction of the circuit substrate 110 is higher than the light-emitting surface 121 of each micro light-emitting diode 120.
That is, the height of the top surface 113a of each positioning protrusion 113 from the circuit substrate 110 is higher than the height of the light-emitting surface 121 of each micro light-emitting diode 120 from the circuit substrate 110. Since any two adjacent micro leds 120 are separated by one positioning protrusion 113, each positioning protrusion 113 can be used to reduce the light emission effect between any two adjacent micro leds 120, so as to improve the contrast and the resolution. In other words, the sum T1 of the thickness of each micro led 120 and the corresponding one of the conductive bumps 112 is less than the thickness T2 of each positioning protrusion 113.
Referring to fig. 1A and fig. 1B, in the process of mass transfer, the positions of the micro light emitting diodes 120 can be precisely positioned by the positioning protrusions 113, so that each light emitting diode 120 is precisely electrically connected (e.g., flip chip connected) to the corresponding two conductive bumps 112, thereby avoiding short circuit or open circuit caused by misalignment or error in positioning, and further improving the transfer yield and precision. Further, when the temporary substrate 10 absorbs the micro leds 120 and moves to the upper side of the circuit substrate 110, the position of each micro led 120 must be controlled to fall between any two adjacent positioning protrusions 113, then each micro led 120 is aligned with two conductive bumps 112 located between any two adjacent positioning protrusions 113, and finally the micro leds 120 are released so that each micro led 120 is precisely and electrically connected to the corresponding two conductive bumps 112.
The auxiliary positioning mechanism of the positioning protrusions 113 helps to avoid the occurrence of short circuit caused by one electrode of the micro light emitting diode 120 being connected to two conductive bumps 112 on the circuit substrate 110, short circuit caused by two electrodes of the micro light emitting diode 120 being electrically connected to one conductive bump 112 on the circuit substrate 110, and failure of effective electrical connection (e.g., disconnection) caused by the electrodes of the micro light emitting diode 120 being deviated from the conductive bumps 112 on the circuit substrate 110.
Referring to fig. 1B, the cross-sectional width W of each positioning protrusion 113 decreases from the circuit substrate 110 to the top surface 113a, and a positioning space 101 for accommodating at least one micro led 120 is formed between any two adjacent positioning protrusions 113. Therefore, each positioning space 101 has a substantially trapezoidal cross-sectional profile, and the cross-sectional width decreases toward the circuit board 110. That is, each positioning space 101 has a larger opening to the outside, so as to facilitate each micro led 120 to be placed in the corresponding positioning space 101. In addition, based on the design of the cross-sectional profile of each positioning space 101, each micro led 120 can be guided by any two adjacent positioning protrusions 113 to move towards the corresponding two conductive bumps 112, thereby effectively reducing misalignment or error in alignment.
Referring to fig. 1B, each micro light emitting diode 120 further has a first electrode 123 and a second electrode 124, and the first electrode 123 and the second electrode 124 of each micro light emitting diode 120 are electrically connected to the two conductive bumps 112 between any two adjacent positioning protrusions 113. Based on the angle design of the corner of each positioning protrusion 113 and the angle design of the corner of each micro led 120, each micro led 120 can be guided by any two adjacent positioning protrusions 113 to move toward the circuit substrate 110, and the first electrode 123 and the second electrode 124 are precisely bonded to the two corresponding conductive bumps 112, thereby avoiding short circuit or open circuit caused by misalignment or error of positioning.
On the other hand, the distance between any two adjacent positioning protrusions 113 is greater than the width of the micro light emitting diode 120, and the ratio of the distance to the width is less than 1.2 at the same cross-sectional height. By setting the ratio of the distance between any two adjacent positioning protrusions 113 to the width of the micro light emitting diode 120 and the guiding of the two positioning side surfaces (i.e., the second positioning side surface 113c and the first positioning side surface 113b) of any two adjacent positioning protrusions 113, the displacement error between the two electrodes (i.e., the first electrode 123 and the second electrode 124) of the micro light emitting diode 120 and the two conductive bumps 112 can be further reduced.
As shown in fig. 1B and fig. 2, the positioning protrusions 113 may be a plurality of positioning ribs and are arranged in parallel. Further, an extension line L of a connection line between the first electrode 123 and the second electrode 124 of the micro light emitting diode 120 passes through two positioning side surfaces (i.e., the second positioning side surface 113c and the first positioning side surface 113b) of the two positioning protrusions 113. On the other hand, the light-emitting surface 121 of each micro light-emitting diode 120 has two opposite sides 121a, and the two positioning protrusions 113 are respectively located on two opposite sides of the two sides 121 a.
Referring to fig. 1A and 1B, in the present embodiment, the first electrode 123 and the second electrode 124 of each micro light emitting diode 120 are respectively connected to the two conductive bumps 112 in the corresponding positioning space 101, wherein a first distance d1 is between the first electrode 123 and the second electrode 124, and a second distance d2 is between the two conductive bumps 112. The second distance d2 is greater than the first distance d1, and the ratio of the second distance d2 to the first distance d1 is between 2 and 10, so as to prevent the two conductive bumps 112 from being shorted due to solder bridging.
On the other hand, a gap G is formed between the first side surface 125 and the second positioning side surface 113c of the micro light emitting diode, and the width of the gap G is less than or equal to 5 micrometers. Accordingly, the width of the gap between the second side surface 126 of the micro light emitting diode and the first positioning side surface 113b may also be less than or equal to 5 micrometers. By reducing the gap between the side surface of the micro led 120 and the positioning side surface of the positioning protrusion 113, the positioning protrusion 113 can provide precise positioning and guiding for the micro led 120 during the process of moving the micro led 120 into the positioning space 101, so as to ensure that the first electrode 123 and the second electrode 124 of the micro led 120 are respectively connected to the two conductive bumps 112. That is, even though the conductive bump 112 has a smaller bonding area, the first electrode 123 and the second electrode 124 of the micro light emitting diode 120 can be positioned and guided by the positioning protrusion 113 to be precisely bonded to the two conductive bumps 112 respectively.
Fig. 3 is a schematic top view of a portion of a micro led display device according to another embodiment of the invention. Referring to fig. 3, unlike the positioning space 101 of the previous embodiment, the positioning space 102 of the present embodiment is surrounded by at least four positioning protrusions 113, wherein the micro light emitting diode 120 is disposed in the positioning space 102 and surrounded by four positioning protrusions 113. Further, the four positioning protrusions 113 are connected to each other to form a hollow rectangular positioning structure, and four positioning side surfaces (e.g., two second positioning side surfaces 113c and two first positioning side surfaces 113b) of the four positioning protrusions 113 surround a positioning space 102.
Fig. 4 is a partial cross-sectional view of a micro light emitting diode display device according to still another embodiment of the present invention. Referring to fig. 4, the structure design of the micro led display device 100A of the present embodiment is substantially the same as that of the micro led display device 100 shown in fig. 1B, and the difference between the two is: the micro light emitting diode 1201 of the present embodiment is a vertical micro light emitting diode, and the micro light emitting diode 120 shown in fig. 1B is a horizontal micro light emitting diode. In detail, in each of the micro light emitting diodes 1201, the first electrode 123 is located on the bottom surface. In addition, one conductive bump 112 is disposed in each positioning space 101, and the first electrode 123 of each micro light emitting diode 1201 is electrically connected to a corresponding conductive bump 112. That is, each micro light emitting diode 1201 is bonded to the circuit substrate 110 via the corresponding conductive bump 112.
In the present embodiment, the height of the top surface 113a of each positioning protrusion 113 in the thickness direction of the circuit substrate 110 is equal to the light-emitting surface 121 of each micro light-emitting diode 120. That is, the height of the top surface 113a of each positioning protrusion 113 from the circuit substrate 110 is equal to the height of the light-emitting surface 121 of each micro light-emitting diode 120 from the circuit substrate 110. For example, the thickness of the epitaxial layer of each micro led 120 is between 3 and 10 μm.
As shown in fig. 4, the micro light emitting diode display device 100A further includes a common electrode layer 130, wherein the common electrode layer 130 covers the top surfaces 113a of the positioning protrusions 113 and the light emitting surfaces 121 of the micro light emitting diodes 1201, and the micro light emitting diodes 1201 are electrically connected to each other through the common electrode layer 130. For example, the common electrode layer 130 may be a patterned transparent conductive oxide layer and is formed on the light emitting surfaces 121 of the micro light emitting diodes 1201 as the second electrodes of the micro light emitting diodes 120. In a preferred embodiment, the cross-sectional profile of the positioning protrusion 113 is a trapezoid, wherein the top surface 113a of the positioning protrusion 113 is a plane and is as high as the light emitting surface 121 of the micro light emitting diode 120. Therefore, the common electrode layer 130 is formed on a flat surface, so that the patterned common electrode layer 130 has a uniform film thickness, and the problem of exposure error caused by height difference is reduced, thereby improving the connection yield of the common electrode layer 130.
In the present embodiment, the circuit substrate 110 defines a display region 111, and the micro light emitting diodes 1201 are disposed in the display region 111. On the other hand, the micro light emitting diode display device 100A further includes two common electrode pads 114, 115 disposed opposite to each other, wherein the two common electrode pads 114, 115 are disposed outside the display region 111, and the plurality of positioning protrusions 113 and the plurality of micro light emitting diodes 1201 are alternately arranged between the common electrode pads 114 and the common electrode pads 115. Further, two opposite side extension segments of the common electrode layer 130 extend along the alignment side surfaces (e.g., the first alignment side surface 113b and the second alignment side surface 113c) of the two alignment protrusions 113 to the common electrode pad 114 and the common electrode pad 115, and are connected to the common electrode pad 114 and the common electrode pad 115, respectively.
As shown in fig. 4, a portion of the positioning protrusions 113 is disposed in the display area 111, and another portion of the positioning protrusions 113 is disposed outside the display area 111.
Fig. 5 is a partial cross-sectional view of a micro led display device according to still another embodiment of the invention. Referring to fig. 5, the structure design of the micro led display device 100B of the present embodiment is substantially the same as that of the micro led display device 100A shown in fig. 4, and the main difference between the two is: the angles of the corners of the two positioning protrusions 113 adjacent to the two common electrode pads 114, 115 are designed.
In the present embodiment, the alignment protrusion 113 adjacent to the common electrode pad 114 (i.e., a portion of the alignment protrusion 113 disposed outside the display region 111) has a connection side surface 113e opposite to the second alignment side surface 113c, and the alignment protrusion 113 adjacent to the common electrode pad 115 has a connection side surface 113f opposite to the first alignment side surface 113 b. The connection side surface 113e and the connection side surface 113f are respectively covered by two opposite side extensions of the common electrode layer 130, and the two side extensions are respectively connected to the common electrode pad 114 and the common electrode pad 115.
In detail, a third included angle A3 is included between the connecting side surface 113e and the corresponding bottom surface 113d, and between the connecting side surface 113f and the corresponding bottom surface 113d, and the third included angle A3 is smaller than the first included angle a 1. That is, at the positions of the connection side surfaces 113e and 113f, the two side extensions of the common electrode layer 130 have a relatively gentle slope, so as to prevent the common electrode layer 130 from being disconnected due to too steep slope during deposition, and better ensure the electrical connection between the common electrode layer 130 and the common electrode pad 115. On the other hand, the two positioning protrusions 113 adjacent to the two common electrode pads 114, 115 are symmetrically disposed, and the cross-sectional profiles thereof are all non-isosceles trapezoids.
As shown in fig. 5, the height of the top surface 113a of each positioning protrusion 113 in the thickness direction of the circuit substrate 110 may also be higher than the light-emitting surface 121 of each micro light-emitting diode 120. That is, the height of the top surface 113a of each positioning protrusion 113 from the circuit substrate 110 is higher than the height of the light-emitting surface 121 of each micro light-emitting diode 120 from the circuit substrate 110, but the invention is not limited thereto. For example, the top surface 113a and the light emitting surface 121 may also be arranged in a high manner, as shown in fig. 4. In each alignment space 101, the common electrode layer 130 extends from the light emitting surface 121 of the micro light emitting diode 120 to two alignment side surfaces (i.e., the second alignment side surface 113c and the first alignment side surface 113b) of two adjacent alignment protrusions 113, and a part of the second alignment side surface 113c and a part of the first alignment side surface 113b are covered by the common electrode layer 130.
Fig. 6 is a schematic partial cross-sectional view of a micro led display device according to a further embodiment of the invention. Referring to fig. 6, the structure design of the micro led display device 100C of the present embodiment is substantially the same as that of the micro led display device 100A shown in fig. 4, and the main difference between the two is: in the present embodiment, a transparent oxide electrode 127 is formed on the light emitting surface 121 of each micro light emitting diode 1201. In detail, the common electrode layer 130 contacts and covers the transparent oxide electrode 127 on the light emitting surface 121 of each micro light emitting diode 1201.
On the other hand, the height of the top surface 113a of each positioning protrusion 113 in the thickness direction of the circuit substrate 110 is higher than the light-emitting surface 121 of each micro light-emitting diode 120. That is, the height of the top surface 113a of each positioning protrusion 113 from the circuit substrate 110 is higher than the height of the light-emitting surface 121 of each micro light-emitting diode 120 from the circuit substrate 110. In each alignment space 101, the common electrode layer 130 extends from the light emitting surface 121 of the micro light emitting diode 120 to two alignment side surfaces (i.e., the second alignment side surface 113c and the first alignment side surface 113b) of two adjacent alignment protrusions 113, and a part of the second alignment side surface 113c and a part of the first alignment side surface 113b are covered by the common electrode layer 130.
In summary, in the micro led display device of the present invention, the positioning protrusions and the conductive bumps are alternately arranged on the circuit substrate, and each micro led is disposed between any two adjacent positioning protrusions. In the process of mass transfer, the positions of the micro light-emitting diodes can be accurately positioned through the positioning bulges, so that the electrode of each micro light-emitting diode is accurately and electrically connected with the corresponding conductive bump, the situations of short circuit or open circuit and the like caused by mis-positioning or errors are avoided, and the transfer yield and precision are further improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (16)
1. A micro light emitting diode display device, comprising:
a circuit substrate;
the positioning protrusions are arranged on the circuit substrate, each positioning protrusion is provided with a positioning side surface and a bottom surface, a first included angle is formed between each positioning side surface and the corresponding bottom surface, and the positioning protrusions form a plurality of positioning spaces on the circuit substrate; and
a plurality of miniature emitting diode, dispose respectively in the dissimilarity in a plurality of location spaces and electric connection in circuit substrate, each miniature emitting diode has a plain noodles and connects the side surface on plain noodles, each it is located the correspondence to go out the plain noodles miniature emitting diode keeps away from one side of circuit substrate, just side surface and correspondence accompany the second contained angle between the plain noodles, the second contained angle is less than 90 degrees and is greater than or equal to first contained angle.
2. The device as claimed in claim 1, wherein any one of the micro-leds is located between two of the positioning side surfaces of two adjacent positioning protrusions, and the micro-led has another side surface connecting the light exit surface, the two side surfaces respectively facing the two positioning side surfaces.
3. The micro light-emitting diode display device of claim 2, wherein the micro light-emitting diode comprises a first electrode and a second electrode on the same side, and an extension line of a connection line of the first electrode and the second electrode passes through both the positioning side surfaces of both the positioning protrusions.
4. The micro light-emitting diode display device of claim 1, wherein the plurality of positioning side surfaces of the plurality of positioning projections surround any one of the positioning spaces.
5. The device as claimed in claim 1, wherein each of the positioning spaces is configured with only one of the micro light emitting diodes.
6. The micro light-emitting diode display device of claim 1, wherein the second included angle is between 15 degrees and 75 degrees.
7. The micro light-emitting diode display device of claim 1, wherein an angular difference between the second angle and the first angle is less than or equal to 15 degrees.
8. The device as claimed in claim 1, further comprising a plurality of conductive bumps, wherein at least one of the conductive bumps is disposed in each of the positioning spaces, and each of the micro light emitting diodes is bonded to the circuit substrate via the corresponding conductive bump, each of the positioning bumps has a top surface, and the top surfaces have a height in the thickness direction of the circuit substrate equal to the light emitting surfaces of the micro light emitting diodes.
9. The micro light-emitting diode display device of claim 8, further comprising a common electrode layer covering the top surfaces of the positioning protrusions and electrically connecting the micro light-emitting diodes.
10. The micro led display device of claim 9, wherein the circuit substrate defines a display area, and the plurality of micro leds are disposed in the display area, the micro led display device further comprising a common electrode pad disposed outside the display area, and the common electrode pad is connected to the common electrode pad.
11. A micro led display device according to claim 10, wherein a portion of the positioning protrusions is located outside the display region, and the positioning protrusions have a connection side surface opposite to the positioning side surface, the common electrode layer covers the connection side surface and extends to connect the common electrode pad, and the connection side surface and the bottom surface form a third included angle, and the third included angle is smaller than the first included angle.
12. The micro light-emitting diode display device of claim 8, wherein the cross-sectional width of each positioning protrusion decreases from the circuit substrate to the top surface.
13. The micro light-emitting diode display device of claim 12, wherein each of the positioning protrusions has a trapezoidal cross-sectional profile.
14. The micro light-emitting diode display device of claim 1, wherein the plurality of positioning protrusions and the plurality of micro light-emitting diodes are alternately arranged on the circuit substrate.
15. The micro light-emitting diode display device of claim 8, wherein two of the conductive bumps are disposed in each of the positioning spaces, each of the micro light-emitting diodes includes a first electrode and a second electrode on the same side, the first electrode and the second electrode of each of the micro light-emitting diodes are respectively bonded to the two conductive bumps in the corresponding positioning spaces,
wherein a first distance exists between the first electrode and the second electrode, a second distance exists between the two conductive bumps, and the ratio of the second distance to the first distance is between 2 and 10.
16. The micro light-emitting diode display device of claim 2, wherein a gap is formed between one of the side surfaces of the micro light-emitting diode and the corresponding positioning side surface, and the width of the gap is less than or equal to 5 micrometers.
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| CN202111249338.7A CN113990996A (en) | 2021-10-26 | 2021-10-26 | Miniature light emitting diode display device |
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| CN202111249338.7A CN113990996A (en) | 2021-10-26 | 2021-10-26 | Miniature light emitting diode display device |
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